Chemical vapor deposition furnace and chemical vapor deposition manufacturing system

Abstract

The utility model relates to a chemical vapor deposition furnace and a chemical vapor deposition manufacturing system. In one aspect, there is provided a CVD furnace comprising: a furnace body; and a plurality of lower covers which can be replaced with each other, and any one of the plurality of lower covers can be provided with a base material support used for supporting a plurality of base materials thereon, and can be detachably connected to the bottom of the furnace body to form the complete CVD furnace. Therefore, the idle time of the furnace body can be shortened, and the utilization rate of the furnace body is improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing technology, and more specifically, to chemical vapor deposition furnaces and chemical vapor deposition manufacturing systems. Background Technology

[0002] Chemical vapor deposition (CVD) is a common coating method in semiconductor manufacturing. For example, in the process of preparing SiC structures, such as focusing rings, for semiconductor manufacturing components using CVD, multiple substrates to be coated, such as graphite rings, are supported in the furnace of a CVD furnace by a substrate support, so that SiC films are deposited on the substrates through CVD reactions.

[0003] During the coating process, the ejector pins of the substrate support may partially obstruct the substrate, preventing film deposition on the obstructed portion. Therefore, throughout the coating process, the substrate and its support must be repeatedly removed from the furnace. After cooling, the ejector pins are manually adjusted to maintain their position before being returned to the furnace for deposition. This process is repeated multiple times to complete the entire coating process.

[0004] However, the furnace remains idle while waiting for the substrate to cool and for the support position to be adjusted, resulting in low furnace utilization. Utility Model Content

[0005] This section provides a general overview of this disclosure, rather than a full disclosure of the entire scope or all features of this disclosure.

[0006] The purpose of this disclosure is to provide a chemical vapor deposition furnace and a chemical vapor deposition manufacturing system that can reduce furnace downtime.

[0007] To achieve the above objectives, according to one aspect of this disclosure, a CVD furnace is provided, comprising:

[0008] Furnace body; and

[0009] Multiple lower covers are interchangeable with each other, and any one of the lower covers can be mounted on a substrate support for supporting multiple substrates, and can be detachably connected to the bottom of the furnace body to form a complete CVD furnace.

[0010] In some embodiments, the CVD furnace may also include a substrate support mounted to each lower cover.

[0011] In some embodiments, the CVD furnace may also include a sealing cover for sealing the bottom of the furnace body after the lower cover has been removed from the furnace body.

[0012] According to another aspect of this disclosure, a CVD manufacturing system is also provided, comprising:

[0013] The CVD furnace according to any of the above embodiments;

[0014] A support frame is used to suspend the CVD furnace in mid-air.

[0015] A lifting mechanism is used to lift the lower cover from below the furnace body; and

[0016] A transport device for moving the lower cover away from and under the furnace body.

[0017] In some implementations, the transport device may be multiple transport vehicles, each used to transport a lower cover.

[0018] In some embodiments, the transport device may be a horizontal track, which is configured such that, while a lower cover removed from the furnace body moves away from below the furnace body on the horizontal track without leaving the horizontal track, another lower cover among the plurality of lower covers can move on the horizontal track to below the furnace body.

[0019] In some implementations, the horizontal track may include multiple sub-horizontal tracks, each extending outward from the bottom of the furnace body, and each sub-horizontal track is used to transport a lower cover.

[0020] In some implementations, the plurality of sub-horizontal tracks may be two sub-horizontal tracks, and the included angle between the two sub-horizontal tracks may be 60°, 90° or 180°.

[0021] In some implementations, the horizontal track can be a closed circular track.

[0022] In some embodiments, the lifting mechanism may include a lifting part and a supporting part, the supporting part being disposed on the lifting part for supporting the lower cover, and the lifting part being used to drive the supporting part to rise and fall.

