Electronic component

Abstract

The utility model relates to an electronic assembly. The electronic component includes: a chip having a connection terminal protected by a housing including a first main surface, a side wing, and a second main surface; and a layer of conductive material covering a portion of the flanks and extending over the first main face, the layer of conductive material being electrically connected to the connection terminals of the chip by means of connection pads soldered to the connection terminals.

Description

[0001] Cross-references to (one or more) related applications

[0002] This application claims priority to French patent application number 2312922, filed on November 23, 2023, entitled “Procédé de fabrication decomposants électroniques”, which is hereby incorporated by reference to the fullest extent permitted by law. Technical Field

[0003] This specification relates to the manufacture of electronic components. More specifically, it applies to the manufacture of so-called surface mount components, i.e., components having one or more connection metallizations on at least one side, which are designed to be soldered to corresponding connection pads on external devices, such as printed circuit boards or other components. Background Technology

[0004] In some applications, one use of surface mount components is for the metallization of connections designed to be soldered to external devices to extend to the component's flanks. These are called "wettable flank" components. When the component is mounted in its environment (e.g., on a printed circuit board), the connection metallization (also known as electrical contacts) is soldered or brazed to corresponding metal tracks or components on the PCB side. Some solder material then rises to the side of the component, allowing for visual inspection of the connection quality.

[0005] This application exists in fields such as automotive or medical, and more generally in all fields where the reliability of electrical connections must be guaranteed once circuits are installed in their environment. Summary of the Invention

[0006] There are uses for at least some aspects of known processes for manufacturing electronic components with wettable flanks.

[0007] This is achieved through a process for manufacturing electronic components with wettable flanks from a substrate covered by connected terminals and in which chips are formed, the process comprising the following steps:

[0008] a) Solder the connection pads to the chip's connection terminals.

[0009] b) Coat the bonding pads with an insulating resin layer.

[0010] c) Thin the insulating resin layer until it reaches the core of the bonding pads.

[0011] d) A cavity is formed by removing portions of the connecting pads and the insulating resin layer to make the side portions of the component accessible.

[0012] e) depositing a layer of electrically conductive material on the flanks of the assembly and on the cores of the connection pads,

[0013] f) separating the chips through the cavity.

[0014] According to an embodiment, the connection pads comprise an electrically conductive core covered by a layer of solderable material.

[0015] According to an embodiment, the solderable material is Sn or a tin alloy, such as SnAg or SnAgCu.

[0016] Advantageously, the electrically conductive core is made of copper.

[0017] According to an embodiment, the electrically conductive material and the solderable material are identical.

[0018] According to an embodiment, step e) is performed by screen printing.

[0019] This is achieved by an electronic assembly having wettable flanks, comprising a chip having connection terminals, protected by a housing comprising a first main face, flanks and a second main face, a layer of electrically conductive material covering part of the flanks and extending over the first main face, the layer of electrically conductive material being electrically connected to the connection terminals of the chip by means of connection pads soldered to the connection terminals.

[0020] According to an embodiment, the connection pads comprise an electrically conductive core covered at least in part by a layer of material soldered to the connection terminals.

[0021] According to an embodiment, the layer of electrically conductive material is a layer of Sn or a tin alloy, such as SnAg or SnAgCu.

[0022] According to an embodiment, the first main face of the chip between the connection pads is covered by a layer of insulating resin.

[0023] According to a first aspect of the disclosure, there is provided a method of manufacturing an electronic assembly, comprising: forming a connection pad on each of a plurality of connection terminals on a plurality of chips; coating each connection pad with a layer of insulating resin; thinning the layer of insulating resin until it reaches a core of each connection pad; forming a cavity by removing a portion of one of the connection pads and a portion of the layer of insulating resin, thereby exposing a flank of the electronic assembly; depositing a layer of electrically conductive material on the flank of the electronic assembly and on the cores of the connection pads; and separating each of the plurality of chips through the cavity.

[0024] According to an embodiment, wherein the core of each connection pad is an electrically conductive core covered by a layer of solderable material.

[0025] According to an embodiment, wherein the solderable material is a tin alloy.

[0026] According to an embodiment, wherein the electrically conductive core is copper.

[0027] According to embodiments, the electrically conductive material is the same material as the solderable material.

[0028] According to embodiments, depositing the layer of electrically conductive material is performed by screen printing.

