Chemical mechanical polishing equipment

Abstract

The utility model discloses chemical mechanical polishing equipment which comprises a supporting structure and a limiting assembly, the supporting structure is arranged on the cavity wall of a wafer processing cavity where a trimmer is located, and the limiting assembly is arranged between a supporting part included by the trimmer and a swing arm included by the trimmer; the limiting assembly is used for being in contact with the supporting structure to limit the swing arm when the swing arm rotates to a limiting position with the position where the supporting part is located as the circle center, and the limiting position is used for indicating the rotation angle of the swing arm relative to the initial position when the distance between the far end of the swing arm and the cavity wall is smaller than a distance threshold value. By arranging the supporting structure and the limiting assembly, the swing arm rotating to the limit position can be limited, so that the swing arm cannot rotate to exceed the limit position even if the motor galloping rotating speed is suddenly out of control and the like, and the swing arm is prevented from impacting the internal structure of the machine table.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chemical mechanical polishing, and particularly relates to a chemical mechanical polishing device. BACKGROUND

[0002] A chemical mechanical polishing (CMP) device mainly carries a wafer to a polishing pad through a polishing head, and completes the planarization of the wafer surface under the joint action of mechanical friction and chemical reaction. In the polishing process, a dresser is needed to maintain the flatness of the polishing pad, and the dresser also plays the roles of removing waste liquid in the groove of the polishing pad, improving the surface roughness of the polishing pad and improving the flatness of the polishing pad.

[0003] During the running or debugging of the dresser, the motor may be suddenly out of control due to abnormal factors (abnormal control signal, strong interference signal generation, internal circuit abnormality of the servo driver), and the motor speed exceeds the highest speed and still does not stop. The reasons for the motor flying are basically that the controller is not powered normally, the controller is dead, the feedback data reception is not normal and the like. After the motor flying phenomenon occurs, the dresser may collide with the internal structure of the machine table, resulting in damage. SUMMARY

[0004] Therefore, the present application provides a chemical mechanical polishing device to at least partially solve the above technical problems.

[0005] The first aspect of the present application provides a chemical mechanical polishing device, comprising: a polishing head, a polishing pad, a liquid supply device, a dresser and a polishing disc arranged in a wafer processing chamber; the polishing disc is arranged at the center of the wafer processing chamber, the polishing pad is arranged on the polishing disc, the liquid supply device and the dresser are rotationally arranged at the outer periphery of the polishing disc, and the polishing head is movably arranged in the wafer processing chamber and used to move the wafer to abut against the polishing pad for polishing and move the wafer out of the polishing pad; the chemical mechanical polishing device further comprises: a support structure arranged on the cavity wall of the wafer processing chamber where the dresser is located, and a limiting component arranged between a support part included in the dresser and a swing arm included in the dresser; the limiting component is used to contact the support structure when the swing arm rotates to a limit position with the position where the support part is located as the center, so as to limit the swing arm, wherein the limit position is used to indicate that the distance between the distal end of the swing arm and the cavity wall is less than a distance threshold, and the angle of the swing arm relative to the initial position is rotated.

[0006] Optionally, the support structure can further comprise: a first support and a second support, the first support is fixedly installed on the cavity wall, and the second support is fixedly installed on the first support.

[0007] Optionally, the support structure further comprises: a pad block arranged on a surface of the second support member in contact with the limiting assembly; the pad block is used for being in contact with the limiting assembly when the swing arm rotates to the limit position with the position of the support part as the center, so as to limit the swing arm.

[0008] Optionally, the pad block comprises polyoxymethylene material, and the thickness of the pad block is [14mm, 15mm], the width of the pad block is [15mm, 17mm], and the length of the pad block is [45mm, 51mm].

[0009] Optionally, the limiting assembly comprises: a first sleeve and a second sleeve, a first end of the first sleeve corresponds to a first end of the second sleeve and can be sleeved with each other, and a second end of the first sleeve is fixedly connected with a second end of the second sleeve.

