Immersed data center heat dissipation system

Abstract

The utility model relates to the technical field of immersion type heat dissipation, in particular to an immersion type data center heat dissipation system which comprises a box body and a data center server, cooling liquid is injected into the box body, the data center server is placed in the box body, a temperature sensor and a heat exchange unit are arranged in the box body, and the temperature sensor is connected with the heat exchange unit. A heat dissipation unit and a controller are arranged outside the box body; the temperature sensor is in signal connection with the controller; the controller is in signal connection with the heat dissipation unit; the heat exchange unit is connected with the heat dissipation unit; the data center server can be placed in the box body from the box top door and is suspended, so that a temperature sensor and a controller are arranged to form a hardware structure of an intelligent module unit, the system temperature can be controlled, heat is efficiently dissipated, and the energy consumption of a refrigerating system is reduced; the contact area of the data center server and the cooling liquid is increased, and the phenomenon of uneven heat distribution of partial area of the data center server can be greatly reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of immersion heat dissipation, in particular to an immersion data center heat dissipation system. BACKGROUND

[0002] In today's digital age, especially with the development of AI technology, the scale of data centers is growing explosively, and the computing power of servers is also constantly improving. However, the subsequent heat dissipation problem is increasingly prominent, becoming a key bottleneck restricting the development of data centers.

[0003] Traditional air-cooled heat dissipation methods have been unable to meet the heat dissipation needs of high-density servers due to their low efficiency. Liquid cooling technology, on the other hand, has become the mainstream choice in the market due to its higher efficiency and lower energy consumption.

[0004] Liquid cooling mainly has two types: indirect contact type liquid cooling such as cold plate liquid cooling, and direct contact type liquid cooling such as immersion liquid cooling. Cold plate liquid cooling appeared earlier and has obvious heat transfer efficiency and cost advantages compared to air cooling, but also has obvious disadvantages, mainly in the following aspects:

[0005] 1. High installation complexity, requiring hardware modification or even disassembly of the entire system for installation;

[0006] 2. There is a risk of coolant leakage, which can damage electronic components, and the manufacturing process requires high precision and has large fluctuations in yield.

[0007] Immersion liquid cooling relies mainly on a unique fluid coolant that can directly contact the hardware of data center servers, such as CPUs, GPUs, and other areas prone to heat accumulation, and quickly remove these heat to achieve cooling.

[0008] Common coolants can be pure water, deionized water, fluorinated liquid, synthetic oil, or two-phase coolant. These coolants can quickly remove heat for cooling while also preventing electrical short circuits based on their own characteristics.

[0009] Chinese patent CN208314710U discloses a liquid-cooled server that detects coolant height through a liquid level sensor to automatically add coolant for server cooling. This cooling method can only ensure the overall amount of coolant, but cannot guarantee the temperature of the coolant. Additionally, the server is submerged, which makes it difficult for the bottom surface to fully contact the coolant, leading to heat accumulation in that area. Utility model content

[0010] The utility model aims to provide an immersion data center heat dissipation system to address the above problems.

[0011] The utility model discloses a technical scheme as follows, a kind of immersion type data center heat dissipation system, including box and data center server, cooling liquid is injected in the box, the data center server is placed in box, and immerse in cooling liquid, wherein temperature sensor and heat exchange unit are provided in the box, heat dissipation unit and controller are provided outside the box, and box top is provided with box top door;

[0012] Temperature sensor can collect cooling liquid temperature in box, and temperature sensor is connected with controller signal;

[0013] Controller is connected with heat dissipation unit signal;

[0014] Heat exchange unit can exchange heat to data center server, and heat exchange unit is connected with heat dissipation unit;

[0015] Data center server can be placed in box from box top door, and hang in the air.

[0016] Optionally, detachable top plate is connected to the top of data center server, limit plate is arranged on the both sides of the top plate, and the limit plate can be clamped on the box.

[0017] Optionally, the heat exchange unit is a reflux type heat exchange unit or evaporative heat exchange unit.

