Packaging frame of power module, power module and inverter
By integrating components such as the package cover, gate pins, electrode bus, and bushing into a single package frame, the assembly complexity caused by the large number of components in traditional power modules is solved, thereby improving the reliability and stability of the power module.
Patent Information
- Application Number
- CN202520333015.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-02-27
AI Technical Summary
Traditional power modules have many components and a complex assembly process, which makes them prone to errors during assembly, affecting reliability and stability.
The package cover, gate pins, electrode busbars and bushings are integrated into a single package frame to form a stable integrated component. The stability and reliability of the component are improved by one-time injection molding.
It effectively solves the problem of complex assembly caused by numerous components, improves the reliability and stability of the power module, and simplifies the assembly process.
Smart Images
Figure CN223872756U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of automobile parts, and concretely relates to a packaging frame of power module, power module and inverter. BACKGROUND
[0002] The power module is the main functional component of the automobile inverter, and the reliability and stability of the power module affect the working performance of the inverter. Traditionally, the packaging cover of the power module is formed as a separate component, and the grid pins, electrode bus bars and other components of the power module need to be assembled separately in the assembly process of the power module, resulting in a large number of components of the power module, a complex assembly process, and errors in the assembly process, which affect the reliability and stability of the power module.
[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the utility model, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY
[0004] Therefore, the utility model provides a packaging frame of power module, power module and inverter, which integrates the packaging cover, grid pins, electrode bus bars, bushings and other components into a packaging frame to form an integrated component, effectively solves the problem of errors in the assembly process caused by a large number of components and a complex assembly process of the power module, and ensures the reliability and stability of the power module.
[0005] According to one aspect of the utility model, a packaging frame of power module is provided, which comprises: a packaging cover; a plurality of grid pins, each grid pin having a first end exposed to the packaging cover, a body embedded in the packaging cover, and a second end exposed to the surface of the packaging cover; a plurality of electrode bus bars, each electrode bus bar having a first end exposed to the packaging cover, a body embedded in the packaging cover, and a second end exposed to the surface of the packaging cover; and a plurality of bushings, the packaging cover being provided with a plurality of mounting holes, the plurality of bushings being respectively embedded in the plurality of mounting holes, and each bushing providing a mounting space.
[0006] In some embodiments, the grid pin has a flat body and protrusions at both ends of the body; and the packaging cover is provided with a first through hole exposing the second end of the grid pin.
[0007] In some embodiments, the electrode bus bar has a flat body and protrusions at both ends of the body; and the packaging cover is provided with a second through hole exposing the second end of the electrode bus bar.
[0008] In some embodiments, the plurality of bushings comprises a plurality of threaded bushings, the outer wall of each threaded bushing being in interference fit with the corresponding mounting hole and the inner wall providing a threaded mounting space.
[0009] In some embodiments, the plurality of bushings comprises a plurality of anti-rotation bushings, an outer wall of each anti-rotation bushing is provided with rough lines to prevent rotation with the corresponding mounting hole, and an inner wall provides an interference mounting space.
[0010] In some embodiments, the packaging cover is made of plastic, and / or the gate pin and the electrode bus bar are made of a metal material containing copper, and / or the bushing is made of steel.
[0011] In some embodiments, the gate pin, the electrode bus bar and the bushing are integrally injection molded with the packaging cover.
[0012] In some embodiments, the electrode bus bar is a direct current positive bus bar, and the plurality of gate pins and the plurality of electrode bus bars are respectively used to connect a plurality of groups of power units of the power module.
[0013] According to another aspect of the present application, a power module is provided, which is configured with the packaging frame according to any of the above embodiments, wherein the power module comprises a plurality of groups of power units, and the plurality of gate pins and the plurality of electrode bus bars are respectively used to connect the plurality of groups of power units.
[0014] According to still another aspect of the present application, an inverter is provided, which is configured with the power module according to any of the above embodiments.
[0015] The present application has at least the following beneficial effects compared with the prior art:
[0016] The present application integrates the packaging cover, the gate pin, the electrode bus bar, the bushing and other components into a packaging frame to form an integrated component, effectively solves the problem that the power module is prone to errors during assembly due to the large number of components and the complex assembly process, and ensures the reliability and stability of the power module.
