High-stability smart home host mainboard

Abstract

The utility model relates to the technical field of smart home, in particular to a high-stability smart home host mainboard, which comprises a circuit board main body, a vapor chamber, a CPU (central processing unit), a flash memory chip, an inductor and a capacitor, the CPU is arranged on the circuit board main body close to the center, and the flash memory chip, the inductor and the capacitor are further arranged on the circuit board main body; a soaking plate is arranged on one side of the circuit board body, a rectangular groove is formed in the position, corresponding to the CPU, of one side of the soaking plate in a penetrating mode, semi-open type circular grooves are formed in the positions, close to the corners, of the inner wall of the rectangular groove, and lower clamping grooves are formed in the positions, close to the bottom ends, of the inner walls of the semi-open type circular grooves. A circular piece is arranged in the lower clamping groove, a stud is connected to the top of the circular piece, a nut is arranged on the periphery of the top end of the stud in a sleeving mode, and a rubber limiting block is further arranged in the semi-open type circular groove. And during use, the heat dissipation effect is good, and the stability is better.

Description

Technical Field

[0001] This utility model relates to the field of smart home technology, specifically to a highly stable smart home host motherboard. Background Technology

[0002] The smart home host motherboard is the core component of a smart home system, responsible for coordinating and managing various smart devices. It typically integrates a processor, memory, and interfaces, supporting wireless communication technologies such as Wi-Fi, Zigbee, and Z-Wave, enabling the host to interconnect with different devices. Through the control chip and software on the motherboard, users can centrally manage their home's lighting, temperature control, security, and other systems, achieving automated control and remote monitoring. Choosing a stable and highly compatible motherboard is crucial for building an efficient smart home system.

[0003] Previous smart home host motherboards lacked a good heat dissipation structure, resulting in poor heat dissipation and instability. Summary of the Invention

[0004] To address the problems in existing technologies, this utility model provides a highly stable smart home host motherboard with good heat dissipation and better stability during use.

[0005] The technical solution adopted by this utility model to solve its technical problem is a highly stable smart home host motherboard, including a circuit board body, a heat spreader, a CPU, a flash memory chip, an inductor and a capacitor. The CPU is arranged near the center of the circuit board body, and the circuit board body is also provided with a flash memory chip, an inductor and a capacitor.

[0006] A heat spreader is provided on one side of the circuit board body. A rectangular groove is provided through one side of the heat spreader at the position corresponding to the CPU. A semi-open circular groove is provided on the inner wall of the rectangular groove near the corner. A lower retaining groove is provided on the inner wall of the semi-open circular groove near the bottom. A circular piece is provided in the lower retaining groove. A stud is connected to the top of the circular piece. A nut is sleeved around the top of the stud. A rubber limiting block is also provided in the semi-open circular groove. The rubber limiting block is sleeved around the stud.

[0007] By adopting the above technical solution, the rubber limiting block is pre-fixed by inserting the circular piece into the lower slot, and then the rubber limiting block is embedded in the semi-open circular groove and the nut is tightened, so that the heat sink bracket is locked between the nut and the rubber limiting block, thus achieving a highly efficient heat dissipation effect for the CPU. This motherboard has a good heat dissipation effect and better stability during use.

[0008] Specifically, the rubber limiting block is provided with a limiting protrusion on its periphery, and the inner wall of the semi-open circular groove is provided with an upper slot near the upper end of the lower slot, and the limiting protrusion is engaged in the upper slot.

[0009] Specifically, a first convex cover is provided on the heat spreader plate at the position corresponding to the inductor and capacitor, and a second convex cover is provided on the heat spreader plate at the position corresponding to the flash memory chip.

[0010] By adopting the above technical solution, the first convex cover facilitates better contact between the heat spreader and the part of the circuit board body near the inductor and capacitor, and the second convex cover facilitates better contact between the heat spreader and the part of the circuit board body near the flash memory chip.

[0011] Specifically, a second screw is provided through a pre-drilled hole near the corner of the outer wall of the heat spreader, and a first screw is provided through a pre-drilled hole near the corner of the rectangular groove on the outer wall of the heat spreader. A circular pad is provided on the outer wall of the circuit board body at the position corresponding to the first and second screws, and a threaded groove is provided on the circular pad.

[0012] By adopting the above technical solution, by tightening the first screw and the second screw, and by utilizing the engagement of the first screw and the second screw with the corresponding threaded groove, the heat spreader can be easily locked and fixed to one side of the circuit board body.

[0013] Specifically, a strip groove is formed at the bottom of the rectangular groove, which communicates with one side of the heat spreader.

[0014] Specifically, the outer surface of the circuit board body is provided with an epoxy resin flame retardant layer.