[0023] According to the above technical solution, by setting multiple lower covers, and enabling each lower cover to install a corresponding substrate support for supporting multiple substrates, another batch of substrates can be coated using the furnace body while the substrates on the removed lower cover are cooling and their support positions are being adjusted. This reduces furnace downtime and heat loss within the furnace, thereby improving furnace utilization. Furthermore, since other substrate supports can be installed on corresponding lower covers without occupying the lower covers removed from the furnace, the support positions can be adjusted directly without removing the substrate supports from the removed lower covers. This also reduces furnace downtime, further improving furnace utilization. Attached Figure Description

[0024] The features and advantages of embodiments of the present disclosure will become more readily understood from the following description with reference to the accompanying drawings. The drawings are not drawn to scale and some features may be enlarged or reduced to show detail of specific parts. In the drawings:

[0025] Figure 1 This is a schematic structural diagram of a CVD furnace according to an embodiment of the present disclosure.

[0026] Figure 2 This is a schematic structural diagram of a CVD furnace according to another embodiment of the present disclosure.

[0027] Figure 3 This is a schematic structural diagram of a CVD furnace according to yet another embodiment of the present disclosure.

[0028] Figure 4 This is a schematic front view of a CVD manufacturing system according to an embodiment of the present disclosure.

[0029] Figure 5 This is a schematic top view of a CVD manufacturing system according to an embodiment of the present disclosure.

[0030] Figure 6 The diagram schematically illustrates a horizontal track comprising two sub-horizontal tracks with an included angle of 180°.

[0031] Figure 7 The diagram schematically illustrates a scenario where a horizontal track comprises two sub-horizontal tracks with an included angle of 90°.

[0032] Figure 8 This is a schematic top view of a CVD manufacturing system according to another embodiment of the present disclosure.

[0033] Figure 9 This is a schematic top view of a CVD manufacturing system according to yet another embodiment of the present disclosure.

[0034] In the accompanying drawings, the same or corresponding technical features, parts or components are represented by the same or corresponding reference numerals. Detailed Implementation

[0035] The present disclosure will now be described in detail with reference to the accompanying drawings and exemplary embodiments. It should be noted that the following detailed description of the present disclosure is for illustrative purposes only and is not intended to limit the scope of the disclosure.

[0036] It should be noted that, for clarity, not all features of a particular embodiment are described or shown in the specification and drawings. Furthermore, to avoid unnecessary details obscuring the technical solutions of interest in this disclosure, only the device structures and parts closely related to the technical solutions of this disclosure are described and shown in the specification and drawings, while other details that are not closely related to the technical content of this disclosure and are known to those skilled in the art are omitted.

[0037] As mentioned earlier, because the substrate and its corresponding support need to be removed from the furnace multiple times, and the substrate and support are sent back into the furnace to continue deposition after the substrate has cooled and the support position has been adjusted, the furnace body is always idle while waiting for the substrate to cool and the support position to be adjusted, resulting in low furnace utilization.

[0038] In view of this, according to embodiments of the present disclosure, a CVD furnace is provided. Hereinafter, referring to... Figures 1 to 3 The CVD furnace 10 will be described in detail.

[0039] CVD furnace 10 includes furnace body 110 and multiple lower covers 120 (in Figures 1 to 3 (Example shown as 2).

[0040] The furnace body 110 provides space for CVD reactions. During the coating process, a substrate support 130 supporting multiple substrates 2 is arranged inside the furnace body 110 to deposit a film on the substrates 2 through a CVD reaction of reaction gases introduced into the furnace body 110.

[0041] like Figure 1 As shown, the furnace body 110 may include, for example, a body portion 1101 and a top cover 1102. The body portion 1101 is a cylindrical shape with open ends, and the top cover 1102 is detachably connected to the top of the body portion 1101, for example, by bolts, to close the top opening of the body portion 1101. However, it is conceivable that the body portion 1101 and the top cover 1102 may also be integrally formed.

[0042] The plurality of lower covers 120 can be interchanged with each other, and any one of the plurality of lower covers 120 can be mounted on a substrate support 130 for supporting a plurality of substrates 2, and can be detachably connected to the bottom 110a of the furnace body 110 to form a complete CVD furnace 10.

[0043] In other words, each of these lower covers 120 is adapted to the furnace body 110, or more specifically, to the bottom 110a of the furnace body 110, so that it can be individually assembled with the furnace body 110 to form a complete CVD furnace 10. Moreover, each lower cover can be fitted with a substrate support 130, so that each lower cover 120 can be paired with a corresponding substrate support 130.