[0018] Optionally, the reflux type heat exchange unit includes a submersible pump and a plate heat exchanger.

[0019] The submersible pump is arranged in the box and located at the upper part of the box, and can pump the cooling liquid in the box to the plate heat exchanger.

[0020] The plate heat exchanger is arranged outside the box, and the plate heat exchanger is connected with the heat dissipation unit, and can return the cooling liquid input by the submersible pump to the box.

[0021] Optionally, the plate heat exchanger is provided with a reflux inlet, a reflux outlet, a cooling inlet and a cooling outlet.

[0022] The submersible pump is connected with the reflux inlet on the plate heat exchanger through a cooling liquid input pipe.

[0023] The heat dissipation unit is connected with the cooling inlet on the plate heat exchanger through a refrigeration input pipe, and the heat dissipation unit is connected with the cooling outlet on the plate heat exchanger through a refrigeration output pipe.

[0024] The reflux outlet on the plate heat exchanger is connected with a cooling liquid return pipe, and the cooling liquid is returned to the box.

[0025] The end of the part of the cooling liquid return pipe arranged in the box is located at the lower part of the box.

[0026] Optionally, the plate heat exchanger is provided with heat exchange pipes, plate heat exchange sheet groups and heat exchange connecting pipes.

[0027] The heat exchange pipes are connected with the cooling liquid input pipe and the cooling liquid return pipe respectively, and the heat exchange pipes can pass through the plate heat exchange sheet groups.

[0028] The plate heat exchange sheet groups are provided with plate heat exchange sheets arranged in levels.

[0029] The heat exchange connecting pipes are arranged between adjacent plate heat exchange sheets and connect the adjacent plate heat exchange sheets.

[0030] Optionally, the refrigeration output pipe is communicated with one end of the plate heat exchange sheet group, and the refrigeration output pipe is provided with a second one-way valve.

[0031] The refrigeration input pipe is communicated with the other end of the plate heat exchange sheet group, and the refrigeration input pipe is provided with a first one-way valve.

[0032] The heat exchange pipes are in U-shaped structure.

[0033] Optionally, the evaporative heat exchange unit comprises an evaporator.

[0034] The evaporator is arranged in the box body and is arranged in parallel close to the data center server, the evaporator is detachably connected with the inner wall of the box body through a connecting block, and the evaporator is communicated with the heat dissipation unit.

[0035] Optionally, the evaporator is provided with a curved coil pipe, and the curved coil pipe is filled with a heat exchange agent.

[0036] The evaporator is communicated with the refrigeration output pipe through a heat exchange agent output pipe, and the refrigeration output pipe is communicated with the heat dissipation unit.

[0037] The evaporator is communicated with the refrigeration input pipe through a heat exchange agent input pipe, and the refrigeration input pipe is communicated with the heat dissipation unit.

[0038] The heat exchange agent input pipe is provided with a third one-way valve.

[0039] Optionally, the heat dissipation unit is an air conditioner outdoor unit.

[0040] The beneficial effects of the utility model at least include one of the following;

[0041] 1. The temperature sensor and the controller are arranged to form an intelligent module unit hardware structure, and in combination with an existing control method, the system temperature can be controlled, the heat dissipation is efficient, the refrigeration system energy consumption is reduced, and the data center operation cost is reduced.

[0042] 2. The suspension of the data center server can increase the contact area between the data center server and the cooling liquid, and can greatly reduce the uneven heat distribution in the data center server.

[0043] 3. Two kinds of heat exchange unit structures are provided, wherein the reflux type heat exchange unit carries away the heat in the cooling liquid to exchange heat with the heat dissipation unit, and the cooling liquid returns to the box after cooling, so that the cooling liquid capacity is dynamically balanced while the cooling liquid is cooled, and the evaporation type heat exchange unit cools the data center server, shortens the heat transfer path, accelerates heat dissipation, ensures stable operation of the server, and can reduce the temperature of the key components of the server. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1 It is a three-dimensional schematic diagram of an immersion type data center cooling system.

