Edge grinding machine for wafer processing

Abstract

The utility model relates to the technical field of wafer processing, and discloses an edge grinding machine for wafer processing, which comprises a processing table, a first motor is fixedly arranged on one side of the bottom of the processing table, the output end of the first motor is fixedly connected with a supporting disc, a frosted layer is arranged outside the supporting disc, frosted particles are arranged outside the frosted layer, and the first motor is fixedly connected with the supporting disc. Universal wheels are arranged at the bottom of the supporting disc, an electric sliding rail is fixedly installed on the other side of the bottom of the machining table, and the output end of the electric sliding rail is fixedly connected with a moving block. Compared with the prior art, the wafer edge grinding device has the advantages that the second motor drives the suction cup and the wafer to rotate, the rotation direction of the supporting disc and the grinding layer is opposite to the rotation direction of the suction cup and the wafer, then the grinding layer can rub the wafer, the edge grinding effect on the wafer is achieved, automatic edge grinding can be conducted on the wafer in the process, and the production efficiency is improved. And the edge grinding efficiency of the wafer is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, especially a kind of edge grinding machine of wafer processing. BACKGROUND

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuit, since its shape is circular, it is called wafer, and wafer is an important basic material of semiconductor industry, in the semiconductor manufacturing process, various integrated circuits complex circuits and devices will be gradually formed on wafer through a series of process steps.

[0003] In the prior art, such as the new wafer edge grinding wheel disclosed in patent announcement No.CN217596846U, it relates to the technical field of wafer edge grinding wheel, and its technical points are: the edge grinding wheel base disc is provided with a mounting hole in the center, the circumference of the edge grinding wheel base disc is provided with a grinding ring, the grinding ring is provided with a plurality of annular grinding grooves, the grinding ring is provided with a reserved ring on one side, and a plurality of anti-skid grooves are arranged in the mounting hole; the utility model can reduce the replacement frequency and improve the work efficiency.

[0004] However, the existing wafer needs to be held by the staff during edge grinding, and the edge grinding effect can be achieved by rubbing on the grinding wheel of the edge grinding machine, so the edge grinding efficiency is low, and therefore improvement is needed. UTILITY MODEL CONTENT

[0005] The utility model aims to provide an edge grinding machine for wafer processing, which has high edge grinding efficiency.

[0006] The above technical purpose of the utility model is realized by the following technical scheme: an edge grinding machine for wafer processing, comprising a processing table, a first motor is fixedly installed on one side of the bottom of the processing table, a support disc is fixedly connected to the output end of the first motor, a grinding layer is arranged outside the support disc, grinding particles are arranged outside the grinding layer, universal wheels are arranged at the bottom of the support disc, an electric sliding rail is fixedly installed on the other side of the bottom of the processing table, a moving block is fixedly connected to the output end of the electric sliding rail, a second motor is fixedly installed at the bottom of the moving block, a track is fixedly connected to the top of the processing table, a sliding block is slidably connected inside the track, a pulley is rotatably connected to the inner side of the sliding block, a suction disc is rotatably connected to the center of the sliding block, and a wafer is arranged on the top of the suction disc.

[0007] By adopting the technical scheme, when the wafer is edge polished, the wafer is placed above the suction cup, the wafer is adsorbed by the suction cup, then the electric sliding rail is started, the electric sliding rail drives the second motor to displace, the output end of the second motor penetrates into the inside of the sliding block and is fixedly connected with the suction cup, the sliding block is displaced in the inside of the track during the displacement of the second motor, so that the wafer on the top of the suction cup can be displaced to the outside of the grinding layer, when the wafer contacts the grinding layer, the first motor is started, the first motor drives the support disc and the grinding layer to rotate, the second motor drives the suction cup and the wafer to rotate, the rotating directions of the support disc and the grinding layer and the suction cup and the wafer are opposite, so that the grinding layer can rub the wafer, the wafer is edge polished, the wafer can be automatically edge polished, and the wafer edge polishing efficiency is greatly improved.

[0008] The utility model further provides: the number of universal wheel is four, and four universal wheel is in the form of annular array distribution.

[0009] By adopting the technical scheme, four universal wheels are distributed in four directions of the support disc, and the support disc is supported by the four universal wheels when rotating.

[0010] The utility model further provides: the number of pulley is four, and four pulley is in the form of rectangular array distribution.

[0011] By adopting the technical scheme, four pulleys are respectively rotationally connected to the left and right sides of the sliding block, and the four pulleys are respectively in contact with the inner wall of the track, so that the smoothness of the sliding block in the sliding process is improved.

