Wafer level chip test probe

Abstract

The utility model relates to the technical field of chip testing, and discloses a wafer-level chip testing probe, which comprises a shell, an upper probe head is mounted at the top of the inner wall of the shell, a spring is fixedly connected to the bottom of the upper probe head, and a lower probe head is fixedly connected to the bottom of the spring. According to the wafer-level chip test probe, the inner sleeve shell and the outer sleeve shell respectively sleeve the outer side of the circuit connection of the upper probe head and the spring, and the inner sleeve shell and the outer sleeve shell are made of aluminum oxide ceramic materials, so that the wafer-level chip test probe has relatively high electrical insulativity and hardness, and the influence of an external current magnetic field on the connection circuit of the upper probe head and the lower probe head is reduced; the inner sleeve shell and the outer sleeve shell are not prone to deformation in a high-temperature state to affect the size of the inner sleeve shell and the outer sleeve shell, the inner sleeve shell and the outer sleeve shell slide more smoothly due to the smooth surface, operation of the spring is not prone to be affected, and therefore the efficient protection effect on the interior of the upper needle head is achieved, and the influence of an external electromagnetic field on the test needle is isolated. And the test stability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a wafer-level chip testing probe. Background Technology

[0002] Wafer-level chip test probes are precision tools used in semiconductor manufacturing to test the electrical performance of chips on wafers. They connect to contact points on the chip via tiny probes to detect the chip's functions and performance. The design and manufacturing of these test probes are extremely demanding because they must be able to precisely contact the tiny chip contact points and remain stable during testing to ensure the accuracy of the test results.

[0003] Traditional test probes have two needles connected to a circuit, with a spring inside the casing. The spring is usually placed outside the connecting circuit or the connector between the two needles, which makes it easy for the circuit to come into contact with the spring and conduct electricity, affecting the stability of the circuit transmission. At the same time, the circuit is easily affected by external electromagnetic interference, which can affect the data transmission. Therefore, when the test probe is used in an environment with a certain electromagnetic field, the performance of the test probe is greatly reduced, the stability is affected, and the data test is inaccurate. Utility Model Content

[0004] The technical problem to be solved by this invention is that the existing technology has the disadvantage that external magnetic fields can easily affect the stability of the test probe. To address this, we propose a wafer-level chip test probe.

[0005] To achieve the above objectives, this application adopts the following technical solution: a wafer-level chip test probe, comprising a housing, an upper needle mounted on the top of the inner wall of the housing, a spring fixedly connected to the bottom of the upper needle, a lower needle fixedly connected to the bottom of the spring, the lower needle slidably connected to the inner wall of the housing, the upper needle and the lower needle being connected by a wire, an inner shell fixedly connected to the bottom of the upper needle, an outer shell fixedly connected to the top of the lower needle, the inner wall of the outer shell being slidably connected to the surface of the inner shell, and both the inner shell and the outer shell being made of alumina ceramic material.

[0006] Preferably, both the inner shell and the outer shell have several round holes on their surfaces.

[0007] Preferably, the bottom and top of the outer casing are rounded.

[0008] Preferably, the top of the upper needle is provided with a welding groove, and a long rod is fixedly connected to the top of the inner wall of the welding groove.

[0009] Preferably, the outer casing is made of brass and has a tin-plated coating on its surface.

[0010] Preferably, the inner shell and the outer shell are placed on the inner wall of the spring and are slidably connected to the inner wall of the spring.

[0011] The technical effects and advantages of this utility model are as follows:

[0012] In this invention, an inner and outer shell are respectively fitted onto the outside of the circuit connection between the upper needle and the spring. The alumina ceramic material of the inner and outer shells provides high electrical insulation and hardness, reducing the influence of external current and magnetic fields on the connection circuit between the upper and lower needles. Under high temperature conditions, they are not easily deformed, which affects the size of the inner and outer shells. At the same time, their smooth surfaces make the sliding of the inner and outer shells smoother and less likely to affect the operation of the spring. This achieves a highly efficient protection effect on the inside of the upper needle, isolates the test needle from the influence of external electromagnetic fields, and improves the testing stability of the device. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0014] Figure 2 This is a cross-sectional view of the top structure of the outer shell of this utility model;

[0015] Figure 3 This is a schematic diagram of the spring structure of this utility model;

[0016] Figure 4 This is a cross-sectional view of the internal structure of this utility model;

[0017] Figure 5 This is a schematic diagram of the top structure of the upper needle tip of this utility model.

