Laser sintering device
By setting a sintering template and adjusting the platform position in the laser sintering device, the problem of uneven sintering caused by uneven laser spot energy was solved, achieving higher quality and more precise sintering results.
Patent Information
- Application Number
- CN202423316024.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2034-12-31
AI Technical Summary
During laser sintering, the energy difference between the center of the laser spot and the surrounding area leads to uneven sintering, which affects the sintering quality.
By setting a sintering template in the laser sintering device and adjusting the relative position between the sintering platform and the light source assembly, the energy distribution of the laser beam is made more uniform. The sintering template is used to block the excess part of the laser beam, ensuring that the laser beam is evenly irradiated on the workpiece to be sintered.
This achieves uniform distribution of laser beam energy, improves sintering quality and precision, protects non-target areas of the workpiece to be sintered, and avoids damage.
Smart Images
Figure CN223863060U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of laser sintering, in particular to a laser sintering device. BACKGROUND
[0002] The laser beam forms a high-energy-density and small-size light spot on the workbench through a focusing lens or the like, which can sinter the conductive paste on the workbench to form the final required product. However, during the sintering process, the energy difference between the center position and the peripheral area of the light spot easily leads to uneven sintering, affecting the sintering quality. CONTENT OF THE UTILITY MODEL
[0003] Therefore, it is necessary to provide a laser sintering device to solve the problem that the energy difference between the center position and the peripheral area of the light spot easily leads to uneven sintering, affecting the sintering quality during the sintering process.
[0004] In a first aspect, the present application provides a laser sintering device, comprising:
[0005] a sintering platform configured to support a sintering object;
[0006] a light source assembly spaced apart from the sintering platform along a first direction and configured to emit a laser beam toward the sintering object along the first direction; and
[0007] a sintering template spaced apart from the sintering platform and the light source assembly along the first direction, the sintering template having a light transmission channel configured to transmit the laser beam, so that the laser beam irradiates on the sintering object and forms a target pattern.
[0008] According to one or more embodiments, in the first direction, the distance between the sintering template and the sintering platform is 0.1mm-0.5mm.
[0009] According to one or more embodiments, in the first direction, the sintering platform is arranged at a position with a defocus amount of 15mm-30mm.
[0010] According to one or more embodiments, the sintering template is movably arranged along the first direction and / or a second direction and / or a third direction, and the first direction, the second direction and the third direction intersect with each other.
[0011] According to one or more embodiments, the sintering template is rotatably arranged around the first direction and / or the second direction and / or the third direction.
[0012] According to one or more embodiments, in a plane intersecting the first direction, the width of the light transmission channel is less than 150μm.
[0013] According to one or more embodiments, the light source assembly is movably arranged in a plane intersecting the first direction, and a cross-sectional shape of the light-transmissive passage is configured to be consistent with a shape of the target pattern in the plane intersecting the first direction.
[0014] According to one or more embodiments, the light-transmissive passage is configured as a through hole penetrating along the first direction, and the sintering platform is movably arranged in a plane intersecting the first direction.
[0015] According to one or more embodiments, the light source assembly comprises a laser generator, a scanning galvanometer, and a focusing field lens, and the scanning galvanometer is arranged between the laser generator and the focusing field lens.
[0016] According to one or more embodiments, the laser sintering device further comprises a control assembly in communication connection with the sintering platform and the light source assembly respectively, and configured to control the sintering platform and / or the light source assembly to move in the plane intersecting the first direction.
[0017] The laser sintering device described above is provided with a sintering template between the light source assembly and the sintering platform, and the laser beam emitted by the light source assembly can pass through the light-transmissive passage on the sintering template and irradiate on the part to be sintered. In this process, the relative position between the sintering platform and the light source assembly can be adjusted so as to be able to sinter at a defocus position, so that the energy distribution of the laser beam is more uniform, that is, the energy of the laser beam irradiated on the part to be sintered remains consistent, and the laser beam irradiated on the peripheral excess part is shielded by the sintering template. In this way, the laser beam can be more uniformly irradiated on the part to be sintered, and the sintering quality is improved. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is a structural schematic diagram of the laser sintering device according to one or more embodiments.
[0019] Figure 2 It is a structural schematic diagram of the laser sintering device according to one or more embodiments.
[0020] Reference signs: 100, laser sintering device; 200, part to be sintered; 10, sintering platform; 20, light source assembly; 30, sintering template; 21, laser generator; 22, scanning galvanometer; 23, focusing field lens; 31, light-transmissive passage; a, first direction; b, second direction; c, third direction. DETAILED DESCRIPTION
[0021] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described herein and by one of ordinary skill in the art without departing from the spirit and scope of the present application, and it is therefore intended that all such variations be considered as falling within the scope of the present application. It should be understood that the use of the terms "include", "comprise" or "contain" herein should not be understood as limiting the present application to the features or steps described herein, but rather the use of these terms is intended to cover the presence of the features or steps described herein as well as the presence of other features or steps not described herein.