[0045] Figure 2 It is a reflux type heat exchange unit connection schematic diagram.

[0046] Figure 3 It is a reflux type heat exchange unit connection principle schematic diagram.

[0047] Figure 4 It is a plate heat exchanger structure schematic diagram.

[0048] Figure 5 It is a evaporation type heat exchange unit connection schematic diagram.

[0049] Figure 6 It is a evaporation type heat exchange unit connection principle schematic diagram.

[0050] Figure 7 It is a top plate and limiting plate connection structure schematic diagram.

[0051] In the figure:

[0052] 1 is a cooling liquid, 2 is a box, 3 is a temperature sensor, 4 is a data center server, 5 is a submersible pump, 6 is an evaporator, 7 is a plate heat exchanger, 8 is a first one-way valve, 9 is a heat dissipation unit, 10 is a controller, 11 is a second one-way valve, 12 is a third one-way valve, 16 is a cooling liquid input pipe, 17 is a cooling liquid return pipe, 18 is a heat exchange agent output pipe, 19 is a heat exchange agent input pipe, 20 is a refrigeration output pipe, 21 is a refrigeration input pipe, 22 is a top plate, 23 is a limiting plate, 24 is a box top door, 28 is a heat exchange pipe, 29 is a plate heat exchange sheet, and 30 is a heat exchange connection pipe. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0054] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0055] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0056] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0057] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0058] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set", "mount", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0059] As Figure 1As shown, an immersion data center cooling system includes a box 2 into which a cooling liquid 1 is injected, and a data center server 4 placed in the box 2 and immersed in the cooling liquid 1, wherein the box 2 is provided with a temperature sensor 3 and a heat exchange unit, the box 2 is provided with a heat dissipation unit 9 and a controller 10 outside the box 2, and the box 2 is provided with a box top door 24 at the top of the box 2.

[0060] The temperature sensor 3 can collect the temperature of the cooling liquid 1 in the box 2, and the temperature sensor 3 is signal connected with the controller 10.

[0061] The controller 10 is signal connected with the heat dissipation unit 9.

[0062] The heat exchange unit can exchange heat with the data center server 4, and the heat exchange unit is connected with the heat dissipation unit 9.

[0063] The data center server 4 can be placed in the box 2 from the box top door 24 and suspended.

[0064] The purpose of such design is to use the temperature sensor and the controller to form an intelligent module unit hardware structure, which can control the system temperature, efficiently dissipate heat, reduce the energy consumption of the refrigeration system, and reduce the operation cost of the data center by matching the existing control method. The suspended data center server can improve the contact area between the data center server and the cooling liquid, and can greatly reduce the uneven heat distribution phenomenon in the data center server.

[0065] At the same time, it should be pointed out that the controller can control the opening of the one-way valve through the temperature sensor to control the temperature of the cooling liquid according to the set temperature control mode and through the algorithm. The temperature difference control ±t=2 degrees, for example, the control temperature is 30℃ system shutdown, and the system is automatically started when it exceeds 32℃. Further, the temperature of the whole system is controlled to ensure the normal operation of the server.

[0066] In this embodiment, the temperature sensor used can be one of a thermistor, a resistance temperature detector, a thermocouple, and an optical fiber temperature sensor. Those skilled in the art can select one according to the actual scene needs, and select the corresponding model, and the change of the model does not affect the use of the function of the temperature sensor in this embodiment.

[0067] And for the controller, the conventional PCL or single-chip microcomputer can be used, and the model of Mitsubishi FX series can be selected.

[0068] The technical scheme provided in this embodiment is mainly a hardware structure. To realize more accurate temperature control, it is necessary to match the existing mature algorithm. This part of the content belongs to the selection of those skilled in the art according to actual needs.

[0069] In this embodiment, as shown in Figure 7 The top of the data center server 4 is connected with a detachable top plate 22, the both sides of the top plate 22 are provided with limiting plates 23, and the limiting plates 23 can be clamped on the box body 2.