[0012] The utility model further provides: the center of processing table bottom is fixedly connected with the protection box.

[0013] By adopting the technical scheme, the second motor, the electric sliding rail and the first motor are covered by the protection box, and the protection box protects them.

[0014] The utility model further provides: the both sides of processing table outside are all overlapped with the protection board, and the inside of protection board is screw threaded with screw pin.

[0015] By adopting the technical scheme, the screw pin is screw threaded to the inside of the protection board, so that the screw pin extends to the inside of the processing table, and the protection board can be installed to the left and right sides of the top of the processing table.

[0016] The utility model further provides: the number of protection board is two, and two protection board is mutually symmetrical.

[0017] By adopting the above technical solution, two protective plates are distributed on both sides of the wafer. When the wafer is being ground, the sparks and debris generated are blocked by the protective plates to prevent sparks and debris from splashing out.

[0018] A further feature of this invention is that the interior of each processing table is provided with a cavity, and a mounting block is fixedly connected inside the cavity, with an isolation net attached to the top of the mounting block.

[0019] By adopting the above technical solution, the isolation net is attached to the top of the block, thereby allowing the isolation net to be installed in the cavity inside the processing table. When the debris generated during the edge grinding process comes into contact with the protective plate, the debris is bounced back into the isolation net inside the cavity, and the debris is collected by the isolation net.

[0020] A further feature of this invention is that the number of isolation nets is two, and each of the two isolation nets has a handle fixedly connected to its top.

[0021] By adopting the above technical solution, the isolation net can be easily removed from the cavity by holding the handle.

[0022] A further feature of this invention is that: a base is fixedly connected to both sides of the bottom of the processing table, and a reinforcing plate is fixedly connected to one side of the base.

[0023] By adopting the above technical solution, the base is distributed on both sides of the bottom of the processing table, thereby supporting the processing table. The reinforcing plate is fixed between the two bases to enhance the stability of the base.

[0024] A further feature of this invention is that heat dissipation holes are provided on both sides of the protective box.

[0025] By adopting the above technical solution, the heat dissipation holes are used to expel the hot air inside the protective box, thereby dissipating heat from the second motor, the electric slide rail, and the first motor.

[0026] The beneficial effects of this utility model are:

[0027] 1. The utility model, through the setting between processing table, first motor, support disc, frosted layer, universal wheel, electric slide rail, second motor, track, sliding block, pulley and sucking disc, when the edge of wafer is ground, the wafer is placed into the top of sucking disc, the wafer is adsorbed through sucking disc, then starts electric slide rail, makes electric slide rail drive second motor to displace, the output of second motor penetrates to the inside of sliding block and is fixedly connected with sucking disc, when second motor displaces, will drive sliding block to displace in the inside of track, further makes the wafer of sucking disc top can displace to the outside of frosted layer, when wafer contacts frosted layer, starts first motor, makes first motor drive support disc and frosted layer rotate, and second motor drives sucking disc and wafer to rotate, and the direction of support disc and frosted layer is opposite to the direction of sucking disc and wafer, further makes frosted layer can rub wafer, reaches the effect that the edge of wafer is ground, can automatically grind the edge of wafer in this process, greatly improves the edge grinding efficiency of wafer.

[0028] 2. The utility model discloses a protective plate, screw pin, cavity, block, isolation net and handle between the setting of being connected to the inside of protective plate with screw pin thread, make screw pin extend to the inside of processing table, further can install protective plate to the left and right sides on the top of processing table, two protective plates distribute on the both sides of wafer, when the edge of wafer is ground, the spark and debris generated are blocked through protective plate, prevent the spark and debris from spattering, the isolation net is overlapped to the top of block, further make isolation net be installed in the cavity in the inside of processing table, after the debris generated in the edge grinding process contacts protective plate, the debris is bounced to the isolation net in the inside of cavity, collects the debris through isolation net. ACCURACY

[0029] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the following will briefly introduce the drawing needed to be used in embodiment description, obviously, the drawing in the following description only is some embodiments of the utility model, for ordinary skilled person in the art, under the premise of not paying creative labor, still can obtain other drawings according to these drawings.

[0030] Figure 1 It is the structure schematic diagram of the utility model;

[0031] Figure 2 It is the side view structure schematic diagram of the utility model;

[0032] Figure 3 It is the overhead view structure schematic diagram of the track inside the utility model;

[0033] Figure 4 It is the side view structure schematic diagram of the cavity inside the utility model.