[0010] Optionally, the limiting assembly comprises: a first ring body and a second ring body; a first end of the first ring body is fixedly connected with a first end of the second ring body, a second end of the first ring body is provided with an internally threaded through hole, a second end of the second ring body is provided with an internally threaded blind hole, and the second end of the first ring body is connected with the second end of the second ring body through a bolt.

[0011] Optionally, an included angle between a plane where the second support member is located and a plane where the first support member is located is 45°.

[0012] Optionally, a surface of the first support member in contact with the cavity wall is trapezoidal, and a ratio of a length of an upper base of the surface of the first support member in contact with the cavity wall to a length of a lower base is 1:4, wherein the upper base and the lower base are arranged in sequence in a direction in which the limiting assembly moves to the second support member.

[0013] Optionally, the limiting assembly is provided with a protrusion; the protrusion is used for being in contact with the pad block when the swing arm rotates to the limit position with the position of the support part as the center, so as to limit the swing arm.

[0014] Optionally, the support structure comprises metal material.

[0015] The second aspect of the present application provides a chemical mechanical polishing device, comprising: a polishing head, a polishing pad, a liquid supply device, a trimmer, a polishing disc, a motor and a controller arranged in a wafer processing chamber; the polishing disc is arranged at the center of the wafer processing chamber, the polishing pad is arranged on the polishing disc, the liquid supply device and the trimmer are rotationally arranged at the outer periphery of the polishing disc, the polishing head is movably arranged in the wafer processing chamber, used for moving the wafer to abut against the polishing pad for polishing and moving the wafer out of the polishing pad; the chemical mechanical polishing device further comprises: a support structure arranged on the cavity wall of the wafer processing chamber where the trimmer is located, and a limiting component arranged between the support part included in the trimmer and the swing arm included in the trimmer; the motor is used to drive the swing arm to rotate with the position where the support part is located as the center; the limiting component is used to contact the support structure when the swing arm rotates to the limit position, so as to limit the swing arm and generate a stop signal, wherein the limit position is used to indicate the position where the distance between the distal end of the swing arm and the cavity wall of the wafer processing chamber is less than a distance threshold; the controller is used to control the motor to stop driving the swing arm in response to the stop signal.

[0016] Optionally, the chemical mechanical polishing device can further comprise: a pressure sensor arranged at one end of the limiting component towards the support part, the pressure sensor contacts the support structure when the swing arm rotates to the limit position; the pressure sensor is used to generate the stop signal when contacting the support structure.

[0017] Optionally, the pressure sensor is used to generate a pressure reading after contacting the support structure, and generate the stop signal when the pressure reading is greater than a pressure threshold.

[0018] Optionally, the pressure threshold is equal to 0.

[0019] By arranging the support structure and the limiting component, the swing arm rotating to the limit position can be limited, so that even if the motor suddenly loses control of the flywheel speed, the swing arm will not rotate beyond the limit position, thereby avoiding the swing arm colliding with the internal structure of the machine, and improving the operation safety of the chemical mechanical polishing device. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0021] Figure 1 is a schematic diagram of an exemplary scenario applicable to embodiments of the present application;

[0022] Figure 2 is a schematic diagram of another exemplary scenario applicable to embodiments of the present application;

[0023] Figure 3 is a schematic diagram of a chemical mechanical polishing apparatus according to an embodiment of the present application;

[0024] Figure 4 is a schematic diagram of a chemical mechanical polishing apparatus according to another embodiment of the present application;

[0025] Figure 5 is a schematic diagram of a chemical mechanical polishing apparatus according to yet another embodiment of the present application. DETAILED DESCRIPTION

[0026] In order to make persons skilled in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art should belong to the scope of protection of the embodiments of the present application.

[0027] The terms used in the present application are merely for the purpose of describing particular embodiments and are not intended to limit the present application. The singular forms "a," "an," and "the" used in the present application and its claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used in the present application means and includes any or all possible combinations of one or more associated listed items.

[0028] It should be understood that, although the terms first, second, third, etc. can be used in this application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one piece of information from another piece of information of the same type. For example, without departing from the scope of the present application, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information. Depending on the context, the word "if" as used herein can be interpreted as "when" or "upon determination" or "in response to determining".