[0070] The purpose of such design is to provide a scheme that can realize the suspension of the data center server. In actual use, there is a groove at the box top door 24 of the box body. When the data center server needs to be placed, it is connected with the top plate first. The optimal connection mode is through the hollow structure, which can ensure the contact area between the top of the data center server and the cooling liquid. Then the whole is put into the box body from the groove. Since the limiting plates are protruded to both sides, they can be clamped on the edge of the groove. Of course, in order to further improve the stability of the connection between the two, the limiting plates can be additionally connected with the edge of the groove through the detachable structure. After these operations are completed, the box top door can be covered.

[0071] In this embodiment, the heat exchange unit is a reflux type heat exchange unit or an evaporation type heat exchange unit. In specific implementation, as shown in Figure 2 and Figure 3 A specific structure of the reflux type heat exchange unit is provided, wherein the reflux type heat exchange unit comprises a submersible pump 5 and a plate heat exchanger 7.

[0072] The submersible pump 5 is arranged in the box body 2 and located at the upper part of the box body 2, and can pump the cooling liquid 1 in the box body 2 to the plate heat exchanger 7.

[0073] The plate heat exchanger 7 is arranged outside the box body 2, and the plate heat exchanger 7 is connected with the heat dissipation unit 9 and can return the cooling liquid 1 input by the submersible pump 5 to the box body 2.

[0074] The purpose of such design is to reduce the temperature of the cooling liquid through the reflux type heat exchange unit, so that it will not continuously increase the temperature to ensure the efficiency and quality of heat dissipation.

[0075] Based on this premise, in the whole heat dissipation process, the heat generated by the data center server is distributed downward and upward in the cooling liquid and enriched in the upper area, so the submersible pump is usually arranged at the upper part of the box body. In this way, the cooling liquid with heat enrichment at the upper part of the whole box body can be pumped to the plate heat exchanger, and then returned from the lower part of the box body after heat exchange and cooling. The whole cooling liquid forms a large cycle, and the heat is continuously discharged from the box body.

[0076] On this basis, as shown in Figure 4 A specific structure of the plate heat exchanger is provided in this embodiment, wherein the plate heat exchanger 7 is provided with a reflux inlet, a reflux outlet, a cooling inlet and a cooling outlet.

[0077] The submersible pump 5 is connected to the return inlet on the plate heat exchanger 7 via the coolant inlet pipe 16.

[0078] The heat dissipation unit 9 is connected to the cooling inlet on the plate heat exchanger 7 via the refrigeration input pipe 21, and the heat dissipation unit 9 is connected to the cooling outlet on the plate heat exchanger 7 via the refrigeration output pipe 20.

[0079] The plate heat exchanger 7 is connected to a coolant return pipe 17 at its return outlet, and the coolant 1 is returned to the housing 2.

[0080] The end of a section of the coolant return pipe 17 located in the lower part of the housing 2 is located in the housing 2.

[0081] Meanwhile, the plate heat exchanger 7 is equipped with heat exchange tubes 28, plate heat exchange fins and heat exchange connecting pipes 30.

[0082] The two ends of the heat exchange tube 28 are connected to the coolant inlet pipe 16 and the coolant return pipe 17, respectively, and the heat exchange tube 28 can pass through the plate heat exchanger assembly.

[0083] The plate heat exchanger assembly is provided with plate heat exchangers 29 arranged in layers;

[0084] The heat exchange connecting pipe 30 is located between adjacent plate heat exchange plates 29 and connects the adjacent plate heat exchange plates 29.

[0085] Furthermore, the cooling output pipe 20 is connected to one end of the plate heat exchanger assembly, and a second one-way valve 11 is provided on the cooling output pipe 20.

[0086] The refrigeration input pipe 21 is connected to the other end of the plate heat exchanger assembly, and a first one-way valve 8 is provided on the refrigeration input pipe 21.