[0022] In the description of the present application, it should be understood that, if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0023] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second" can include at least one of the features explicitly or implicitly. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.
[0024] In the present application, unless otherwise specifically defined and limited, if the terms "mount", "connect", "connect", "fix" and the like appear, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0025] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0026] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0027] See Figure 1 and Figure 2 One embodiment of this application provides a laser sintering apparatus 100, including a sintering platform 10, a light source assembly 20, and a sintering template 30. The sintering platform 10 supports a workpiece 200 to be sintered. The light source assembly 20 is spaced apart from the sintering platform 10 along a first direction a and is used to emit a laser beam toward the workpiece 200 along the first direction a. The sintering template 30 is spaced apart between the sintering platform 10 and the light source assembly 20 along the first direction a. The sintering template 30 has a light-transmitting channel 31 for transmitting the laser beam, so that the laser beam irradiates the workpiece 200 to form a target pattern.
[0028] It should be noted that the sintering platform 10 refers to a structure that can be used to place the part to be sintered 200. The sintering platform 10 can be set as a rectangular structure, and its upper surface is the bearing surface. The part to be sintered 200 is placed on the bearing surface so that the part to be sintered 200 can be laser sintered.
[0029] The part to be sintered 200 may be, but is not limited to, a flexible display product, and silver paste wire circuits are coated on the surface of the flexible display product to facilitate laser sintering of the areas coated with silver paste wire circuits.
[0030] The light source assembly 20 can emit a laser beam and direct the laser beam onto the workpiece 200 to be sintered along a preset path. Specifically, when the workpiece 200 to be sintered is placed on the sintering platform 10, the light source assembly 20 can be positioned above the sintering platform 10 so that the laser beam can be directed downwards onto the workpiece 200 to be sintered.
[0031] Specifically, the light source assembly 20 is spaced apart from the sintering platform 10 along the first direction a, that is, the first direction a is the vertical direction, the light source assembly 20 is spaced apart above the sintering platform 10, and the laser beam shines downward onto the surface of the workpiece 200 to be sintered.
[0032] The sintering template 30 refers to a structure capable of filtering the laser beam to ensure that the laser beam is uniformly irradiated onto the workpiece 200 to form the target pattern. The sintering template 30 is spaced apart between the sintering platform 10 and the light source assembly 20 along the first direction a, that is, the sintering template 30 is spaced apart from both the sintering platform 10 and the light source assembly 20, and is located between the sintering platform 10 and the light source assembly 20.
[0033] A light-transmitting channel 31 is opened on the sintering template 30. The light-transmitting channel 31 is arranged through the first direction a so that the laser beam can pass through the light-transmitting channel 31 and then irradiate the workpiece 200 to be sintered.
[0034] It should be noted that current sintering methods typically involve sintering at the focal point. In this case, the size of the laser beam is equal to the size of the target pattern, but the energy is stronger in the central region and weaker at the edges. When the laser beam irradiates the part to be sintered, the uneven energy distribution within the beam itself can affect the final sintering quality.
[0035] Therefore, this application sets up a sintering template 30 and first adjusts the relative position between the sintering platform 10 and the light source assembly 20 so that the size of the laser beam is slightly larger than the size of the target pattern, thereby making the energy of the laser beam more uniform. However, when the laser beam irradiates the part to be sintered 200, there will be excess laser beam in the edge area. In order to avoid damage to the part to be sintered 200 by the excess laser beam, the sintering template 30 is used to block the excess laser beam at the edge, thereby enabling better sintering to form the target pattern.
[0036] In this way, after the light source assembly 20 emits a laser beam, adjusting the relative position between the sintering platform 10 and the light source assembly 20 can make the energy distribution of the laser beam more uniform, that is, the energy of the laser beam irradiating the workpiece 200 to be sintered remains consistent. By setting the sintering template 30, the edge area of the laser beam is blocked by the sintering template 30 and cannot irradiate the workpiece 200 to be sintered. As a result, the target pattern can be formed more uniformly and faster. And because a portion of the laser beam in the edge area is blocked by the sintering template 30 and will not irradiate the workpiece 200 to be sintered, it will not cause damage to areas on the workpiece 200 outside the target pattern.
[0037] The above structure not only enables the rapid formation of a uniform sintering area on the part to be sintered 200, thus better sintering the target pattern, but also protects the area outside the target pattern, improving the sintering quality.