[0044] In this case, when it is necessary to remove the substrate 2 and the corresponding substrate support 130 from the furnace body 110 to adjust the support position of the substrate support 130 on the substrate 2, the lower cover 120 of the substrate support 130 that carries multiple substrates 2 can be directly removed from the furnace body 110 to adjust the support position. At the same time, another lower cover 120 of the other substrate support 130 that carries multiple other substrates 2 can be installed at the bottom 110a of the furnace body 110 to continue the coating process in the furnace body 110.

[0045] In this way, while waiting for the substrate 2 on the removed lower cover 120 to cool and for its support position to be adjusted, the furnace body 110 can be used to coat another batch of other substrates 2. Moreover, while the lower cover 120 corresponding to this other batch of other substrates 2 is removed and waiting for this other batch of other substrates 2 to cool and for its support position to be adjusted, the furnace body 110 can be used again to coat the substrates 2 whose support position has been adjusted, or to coat a new batch of other substrates 2, and so on in a repeated cycle. As a result, the idle time of the furnace body 110 can be reduced, and the heat loss inside the furnace body 110 can be reduced due to the shortened idle time, thereby improving the utilization rate of the furnace body.

[0046] Furthermore, since other substrate supports 130 can be installed on corresponding lower covers 120 without occupying the lower cover 120 removed from the furnace body 110, the support position can be adjusted directly without removing the substrate support 130 from the removed lower cover 120. This saves the time spent assembling and disassembling the substrate 2 and substrate support 130 from the removed lower cover 120. In particular, the substrate 2 and substrate support 130 are too hot when just removed from the furnace body 110, making assembly and disassembly difficult and time-consuming. This also reduces the idle time of the furnace body 110, thereby improving furnace utilization.

[0047] It is conceivable that, for example Figure 2 As shown, the CVD furnace 10 may also include a substrate support 130 mounted to each lower cover 120.

[0048] In this manner, the CVD furnace 10 may include multiple paired lower cover and substrate support assemblies, wherein each lower cover and substrate support assembly includes a lower cover 120 and may include at least one substrate support 130, for example, in Figure 2 In the middle, the lower cover and substrate support assembly includes 6 substrate supports 130 (in Figure 2 In the semi-sectional view, only three substrate supports 130 are shown. This allows for easy replacement of each lower cover and substrate support assembly, enabling the alternating processing of different batches of substrate 2.

[0049] In some implementations, such as Figure 3 As shown, the CVD furnace 10 may also include a sealing cover 140 for sealing the bottom 110a of the furnace body 110 after the lower cover 120 is removed from the furnace body 110.

[0050] Normally, the lower cover 120 is removed from the furnace body 110 only after it has cooled to a certain temperature. However, at this time, the temperature inside the furnace body 110 is still relatively high. Before the other lower cover 120 is installed on the furnace body 110, impurities such as oxygen may enter the furnace body 110 from the open bottom 110a, potentially damaging internal components or even causing an explosion. Furthermore, heat inside the furnace body 110 is continuously lost through the open bottom 110a, resulting in energy waste.

[0051] By sealing the bottom 110a of the furnace body 110 with the sealing cover 140, the interior of the furnace body 110 can be isolated from the external environment before the other lower cover 120 is installed to the bottom 110a. This prevents impurity gases from entering the furnace body 110 and damaging the internal components, or even causing an explosion. It also prevents heat loss from the bottom 110a, which helps to retain residual heat in the furnace body 110 and thus improves the utilization rate of the furnace body.

[0052] It is conceivable that the sealing cover 140 can be detachably connected to the bottom 110a of the furnace body 110 by bolts or the like. However, the sealing cover 140 can also achieve a seal on the bottom 110a in other ways.

[0053] According to another aspect of this disclosure, a CVD manufacturing system 1 is also provided. Hereinafter, referring to... Figures 4 to 9 The CVD manufacturing system 1 will be described in detail.