[0029] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0030] Figure 1 A schematic diagram of an exemplary scenario applicable to embodiments of this application, such as... Figure 1 As shown, a chemical mechanical polishing (CMP) device may include: a polishing head 2, a polishing pad 3, a liquid supply device 4, a dressing device 5, and a polishing disc 6.

[0031] The polishing disk 6 is located at the center of the wafer processing chamber, the polishing pad 3 is located on the polishing disk 6, the liquid supply device 4 and the dressing device 5 are rotatably located on the outer periphery of the polishing disk 6, and the polishing head 2 is movably located in the wafer processing chamber for moving the wafer to contact the polishing pad 3 for polishing and removing the wafer from the polishing pad 3.

[0032] The polishing head 2 loads the wafer to be polished and places it against the polishing pad 3 above the polishing disk 6. During the polishing process, the liquid supply device 4 supplies polishing liquid to the polishing pad 3, and the polishing liquid flows between the wafer and the polishing pad 3 to aid in polishing. During the polishing process, the dresser 5 dresses the surface of the polishing pad 3.

[0033] However, during operation, the motor driving the dresser may experience sudden and uncontrolled speed fluctuations due to abnormal factors (abnormal control signals, strong interference signals, or internal circuit malfunctions in the servo driver). If the motor continues to exceed its maximum speed, the dresser may collide with the machine's internal structure. Figure 2 The cavity wall shown in the image may be damaged; it could even be shattered, compromising the sealing of the chemical mechanical polishing equipment and posing a serious hazard to the entire machine and personnel outside the machine.

[0034] Therefore, embodiments of this application provide a chemical mechanical polishing apparatus, such as... Figures 3-4As shown, the chemical mechanical polishing (CMP) equipment includes a support structure 11 and a limiting component 12. The support structure 11 is disposed on the cavity wall of the wafer processing chamber where the dresser 5 is located. The limiting component 12 is disposed between the support portion 51 and the swing arm 52 included in the dresser 5. The limiting component 12 is used to contact the support structure 11 when the swing arm 52 rotates to a limit position with the position of the support portion 51 as the center, thereby limiting the swing arm 52. The limit position is used to indicate the position where the distance between the distal end of the swing arm 52 and the cavity wall is less than a distance threshold. Specifically, the limit position can be the angle of rotation of the swing arm 52 relative to the initial position, or it can be the rotation distance of a certain position of the swing arm 52 relative to the initial position.

[0035] To limit the movement of the swing arm 52 of the dresser 5, a support structure 11 can be provided on the cavity wall of the wafer processing chamber, and a limiting component 12 can be installed between the support part 51 of the dresser 5 and the swing arm 52. The relative position of the limiting component 12 and the swing arm 52 is fixed. During the rotation of the swing arm 52 of the dresser 5, the limiting component 12 rotates with the swing arm 52 at the same angle. When the swing arm 52 rotates to the limit position, the limiting component 12 will contact the support structure 11. At this time, since the support structure 11 blocks the limiting component 12, the limiting component 12 cannot continue to rotate. Therefore, even if the swing arm 52 is driven by a motor, it cannot continue to rotate.

[0036] Specifically, such as Figure 5 As shown, the support structure 11 can be mounted on the bracket 71 included in the cavity wall. The straight line of the bracket 71 is perpendicular to the plane of the rotation path of the swing arm 52. Since the cavity wall is thin, the stability of the support structure 11 can be improved by mounting the support structure 11 on the bracket 71 included in the cavity wall. In addition, since the straight line of the bracket 71 is perpendicular to the plane of the rotation path of the swing arm 52, the bracket 71 can further improve the stability of the support structure 11 when the support structure 11 is subjected to the force of the limiting component 12.

[0037] Specifically, the support structure 11 is made of metal. By making the support structure 11 of metal, the support structure 11 can have higher strength.