[0029] According to a second aspect of the present disclosure, there is provided an electronic assembly comprising: a chip; a plurality of connection terminals on the chip; a plurality of connection pads each coupled to one of the plurality of connection terminals; an enclosure on the chip surrounding the plurality of connection terminals, the enclosure comprising a first face opposite a second face and a plurality of side walls; and a layer of electrically conductive material covering a portion of the side walls and extending over the first face, the layer of electrically conductive material being electrically coupled to the connection terminals of the chip through the connection pads soldered to the connection terminals.

[0030] According to embodiments, the connection pads comprise an electrically conductive core at least partially covered by a layer of solderable material coupled to the connection terminals.

[0031] According to embodiments, the layer of electrically conductive material is an alloy of tin.

[0032] According to embodiments, the insulating resin layer covers the first face of the chip between the connection pads.

[0033] According to a third aspect of the present disclosure, there is provided an electronic assembly comprising: a chip having a first face opposite a second face and a plurality of side walls extending from the first face to the second face along a first direction; a plurality of connection terminals on the first face; an insulating enclosure covering the first face and having a plurality of side walls extending along the first direction; a plurality of connection pads each coupled to one of the plurality of connection terminals; and a first wettable material layer partially covering a side wall of the plurality of side walls of the insulating enclosure, the first wettable material layer being directly coupled to a first one of the plurality of connection pads. According to embodiments, the plurality of connection terminals are each separated from a side wall of the chip by a first distance in a range of 10 μιη to 50 μιη.

[0034] According to embodiments, the enclosure completely covers the first face, the second face and the plurality of side walls of the chip.

[0035] According to embodiments, each connection pad comprises an electrically conductive core covered by a layer of solderable material.

[0036] According to embodiments, the insulating enclosure has a first face transverse to the plurality of side walls of the insulating enclosure.

[0037] According to embodiments, the wettable material layer is L-shaped having a first portion covering a side wall of the plurality of side walls of the insulating enclosure and a second portion on the first face of the insulating enclosure.

[0038] According to embodiments, the second portion of the layer of wettable material is coplanar with the first face of the insulating enclosure.

[0039] According to embodiments, both the first portion and the second portion of the layer of wettable material are directly coupled to the electrically conductive core of the first one of the plurality of connection pads.

[0040] According to embodiments, the electronic assembly further comprises a second layer of wettable material directly coupled to a second one of the plurality of connection pads, the second layer of wettable material being coplanar with the first face of the insulating enclosure.

[0041] According to embodiments, the electronic assembly further comprises a layer of insulating resin covering entirely the chip. BRIEF DESCRIPTION OF DRAWINGS

[0042] The foregoing features and advantages, as well as others, will be described in detail in the description of specific embodiments given below with reference to the accompanying drawings, in which:

[0043] Figure 1 Fig. 1 shows a schematic cross-section of an electronic assembly with wettable flanks according to a particular embodiment;

[0044] Figure 2A Figure 2B Figure 2C Figure 2D Figure 2E Figure 2F are cross-sectional views illustrating steps in a process for manufacturing an electronic assembly with wettable flanks according to another particular embodiment;

[0045] Figure 3 Fig. 1 shows a schematic cross-section of an electronic assembly with wettable flanks according to a particular embodiment; Figures 2A to 2F Fig. 1 shows a schematic cross-section of an electronic assembly with wettable flanks according to a particular embodiment;

[0046] Figure 4A Figure 4B are cross-sectional views illustrating steps in a process for manufacturing an electronic assembly with wettable flanks according to another particular embodiment;

[0047] Figure 5 Fig. 1 shows a schematic cross-section of an electronic assembly with wettable flanks according to a particular embodiment; Figure 4A 4B Fig. 1 shows a schematic cross-section of an electronic assembly with wettable flanks according to a particular embodiment;

[0048] Figure 6 is a scanning electron microscope (SEM) image of a spherical core housing connection pad in a particular embodiment. DETAILED DESCRIPTION

[0049] ​​​​​​​Like features in various figures are denoted by like reference numerals. In particular, structural and / or functional features common to various embodiments can have the same reference numerals and can have the same structure, dimensions, and material properties.

[0050] For the sake of clarity, only the operations and elements that are useful in understanding the embodiments described herein are illustrated and described.

[0051] Unless otherwise stated, when referring to two elements connected together, this means a direct connection without any intermediate elements other than conductors, and when referring to two elements coupled together, this means that the two elements can be connected or they can be coupled via one or more other elements.