[0034] In the figure, 1, processing platform; 2, first motor; 3, support disc; 4, frosted layer; 5, universal wheel; 6, electric slide rail; 7, second motor; 8, track; 9, sliding block; 10, pulley; 11, suction cup; 12, wafer; 13, protective box; 14, protective plate; 15, screw pin; 16, cavity; 17, block; 18, isolation net; 19, handle; 20, base; 21, reinforcing plate; 22, heat dissipation hole. DETAILED DESCRIPTION

[0035] The technical scheme of the present application will be described clearly and completely in combination with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0036] REFERENCE Figures 1-4The utility model provides a kind of wafer processing's edge grinding machine, including processing table 1, the bottom one side of processing table 1 is fixedly installed with first motor 2, the output of first motor 2 is fixedly connected with support disc 3, the outside of support disc 3 is provided with sanding layer 4, the outside of sanding layer 4 is provided with sanding particle, the bottom of support disc 3 is provided with universal wheel 5, the bottom other side of processing table 1 is fixedly installed with electric slide rail 6, the output of electric slide rail 6 is fixedly connected with moving block, the bottom of moving block is fixedly installed with second motor 7, the top of processing table 1 is fixedly connected with track 8, the inside of track 8 is slidably connected with sliding block 9, the inside of sliding block 9 is rotatably connected with pulley 10, the center of sliding block 9 is rotatably connected with suction disc 11, the top of suction disc 11 is provided with wafer 12, when edge grinding is carried out to wafer 12, wafer 12 is placed into the upper side of suction disc 11, wafer 12 is adsorbed by suction disc 11, then electric slide rail 6 is started, so that electric slide rail 6 drives second motor 7 to displace, the output of second motor 7 penetrates to the inside of sliding block 9 and is fixedly connected with suction disc 11, when second motor 7 displaces, sliding block 9 will displace in the inside of track 8, so that wafer 12 on the top of suction disc 11 can displace to the outside of sanding layer 4, when wafer 12 contacts sanding layer 4, first motor 2 is started, so that first motor 2 drives support disc 3 and sanding layer 4 to rotate, and second motor 7 drives suction disc 11 and wafer 12 to rotate, the direction of support disc 3 and sanding layer 4 is opposite to the direction of suction disc 11 and wafer 12, so that sanding layer 4 can rub wafer 12, reach the effect that wafer 12 is edge ground, wafer 12 can be automatically edge ground in this process, greatly improve the edge grinding efficiency of wafer 12, the number of universal wheel 5 is four, and four universal wheels 5 are distributed in the form of annular array, four universal wheels 5 are distributed in four directions of support disc 3, when support disc 3 rotates, support disc 3 is supported by four universal wheels 5, the number of pulley 10 is four, and four pulleys 10 are distributed in the form of rectangular array, four pulleys 10 are rotatably connected on the left and right sides of sliding block 9 respectively, four pulleys 10 are in contact with the inner wall of track 8 respectively, so as to improve the smoothness of sliding block 9 in sliding process, the center of the bottom of processing table 1 is fixedly connected with protection box 13, second motor 7, electric slide rail 6 and first motor 2 are covered by protection box 13, they are protected by protection box 13, the both sides of the outside of processing table 1 are all lapped with protective plate 14, the inside of protective plate 14 is threadedly connected with screw pin 15, screw pin 15 is threadedly connected to the inside of protective plate 14, so that screw pin 15 extends to the inside of processing table 1, so that protective plate 14 can be installed to the left and right sides of the top of processing table 1, the number of protective plate 14 is two, and two protective plates 14 are symmetrical, two protective plates 14 are distributed on the both sides of wafer 12, the sparks and debris generated when wafer 12 is edge ground are blocked by protective plate 14, to prevent sparks and debris from splashing, the inside of processing table 1 is all provided with cavity 16,The inside of the cavity 16 is fixedly connected with a block 17, the top of the block 17 is overlapped with an isolation net 18, the isolation net 18 is overlapped to the top of the block 17, so that the isolation net 18 is installed into the cavity 16 inside the processing table 1, the debris generated in the edging process is bounced to the isolation net 18 inside the cavity 16 after contacting the protective plate 14, the debris is collected through the isolation net 18, the number of the isolation net 18 is two, and the top of the two isolation nets 18 is fixedly connected with a handle 19, the isolation net 18 is taken out in the inside of the cavity 16 by holding the handle 19, which is more convenient, the bottom of the processing table 1 is fixedly connected with a base 20 on the two sides, one side of the base 20 is fixedly connected with a reinforcing plate 21, the base 20 is distributed on the two sides of the bottom of the processing table 1, so that the processing table 1 can be supported, the reinforcing plate 21 is fixed between the two bases 20, the firmness of the base 20 is strengthened, and the two sides of the protective box 13 are provided with heat dissipation holes 22, the heat dissipation holes 22 are used for exhausting hot air in the protective box 13, so that the second motor 7, the electric sliding rail 6 and the first motor 2 can be cooled.