[0038] In some embodiments, the distance between the sintering template 30 and the sintering platform 10 in the first direction a is 0.1 mm to 0.5 mm.
[0039] Specifically, the distance between the sintering template 30 and the sintering platform 10 in the vertical direction is 0.1mm~0.5mm, and the sintering template 30 is suspended. By visual alignment, the light-transmitting channel 31 on the sintering template 30 is aligned with the target pattern on the part to be sintered 200. Then, the target pattern is uniformly sintered by the laser beam emitted by the light source assembly 20.
[0040] By setting the sintering template 30 within the range of the sintering platform 10, the laser beam can pass through the light transmission channel 31 and form the target pattern on the workpiece 200 to be sintered in proportion, thereby improving the sintering accuracy.
[0041] In some embodiments, in the first direction a, the sintering platform 10 is positioned at a defocusing distance of 15mm to 30mm. Therefore, with the light source assembly 20 well focused, the laser beam forms a larger spot on the sintering platform 10, allowing the laser beam to cover the target pattern more evenly.
[0042] In some embodiments, the sintering template 30 is movably disposed along a first direction a and / or a second direction b and / or a third direction c, and the first direction a, the second direction b and the third direction c intersect each other.
[0043] Specifically, when the first direction a is set to the vertical direction, the second direction b and the third direction c are both set along the horizontal plane, and the second direction b and the third direction c are perpendicular to each other, that is, the first direction a, the second direction b and the third direction c are perpendicular to each other.
[0044] The sintering template 30 can be moved in three directions via a support, or via a robotic arm or other structure. Movement of the sintering template 30 in the first direction (a), the second direction (b), and the third direction (c) allows for better adjustment of its position, improved alignment, and enhanced sintering precision.
[0045] In some embodiments, the sintering template 30 is rotatably disposed about a first direction a and / or a second direction b and / or a third direction c. That is, the sintering template 30 can be rotated about the first direction a, the second direction b, and the third direction c respectively, so that the sintering template 30 can be better aligned.
[0046] In some embodiments, the width of the light-transmitting channel 31 is less than 150 μm in the plane intersecting the first direction a.
[0047] Specifically, when the first direction a is set to the vertical direction, the plane intersecting with the first direction a can be a horizontal plane, that is, in the horizontal plane, the width of the light transmission channel 31 is less than 150μm.
[0048] When the light-transmitting channel 31 is set as a through hole, the width of the light-transmitting channel 31 refers to the diameter of the through hole. When the light-transmitting channel 31 is set as a graphic, the width of the light-transmitting channel 31 refers to the line width of the graphic.
[0049] Furthermore, the surface of the part to be sintered 200 is coated with silver paste wire circuit with a line width of less than 150μm. This allows the laser beam passing through the light transmission channel 31 to sinter only in the area of the silver paste wire circuit, protecting other parts of the part to be sintered 200 from damage by the laser beam.
[0050] like Figure 1 As shown, in some embodiments, the light source assembly 20 is movably disposed in a plane intersecting the first direction a, and in the plane intersecting the first direction a, the cross-sectional shape of the light transmission channel 31 is configured to conform to the shape of the target pattern.
[0051] Specifically, the light source assembly 20 can move in the horizontal plane. By adjusting the position of the light source assembly 20, the laser beam passes through the light transmission channel 31 and is aligned with the target pattern on the workpiece to be sintered 200.
[0052] Furthermore, in the horizontal plane, the cross-sectional shape of the light-transmitting channel 31 is consistent with the shape of the target pattern; that is, the outline of the light-transmitting channel 31 is the same as the shape of the target pattern. In this way, when the laser beam shines from the light-transmitting channel 31 onto the workpiece 200 to be sintered, it can sinter along the shape of the target pattern on the workpiece 200.
[0053] During the sintering process, the position of the light source component 20 can be adjusted so that the laser beam sinters along the light transmission channel 31, that is, along the path of the target pattern.
[0054] like Figure 2 As shown, in some embodiments, the light-transmitting channel 31 is configured as a through hole extending along the first direction a, and the sintering platform 10 is movably disposed in a plane intersecting the first direction a.
[0055] Understandably, when the sintering platform 10 is configured to be movable in the horizontal plane, the light transmission channel 31 can also be configured as a through hole extending along the first direction a. During the sintering process, the light source assembly 20 and the sintering template 30 remain stationary. By moving the sintering platform 10, the laser beam passes through the through hole and irradiates the workpiece 200 to be sintered along the path of the target pattern, ultimately forming the target pattern through sintering.