[0018] Illustration: 1. Outer shell; 2. Upper needle; 3. Spring; 4. Lower needle; 5. Inner shell; 6. Outer shell; 7. Round hole; 8. Rounded corner; 9. Welding groove; 10. Long rod. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0020] Reference Figure 1 - Figure 5As shown, this utility model provides a technical solution: a wafer-level chip test probe, including a housing 1, an upper probe 2 mounted on the top of the inner wall of the housing 1, a spring 3 fixedly connected to the bottom of the upper probe 2, a lower probe 4 fixedly connected to the bottom of the spring 3, the lower probe 4 slidably connected to the inner wall of the housing 1, the upper probe 2 and the lower probe 4 connected by a wire, an inner shell 5 fixedly connected to the bottom of the upper probe 2, and an outer shell 6 fixedly connected to the top of the lower probe 4, the inner wall of the outer shell 6 slidably connected to the surface of the inner shell 5, both the inner shell 5 and the outer shell 6 are made of alumina ceramic material, and the inner shell... The inner shell 5 and outer shell 6 are respectively fitted onto the outside of the circuit connection between the upper needle 2 and the spring 3. The alumina ceramic material of the inner shell 5 and outer shell 6 gives them high electrical insulation and hardness, reducing the influence of external current and magnetic field on the connection circuit between the upper needle 2 and the lower needle 4. They are not easily deformed at high temperatures, which affects the size of the inner shell 5 and outer shell 6. At the same time, their smooth surface makes the sliding of the inner shell 5 and outer shell 6 smoother and less likely to affect the operation of the spring 3. This achieves a highly efficient protection effect on the inside of the upper needle 2, isolates the test needle from the influence of external electromagnetic field, and improves the testing stability of the device.

[0021] Reference Figure 2 As shown in this embodiment: both the inner shell 5 and the outer shell 6 have several round holes 7 on their surfaces. The round holes 7 allow air circulation between the inner shell 5 and the outer shell 6, allowing the heat inside the inner shell 5 and the outer shell 6 to flow to the outside through the round holes 7. This interaction between heat and air ensures that the heat generated by the wiring connection between the upper needle 2 and the lower needle 4 can be discharged to the outside, ensuring that the heat inside the inner shell 5 and the outer shell 6 is dissipated normally.

[0022] Reference Figure 2 As shown in this embodiment: the bottom and top of the outer casing 1 are provided with rounded corners 8. The rounded corners 8 make the top and bottom of the outer casing 1 more rounded and smooth, so that when the outer casing 1 bumps into the chip, it is not easy to cause scratches on the chip surface and affect its normal use, thereby improving the protection of the outer casing 1 during use and reducing scratches caused to the chip by the outer casing 1 during use.

[0023] Reference Figure 5 As shown in this embodiment: a welding groove 9 is provided on the top of the upper needle 2, and a long rod 10 is fixedly connected to the top of the inner wall of the welding groove 9. When the upper needle 2 is connected to the instrument circuit, the circuit is placed on the inner wall of the welding groove 9 and soldered to allow the solder to enter the inner wall of the welding groove 9. After solidification, the solder is bound by the long rod 10, embedding the solder block into the inner wall of the welding groove 9, making the circuit soldered on the top of the upper needle 2 more stable and firm, and less likely to loosen or fall off.

[0024] Reference Figure 1 and Figure 2As shown in this embodiment: the outer shell 1 is made of brass and coated with a tin plating layer. By using brass as the outer shell 1 and coating the surface with a tin plating layer, the outer shell 1 has the high thermal conductivity of brass, which improves the heat dissipation effect of the outer shell 1 and prevents the internal overheating of the outer shell 1 from affecting the operation of the device. At the same time, the tin plating layer on the surface prevents the surface of the outer shell 1 from oxidizing and rusting after long-term use, thereby improving the service life of the device.

[0025] Reference Figure 2 - Figure 4 As shown in this embodiment: the inner shell 5 and the outer shell 6 are placed on the inner wall of the spring 3 and are slidably connected to the inner wall of the spring 3. When the lower needle 4 pushes the spring 3 to retract, the inner shell 5 and the outer shell 6 restrict the position of the spring 3, preventing the spring 3 from rolling inward and causing itself to become entangled, preventing the connection line between the spring 3 and the lower needle 4 from contacting and conducting electricity, affecting the transmission effect of the line, isolating the spring 3, and ensuring the stability of the transmission of the connection line between the lower needle 4 and the upper needle 2.