[0038] In this embodiment of the application, by setting the support structure 11 and the limiting component 12, the swing arm 52 can be limited when it rotates to the limit position. Therefore, even if the motor speed suddenly goes out of control, the swing arm 52 will not rotate beyond the limit position, thereby avoiding the swing arm 52 from hitting the internal structure of the machine.

[0039] In one possible implementation, the support structure 11 includes a first support member 111 and a second support member 112, wherein the first support member 111 is fixedly installed on the cavity wall and the second support member 112 is fixedly installed on the first support member 111.

[0040] The support structure 11 can include two parts of a first support 111 and a second support 112. The first support 111 can be a flat plate structure and is directly fixed and installed on the cavity wall. The second support 112 can be fixed and installed on the first support 111 by means of a bolt or the like.

[0041] Specifically, the included angle between the plane where the second support 112 is located and the plane where the first support 111 is located can be 45°.

[0042] By setting the included angle between the plane where the second support 112 is located and the plane where the first support 111 is located to be 45°, the force applied by the limiting assembly 12 can be better conducted, thereby improving the crashworthiness of the support structure 11.

[0043] Specifically, the surface of the first support 111 in contact with the cavity wall is a trapezoid, and the ratio of the length of the upper base to the length of the lower base of the surface of the first support 111 in contact with the cavity wall is 1:4, wherein the upper base and the lower base are arranged in sequence in the direction in which the limiting assembly 12 moves towards the second support 112.

[0044] By setting the ratio of the length of the upper base to the length of the lower base of the surface of the first support 111 in contact with the cavity wall to be 1:4, the part of the first support 111 where the longer lower base is located can better support the second support 112 when the limiting assembly 12 applies force to the second support 112.

[0045] In the embodiments of the present application, by setting the first support 111 and the second support 112, the position of the second support 112 can be adjusted according to different trimmers, thereby adapting to more models of trimmers.

[0046] In one possible implementation, the support structure 11 can further include a pad 113, which is arranged on the surface of the limiting assembly 12 in contact with the second support 112. The pad 113 is used to contact the limiting assembly 12 when the swing arm 52 rotates to the limit position with the position where the support part 51 is located as the center, so as to limit the swing arm 52.

[0047] Specifically, the pad 113 is made of polyoxymethylene material, and the thickness of the pad 113 is in the range of [14mm, 15mm], the width of the pad 113 is in the range of [15mm, 17mm], and the length of the pad 113 is in the range of [45mm, 51mm].

[0048] For example, the thickness of the cushion block 113 can be 14.5 mm, the width can be 16 mm, and the length can be 48 mm. In this way, the cushion block 113 has sufficient compression space, and the cushion block 113 has sufficient width and length to ensure that the support structure 11 contacts the limiting assembly 12, and the limiting assembly 12 only contacts the cushion block 113, thereby protecting other devices.

[0049] Specifically, the limiting assembly 12 is provided with a protrusion. The protrusion is used to contact the cushion block 113 when the swing arm 52 rotates to the limit position with the position of the support part 51 as the center, so as to limit the swing arm 52.

[0050] By providing the protrusion on the limiting assembly 12 to contact the cushion block 113, the force of the swing arm 52 can be better transmitted to the support structure 11 through the limiting assembly 12, thereby improving the limiting effect of the swing arm 52.

[0051] In the embodiment of the present application, by providing the cushion block 113 on the surface of the limiting assembly 12 in contact with the second support 112, the cushion block 113 can better buffer the impact of the limiting assembly 12 and the support structure 11, thereby protecting the support structure 11 and the limiting assembly 12.

[0052] In addition, by cooperating the cushion block 113 and the support structure 11, the cushion block 113 buffers, and the angle between the plane where the second support 112 of the support structure 11 is located and the plane where the first support 111 is located can be 45°, which can disperse the force. The support structure 11 can also contact the cavity wall through the first support 111, and specifically can be fixedly connected with the support 71 of the cavity wall, to ensure the stability after being stressed. This layered shock absorption and force guaranteeing structure can effectively limit the movement range of the trimmer.

