Biochip substrate heating device

Abstract

The utility model relates to the technical field of biochip base material heating devices, and discloses a biochip base material heating device and device framework group which comprises a device shell, a box door is hinged to one side of the device shell, a plurality of groups of heating fans are arranged on the box door and used for ventilating the interior of the device shell, the heating fans are arranged above the device shell, and the heating fans are connected with the box door. A ventilation opening of the heating fan is connected with hot air and used for heating the chip base material, and a chip base material cooling assembly is arranged in the device shell. The heating auxiliary set is arranged in the device framework set and comprises a motor fixedly arranged on one side of the device shell, the output end of the motor is fixedly connected with a rotating disc, and the device framework set introduces hot air into the device shell through a box door and a heating fan on the top to heat a chip base material, and meanwhile the good ventilation effect is achieved; and temperature uniformity in the device is ensured.

Description

Technical Field

[0001] This utility model relates to the technical field of heating devices for biochip substrates, specifically a heating device for biochip substrates. Background Technology

[0002] Currently, the main difference between commercial-grade and industrial-grade chips lies in their operating temperature range. Commercial-grade chips typically operate between 0°C and 70°C, while industrial-grade chips generally operate between -40°C and 85°C. Therefore, even for commercial-grade chips, the hardware circuitry cannot function properly in environments below zero degrees Celsius. In practical circuit design, some chips are only available in commercial-grade versions and cannot be substituted, or there are industrial-grade chips with essentially equivalent performance but at a much higher price. If the designed circuit requires operating in an environment below zero degrees Celsius, a chip heating circuit is needed to heat the chip when necessary.

[0003] A search revealed an existing technology (application number: CN113568450A) for a chip heating device. The document describes a circuit that "the temperature detection circuit is used to detect the temperature of the heated chip in real time, and when the temperature of the heated chip is detected to be lower than a first preset temperature value, sends a first warning signal to the control circuit, or when the temperature of the heated chip is detected to be higher than the first preset temperature value, sends a second warning signal to the control circuit; the control circuit is used to receive the first warning signal and control the heating circuit to turn on to heat the heated chip." This invention effectively solves the problem of chips failing to function properly due to excessively low ambient temperatures.

[0004] However, while existing technologies have improved the problem of chip substrates failing to function properly due to excessively low ambient temperatures, they still have some shortcomings: uneven heating of the chip substrate and inability to cool it quickly. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a heating device for biochip substrates.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a biochip substrate heating device, the device structure group includes a device shell, a door hinged to one side of the device shell, multiple sets of heating fans on the door for ventilation inside the device shell, a heating fan on the top of the device shell, the ventilation port of the heating fan connected to hot air for heating the chip substrate, and a chip substrate cooling component inside the device shell.

[0007] The heating auxiliary unit, located inside the device structure assembly, includes a motor fixedly mounted on one side of the device housing, with the motor's output end fixedly connected to a turntable.

[0008] And auxiliary sliding components.

[0009] As a further description of the above technical solution:

[0010] The auxiliary sliding component includes:

[0011] A fixing frame 1 is fixedly arranged on the inner wall of the device housing, and a sliding groove 1 is provided on the fixing frame 1;

[0012] Fixing bracket 2 is fixedly arranged on the inner wall of the device housing, and fixing bracket 2 is provided with sliding groove 2;

[0013] Slide three is arranged on the inner wall of the device housing on the side away from the fixed frame one;

[0014] The slide is equipped with a heating component for heating the chip substrate.

[0015] As a further description of the above technical solution:

[0016] The heating component includes:

[0017] Slider 2 is slidably arranged on slide groove 2; transmission rod is fixedly arranged above slider 2;

[0018] Slide five is set on the transmission rod, and slider one is slidably arranged inside slide five to drive the transmission rod to move;

[0019] Slider 3 is slidably arranged inside slide groove 1, and is fixedly connected to the transmission rod below;

[0020] The heating plate is fixedly connected to one side of the slider three, and multiple sets of mounting slots two are provided above the heating plate for placing chip substrates.

[0021] As a further description of the above technical solution:

[0022] The end of the heating plate away from the slider three slides within the groove three.

[0023] As a further description of the above technical solution:

[0024] The slider one is arranged at the eccentric circle position of the turntable. When the motor is started, the turntable drives the slider one to slide on the slide groove five. The slide groove five drives the slider three and the heating plate to slide in the slide groove one, so that the chip substrate arranged in the placement groove two is heated evenly.

[0025] As a further description of the above technical solution:

[0026] The chip substrate cooling assembly includes:

[0027] Slide four is located on the lower inner wall of the device housing;

[0028] The cooling plate is slidably arranged on the slide groove four; the mounting groove one is provided with multiple sets and arranged above the cooling plate.

[0029] As a further description of the above technical solution:

[0030] The device housing is located below the heating plate, and the cooling plate is provided in multiple sets and slides on the device housing for cooling the multiple sets of chip substrates after heating.

[0031] This utility model has the following beneficial effects:

[0032] 1. The device architecture group introduces hot air into the device housing through the door and the heating fan on the top to heat the chip substrate, while achieving good ventilation and ensuring uniform temperature inside the device.