[0052] In the following disclosure, unless otherwise stated, when referring to absolute position qualifiers such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative position qualifiers such as the terms "above", "below", "higher", "lower", etc., or orientation qualifiers such as "horizontal", "vertical", etc., all refer to the orientation shown in the various figures.

[0053] Unless otherwise stated, the expressions "about", "approximately", "substantially", and "on the order of" mean within 10% preferably within 5%.

[0054] Electronic assemblies are used in a wide range of industrial fields, in particular automotive and medical fields.

[0055] Figure 1 A schematic cross-section of an electronic assembly 100 is shown.

[0056] The electronic assembly 100 is composed of an electronic die 103 and a housing 109. In one example, the die 103 is formed of a semiconductor substrate such as silicon. It can also be SiC. Alternatively, the substrate can be glass or sapphire.

[0057] The die includes a front side 105 (also referred to as a first side or front face), a back side 104 (also referred to as a second side or back face), and side walls 106 (also referred to as side faces). The lower side 104 is opposite the upper side 105.

[0058] One or more connection terminals 107 (also referred to as electrical contacts) are formed on the top surface 105 of the micro-die 103, enabling it to be connected to other elements (micro-die or electronic device).

[0059] The electrical connection terminals 107 are also called "UBM" (Under-Bump Metallization). The electrical connection terminals 107 are made of an electrically conductive material that is specifically designed to receive the connection pads 117, in particular to adhere well to the pads 117. The electrical connection terminals 107 comprise at least one of the following elements: gold, titanium, nickel, copper, silver, tin or tungsten. Preferably, they comprise gold or copper. The connection terminals 107 can be electroplated.

[0060] The electrical connection terminals 107 are at a distance of, for example, 10 to 50 pm, or even 10 to 30 pm, from the chip side wall. This distance will depend on the size of the connection pads 117. The electrical connection terminals 107 can be positioned on the top surface 105 of the chip 103 or flush with the top surface (i.e. at the same level as the top surface 105 of the chip 103).

[0061] The chip 103 can comprise one or more discrete components. The discrete component(s) are, for example, chosen from transistors, diodes, thyristors, triacs, filters, etc. The chip 103 can comprise one or more electronic circuits. The chip 103 can be used to implement various electronic functions.

[0062] The assembly 100 is an integrated assembly.

[0063] The chip 103 is protected by the housing 109. More specifically, the housing 109 covers at least the front side 105. Preferably, as shown in Figure 1 , it can also cover the side faces 106 of the chip 103 and / or the back side 104 of the chip 103.

[0064] The housing 109 is made of an electrically insulating material.

[0065] In order to connect the assembly 100 to other electronic elements and / or circuits, the housing 109 also comprises connection pads 117 (also called housing contacts or contact covers). The connection pads 117 are positioned on the top surface 105 of the chip 103. Each pad 117 is connected to an electrical terminal 107 on the chip 103.

[0066] The connection pads 117 can be metallic elements.

[0067] The connection pads 117 are, for example, metal balls. They can be made of copper, nickel or any other non-meltable material.

[0068] The connection pads 117 can be elements comprising an electrically conductive core 116 covered by a layer of meltable material 118 (also called shell).

[0069] Preferably, the electrically conductive core 116 is made of copper.

[0070] Preferably, the solderable material is tin or one of its alloys, such as SnAgCu or SnAg. The layer 118 acts as an oxidation barrier.

[0071] The electrical connection terminals 107 and the connection pads 117 on the chip 103 are positioned in holes in an insulating resin layer 121 covering the chip 103.

[0072] The assembly 100 is an assembly with wettable flanks, i.e. at least part of its side walls are covered by a layer 122 of wettable and / or solderable material, i.e. a material that can be soldered or otherwise mechanically attached (e.g. conductive adhesive, sintering).

[0073] The wettable material layer 122 covers part of the flanks 119 of the assembly 100 and extends over the first main face 115 of the assembly 100, forming a continuous layer having a first part 122A covering part of the first main face 115 of the assembly 100 and a second part 122B covering part of the flanks 119 of the assembly 100.

[0074] The wettable material is in direct contact with the connection pads 117. There is no element between the connection pads 117 and the wettable material. It is in direct contact on the flanks 119 and the first main face 115.

[0075] The wettable material is preferably a solderable material, such as Sn, SnAg or SnAgCu or another material with a higher melting point.