[0053] In a possible implementation manner, the limiting assembly 12 includes a first sleeve ring and a second sleeve ring. The first end of the first sleeve ring corresponds to the first end of the second sleeve ring and can be sleeved with each other. The second end of the first sleeve ring is fixedly connected with the second end of the second sleeve ring.

[0054] The limiting assembly 12 can be composed of the first sleeve ring and the second sleeve ring. The first sleeve ring and the second sleeve ring are sleeved at the connection between the swing arm 52 and the support part 51, and then the first end of the first sleeve ring is sleeved with the first end of the second sleeve ring, so that the installation of the limiting assembly 12 is completed.

[0055] In the embodiment of the present application, the limiting assembly 12 includes the first sleeve ring and the second sleeve ring, which can make the installation of the limiting assembly 12 more convenient.

[0056] In a possible implementation manner, the limiting assembly 12 includes a first ring body and a second ring body.

[0057] The first end of the first ring body is fixedly connected with the first end of the second ring body, the second end of the first ring body is provided with an internally threaded through hole, the second end of the second ring body is provided with an internally threaded blind hole, and the second end of the first ring body is connected with the second end of the second ring body through a bolt.

[0058] When the limiting assembly 12 is installed, the first ring body and the second ring body are sleeved at the connection between the swing arm 52 and the support part 51, then the bolt is placed in the internally threaded through hole and the internally threaded blind hole, and the installation of the limiting assembly 12 is completed after being tightened.

[0059] In the embodiment of the application, by adjusting the bolt, the distance between the second end of the first ring body and the second end of the second ring body can be controlled, and then the size of the area surrounded by the first ring body and the second ring body is controlled, so that the limiting assembly 12 can be adapted to multiple models of trimmers.

[0060] The embodiment of the application provides a chemical mechanical polishing device, which comprises a polishing head, a polishing pad, a liquid supply device, a trimmer, a polishing disc, a motor and a controller arranged in a wafer processing chamber. The polishing disc is arranged at the center of the wafer processing chamber, the polishing pad is arranged on the polishing disc, the liquid supply device and the trimmer are rotationally arranged at the outer periphery of the polishing disc, and the polishing head is movably arranged in the wafer processing chamber and used to move a wafer to abut against the polishing pad for polishing and move the wafer away from the polishing pad. The chemical mechanical polishing device further comprises a support structure and a limiting assembly. The support structure is arranged on the cavity wall of the wafer processing chamber where the trimmer is located, and the limiting assembly is arranged between the support part included in the trimmer and the swing arm included in the trimmer. The motor is used to drive the swing arm to rotate with the position where the support part is located as the center. The limiting assembly is used to contact the support structure when the swing arm rotates to a limit position, so as to limit the swing arm and generate a stop signal. The limit position is used to indicate a position where the distance between the distal end of the swing arm and the cavity wall of the wafer processing chamber is less than a distance threshold. The controller is used to control the motor to stop driving the swing arm in response to the stop signal.

[0061] The limit position is used to indicate a position where the distance between the distal end of the swing arm and the cavity wall is less than the distance threshold. Specifically, the limit position can be the angle of rotation of the swing arm relative to the initial position, or the rotation distance of a certain position of the swing arm relative to the initial position.

[0062] In order to limit the swing arm of the trimmer, a support structure can be provided on the cavity wall of the wafer processing chamber, and a limiting component is installed between the trimmer support part and the swing arm. The relative pose of the limiting component and the swing arm is fixed. During the rotation of the swing arm driven by the motor with the position where the support part is located as the center, the limiting component rotates at the same angle as the swing arm. When the swing arm rotates to the limit position, the limiting component will contact the support structure. At this time, the limiting component cannot continue to rotate because the support structure blocks it. Therefore, even if the swing arm is driven by the motor, it cannot continue to rotate. At the same time, the swing arm will generate a stop signal and send it to the controller. The controller will respond to the stop signal to control the motor to stop driving the swing arm, thereby avoiding the swing arm being limited while still being driven by the motor, which can cause damage to the corresponding equipment.