[0033] 2. The cooling plate in the chip substrate cooling assembly can slide on the slide four, and the heated chip substrate can be easily transferred to the cooling plate placement slot one for cooling. Attached Figure Description

[0034] Figure 1 This is an overall schematic diagram of a biochip substrate heating device proposed in this utility model;

[0035] Figure 2 This is a schematic diagram of the internal structure of a biochip substrate heating device proposed in this utility model;

[0036] Figure 3 This is a schematic diagram of the mounting bracket for a biochip substrate heating device proposed in this utility model;

[0037] Figure 4 This is a schematic diagram of the internal sliding groove of the device housing of a biochip substrate heating device proposed in this utility model;

[0038] Figure 5 This is a schematic diagram of the motor of a biochip substrate heating device proposed in this utility model;

[0039] Figure 6 This is a schematic diagram of a cooling chip substrate for a biochip substrate heating device proposed in this utility model.

[0040] Legend: 1. Device frame assembly; 11. Device housing; 12. Door; 13. Ventilation hole; 14. Heating fan; 15. Fixing frame one; 16. Slide one; 17. Fixing frame two; 18. Slide two; 19. Slide three; 110. Slide four; 111. Cooling plate; 112. Installation slot one; 2. Heating auxiliary assembly; 21. Motor; 22. Turntable; 23. Slide one; 24. Slide two; 25. Transmission rod; 26. Slide five; 27. Slide three; 28. Heating plate; 29. ​​Installation slot two. Detailed Implementation

[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0042] like Figures 1 to 6 As shown, this embodiment provides a biochip substrate heating device, comprising: a device structure group 1, including a device housing 11, a door 12 hinged to one side of the device housing 11, multiple sets of heating fans 14 provided on the door 12 for ventilation of the inside of the device housing 11, a heating fan 14 provided above the device housing 11, the ventilation port of the heating fan 14 connected to hot air for heating the chip substrate, and a chip substrate cooling assembly provided inside the device housing 11; a heating auxiliary group 2, disposed inside the device structure group 1, including a motor 21 fixedly arranged on one side of the device housing 11, the output end of the motor 21 fixedly connected to a turntable 22.

[0043] In this embodiment, the device housing 11 and the heating auxiliary group 2 constitute the biochip substrate heating device involved in this application, realizing a biochip substrate heating device. In this application, it is a chip substrate. This device can be used as long as the chip substrate needs to be heated and cooled. This application does not limit the specific type of chip substrate.

[0044] In this embodiment, a chip substrate cooling assembly is also provided inside the device housing 11. This assembly can cool the chip substrate when appropriate, so as to meet the temperature control requirements of the biochip substrate at different processing stages.

[0045] In this embodiment, the heating fan 14 on the door 12 ventilates the inside of the device, and the heating fan 14 above the device housing 11 sends hot air into the device to heat the chip substrate.

[0046] It should be noted that motor 21 drives turntable 22 to rotate, providing power for the movement of the heating component.

[0047] Specifically, the auxiliary sliding assembly includes: a first fixing frame 15, which is fixedly arranged on the inner wall of the device housing 11, and the first fixing frame 15 is provided with a first sliding groove 16; a second fixing frame 17, which is fixedly arranged on the inner wall of the device housing 11, and the second fixing frame 17 is provided with a second sliding groove 18; a third sliding groove 19, which is arranged on the inner wall of the device housing 11 away from the first fixing frame 15; the first sliding groove 16 is provided with a heating component for heating the chip substrate.

[0048] In this embodiment, a sliding track is provided for the heating component, allowing the heating component to move within the device housing along a predetermined path.

[0049] Specifically, the heating assembly includes: slider 24, which is slidably arranged on slide groove 28; transmission rod 25, which is fixedly arranged above slider 24; slide groove 5 26, which is set on transmission rod 25, and slider 1 23 is slidably arranged inside slide groove 5 26 for driving transmission rod 25 to move; slider 3 27, which is slidably arranged inside slide groove 16, and is fixedly connected to transmission rod 25 below; heating plate 28, which is fixedly connected to one side of slider 3 27, and has multiple sets of placement grooves 29 above heating plate 28 for placing chip substrate.

[0050] In a preferred embodiment, the motor 21 drives the turntable 22 to rotate, and the slider 23 on the turntable 22 slides in the slide groove 26, which drives the transmission rod 25 and the slider 27 to slide in the slide groove 16, thereby moving the heating plate 28 to uniformly heat the chip substrate in the placement groove 29. Example

[0051] Based on Example 1, in order to further improve the cooling of the chip substrate, a chip substrate cooling group is arranged under the device housing 11;

[0052] Specifically, the end of the heating plate 28 away from the slider 3 27 slides within the groove 3 19.

[0053] It should be noted that one end of the heating plate 28 slides within the slide groove 3 19, providing guidance and support for the movement of the heating plate 28, thus ensuring the smoothness of the movement of the heating plate 28.