[0087] The heat exchange tube 28 has a U-shaped structure.

[0088] The purpose of this design is that the entire heat exchange process is a heat conduction process, where heat is transferred from the high-temperature coolant to the low-temperature refrigerant, and the refrigerant is introduced into the plate heat exchanger through the heat dissipation unit.

[0089] In the specific heat exchange process, the refrigerant enters the plate heat exchanger through the refrigeration input pipe, fills the plate heat exchanger assembly through the heat exchange connection pipe, and then returns to the heat exchange unit through the refrigeration output pipe. The discharged coolant then enters the heat exchange tube. Since the heat exchange tube passes through the plate heat exchanger and is also U-shaped, this greatly increases the contact area between the heat exchange tube and the plate heat exchanger, providing ample space for heat exchange.

[0090] In this embodiment, in order to avoid the phenomenon of backflow of the pipeline during transportation, therefore, on several important pipeline added check valve, such as refrigeration output pipe 20 is provided with the second check valve 11, refrigeration input pipe 21 is provided with the first check valve 8.

[0091] In this embodiment, in the specific implementation, as shown in Figure 5 and Figure 6 It is provided that the specific structure of the evaporative heat exchange unit, wherein the evaporative heat exchange unit comprises an evaporator 6;

[0092] The evaporator 6 is arranged in the box body 2 and is arranged in parallel close to the data center server 4, the evaporator 6 is detachably connected with the box body 2 through the connecting block, the evaporator 6 is communicated with the heat dissipation unit 9, the evaporator 6 is provided with a curved coil pipe, and the curved coil pipe is filled with a heat exchange agent;

[0093] The evaporator 6 is communicated with the refrigeration output pipe 20 through the heat exchange agent output pipe 18, and the refrigeration output pipe 20 is communicated with the heat dissipation unit 9;

[0094] The evaporator 6 is communicated with the refrigeration input pipe 21 through the heat exchange agent input pipe 19, and the refrigeration input pipe 21 is communicated with the heat dissipation unit 9;

[0095] The third check valve 12 is arranged on the heat exchange agent input pipe 19.

[0096] The purpose of such design is that the evaporator rapidly transmits the heat in the cooling liquid near the data center server to the external heat dissipation unit by virtue of its large-area contact surface and high-efficiency heat conduction performance, so as to cool down the region, and the cooled cooling liquid is circulated to the periphery of the server to continue absorbing heat, thereby forming a continuous and stable heat dissipation cycle.

[0097] Meanwhile, it should be pointed out that in the technical scheme provided in this embodiment, the refrigeration output pipe and the refrigeration input pipe are used to respectively perform heat exchange on the evaporator and the plate heat exchanger, therefore freon is selected as the refrigerant, and considering the environmental protection and other factors, the person skilled in the art can select a more environmentally friendly material for corresponding replacement, this embodiment is only used for illustrating the principle, and the material is not limited.

[0098] In addition, in the specific work, the heat dissipation unit is similar in function to the air conditioner outdoor unit, therefore this embodiment selects the same as the heat dissipation unit, and the person skilled in the art can also select other suitable structures.

[0099] Although the utility model has been explained in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An immersion data center cooling system, comprising a tank (2) and data center servers (4), the tank (2) being filled with a cooling liquid (1), the data center servers (4) being placed in the tank (2) and immersed in the cooling liquid (1), characterized in that, The box (2) is provided with a temperature sensor (3) and a heat exchange unit, the box (2) is provided with a heat dissipation unit (9) and a controller (10) outside the box (2), and the box (2) is provided with a box top door (24) on the top of the box (2); The temperature sensor (3) can collect the temperature of the cooling liquid (1) in the box (2), and the temperature sensor (3) is signal connected with the controller (10); The controller (10) is signal connected with the heat dissipation unit (9); The heat exchange unit can exchange heat with the data center server (4), and the heat exchange unit is connected with the heat dissipation unit (9); The data center server (4) can be put into the box (2) from the box top door (24) and be suspended.