[0063] Specifically, the chemical mechanical polishing equipment further comprises a pressure sensor. The pressure sensor is arranged at one end of the limiting component facing the support part. When the swing arm rotates to the limit position, the pressure sensor contacts the support structure. The pressure sensor is used to generate a stop signal when it contacts the support structure.

[0064] A pressure sensor can be arranged at one end of the limiting component facing the support part. The pressure sensor is opposite to the support structure. During the rotation of the swing arm driven by the motor, the limiting component is rotated, thereby driving the pressure sensor to rotate towards the support structure. When the swing arm is driven by the motor to rotate to the limit position, the pressure sensor will contact the support structure, thereby generating a stop signal. After obtaining the stop signal, the controller will control the motor to stop driving the swing arm. By arranging the pressure sensor, the accuracy of the timing control of stopping the motor to drive the swing arm can be further improved.

[0065] Specifically, the pressure sensor is used to generate a pressure reading after contacting the support structure, and generate a stop signal when the pressure reading is greater than a pressure threshold. When the swing arm rotates to the limit position at a certain speed, the pressure sensor will generate a reading when it contacts the support structure. However, if the speed of the swing arm when it rotates to the limit position is not high, the swing arm can be stopped through the interaction between the limiting component and the support structure without damaging the corresponding equipment in a short time. Therefore, a certain pressure threshold can be set. Only when the pressure reading is greater than the pressure threshold, the pressure sensor will generate a stop signal.

[0066] In addition, the pressure threshold can also be equal to 0, that is, no matter how fast the swing arm is when the pressure sensor contacts the support structure, the pressure sensor will generate a stop signal, thereby further improving the safety of the equipment.

[0067] Although the present application has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based on the foregoing description and accompanying drawings. The present application includes all such modifications and alterations and is limited only by the scope of the following claims. In particular regard to the various functions performed by the above described components, the terms (including a reference to a "means") used to describe such components are intended to correspond, unless otherwise indicated, to any component which performs the specified function of the described component (e.g., a functionally equivalent

[0068] That is, the above-described embodiments are merely exemplary implementations of the present application, and do not limit the patent scope of the present application, and equivalent structures or equivalent processes of the present application made on the basis of the above-described description and the accompanying drawings, for example, a combination of technical features of each embodiment, or a direct or indirect use in other related fields, are also included in the patent scope of the present application.

[0069] In addition, the terms "first", "second", etc. are used only for the purpose of description, and should not be construed as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified.

[0070] The above description has been given for the purpose of illustration and description. It will be appreciated by those skilled in the art that the present application can be practiced without these specific details. In other instances, well-known processes have not been described in detail so as not to obscure the description of the present application with unnecessary detail. Accordingly, the present application is not intended to be limited to the implementations shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

[0071] It should be noted that the various embodiments described herein and / or the various features of the embodiments described can be combined in any manner, and the resulting technology solutions are also within the scope of the present application.

[0072] It should be understood that the specific examples of the embodiments of the present application are only to help those skilled in the art better understand the embodiments of the present application, and not to limit the scope of the embodiments of the present application, and those skilled in the art can make various improvements and modifications on the basis of the above-described embodiments, and these improvements or modifications are also within the scope of protection of the present application.

[0073] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A chemical mechanical polishing apparatus characterized by comprising: The application relates to a chemical mechanical polishing device. The polishing head, the polishing pad, the liquid supply device, the trimmer and the polishing disc are arranged in a wafer processing chamber. The polishing disc is arranged at the center of the wafer processing chamber, the polishing pad is arranged on the polishing disc, the liquid supply device and the trimmer are arranged at the periphery of the polishing disc, and the polishing head is movably arranged in the wafer processing chamber and used for moving the wafer to abut against the polishing pad for polishing and moving the wafer out of the polishing pad. The chemical mechanical polishing device further comprises a supporting structure and a limiting component, the supporting structure is arranged on the cavity wall of the wafer processing chamber where the trimmer is arranged, and the limiting component is arranged between the supporting part included in the trimmer and the swing arm included in the trimmer. The limiting component is used for contacting the supporting structure when the swing arm rotates to the limit position with the position where the supporting part is arranged as the center, so as to limit the swing arm, wherein the limit position is used for indicating the position where the distance between the distal end of the swing arm and the cavity wall of the wafer processing chamber is less than a distance threshold.