[0026] Working principle: The inner shell 5 and outer shell 6 are respectively fitted onto the outside of the circuit connection between the upper needle 2 and the spring 3. The alumina ceramic material of the inner shell 5 and outer shell 6 gives them high electrical insulation and hardness, reducing the influence of external current and magnetic field on the connection circuit between the upper needle 2 and the lower needle 4. Under high temperature conditions, they are not easily deformed, which would affect the size of the inner shell 5 and outer shell 6. At the same time, their smooth surface makes the sliding of the inner shell 5 and outer shell 6 smoother and less likely to affect the operation of the spring 3, thus achieving a highly efficient protection effect on the inside of the upper needle 2. To isolate the test probe from external electromagnetic fields and improve the testing stability of this device, the circular hole 7 allows for air circulation between the inner shell 5 and the outer shell 6. This allows heat from inside the inner shell 5 and outer shell 6 to flow to the outside, ensuring that the heat generated by the wiring connection between the upper needle 2 and the lower needle 4 can be dissipated normally. The rounded corners 8 make the top and bottom of the outer shell 1 more rounded and smooth, reducing the risk of damage to the chip when the outer shell 1 bumps against the chip. Scratches on the surface can affect normal use. To improve the protective properties of the outer casing 1 during use, and reduce accidental scratches on the chip, when the upper needle 2 is connected to the instrument circuitry, the circuitry is placed inside the soldering tank 9, and soldering allows the solder to enter the inner wall of the soldering tank 9. After solidification, the solder is restrained by the long rod 10, embedding the solder block into the inner wall of the soldering tank 9. This makes the circuitry soldered to the top of the upper needle 2 more stable and secure, less prone to loosening or falling off. By using brass material for the outer casing 1 and coating the surface with a tin layer, the outer casing 1 gains the high brass quality... The heat dissipation effect of the outer shell 1 is improved by improving the thermal conductivity, preventing overheating inside the outer shell 1 from affecting the operation of the device. At the same time, the tin plating layer on the surface prevents oxidation and rust on the surface of the outer shell 1 after long-term use, thereby improving the service life of the device. When the lower needle 4 pushes the spring 3 to retract, the inner shell 5 and the outer shell 6 restrict the position of the spring 3, preventing the spring 3 from rolling inward and causing itself to become entangled. This also prevents the connection line between the spring 3 and the lower needle 4 from contacting and conducting electricity, thus affecting the transmission effect of the line. The spring 3 is isolated to ensure the stability of the transmission line between the lower needle 4 and the upper needle 2.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer-level chip test probe, comprising a housing (1), characterized in that: An upper needle (2) is installed on the top of the inner wall of the outer shell (1). A spring (3) is fixedly connected to the bottom of the upper needle (2). A lower needle (4) is fixedly connected to the bottom of the spring (3). The lower needle (4) is slidably connected to the inner wall of the outer shell (1). The upper needle (2) and the lower needle (4) are connected by an electric wire. An inner shell (5) is fixedly connected to the bottom of the upper needle (2). An outer shell (6) is fixedly connected to the top of the lower needle (4). The inner wall of the outer shell (6) is slidably connected to the surface of the inner shell (5). Both the inner shell (5) and the outer shell (6) are made of alumina ceramic material.

2. The wafer-level chip test probe according to claim 1, characterized in that: Both the inner shell (5) and the outer shell (6) have several round holes (7) on their surfaces.

3. The wafer-level chip test probe according to claim 1, characterized in that: The bottom and top of the outer shell (1) are both provided with rounded corners (8).

4. The wafer-level chip test probe according to claim 1, characterized in that: The upper needle (2) has a welding groove (9) at its top, and a long rod (10) is fixedly connected to the top of the inner wall of the welding groove (9).

5. A wafer-level chip test probe according to claim 1, characterized in that: The outer casing (1) is made of brass and has a tin-plated coating on its surface.

6. A wafer-level chip test probe according to claim 1, characterized in that: The inner shell (5) and the outer shell (6) are placed on the inner wall of the spring (3) and are slidably connected to the inner wall of the spring (3).

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