[0037] In the utility model, when the wafer 12 is edged, the wafer 12 is placed into the upper side of the suction cup 11, the wafer 12 is adsorbed through the suction cup 11, then the electric sliding rail 6 is started, the electric sliding rail 6 drives the second motor 7 to displace, the output end of the second motor 7 penetrates into the inside of the sliding block 9 and is fixedly connected with the suction cup 11, when the second motor 7 displaces, the sliding block 9 will displace in the inside of the track 8, so that the wafer 12 on the top of the suction cup 11 can displace to the outside of the sanding layer 4, when the wafer 12 contacts the sanding layer 4, the first motor 2 is started, the first motor 2 drives the support disc 3 and the sanding layer 4 to rotate, and the second motor 7 drives the suction cup 11 and the wafer 12 to rotate, the rotating direction of the support disc 3 and the sanding layer 4 is opposite to that of the suction cup 11 and the wafer 12, so that the sanding layer 4 can rub the wafer 12, the effect that the wafer 12 is edged is achieved, the wafer 12 can be automatically edged in the process, the edging efficiency of the wafer 12 is greatly improved, the screw pin 15 is screw-connected into the inside of the protective plate 14, the screw pin 15 extends into the inside of the processing table 1, so that the protective plate 14 can be installed to the left and right sides on the top of the processing table 1, the two protective plates 14 are distributed on the two sides of the wafer 12, the sparks and the debris generated when the wafer 12 is edged are blocked through the protective plate 14, the sparks and the debris are prevented from splashing out, the isolation net 18 is overlapped to the top of the block 17, so that the isolation net 18 is installed into the cavity 16 inside the processing table 1, the debris generated in the edging process is bounced to the isolation net 18 inside the cavity 16 after contacting the protective plate 14, the debris is collected through the isolation net 18.

[0038] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A grinding machine for wafer processing, comprising a processing table (1), characterized in that: The bottom of the processing table (1) is fixedly installed with a first motor (2), the output end of the first motor (2) is fixedly connected with a support disc (3), the outside of the support disc (3) is provided with a frosted layer (4), the outside of the frosted layer (4) is provided with frosted particles, the bottom of the support disc (3) is provided with a universal wheel (5), the other side of the bottom of the processing table (1) is fixedly installed with an electric sliding rail (6), the output end of the electric sliding rail (6) is fixedly connected with a moving block, the bottom of the moving block is fixedly installed with a second motor (7), the top of the processing table (1) is fixedly connected with a track (8), the inside of the track (8) is slidably connected with a sliding block (9), the inner side of the sliding block (9) is rotatably connected with a pulley (10), the center of the sliding block (9) is rotatably connected with a suction disc (11), the top of the suction disc (11) is provided with a wafer (12).

2. The edge polisher for wafer processing as claimed in claim 1, wherein: The number of universal wheels (5) is four, and the four universal wheels (5) are distributed in the form of a ring array.

3. The edge polisher for wafer processing as claimed in claim 1, wherein: The number of pulleys (10) is four, and the four pulleys (10) are distributed in the form of a rectangular array.

4. The edge polisher for wafer processing as recited in claim 1, wherein: The bottom of the processing table (1) is fixedly connected with a protection box (13).

5. The edge polisher for wafer processing as recited in claim 1, wherein: Both sides of the outside of the processing table (1) are overlapped with a protection plate (14), the inside of the protection plate (14) is threadedly connected with a screw pin (15).

6. A wafer processing edger as claimed in claim 5, characterized in that: The number of protection plates (14) is two, and the two protection plates (14) are symmetrical to each other.

7. The edge polisher for wafer processing as recited in claim 1, wherein: The inside of the processing table (1) is provided with a cavity (16), the inside of the cavity (16) is fixedly connected with a clamping block (17), the top of the clamping block (17) is overlapped with an isolation net (18).

8. The edge polisher for wafer processing as claimed in claim 7, wherein: The number of isolation nets (18) is two, and the top of the two isolation nets (18) is fixedly connected with a handle (19).

9. The edge polisher for wafer processing as recited in claim 1, wherein: Both sides of the bottom of the processing table (1) are fixedly connected with a base (20), one side of the base (20) is fixedly connected with a reinforcing plate (21).

10. The edge polisher for wafer processing as recited in claim 4, wherein: Both sides of the protection box (13) are provided with heat dissipation holes (22).

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