[0076] We will now refer to Figures 2A to 2F The manufacturing process of such an assembly 100 is described in more detail.

[0077] The process is based on a substrate 301 covered by the connection terminals 107 and in which the chip 103 is formed.

[0078] The process comprises the following steps:

[0079] a) soldering the connection pads 117 to the connection terminals 107, the connection pads 117 preferably comprising a conductive core 116 covered by a coating 118 of solderable material (a), Figure 2A ),

[0080] b) depositing an insulating resin layer 121 on the substrate 301, the insulating resin layer 121 encapsulating the connection pads 117 and the connection terminals 107 (a), Figure 2B ),

[0081] c) thinning the insulating resin layer 121 until it reaches the connection pads 117 and, if applicable, the core 116 of the connection pads 117 (a), Figure 2C ),

[0082] d) forming cavities 311 between the chips 103 by locally removing parts of the connection pads 117 and parts of the insulating resin layer 121, so as to make accessible parts of the side wings 119 of the assembly 100 Figure 2D ,

[0083] e) applying a layer of conductive material 122 on the side wings and on the connection pads 117 of the assembly 100 Figure 2E ,

[0084] f) separating the chips 103 by cutting into the cavities 311 Figure 2F , so as to obtain an assembly 100 having wettable side wings.

[0085] In step a), the manufacturing of the discrete assembly(s) and / or of the integrated circuit(s) forming the assembly 100 is completed. The assembly 100 is formed from a single substrate 301 and has not yet been singulated. In the figures, the chips 103 are delimited by dashed lines in the substrate 301. The substrate 301 has a first face 305 (upper or front face) and a second face 303 (rear or back face). Adjacent chips 103 are separated from each other by a portion of the substrate 301. In other words, a portion of the substrate 301 separates adjacent chips 103.

[0086] The substrate 301 is for example a semiconductor substrate, such as silicon or SiC.

[0087] The thickness of the substrate 301 is between 300 and 900 pm, for example about 725 pm thick.

[0088] Moreover, as regards Figure 1 The electrical connection terminals 107 described are formed on the upper face 305 of the substrate 301 Figure 2A .

[0089] In step a), the connection pads 117 are soldered to the connection terminals 107.

[0090] As shown in Figures 2A to Figure 2F and Figure 3 , the connection pads 117 can be balls (i.e. shaped as spheres). Obviously, these figures are schematic representations, in practice the soldered connection pads 117 and connection terminals 107 have a contact surface larger than a single contact point when they are soldered to each other.

[0091] Alternatively, as shown in Figure 4A , Figure 4B and Figure 5 , the connection studs can be posts. These can be posts having a square, circular or rectangular cross-section.

[0092] Preferably, the connection pads 117 comprise a core 116 made of a first material and a shell (or coating) 118 made of a second material.

[0093] The shell 118 preferably covers the core continuously. The thickness of the shell is for example between 10 and 20 pm.

[0094] The conductive core 116 is preferably made of copper.

[0095] The shell 118 or coating is made of a material that can be soldered to the terminal pads. In particular, it is tin or a tin alloy, such as SnAg or SnAgCu.

[0096] Figure 6 An SEM image of a spherical connection pad 117 with a copper core and a shell of a tin-based alloy is shown by way of illustration and not limitation.

[0097] In a variant not shown, the connection pads are metal balls. These balls are not covered by a shell. They can be copper balls or nickel balls.

[0098] In step b), an insulating resin layer 121 is deposited on the substrate 301.

[0099] More particularly, the insulating resin layer 121 is deposited on the first face 305 of the substrate 301 and on the pads 117. In this way, the pads 117 are arranged within the resin. The insulating resin layer 121 forms a first portion of the assembly enclosure 100. By way of example, the layer 121 can be deposited by screen printing, compression or injection molding. This first portion of the box thus protects the upper face of the assembly 100.

[0100] The resin is an electrically insulating resin. More particularly, the resin comprises at least one base material to which electrically insulating particles are added. The base material is chosen from the group comprising epoxy-type resins, phenolic-type resins, acrylic-type resins. Preferably, the resin is an epoxy-type resin. The particles are for example oxide particles, in particular alumina or silica particles.

[0101] The polymerization is for example performed under ultraviolet (UV) radiation or by thermal activation. The annealing can be performed before step c).

[0102] In step c), a thinning step is performed from the front face to remove the portion of the insulating resin 121 covering the connection pads 117 and the upper portion of the connection pads 117 until reaching the core 116 of the connection pads 117.