[0017] The packaging cover is used for covering the circuit board of the power module. The gate pin is used for leading out the gate signal of the chip unit in the circuit board. The first end of the gate pin is exposed outside the packaging cover, the body is embedded in the packaging cover, and the second end is exposed outside the surface of the packaging cover. The gate pin is stably embedded in the packaging cover, and the chip unit is connected through the second end and the gate signal is led out through the first end. The electrode bus bar is used for leading out the electrode signal of the chip unit. The first end of the electrode bus bar is exposed outside the packaging cover, the body is embedded in the packaging cover, and the second end is exposed outside the surface of the packaging cover. The electrode bus bar is stably embedded in the packaging cover, and the chip unit is connected through the second end and the electrode signal is led out through the first end. The mounting hole is used for connecting the packaging cover with the circuit board of the power module and other components and with other components of the inverter. The bushing is embedded in the mounting hole and is used for reducing the friction between the connecting piece and the mounting hole, protecting the connecting piece and the mounting hole, and realizing anti-rotation and stability.
[0018] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the utility model. BRIEF DESCRIPTION OF DRAWINGS
[0019] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the utility model and, together with the specification, serve to explain the principles of the utility model. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.
[0020] Figure 1 A front perspective structural schematic view of the packaging frame in the embodiment of the utility model is shown.
[0021] Figure 2 A back perspective structural schematic view of the packaging frame in the embodiment of the utility model is shown.
[0022] Figure 3 An explosion structural schematic view of the packaging frame in the embodiment of the utility model is shown.
[0023] Figure 4 A perspective structural schematic view of the gate pin in the embodiment of the utility model is shown.
[0024] Figure 5 A perspective structural schematic view of the electrode bus bar in the embodiment of the utility model is shown. DETAILED DESCRIPTION
[0025] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein. Rather, these implementations are provided as non-limiting examples, so that this disclosure will fully convey the scope of the application to those skilled in the art.
[0026] The accompanying drawings are included to provide a further understanding of the application, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.
[0027] The terms "first", "second", and similar terms do not denote any order, quantity, or importance, but are used to distinguish one element from another, and the terms "front", "rear", etc., indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship shown in the drawings, and are used only to facilitate the description of the application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application. The term "a plurality of" means two or more, unless otherwise explicitly specified and limited. In addition, in the description of the application, unless otherwise explicitly specified and limited, the term "connected" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two elements.
[0028] It should be noted that the features of the embodiments of the application and different embodiments can be combined with each other without conflict.
[0029] Figure 1 schematically shows the front perspective structure of the packaging frame, Figure 2 schematically shows the back perspective structure of the packaging frame, Figure 3 schematically shows the explosion structure of the packaging frame; in combination Figures 1 to 3 The packaging frame of the power module provided by the embodiments of the application comprises:
[0030] a packaging cover 10;
[0031] a plurality of gate pins 20, a first end 21 of each gate pin 20 being exposed to the packaging cover 10, a body 22 being embedded in the packaging cover 10, and a second end 23 being exposed to the surface of the packaging cover 10;
[0032] a plurality of electrode bus bars 30, a first end 31 of each electrode bus bar 30 being exposed to the packaging cover 10, a body 32 being embedded in the packaging cover 10, and a second end 33 being exposed to the surface of the packaging cover 10;
[0033] A plurality of bushings 40, the packaging cover 10 is provided with a plurality of mounting holes 14, the plurality of bushings 40 are respectively embedded in the plurality of mounting holes 14, and each bushing 40 provides a mounting space.
[0034] The utility model discloses an integrated packaging cover 10, gate pin 20, electrode busbar 30, bushing 40 and other components into a packaging frame, forming an integral component, effectively solve the problem that the power module is caused by many components, the assembly process is complicated and leads to the error in the assembly process, ensure the reliability and stability of power module.