[0054] First, refer to Figure 4 The CVD manufacturing system 1 includes a CVD furnace 10, a support 20, a lifting mechanism 30, and a transport device 40.

[0055] The support 20 is used to support the CVD furnace 10 so that the CVD furnace 10 is suspended in the air. That is, the support 20 can support the CVD furnace 10 so that the bottom of the CVD furnace 10 is a certain distance from the ground.

[0056] Thus, on the one hand, it can achieve stable support for the CVD furnace 10 to ensure the stability of the reaction inside the furnace; on the other hand, when the lower cover 120 is removed from the furnace body 110 of the CVD furnace 10, since the lower cover 120 carries the substrate support 130 and the substrate 2, the space below the furnace body 110 being suspended can facilitate the removal and insertion of the substrate support 130 and the substrate 2 relative to the furnace body 110.

[0057] The lifting mechanism 30 is used to lift the lower cover 120 from below the furnace body 110.

[0058] Because the bottom of the CVD furnace 10 is suspended, the lower cover 120 must be lowered from the bottom 110a of the furnace body 110 to the ground or transport device 40 for removal, and raised from the ground or transport device 40 to the bottom 110a of the furnace body 110 for installation. This lifting process can be easily performed using the lifting mechanism 30.

[0059] The transport device 40 is used to move the lower cover 120 away from and under the furnace body 110.

[0060] The lower cover 120 can be easily moved using the transport device 40. For example, when the lower cover 120 is removed from the furnace body 110, the lifting mechanism 30 can be used to lower the lower cover 120 to the transport device 40, and the transport device 40 can be used to move the lower cover 120 away from under the furnace body 110 to allow for cooling of the substrate 2 and adjustment of its support position. When the lower cover 120 is to be installed on the furnace body 110, the transport device 40 can be used to move the lower cover 120 to under the furnace body 110, and the lifting mechanism 30 can be used to raise the lower cover to the bottom 110a of the furnace body 110 to connect the lower cover 120 to the bottom 110a.

[0061] In some implementations, refer to Figures 5 to 8 The transport device 40 can be a horizontal track, which is configured such that when the lower cover 120 removed from the furnace body 110 moves away from below the furnace body 110 on the horizontal track without leaving the horizontal track, another lower cover of the plurality of lower covers 120 can move on the horizontal track to below the furnace body 110.

[0062] In other words, when the removed lower cover 120 is moved away from under the furnace body 110 and is still on the horizontal track, the removed lower cover 120 will not obstruct the movement of the other lower cover 120 to under the furnace body 110. Instead, the other lower cover 120 can be moved directly along the horizontal track to under the furnace body 110 so that it can be installed on the furnace body 110.

[0063] In this way, the adjustment of the support position and the replacement of the lower cover 120 can be carried out directly on the horizontal track without removing the lower cover 120, thereby reducing the time for adjustment and replacement work, and further shortening the idle time of the furnace body, thus improving the utilization rate of the furnace body.

[0064] It is conceivable that the lower cover 120 may have rollers on its lower surface to allow the lower cover 120 to move on the horizontal track 40. However, other structures are also conceivable, as long as they enable the lower cover 120 to move on the horizontal track 40.

[0065] Additionally, it should be noted that, for clarity, in Figures 5 to 9 In the image, the bracket 20, the furnace body 110, and the lower cover 120, which is removed from the furnace body 110 and located below the furnace body 110, are shown in dashed lines. Moreover, when viewed from above, the outline of the furnace body 110 overlaps with the outline of the lower cover 120 located below the furnace body 110.

[0066] In some implementations, such as Figure 5 As shown, the horizontal track 40 may include a plurality of sub-horizontal tracks 401, each sub-horizontal track 401 extending outward from the lower part of the furnace body 110, and each sub-horizontal track 401 is used to transport a lower cover 120.

[0067] Figure 5 Four sub-horizontal tracks 401 are illustrated in the example. Since each sub-horizontal track 401 extends outward from the bottom of the furnace body 110, the lower cover 120 removed from the furnace body 110 can be lowered to the ends of all sub-horizontal tracks 401, for example, by means of a lifting mechanism 30, and can move along any of the sub-horizontal tracks 401.