[0103] The thinning step on the front face can be performed by lapping. Mechanical polishing is preferred.

[0104] In step d), cavities 311 are formed between the chips 103 in order to remove portions of the resin layer 121 and portions of the connection pads 117. Thus, the cores 116 of the connection pads 117 are also accessible from the side.

[0105] The resulting cavities 311 extend from the front face and to a depth corresponding at least to the height of the conductive material layer 122 of the side wall of the cover assembly 100 described hereafter. The height of the cavities 311 is less than the thickness of the insulating resin layer 121 in order to insulate the wettable flanks from the substrate 301.

[0106] Step d) is performed using a cutting device. The cutting device is for example a mechanical engraving tool such as a saw or a laser engraving tool. In a preferred embodiment, the cutting device is a laser. Furthermore, when the cutting device is a laser, the cutting technique used can be a laser direct structuring (LDS) technique.

[0107] In step e), a conductive material layer 122 is deposited in order to cover the connection pads 117 and at least part of the side face 119 of the assembly 100.

[0108] The conductive material layer 122 can be deposited by a printing method, an additive deposition method or by immersion in a bath. For example, an anti-oxidation material can be deposited on the metal surface. The deposition is optional.

[0109] Advantageously, the conductive material layer 122 is deposited locally by dispensing techniques, preferably by screen printing, in particular by masking.

[0110] Alternatively, it can be a full-plate deposition.

[0111] At the end of step e), the cavities 311 are filled with conductive material and the cores 116 of the connection pads 117 are covered with the conductive material layer 122. Thus, the cores 116 are completely covered by a protective layer formed partly by the shell 118 and partly by the layer 122. Thus, the cores are protected from the outside environment, in particular from oxidation, which is particularly advantageous in the case of copper cores 116.

[0112] In step f), the assembly 100 is separated by cutting through the cavities 311. Thus, the assemblies 100 are separated from each other. In some embodiments, the cutting comprises cutting through portions of the substrate 301 separating adjacent chips 103.

[0113] Alternatively, the steps can be performed in the following order: a), b), c), d), f) and e). Once the cavities 311 have been formed, the full cutting (step f)) can be continued and then the conductive material layer 122 is deposited (step e)). Advantageously, the deposited layer is an organic layer. It also serves as a protective layer against oxidation.

[0114] The process can also comprise a backside thinning step. To this end, the structure is flipped over and attached to a support through its front side, i.e. face 305. The support is for example a strip of adhesive tape. Then, the structure is thinned on its back side 303 so that the substrate 301 has its final thickness.

[0115] The process can advantageously comprise a step during which an additional insulating layer is deposited on the back face 303 of the structure to form the back face of the housing 111 and / or on the side face 106 of the chip 103.

[0116] The additional insulating layer is made of an electrically insulating material, for example a resin of the same type as the resin in layer 121. In another example, the materials of the layers are different.

[0117] At the end of the process, the obtained assemblies 100 are surface-mount devices (SMD) of the “flip-chip” type, i.e. they can be attached to an external device, such as a printed circuit board or another assembly, through their front face, i.e. the face on which the pads 117 of the housing 109 are arranged.

[0118] To achieve this, a soldering material is positioned between the assembly 100 and the external device. During soldering, the soldering material rises to the side face 119 of the assembly 100, thus allowing to verify that the soldering has been correctly performed.

[0119] Once the circuit has been installed in its environment, such assemblies 100 are particularly useful to guarantee the reliability of the electrical connections.

[0120] Various embodiments and variants have been described. The skilled person will understand that certain features of these embodiments can be combined, and that other variants will readily occur to the skilled person.

[0121] Finally, based on the functional description provided above, the actual implementation of the embodiments and variants described herein is within the capabilities of the skilled person.

[0122] A process for manufacturing an electronic assembly (100) with wettable flanks from a substrate (301) covered by connection terminals (107) and in which a chip (103) is formed, the process being summarized as comprising the steps of: a) soldering connection pads (117) to connection terminals (107) of the chip (103), b) coating the connection pads (117) with an insulating resin layer (121), c) thinning the insulating resin layer (121) until it reaches the core (116) of the connection pads (117), d) forming cavities (311) by removing portions of the connection pads (117) and portions of the insulating resin layer (121) so as to make portions of the flanks (119) of the assembly (100) accessible, e) depositing a layer (122) of conductive material on the flanks (119) of the assembly (100) and on the core of the connection pads (117), f) separating the chip (103) through the cavities (311).