2. The immersion data center cooling system of claim 1, wherein, The data center server (4) is connected with a detachable top plate (22) on the top of the data center server (4), the both sides of the top plate (22) are provided with limiting plates (23), and the limiting plates (23) can be clamped on the box (2).

3. The immersion data center cooling system of claim 1, wherein, The heat exchange unit is a backflow type heat exchange unit or an evaporation type heat exchange unit.

4. The immersion data center cooling system of claim 3, wherein, The backflow type heat exchange unit comprises a submersible pump (5) and a plate heat exchanger (7); The submersible pump (5) is arranged in the box (2) and located at the upper portion of the box (2), and can pump the cooling liquid (1) in the box (2) to the plate heat exchanger (7); The plate heat exchanger (7) is arranged outside the box (2), the plate heat exchanger (7) is connected with the heat dissipation unit (9), and the cooling liquid (1) input by the submersible pump (5) can be backflowed to the box (2).

5. The immersion data center cooling system of claim 4, wherein, The plate heat exchanger (7) is provided with a backflow inlet, a backflow outlet, a cooling inlet and a cooling outlet; The submersible pump (5) is connected with the backflow inlet of the plate heat exchanger (7) through a cooling liquid input pipe (16); The heat dissipation unit (9) is connected with the cooling inlet of the plate heat exchanger (7) through a refrigeration input pipe (21), and the heat dissipation unit (9) is connected with the cooling outlet of the plate heat exchanger (7) through a refrigeration output pipe (20); The backflow outlet of the plate heat exchanger (7) is connected with a cooling liquid backflow pipe (17), and the cooling liquid (1) is backflowed to the box (2); The end of the cooling liquid backflow pipe (17) arranged in the box (2) is located at the lower portion of the box (2).

6. The immersion data center cooling system of claim 5, wherein, The plate heat exchanger (7) is provided with heat exchange pipes (28), a plate heat exchange sheet group and heat exchange connecting pipes (30); The both ends of the heat exchange pipe (28) are respectively connected with the cooling liquid input pipe (16) and the cooling liquid backflow pipe (17), and the heat exchange pipe (28) can pass through the plate heat exchange sheet group; The plate heat exchange sheet group is provided with plate heat exchange sheets (29) arranged in levels; The heat exchange connecting pipe (30) is arranged between adjacent plate heat exchange sheets (29) and connects the adjacent plate heat exchange sheets (29).

7. The immersion data center cooling system of claim 6, wherein, The refrigeration output pipe (20) is communicated with one end of the plate heat exchange sheet group, and the refrigeration output pipe (20) is provided with a second one-way valve (11); The refrigeration input pipe (21) is communicated with the other end of the plate heat exchange sheet group, and the refrigeration input pipe (21) is provided with a first one-way valve (8); The heat exchange pipe (28) has a U-shaped structure.

8. The immersion data center cooling system of claim 3, wherein, The evaporation type heat exchange unit comprises an evaporator (6); The evaporator (6) is arranged in the cabinet (2) and is arranged in parallel close to the data center server (4), is detachably connected with the inner wall of the cabinet (2) through a connecting block, and is communicated with the heat dissipation unit (9).

9. The immersion data center cooling system of claim 8, wherein, The evaporator (6) is provided with a curved coil pipe, and the curved coil pipe is filled with a heat exchange agent; The evaporator (6) is communicated with a refrigeration output pipe (20) through a heat exchange agent output pipe (18), and the refrigeration output pipe (20) is communicated with the heat dissipation unit (9); The evaporator (6) is communicated with a refrigeration input pipe (21) through a heat exchange agent input pipe (19), and the refrigeration input pipe (21) is communicated with the heat dissipation unit (9); A third one-way valve (12) is arranged on the heat exchange agent input pipe (19).

10. The immersion data center cooling system of any of claims 1-9, wherein, The heat dissipation unit (9) is an air conditioner outdoor unit.

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