[0068] In this configuration, when the lower cover 120 is removed from the furnace body 110, it can move along any of the sub-horizontal tracks 401 where no other lower cover 120 is placed, to move away from under the furnace body 110. While waiting for the substrate 2 and substrate support 130 on the removed lower cover 120 to cool and for support position adjustments to be made, another lower cover 120 can move along any of the empty sub-horizontal tracks 401 where no removed lower cover 120 is placed, to move under the furnace body 110 without being obstructed by the removed lower cover 120.

[0069] It is understandable that the number of lower covers 120 is less than or equal to the number of sub-horizontal tracks 401, so as to ensure that only one lower cover 120 is transported on each sub-horizontal track 401, thereby avoiding the situation where the movement of the lower cover 120 is blocked.

[0070] Figure 6 and Figure 7 The illustration shows a scenario where the horizontal track 40 includes two sub-horizontal tracks 401.

[0071] In this case, the included angle between the two sub-horizontal tracks 401 can be 180° (e.g., Figure 6 As shown), 90° (as shown) Figure 7 (as shown), 60° or any other suitable angle.

[0072] By making the two sub-horizontal tracks 401 at an angle other than 180°, such as 90° or 60°, compared to a straight structure where the two horizontal tracks 401 are in the same straight line (i.e., at an angle of 180°), the space occupied by the horizontal tracks 40 can be reduced, thus improving space utilization.

[0073] In some implementations, such as Figure 8 As shown, the horizontal track 40 can be a closed circular track.

[0074] In this case, for example, when the lower cover 120 is removed from the furnace body 110, it can move clockwise or counterclockwise on the annular track to leave from under the furnace body 110, and another lower cover 120, which is equipped with other substrate supports 130 that carry multiple other substrates 2, can move in the same direction on the annular track to reach under the furnace body 110, and the movement paths of the two lower covers 120 will not interfere with each other.

[0075] Understandably, the circular track can transport multiple lower covers 120 simultaneously without interfering with or blocking each other, thus enabling the transport of a relatively large number of lower covers 120 with a relatively small footprint.

[0076] In some implementations, refer to Figure 9 The transport device 40 may also be a plurality of transport vehicles 402, wherein each transport vehicle 402 is used to transport a lower cover 120.

[0077] In this case, the lower cover 120 removed from the furnace body 110 can be moved away from under the furnace body 110 by a transport vehicle 402 to adjust the support position, while another lower cover 120 can be transported to the bottom of the furnace body 110 by another transport vehicle 402 to be connected to the bottom 110a of the furnace body 110.

[0078] Because these transport vehicles can move freely on different paths, they are less likely to block each other while moving.

[0079] In some implementations, such as Figure 2 As shown, the lifting mechanism 30 may include a lifting part 301 and a supporting part 302. The supporting part 302 is disposed on the lifting part 301 to support the lower cover 120, and the lifting part 301 is used to drive the supporting part 302 to rise and fall.

[0080] In this way, the stability of the lower cover 120 in moving between the bottom 110a of the furnace body 110 and the transport device 40 can be improved, thereby improving the stability of the substrate support 130 installed on the lower cover 120 in supporting the substrate 2 during the lifting process, and reducing the possibility of damage to the substrate 2 caused by the shaking of the lower cover 120 during the lifting process.

[0081] It is conceivable that, for example Figure 4 As shown, the lifting part 301 can be a lead screw, and the supporting part 302 can be a support plate with a central opening. However, the lifting part 301 and the supporting part 302 can also take any other suitable form.

[0082] Below, in conjunction with Figure 6 The scenario shown describes the CVD manufacturing process.

[0083] In this CVD manufacturing process, two sets of substrates 2 to be deposited can be prepared, namely, a first set of substrates and a second set of substrates. The first set of substrates can be supported on a first substrate holder mounted on a first lower cover, and the second set of substrates can be supported on a second substrate holder mounted on a second lower cover. The first lower cover is placed on one of two sub-horizontal tracks, namely the first sub-horizontal track, while the second lower cover is placed on the other, namely the second sub-horizontal track.