[0123] The connection pads (117) comprise a conductive core (116) covered by a layer (118) of solderable material.

[0124] The solderable material is Sn or a tin alloy, such as SnAg or SnAgCu.

[0125] The conductive core (116) is made of copper.

[0126] The conductive material and the solderable material are the same.

[0127] Step e) is performed by screen printing.

[0128] The electronic assembly (100) with wettable flanks is summarized as comprising: a chip (103) having connection terminals (107), the chip (103) being protected by a housing (109) comprising a first main face (115), flanks (119) and a second main face; a layer (122) of conductive material covering portions of the flanks (119) and extending over the first main face (115), the layer (122) of conductive material being electrically connected to the connection terminals (107) of the chip (103) by means of connection pads (117) soldered to the connection terminals (107).

[0129] The connection pads (117) comprise a conductive core (116) at least partially covered by a layer (118) of material soldered to the connection terminals (107).

[0130] The layer (122) of conductive material is a layer of Sn or a tin alloy, such as SnAg or SnAgCu.

[0131] The insulating resin layer (121) covers the first main face (105) of the chip (103) between the connection pads (117).

[0132] The various embodiments described above can be combined to provide further embodiments. Aspects of an embodiment can be modified, if necessary to employ concepts of various patents, applications, and publications to provide yet further embodiments.

[0133] These and other changes can be made to the embodiments in light of the above Detailed Description. The terms used in the following claims should not be construed to limit the claims present application to the specific embodiments disclosed in the specification and the claims. The scope of the application is to be interpreted only from the claims and their equivalents.

Claims

1. An electronic component, characterized in that, The electronic components include: chip; Multiple connection terminals on the chip; Multiple connection pads, each connection pad being coupled to one of the multiple connection terminals; A housing surrounding the plurality of connection terminals on the chip, the housing including a first surface opposite the second surface and a plurality of sidewalls; and A conductive material layer covering a portion of the sidewall and extending above the first surface is electrically coupled to the chip's connection terminals via connection pads soldered to the connection terminals.

2. The electronic component according to claim 1, characterized in that, The connecting pads include a conductive core that is at least partially covered by a solderable material layer coupled to the connecting terminals.

3. The electronic component according to claim 1, characterized in that, The conductive material layer is an alloy of tin.

4. The electronic component according to claim 1, characterized in that, The insulating resin layer covers the first side of the chip between the bonding pads.

5. An electronic component, characterized in that, The electronic components include: The chip has a first surface opposite to the second surface and a plurality of sidewalls extending from the first surface to the second surface along a first direction; Multiple connection terminals on the first surface; An insulating housing, covering the first surface and having a plurality of sidewalls extending along a first direction; Multiple connection pads, each connection pad being coupled to one of the multiple connection terminals; and A first wettable material layer partially covers one of the plurality of sidewalls of the insulating housing, and the first wettable material layer is directly coupled to the first of the plurality of connection pads.

6. The electronic component according to claim 5, characterized in that, The plurality of connection terminals are each separated from the sidewall of the chip by a first distance ranging from 10 μm to 50 μm.

7. The electronic component according to claim 5, characterized in that, The outer casing completely covers the first side, the second side, and the multiple sidewalls of the chip.

8. The electronic component according to claim 5, characterized in that, Each connection pad includes a conductive core covered by a layer of solderable material.

9. The electronic component according to claim 8, characterized in that, The insulating shell has a first surface that is transverse to the plurality of sidewalls of the insulating shell.

10. The electronic component according to claim 9, characterized in that, The wettable material layer is L-shaped, having a first portion of one of the plurality of sidewalls covering the insulating shell and a second portion located on a first surface of the insulating shell.

11. The electronic component according to claim 10, characterized in that, The second part of the wettable material layer is coplanar with the first surface of the insulating shell.

12. The electronic component according to claim 10, characterized in that, The first and second portions of the wettable material layer are both directly coupled to the conductive core of the first connection pad among the plurality of connection pads.

13. The electronic component according to claim 10, characterized in that, The electronic component further includes a second wettable material layer that is directly coupled to a second connection pad among the plurality of connection pads, the second wettable material layer being coplanar with a first surface of the insulating housing.

14. The electronic component according to claim 5, characterized in that, The electronic component also includes an insulating resin layer that completely covers the chip.

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