[0054] Specifically, slider 1 23 is positioned at the eccentric circle position of turntable 22. When motor 21 is started, turntable 22 drives slider 1 23 to slide on slide groove 5 26. Slide groove 5 26 drives slider 3 27 and heating plate 28 to slide in slide groove 1 16, so that the chip substrate arranged in placement groove 2 29 is heated evenly.

[0055] As a preferred embodiment, the sliding of the heating plate 28 enables the chip substrate placed in the second mounting groove 29 to be heated evenly, ensuring that the chip substrate has a uniform temperature distribution during the processing.

[0056] Specifically, the chip substrate cooling assembly includes: a sliding groove 110 arranged below the inner wall of the device housing 11; a cooling plate 111 slidably arranged on the sliding groove 110; and a mounting groove 112, which is provided in multiple sets and arranged above the cooling plate 111.

[0057] It should be noted that the heated chip substrate is placed in the mounting groove 112 of the cooling plate 111, and the cooling plate 111 slides on the slide groove 110 to cool the chip substrate using its own material properties.

[0058] Specifically, the device housing 11 is located below the heating plate 28, and the cooling plate 111 is provided in multiple sets and slides on the device housing 11 for cooling the multiple sets of chip substrates after heating.

[0059] In this embodiment, the device housing 11 provides installation space and support for the heating plate 28 and the cooling plate 111. The cooling plate 111 slides on the device housing 11 to cool the chip substrate heated by the heating plate 28.

[0060] When heating the biochip substrate, first place each group of biochip substrates in placement tank 29, start the heating fan 14, and the heated gas enters the device housing 11 from the heating fan 14. At the same time, start the motor 21, and the turntable 22 rotates to make slider 23 rotate around the center. At this time, slider 23 slides up and down in slide groove 26 and pushes the transmission rod 25 to move left and right, thereby making the heating plate 28 move left and right, so that each group of biochip substrates in the heating plate 28 is heated evenly. After the biochip substrates are heated, they can be moved from placement tank 29 to placement tank 112. At this time, the biochip substrates in placement tank 112 will gradually cool down as the temperature inside the chamber decreases, so as to avoid the temperature difference being too large and affecting the heating effect.

[0061] Finally, it should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0062] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heating device for a biochip substrate, characterized in that: include: The device architecture group (1) includes a device housing (11), a door (12) is hinged to one side of the device housing (11), and multiple sets of heating fans (14) are provided on the door (12) for ventilation inside the device housing (11). The heating fan (14) is provided above the device housing (11), and the vent of the heating fan (14) is connected to hot air for heating the chip substrate. The device housing (11) is also provided with a chip substrate cooling assembly inside. Heating auxiliary group (2) is set inside the device structure group (1) and includes a motor (21) fixedly arranged on one side of the device housing (11), and the output end of the motor (21) is fixedly connected to the turntable (22). And auxiliary sliding components.

2. The biochip substrate heating device according to claim 1, characterized in that: The auxiliary sliding component includes: A fixing frame (15) is fixedly arranged on the inner wall of the device housing (11), and a sliding groove (16) is provided on the fixing frame (15). Fixing bracket 2 (17) is fixedly arranged on the inner wall of the device housing (11), and the fixing bracket 2 (17) is provided with sliding groove 2 (18). Slide three (19) is arranged on the inner wall of the device housing (11) away from the fixed frame one (15); The slide (16) is equipped with a heating component for heating the chip substrate.

3. The biochip substrate heating device according to claim 2, characterized in that: The heating component includes: Slider 2 (24) is slidably arranged on slide groove 2 (18); transmission rod (25) is fixedly arranged above slider 2 (24); Slide five (26) is set on the transmission rod (25), and slider one (23) is slidably arranged inside slide five (26) to drive the transmission rod (25) to move; Slider 3 (27) is slidably arranged inside slide groove 1 (16) and is fixedly connected to transmission rod (25) below. The heating plate (28) is fixedly connected to one side of the slider three (27), and multiple sets of placement slots two (29) are provided above the heating plate (28) for placing chip substrates.

4. The biochip substrate heating device according to claim 3, characterized in that: The heating plate (28) slides in the groove (19) at the end away from the slider three (27).

5. A biochip substrate heating device according to claim 3, characterized in that: The slider 1 (23) is arranged at the eccentric circle position of the turntable (22). When the motor (21) is started, the turntable (22) drives the slider 1 (23) to slide on the slide groove 5 (26). The slide groove 5 (26) drives the slider 3 (27) and the heating plate (28) to slide in the slide groove 1 (16), so that the chip substrate arranged in the placement groove 2 (29) is heated evenly.

6. A biochip substrate heating device according to claim 5, characterized in that: The chip substrate cooling assembly includes: Slide four (110) is arranged below the inner wall of the device housing (11); Cooling plate (111) is slidably arranged on slide groove four (110); mounting groove one (112) is provided in multiple sets and arranged above cooling plate (111).

7. A biochip substrate heating device according to claim 6, characterized in that: The device housing (11) is located below the heating plate (28), and the cooling plate (111) is provided in multiple sets and slides on the device housing (11) for cooling the multiple sets of chip substrates after heating.

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