[0084] When preparing for deposition, the first lower cover can be moved below the furnace body 110 via the first sub-horizontal track and lifted to the bottom 110a of the furnace body 110 via the lifting mechanism 30 for installation. Thus, the first set of substrates can be deposited and coated within the furnace body 110.

[0085] After the predetermined time, deposition can be stopped. When the furnace body 110 cools to a certain temperature, the first lower cover is removed to remove the corresponding first substrate support and the first group of substrates out of the furnace body 110. The first lower cover is then moved away from under the furnace body 110 via the first sub-horizontal track to allow the first group of substrates to cool. After cooling, the support position of the first substrate support on the substrates in the first group of substrates is adjusted.

[0086] While the first lower cover is being removed, an inert gas, such as nitrogen, is continuously introduced into the furnace body 110 to prevent or reduce the entry of impurity gases, such as oxygen, from the external environment, and the bottom 110a of the furnace body 110 can be sealed using the sealing cover 140.

[0087] Furthermore, while waiting, the second lower cover can be moved below the furnace body 110 via the second sub-horizontal track and lifted to the bottom 110a of the furnace body 110 via the lifting mechanism 30 for installation at the bottom 110a (at this time, the sealing cover 140 has been removed, and inert gas continues to be introduced into the furnace body 110). Thus, the second set of substrates can be deposited and coated in the furnace body 110.

[0088] When it is necessary to adjust the support position of the second set of substrates, remove the second lower cover and move the second set of substrates out of the furnace body 110. Repeat the above operation until the coating process is completed.

[0089] While this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the specific embodiments described and shown herein. Various changes to the exemplary embodiments can be made by those skilled in the art without departing from the scope defined by the claims of this disclosure.

[0090] The features mentioned and / or shown in the foregoing description of exemplary embodiments of this disclosure may be combined in the same or similar manner with one or more other embodiments, combined with features in other embodiments, or substituted for corresponding features in other embodiments. Such combinations or substitutions should also be considered as including within the scope of protection of this disclosure.

Claims

1. A CVD furnace, characterized in that, include: Furnace body; as well as Multiple lower covers are interchangeable with each other, and any one of the lower covers can be mounted on a substrate support for supporting multiple substrates, and can be detachably connected to the bottom of the furnace body to form a complete CVD furnace.

2. The CVD furnace according to claim 1, characterized in that, It also includes the substrate support mounted to each of the lower covers.

3. The CVD furnace according to claim 1 or 2, characterized in that, It also includes a sealing cap for sealing the bottom of the furnace body after the lower cover has been removed from the furnace body.

4. A CVD manufacturing system, characterized in that, include: The CVD furnace according to any one of claims 1 to 3; A support frame is used to support the CVD furnace so that the CVD furnace is suspended in the air; A lifting mechanism is used to lift the lower cover from below the furnace body; as well as A transport device for moving the lower cover away from and under the furnace body.

5. The CVD manufacturing system according to claim 4, characterized in that, The transport device comprises multiple transport vehicles, each of which is used to transport one of the lower covers.

6. The CVD manufacturing system according to claim 4, characterized in that, The transport device is a horizontal track, which is configured such that, while the lower cover removed from the furnace body moves away from below the furnace body on the horizontal track without leaving the horizontal track, another lower cover among the plurality of lower covers can move on the horizontal track to below the furnace body.

7. The CVD manufacturing system according to claim 6, characterized in that, The horizontal track includes multiple sub-horizontal tracks, each extending outward from the bottom of the furnace body, and each sub-horizontal track is used to transport one of the lower covers.

8. The CVD manufacturing system according to claim 7, characterized in that, The plurality of sub-horizontal tracks are two sub-horizontal tracks, and the included angle between the two sub-horizontal tracks is 60°, 90° or 180°.

9. The CVD manufacturing system according to claim 6, characterized in that, The horizontal track is a closed circular track.

10. The CVD manufacturing system according to any one of claims 4 to 9, characterized in that, The lifting mechanism includes a lifting part and a supporting part. The supporting part is disposed on the lifting part to support the lower cover, and the lifting part is used to drive the supporting part to rise and fall.

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