[0035] Wherein, the packaging cover 10 is used for being arranged on the circuit board of power module. The gate pin 20 is used for leading out the gate signal of chip unit in the circuit board, and the first end 21 of the gate pin 20 is exposed to the packaging cover 10, the body 22 is embedded in the packaging cover 10, and the second end 23 is exposed to the surface of the packaging cover 10, so that the gate pin 20 is stably embedded in the packaging cover 10, and the chip unit is connected through the second end 23 and the gate signal is led out through the first end 21. The electrode busbar 30 is used for leading out the electrode signal of chip unit, and the first end 31 of the electrode busbar 30 is exposed to the packaging cover 10, the body 32 is embedded in the packaging cover 10, and the second end 33 is exposed to the surface of the packaging cover 10, so that the electrode busbar 30 is stably embedded in the packaging cover 10, and the chip unit is connected through the second end 33 and the electrode signal is led out through the first end 31. Wherein, the electrode of chip unit, for example, includes source, drain, collector, emitter, etc. The mounting hole 14 is used for connecting the packaging cover 10 with the circuit board of power module and other components, and with the other components of inverter, and the bushing 40 is embedded in the mounting hole 14, for reducing the friction between the connecting piece and the mounting hole 14, protecting the connecting piece and the mounting hole 14, and realizing anti-rotation and stability.
[0036] Figure 4 The three-dimensional structure of the gate pin is shown, and the three-dimensional structure of the electrode busbar is shown. Figures 1 to 4 As shown in some embodiments, the gate pin 20 has a flat body 22 and protrudes at both ends (the first end 21 and the second end 23) of the body 22, and the packaging cover 10 is provided with a first through hole 11 exposing the second end 23 of the gate pin 20.
[0037] Through the flat body 22, the gate pin 20 is stably embedded in the packaging cover 10. The second end 23 of the gate pin 20 protrudes from the body 22 and is exposed through the first through hole 11 of the packaging cover 10, so as to connect the chip unit. The first end 21 of the gate pin 20 protrudes from the body 22 and is exposed from the packaging cover 10, specifically, can extend from the side of the packaging cover 10, so as to be connected with other components of the inverter.
[0038] Figure 5 The three-dimensional structure of the gate pin is shown, and the three-dimensional structure of the electrode busbar is shown. Figures 1 to 3 ,Figure 5 As shown, in some embodiments, the electrode bus 30 has a flat body 32 and two protrusions (first end 31 and second end 33) on the body 32; the encapsulation cover 10 is provided with a second through hole 12 exposing the second end 33 of the electrode bus 30.
[0039] The electrode bus 30 is stably embedded in the package cover 10 through the flat body 32. The second end 33 of the electrode bus 30 protrudes from the body 32 and is exposed through the second through-hole 12 of the package cover 10 for connection to the chip unit. The first end 31 of the electrode bus 30 protrudes from the body 32 and is exposed outside the package cover 10, specifically extending from the side of the package cover 10 for connection to other components of the inverter.
[0040] Combination Figure 1 and Figure 3 As shown, in some embodiments, the plurality of bushings 40 include a plurality of threaded bushings 40a, the outer wall of each threaded bushing 40a being interference-fitted with a corresponding mounting hole 14a and the inner wall providing threaded mounting space. The plurality of bushings 40 also include a plurality of anti-rotation bushings 40b, the outer wall of each anti-rotation bushing 40b being provided with rough texture to anti-rotate with a corresponding mounting hole 14b and the inner wall providing interference mounting space.
[0041] The threaded bushing 40a is used to connect the encapsulation cover 10 to other components of the inverter. The outer wall of the threaded bushing 40a is interference-fitted with the corresponding mounting hole 14a, and the inner wall provides threaded mounting space, so that the encapsulation cover 10 is securely connected to the corresponding component of the inverter and prevents loosening.
[0042] The anti-rotation bushing 40b is used to connect the package cover 10 to the circuit board and other components of the power module. The anti-rotation bushing 40b's outer wall fits into the corresponding mounting hole 14b, and its inner wall provides interference fit space, ensuring a secure connection between the package cover 10 and the corresponding component of the power module and preventing loosening.
[0043] In some embodiments, the encapsulation cap 10 may be made of plastic, such as suitable materials like PBT-GF30 or PPS-GF30. PBT-GF30 is a reinforced engineering plastic, a composite material made of PBT (polybutylene terephthalate) with 30% glass fiber (GF), and PPS-GF30 is a composite material made of PPS (polyphenylene sulfide) with 30% glass fiber (GF). Both possess high strength and impact resistance. The gate pin 20 and electrode bus 30 may be made of copper-containing metal materials. For example, the gate pin 20 may be made of CuNiSi or CuSn6, and the electrode bus 30 may be made of Cu-ETP. CuNiSi is an alloy composed of copper (Cu), nickel (Ni), and silicon (Si), possessing high conductivity, high strength, and corrosion resistance. CuSn6 is tin bronze, possessing high wear resistance and antimagnetic properties. Cu-ETP is a copper or pure copper material with high electrical and thermal conductivity, good corrosion resistance, and good processing performance. Bushing 40 can be made of steel, which has high strength and stability.
