Waterproof earphone
By wrapping a waterproof film around the circuit board of the Bluetooth headset and using a waterproof adhesive layer and multi-layer film design at the charging port, the problem of water ingress into the charging port is solved, achieving better waterproof performance.
Patent Information
- Application Number
- CN202520131936.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing Bluetooth headsets are prone to water damage when used in water, as the charging port can easily get wet, leading to circuit damage and making them not completely waterproof.
A waterproof film is wrapped around the outside of the circuit board, and a waterproof adhesive layer is applied to the charging interface. This multi-layered design, combining the waterproof coating and the waterproof film, ensures the sealing of the charging interface.
It effectively prevents water from entering the shell, ensures the normal operation of the circuit, and improves the waterproof performance of the headphones, especially the waterproof effect of the charging port.
Smart Images
Figure CN223899316U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of headphone technology and relates to a waterproof headphone. Background Technology
[0002] Bluetooth headsets utilize Bluetooth technology, allowing users to easily make calls wirelessly without the constraints of wires. However, in certain scenarios, such as underwater use, Bluetooth headsets require waterproofing. Most current Bluetooth headsets only seal the casing containing the circuitry, leaving room for water to enter and damage the circuitry. The charging port is particularly vulnerable to water ingress, making complete waterproofing impossible and impacting user experience. Utility Model Content
[0003] To overcome the problems existing in the related technology, this application aims to provide a waterproof earphone.
[0004] This application is achieved through the following technical solution.
[0005] This technical solution provides a waterproof earphone, including a housing and a circuit board. The housing has a cavity for accommodating the circuit board, and the circuit board has a charging interface. The housing has an interface hole communicating with the cavity, and the charging interface is correspondingly arranged with the interface hole. The circuit board is wrapped with a waterproof film, and the waterproof film has an opening corresponding to the charging interface. The waterproof film is sealed to the outer wall of the charging interface at the opening.
[0006] This waterproof headphone design utilizes a waterproof film wrapped around the circuit board to ensure its waterproofness, allowing it to function normally even if water enters the casing. It also effectively solves the problem of waterproofing the charging port, preventing water from easily entering.
[0007] In one or more embodiments of this technical solution, the front end of the charging interface is located inside the interface hole, and the waterproof film is clamped between the interface hole and the charging interface.
[0008] In one or more embodiments of this technical solution, the waterproof membrane is composed of multiple layers. Because each layer of the waterproof membrane is very thin and has excellent flexibility, using multiple layers increases the waterproof effect.
[0009] In one or more embodiments of this technical solution, a waterproof adhesive layer for waterproofing and bonding is further provided between the charging interface and the waterproof film. By applying a certain amount of waterproof adhesive to the outer wall of the charging interface, the charging interface is bonded to the waterproof film, thereby increasing the waterproof effect.
[0010] In one or more embodiments of this technical solution, a waterproof coating is sprayed onto the surface of the circuit board.
[0011] In one or more embodiments of this technical solution, the circuit board is further connected to two headphone wires, and the cavity is further provided with wire holes for the wires to pass through. The wire holes are filled with a waterproof adhesive for sealing, and the adhesive also fixes the wires to the waterproof film.
[0012] In one or more embodiments of this technical solution, the housing includes a body and a cover plate, the body is provided with the cavity, the cover plate is used to seal the cavity, and the cover plate is sealed to the body.
[0013] In one or more embodiments of this technical solution, the main body is further provided with a waterproof button, and the circuit board is provided with a button corresponding to the waterproof button.
[0014] In one or more embodiments of this technical solution, the housing is further provided with a waterproof cover, which can be opened to cover the interface hole.
[0015] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0016] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.
[0017] Figure 1 This is an overall schematic diagram of a waterproof earphone shown in one embodiment of this application.
[0018] Figure 2 This is a partial exploded schematic diagram of a waterproof earphone shown in one embodiment of this application.
[0019] Figure 3 This is a cross-sectional schematic diagram of a waterproof earphone shown in one embodiment of this application.
[0020] Explanation of reference numerals in the attached figures:
[0021] 1-Housing; 11-Cavity; 12-Interface hole; 13-Cover plate; 14-Waterproof button; 15-Waterproof cover; 16-Wire hole; 2-Circuit board; 21-Charging interface; 3-Waterproof membrane; Detailed Implementation
[0022] The technical solutions of some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0023] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.
[0024] like Figures 1 to 3 As shown in the figure, this embodiment is a waterproof bone conduction Bluetooth headset, including a housing 1 and a circuit board 2. The housing 1 is provided with a cavity 11 for accommodating the circuit board 2. The circuit board 2 is provided with a charging interface 21. The housing 1 is provided with an interface hole 12 communicating with the cavity 11. The charging interface 21 is correspondingly arranged with the interface hole 12. The circuit board 2 is wrapped with a waterproof film 3. The waterproof film has an opening corresponding to the charging interface 21. The waterproof film is sealed to the outer wall of the charging interface 21 at the opening.
[0025] Thus, by wrapping the circuit board 2 with a waterproof film 3, the circuit is waterproof, meaning it can still work normally even if water enters the housing 1; this effectively solves the problem of waterproofing the charging interface 21 and avoids the problem of water easily entering the charging interface 21.