[0015] The beneficial effects of this utility model are:

[0016] The present invention discloses a highly stable smart home host motherboard. An external heat sink can be installed between the nut and the rubber limit block using a circular piece, stud, nut, and rubber limit block. The compressed heat sink achieves efficient heat dissipation for the CPU, and a heat spreader is used to assist in heat dissipation for other parts of the motherboard. The motherboard has good heat dissipation and better stability during use. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the disassembly structure of the circuit board body and the heat spreader of this utility model;

[0020] Figure 3This is a schematic diagram of the first and second convex covers of this utility model.

[0021] Figure 4 This is a top view of the structure of this utility model;

[0022] Figure 5 This is a schematic diagram showing the detailed structure at point A of this utility model;

[0023] Figure 6 This is a schematic diagram of the circular piece, rubber limiting block, limiting protrusion, stud and nut structure of this utility model.

[0024] In the diagram: 1. Circuit board body; 2. Heat spreader; 3. First screw; 4. Second screw; 5. First convex cover; 6. Second convex cover; 7. CPU; 8. Rectangular slot; 9. Strip slot; 10. Circular pad; 11. Threaded slot; 12. Flash memory chip; 13. Inductor; 14. Capacitor; 15. Semi-open circular slot; 16. Lower slot; 17. Upper slot; 18. Rubber limiting block; 19. Limiting protrusion; 20. Circular piece; 21. Stud; 22. Nut. Detailed Implementation

[0025] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0026] To ensure better heat dissipation and stability during use, such as... Figure 1-6 As shown, the high-stability smart home host motherboard of this utility model includes a circuit board body 1, a heat spreader 2, a CPU 7, a flash memory chip 12, an inductor 13 and a capacitor 14. The CPU 7 is arranged near the center of the circuit board body 1, and the flash memory chip 12, the inductor 13 and the capacitor 14 are also arranged on the circuit board body 1.

[0027] A heat spreader 2 is provided on one side of the circuit board body 1. A rectangular groove 8 is provided through one side of the heat spreader 2 at the position corresponding to the CPU 7. A semi-open circular groove 15 is provided on the inner wall of the rectangular groove 8 near the corner. A lower retaining groove 16 is provided on the inner wall of the semi-open circular groove 15 near the bottom. A circular piece 20 is provided in the lower retaining groove 16. A stud 21 is connected to the top of the circular piece 20. A nut 22 is sleeved on the outer periphery of the top of the stud 21. A rubber limiting block 18 is also provided in the semi-open circular groove 15. The rubber limiting block 18 is sleeved on the outer periphery of the stud 21.

[0028] In use, the rubber limiting block 18 is pre-fixed by inserting the circular piece 20 into the lower slot 16, and then the rubber limiting block 18 is embedded in the semi-open circular groove 15. The nut 22 is tightened so that the heat sink bracket is locked between the nut 22 and the rubber limiting block 18, thus achieving efficient heat dissipation for the CPU7. This motherboard has good heat dissipation and better stability during use.

[0029] For example, such as Figure 5 As shown, the present invention also includes a limiting protrusion 19 on the periphery of the rubber limiting block 18, and an upper slot 17 is provided on the inner wall of the semi-open circular groove 15 near the upper end of the lower slot 16, and the limiting protrusion 19 is engaged in the upper slot 17.

[0030] In use, the upper slot 17 can be used to limit the limiting protrusion 19, thereby making it easy to fix the rubber limiting block 18 in the semi-open circular groove 15.

[0031] For example, such as Figure 5 and 6 As shown, the present invention also includes a first convex cover 5 disposed on the heat spreader 2 at a position corresponding to the inductor 13 and the capacitor 14, and a second convex cover 6 disposed on the heat spreader 2 at a position corresponding to the flash memory chip 12.

[0032] In use, the first convex cover 5 facilitates better contact between the heat spreader 2 and the part of the circuit board body 1 near the inductor 13 and capacitor 14, and the second convex cover 6 facilitates better contact between the heat spreader 2 and the part of the circuit board body 1 near the flash memory chip 12.

[0033] For example, such as Figure 2 As shown, the present invention also includes a second screw 4 provided through a reserved hole on the outer wall of the heat spreader 2 near the corner, a first screw 3 provided through a reserved hole on the outer wall of the heat spreader 2 near the corner of the rectangular groove 8, and a circular pad 10 provided on the outer wall of the circuit board body 1 at the corresponding positions of the first screw 3 and the second screw 4, and a threaded groove 11 provided on the circular pad 10.