[0044] In some embodiments, the gate pin 20, electrode bus 30, and bushing 40 are injection molded together with the package cover 10 in a single process. This single injection molding of the package frame using plastic and metal offers advantages such as high efficiency, good injection molding effect, high positioning accuracy of each component, and good stability. This ensures a tight fit between the gate pin 20, electrode bus 30, and bushing 40 and the package cover 10, forming a high-performance package frame.
[0045] In some embodiments, the electrode bus 30 is a DC positive busbar, and the plurality of gate pins 20 and the plurality of electrode buses 30 are respectively used to connect multiple power units of the power module. Depending on the design requirements, the electrode bus 30 can also be a DC negative busbar and an AC busbar.
[0046] This utility model embodiment also provides a power module, which is configured with a packaging frame as described in any of the above embodiments. The power module includes multiple power units, and multiple gate pins 20 and multiple electrode buses 30 of the packaging frame are respectively used to connect the multiple power units.
[0047] This utility model integrates components such as the package cover 10, gate pin 20, electrode bus 30, and bushing 40 into a package frame, forming an integrated component. This effectively solves the problem of easy errors during the assembly process of power modules due to the large number of components and the complexity of the assembly process, ensuring the reliability and stability of the power module.
[0048] This invention also provides an inverter equipped with the aforementioned power module. The integrated packaging frame of this invention facilitates the assembly of the power module with the inverter, improving the inverter's reliability and stability.
[0049] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.
Claims
1. A packaging frame for a power module, characterized in that, include: Encapsulation cap; Multiple gate pins, each gate pin having a first end exposed outside the package cover, a body embedded in the package cover, and a second end exposed on the surface of the package cover; Multiple electrode busbars, each electrode busbar having a first end exposed outside the encapsulation cover, a body embedded in the encapsulation cover, and a second end exposed on the surface of the encapsulation cover; Multiple bushings are provided, and the encapsulation cover is provided with multiple mounting holes. The multiple bushings are respectively embedded in the multiple mounting holes, and each bushing provides mounting space.
2. The packaging frame as described in claim 1, characterized in that, The gate pin has a flat body and protrusions at both ends of the body; The package cover has a first through-hole that exposes the second end of the gate pin.
3. The packaging frame as described in claim 1, characterized in that, The electrode busbar has a flat body and two protrusions at both ends of the body; The encapsulation cover is provided with a second through hole that exposes the second end of the electrode busbar.
4. The encapsulation frame as described in claim 1, characterized in that, The plurality of bushings includes a plurality of threaded bushings, each threaded bushing having an outer wall that is interference-fitted with a corresponding mounting hole and an inner wall that provides space for threaded installation.
5. The packaging frame as described in claim 1, characterized in that, The plurality of bushings includes a plurality of anti-rotation bushings, each anti-rotation bushing having a rough textured outer wall to anti-rotate with a corresponding mounting hole and an inner wall providing interference fit space.
6. The packaging frame as described in claim 1, characterized in that, The encapsulation cover is made of plastic, and / or the gate pins and the electrode bus are made of copper-containing metal, and / or the bushing is made of steel.
7. The packaging frame as described in claim 1, characterized in that, The gate pin, the electrode bus, the bushing, and the package cover are injection molded in one piece.
8. The packaging frame as described in claim 1, characterized in that, The electrode bus is a DC positive busbar, and the plurality of gate pins and the plurality of electrode buses are respectively used to connect multiple power units of the power module.
9. A power module, characterized in that, The power module is configured with a packaging frame as described in any one of claims 1-8, wherein the power module includes multiple power units, and the multiple gate pins and the multiple electrode buses are respectively used to connect the multiple power units.
10. An inverter, characterized in that, The inverter is equipped with the power module as described in claim 9.