[0026] It should be noted that, as shown in the figure, the housing 1 has two symmetrical parts, a left ear and a right ear. One part is used to install the battery. Since this part does not require an interface, it can be fully sealed. The other part is provided with a cavity 11 for installing the circuit board 2. The circuit board 2 is provided with a charging interface 21. The charging interface 21 and the circuit board 2 need to be waterproofed.
[0027] In this embodiment, the front end of the charging interface 21 is located inside the interface hole 12, and the waterproof film 3 is clamped between the interface hole 12 and the charging interface 21. In this way, the waterproof film 3 is clamped and fixed, and at the same time, the waterproof film 3 can also seal the interface hole 12 and the charging interface 21.
[0028] In this embodiment, the waterproof membrane 3 is composed of multiple layers. The waterproof membrane 3 can be made of heat-shrinkable material. Because each layer of the waterproof membrane 3 is very thin, it has good flexibility, and using multiple layers can increase the waterproof effect.
[0029] In this embodiment, a waterproof adhesive layer for waterproofing and bonding is also provided between the charging interface 21 and the waterproof film 3. By applying a certain amount of waterproof adhesive to the outer wall of the charging interface 21, the charging interface 21 and the waterproof film 3 are bonded together, thereby increasing the waterproof effect.
[0030] In this embodiment, a waterproof coating is sprayed onto the surface of the circuit board 2. The waterproof coating is not shown in the figure. The waterproof coating uses a nano-level waterproof transparent coating, which is easier to repair and lower in cost compared to traditional potting treatment. Even if some water penetrates the waterproof film 3, it can still work normally under the protection of the waterproof coating.
[0031] In this embodiment, the circuit board 2 is also connected to a wire, and the cavity 11 is also provided with a wire hole 16 for the wire to pass through. The wire hole 16 is used to pass the wire that is electrically connected to the battery. The wire hole 16 is filled with a waterproof adhesive for sealing. The adhesive also fixes the wire to the waterproof film 3.
[0032] In this embodiment, the housing 1 includes a body and a cover plate 13. The body has a cavity 11, and the cover plate 13 is used to seal the cavity 11. The cover plate 13 and the body are sealed together. The body is also provided with a waterproof button 14, and the circuit board 2 is provided with a button corresponding to the waterproof button 14.
[0033] In this embodiment, the housing 1 is also provided with a waterproof cover 15, which can be opened to cover the interface hole 12 and is interference-fitted with the charging interface 21. The waterproof cover 15 is made of silicone material.
[0034] The waterproofing process of the waterproof earphone in this embodiment is as follows: First, the circuit board 2 is sprayed with a waterproof transparent coating to form a waterproof coating on its surface. Then, the circuit board 2 is wrapped with a waterproof film 3. Hot air is used to heat the waterproof film 3 to make it adhere to the circuit board 2. The circuit board 2 is then installed into the cavity 11. After wiring, the wire hole 16 is filled with waterproof glue. The cover plate 13 is installed and connected by ultrasonic welding. Finally, the waterproof film 3 at the front end of the charging interface 21 is heat-fused to form an opening.
[0035] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.
Claims
1. A waterproof earphone, characterized in that, The device includes a housing and a circuit board (2). The housing has a cavity (11) for accommodating the circuit board (2). The circuit board (2) has a charging interface (21). The housing (1) has an interface hole (12) communicating with the cavity (11). The charging interface (21) is correspondingly arranged with the interface hole (12). The circuit board (2) is wrapped with a waterproof film (3), which has an opening corresponding to the charging interface (21). The waterproof film is sealed to the outer wall of the charging interface (21) at the opening.
2. The waterproof earphone according to claim 1, characterized in that, The front end of the charging interface (21) is located inside the interface hole (12), and the waterproof film (3) is clamped between the interface hole (12) and the charging interface (21).
3. The waterproof earphone according to claim 1, characterized in that, The waterproof membrane (3) is composed of multiple layers of film.
4. The waterproof earphone according to claim 1, characterized in that, An adhesive layer for bonding is also provided between the charging interface (21) and the waterproof film (3).
5. The waterproof earphone according to claim 1, characterized in that, The circuit board (2) has a waterproof coating sprayed on its surface.
6. The waterproof earphone according to claim 1, characterized in that, The circuit board (2) is also connected to a wire, and the cavity (11) is also provided with a wire hole (16) for the wire to pass through. The wire hole (16) is filled with a sealant for sealing, and the sealant also fixes the wire to the waterproof film (3).
7. The waterproof earphone according to claim 1, characterized in that, The housing (1) includes a body and a cover plate (13). The body is provided with the cavity (11). The cover plate (13) is used to cover the cavity (11). The cover plate (13) is sealed to the body.
8. The waterproof earphone according to claim 7, characterized in that, The main body is also provided with a waterproof button (14), and the circuit board (2) is provided with a button corresponding to the waterproof button (14).
9. The waterproof earphone according to claim 1, characterized in that, The housing (1) is also provided with a waterproof cover (15), which can be opened to cover the interface hole (12).