[0034] In use, by tightening the first screw 3 and the second screw 4, the first screw 3 and the second screw 4 cooperate with the corresponding threaded groove 11 to easily lock and fix the heat spreader 2 to one side of the circuit board body 1.

[0035] For example, such as Figure 3 As shown, the present invention also includes a strip groove 9 at the bottom of the rectangular groove 8 that communicates with one side of the heat spreader 2.

[0036] During use, the strip groove 9 allows the heat spreader 2 to have a certain degree of freedom of deformation when subjected to stress, making it less prone to rigid damage.

[0037] For example, such as Figure 1-3 As shown, the present invention also includes an epoxy resin flame retardant layer on the outer surface of the circuit board body 1.

[0038] When in use, the epoxy resin flame retardant layer can effectively improve the flame retardant effect of the outer surface of the circuit board body 1, which is conducive to improving the reliability of the circuit board body 1 during use.

[0039] In use, the circuit board body 1 of this invention is also provided with other interfaces and modules related to smart homes, which are used to realize the basic control and communication functions of the smart home host motherboard.

[0040] By inserting the circular piece 20 into the lower slot 16, the rubber limiting block 18 is pre-fixed. Then, by embedding the rubber limiting block 18 into the semi-open circular groove 15, the rubber limiting block 18 limits the stud 21 at the top of the circular piece 20. The hole on the external heatsink mounting bracket passes through the rubber limiting block 18. After tightening the nut 22, the heatsink bracket is locked between the nut 22 and the rubber limiting block 18. At this point, the bottom of the heatsink contacts the top of the CPU 7, achieving efficient heat dissipation for the CPU 7.

[0041] Furthermore, thermally conductive silicone pads can be pre-laid on the inner walls of the first convex cover 5 and the second convex cover 6. When the first screw 3 and the second screw 4 are tightened, so that the circuit board body 1 is in close contact with the heat spreader 2, the thermally conductive silicone pads come into contact with the flash memory chip 12, the inductor 13 and the capacitor 14. This allows the heat generated by the flash memory chip 12, the inductor 13 and the capacitor 14 during operation to be uniformly conducted through the heat spreader 2. Thus, the heat spreader 2 can provide auxiliary heat dissipation for other parts of the motherboard. The motherboard has good heat dissipation effect and better stability during use.

[0042] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A highly stable smart home host motherboard, characterized in that, The circuit board includes a main body (1), a heat spreader (2), a CPU (7), a flash memory chip (12), an inductor (13), and a capacitor (14). The CPU (7) is disposed near the center of the main body (1), and the flash memory chip (12), inductor (13), and capacitor (14) are also disposed on the main body (1). A heat spreader plate (2) is provided on one side of the circuit board body (1). A rectangular groove (8) is provided through one side of the heat spreader plate (2) at the position corresponding to the CPU (7). A semi-open circular groove (15) is provided on the inner wall of the rectangular groove (8) near the corner. A lower slot (16) is provided on the inner wall of the semi-open circular groove (15) near the bottom. A circular piece (20) is provided in the lower slot (16). A stud (21) is connected to the top of the circular piece (20). A nut (22) is sleeved on the outer periphery of the top of the stud (21). A rubber limiting block (18) is also provided in the semi-open circular groove (15). The rubber limiting block (18) is sleeved on the outer periphery of the stud (21).

2. The highly stable smart home host motherboard according to claim 1, characterized in that, The rubber limiting block (18) is provided with a limiting protrusion (19) on its periphery. The inner wall of the semi-open circular groove (15) is provided with an upper groove (17) near the upper end of the lower groove (16). The limiting protrusion (19) is engaged in the upper groove (17).

3. The highly stable smart home host motherboard according to claim 1, characterized in that, A first convex cover (5) is provided on the heat spreader (2) at the position corresponding to the inductor (13) and capacitor (14), and a second convex cover (6) is provided on the heat spreader (2) at the position corresponding to the flash memory chip (12).

4. The highly stable smart home host motherboard according to claim 1, characterized in that, The outer wall of the heat spreader (2) is provided with a second screw (4) through a reserved hole near the corner. The outer wall of the heat spreader (2) is provided with a first screw (3) through a reserved hole near the corner of the rectangular groove (8). The outer wall of the circuit board body (1) is provided with a circular pad (10) at the corresponding position of the first screw (3) and the second screw (4). The circular pad (10) is provided with a threaded groove (11).

5. A highly stable smart home host motherboard according to claim 1, characterized in that, The bottom of the rectangular groove (8) is provided with a strip groove (9) that communicates with one side of the heat spreader (2).

6. A highly stable smart home host motherboard according to claim 1, characterized in that, The outer surface of the circuit board body (1) is provided with an epoxy resin flame retardant layer.

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