[0056] In some embodiments, the light source assembly 20 includes a laser generator 21, a scanning galvanometer 22, and a focusing field mirror 23, with the scanning galvanometer 22 disposed between the laser generator 21 and the focusing field mirror 23.
[0057] Specifically, the laser generator 21 can emit a laser beam, which then passes through the scanning galvanometer 22 and the focusing field lens 23 in sequence. After passing through the light transmission channel 31, the laser beam finally irradiates the workpiece 200 to be sintered, forming the target pattern.
[0058] Furthermore, when the light source assembly 20 is movable, the scanning galvanometer 22 and the focusing field mirror 23 actually move in the horizontal plane so that the laser beam can pass through the light transmission channel 31 and then be aligned with the target pattern.
[0059] In some embodiments, the laser sintering apparatus 100 further includes a control component (not shown in the figure), which is communicatively connected to the sintering platform 10 and the light source assembly 20, and is used to control the sintering platform 10 and / or the light source assembly 20 to move in a plane intersecting with the first direction a.
[0060] Specifically, the control component can be configured as a controller, which is communicatively connected to the sintering platform 10, the scanning galvanometer 22, and the focusing field lens 23. Thus, the controller can issue commands to control the sintering platform 10 to move along a specified path in the horizontal plane, or control the scanning galvanometer 22 and the focusing field lens 23 to move along a specified path in the horizontal plane, so as to successfully form the target pattern on the workpiece 200 to be sintered.
[0061] According to one or more embodiments, in specific use of this application, the workpiece 200 to be sintered is first placed on the sintering platform 10, and a silver paste wire circuit is coated on the workpiece 200, which forms the outline of the target pattern. Then, the sintering platform 10 is adjusted to a position with a defocusing amount of 15mm to 30mm, and the sintering template is placed between the focusing field lens 23 and the sintering platform 10. The distances of the sintering template 30 from the focusing field lens 23 and the sintering platform 10 are adjusted respectively, and the sintering template 30 is used to block the excess part of the laser beam, so that after the laser beam passes through the light transmission channel 31, it can form a proportional light spot on the workpiece 200 to be sintered.
[0062] Furthermore, during the sintering process, the scanning galvanometer 22 and the focusing field mirror 23 can be controlled to move along the path of the target pattern, and the sintering platform 10 can also be controlled to move along the path of the target pattern, so that after the laser beam passes through the light transmission channel 31, it can sinter the target pattern on the workpiece 200 to be sintered, thus completing the laser sintering operation.
[0063] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0064] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A laser sintering apparatus, characterized in that, include: A sintering platform is used to support the parts to be sintered. A light source assembly is disposed at a distance from the sintering platform along a first direction and is used to emit a laser beam toward the workpiece to be sintered along the first direction; and A sintering template is disposed at intervals between the sintering platform and the light source assembly along the first direction. The sintering template has a light-transmitting channel for the laser beam to pass through, so that the laser beam irradiates the workpiece to be sintered and forms a target pattern.
2. The laser sintering apparatus according to claim 1, characterized in that, In the first direction, the distance between the sintering template and the sintering platform is 0.1mm~0.5mm.
3. The laser sintering apparatus according to claim 1, characterized in that, In the first direction, the sintering platform is positioned at a decoking distance of 15mm to 30mm.
4. The laser sintering apparatus according to claim 1, characterized in that, The sintering template is movably disposed along the first direction and / or the second direction and / or the third direction, and the first direction, the second direction and the third direction intersect each other.
5. The laser sintering apparatus according to claim 4, characterized in that, The sintering template is rotatably disposed about the first direction and / or the second direction and / or the third direction.
6. The laser sintering apparatus according to claim 1, characterized in that, In the plane intersecting the first direction, the width of the light-transmitting channel is less than 150 μm.
7. The laser sintering apparatus according to any one of claims 1-6, characterized in that, The light source assembly is movably disposed in a plane intersecting the first direction, and the cross-sectional shape of the light-transmitting channel in the plane intersecting the first direction is configured to conform to the shape of the target pattern.
8. The laser sintering apparatus according to any one of claims 1-6, characterized in that, The light-transmitting channel is configured as a through hole extending along the first direction, and the sintering platform is movably disposed in a plane intersecting the first direction.
9. The laser sintering apparatus according to claim 1, characterized in that, The light source assembly includes a laser generator, a scanning galvanometer, and a focusing field lens, with the scanning galvanometer disposed between the laser generator and the focusing field lens.
10. The laser sintering apparatus according to claim 1, characterized in that, The laser sintering apparatus further includes a control component, which is communicatively connected to the sintering platform and the light source component, and is used to control the sintering platform and / or the light source component to move in a plane intersecting the first direction.