2. The apparatus of claim 1, wherein, The supporting structure comprises a first supporting piece and a second supporting piece, the first supporting piece is fixedly installed on the cavity wall, and the second supporting piece is fixedly installed on the first supporting piece.

3. The apparatus of claim 2, wherein, The supporting structure further comprises a pad block arranged on the surface where the limiting component contacts the second supporting piece. The pad block is used for contacting the limiting component when the swing arm rotates to the limit position with the position where the supporting part is arranged as the center, so as to limit the swing arm.

4. The apparatus of claim 3, wherein, The pad block comprises polyoxymethylene material, the thickness of the pad block is in the range of [14mm, 15mm], the width of the pad block is in the range of [15mm, 17mm], and the length of the pad block is in the range of [45mm, 51mm].

5. The apparatus of claim 1, wherein, The limiting component comprises a first ring and a second ring, the first end of the first ring corresponds to the first end of the second ring and can be sleeved with each other, and the second end of the first ring is fixedly connected with the second end of the second ring.

6. The apparatus of claim 1, wherein, The limiting component comprises a first ring body and a second ring body. The first end of the first ring body is fixedly connected with the first end of the second ring body, the second end of the first ring body is provided with an internally-threaded through hole, the second end of the second ring body is provided with an internally-threaded blind hole, and the second end of the first ring body is connected with the second end of the second ring body through a bolt.

7. The apparatus of claim 2, wherein, The included angle between the plane where the second supporting piece is arranged and the plane where the first supporting piece is arranged is 45 degrees.

8. The apparatus of claim 2, wherein, The surface where the first supporting piece contacts the cavity wall is trapezoidal, the ratio of the length of the upper base to the length of the lower base of the surface where the first supporting piece contacts the cavity wall is 1:4, and the upper base and the lower base are arranged in sequence in the direction where the limiting component moves to the second supporting piece.

9. The apparatus of claim 3, wherein, The limiting component is provided with a protrusion. The protrusion is used for contacting the pad block when the swing arm rotates to the limit position with the position where the supporting part is arranged as the center, so as to limit the swing arm.

10. The apparatus of any one of claims 1-9, wherein, The supporting structure comprises metal material.

11. A chemical mechanical polishing apparatus characterized by comprising: The application relates to a chemical mechanical polishing device. The polishing head, the polishing pad, the liquid supply device, the trimmer, the polishing disc, the motor and the controller are arranged in a wafer processing chamber; The polishing disc is arranged at the center of the wafer processing chamber, the polishing pad is arranged on the polishing disc, the liquid supply device and the trimmer are arranged at the periphery of the polishing disc, and the polishing head is movably arranged in the wafer processing chamber for moving the wafer to abut against the polishing pad for polishing and moving the wafer out of the polishing pad; The chemical mechanical polishing device further comprises a support structure and a limiting component, the support structure is arranged on the cavity wall of the wafer processing chamber where the trimmer is located, and the limiting component is arranged between the support part included in the trimmer and the swing arm included in the trimmer; The motor is used to drive the swing arm to rotate with the position where the support part is located as the center; The limiting component is used to contact the support structure when the swing arm rotates to the limit position, so as to limit the swing arm and generate a stop signal, wherein the limit position is used to indicate the position where the distance between the distal end of the swing arm and the cavity wall of the wafer processing chamber is less than the distance threshold value; The controller is used to control the motor to stop driving the swing arm in response to the stop signal.

12. The apparatus of claim 11, wherein, The device further comprises a pressure sensor, the pressure sensor is arranged at one end of the limiting component towards the support part, and the pressure sensor contacts the support structure when the swing arm rotates to the limit position; The pressure sensor is used to generate the stop signal when contacting the support structure.

13. The device according to claim 12, wherein The pressure sensor is used to generate a pressure reading after contacting the support structure, and generate the stop signal when the pressure reading is greater than the pressure threshold value.

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