Mask for vapor deposition

Abstract

A vapor deposition mask includes: a first mask member disposed so as to face one surface of a substrate on which a vapor deposition substance is deposited, the first mask member including: a plurality of first cell opening regions disposed along a first direction and a second direction intersecting the first direction; and at least two second alignment portions overlapping each of the at least two first alignment portions in a third direction crossing the first and second directions; and a second mask member disposed between the substrate and the first mask member, the second mask member including: a plurality of second cell opening regions overlapping the plurality of first cell opening regions in a third direction, either one of the first and second mask members further including a protruding portion protruding in a direction toward the other, the other of the first and second mask members further includes a recessed portion overlapping the protruding portion in the third direction and having a shape corresponding to the protruding portion.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to a mask for evaporation and an evaporation device including the same. BACKGROUND

[0002] An organic light emitting display device can be used in mobile devices such as smartphones, computers, tablet personal computers, or electronic devices such as televisions, outdoor advertising boards, and display devices for exhibitions.

[0003] An organic light emitting display device can include an anode electrode, a cathode electrode, and an organic light emitting layer between the anode electrode and the cathode electrode, which are disposed on a substrate. The organic light emitting layer can be formed using a mask for evaporation.

[0004] The above description is only intended to assist in understanding the background art of the technical idea of the present application, and therefore it cannot be understood as a content equivalent to the prior art known to those skilled in the art of the technical field of the present application. SUMMARY

[0005] The present application provides a mask for evaporation and an evaporation device including the same, which can improve evaporation precision.

[0006] However, the present application is not limited to the above-mentioned problems, and another technical problem not mentioned can be clearly understood by those skilled in the art from the following description.

[0007] To achieve the object of the present application, the mask for evaporation according to an embodiment of the present application can be used to evaporate an evaporation material on a substrate having at least two first alignment portions, wherein the mask for evaporation includes: a first mask member configured to face one side of the substrate to which the evaporation material is evaporated, and including: a plurality of first unit opening regions configured in a first direction and a second direction intersecting the first direction; and at least two second alignment portions overlapping each of the at least two first alignment portions in a third direction intersecting the first direction and the second direction; and a second mask member disposed between the substrate and the first mask member, and including: a plurality of second unit opening regions overlapping the plurality of first unit opening regions in the third direction, either one of the first mask member and the second mask member further including a protrusion protruding in a direction toward the other, and the other of the first mask member and the second mask member further including a recess overlapping the protrusion in the third direction and having a shape corresponding to the protrusion.

[0008] In an embodiment, the first mask member can be composed of a dielectric material.

[0009] In one embodiment, the first mask member can be composed of aluminum oxide and titanium dioxide.

[0010] In one embodiment, the second mask member can be composed of any one of silicon, silicon oxide, and silicon nitride.

[0011] In one embodiment, the protrusion can be disposed between any one of the first unit opening regions adjacent to each other among the plurality of first unit opening regions and the second unit opening regions adjacent to each other among the at least two second unit opening regions, and the recess can be disposed between the other of the first unit opening regions adjacent to each other among the plurality of first unit opening regions and the second unit opening regions adjacent to each other among the at least two second unit opening regions.

[0012] In one embodiment, the protrusion can extend in each of the first direction and the second direction, and the recess can extend in each of the first direction and the second direction.

[0013] In one embodiment, the protrusion can include two or more sub-protrusions spaced apart from each other along each of the first direction and the second direction, and the recess can include two or more sub-recesses spaced apart from each other along each of the first direction and the second direction.

[0014] In one embodiment, the first width of the protrusion can be smaller than the second width of the recess.

[0015] In one embodiment, the first mask member can further include a first conductive member overlapping the protrusion and the recess in a third direction, and a second conductive member not overlapping the protrusion and the recess in the third direction, and the first conductive member and the second conductive member can be applied with voltages of different polarities from each other.

[0016] In one embodiment, the first conductive member and the second conductive member can include a conductive material.

[0017] In one embodiment, a third width of the first conductive member and a fourth width of the second conductive member can be the same.

[0018] In one embodiment, a distance between the first conductive member and the second conductive member can be greater than the third width and the fourth width.

[0019] In one embodiment, the first mask member can further include: a first conductive member overlapping the protruding portion and the recessed portion in the third direction; and a second conductive member overlapping the first conductive member in the third direction, the first conductive member and the second conductive member being applied with voltages of different polarities from each other.

[0020] In one embodiment, the first conductive member and the second conductive member can include a conductive material.

[0021] In one embodiment, the third width of the first conductive member and the fourth width of the second conductive member can be the same.

[0022] In one embodiment, a distance between the first conductive member and the second conductive member can be greater than the third width and the fourth width.

[0023] In one embodiment, the second mask member can further include: at least two third alignment portions overlapping each of the at least two first alignment portions and the at least two second alignment portions, the at least two third alignment portions being composed of substantially the same material as the second mask member.

[0024] To achieve another object of the present application, there can be provided a vapor deposition apparatus including a mask for vapor deposition according to an embodiment of the present application, in a vapor deposition apparatus for vapor depositing a vapor deposition material on a substrate on which at least two first alignment portions are formed, the vapor deposition apparatus including: a mask for vapor deposition including a first mask member configured to face one side of the substrate on which the vapor deposition material is vapor deposited and a second mask member disposed between the substrate and the first mask member; and a support member supporting the mask member, the first mask member including: a plurality of first unit opening regions arranged along a first direction and a second direction intersecting the first direction; and at least two second alignment portions overlapping each of the at least two first alignment portions in a third direction intersecting the first and second directions, the second mask member including: a plurality of second unit opening regions overlapping the plurality of first unit opening regions in the third direction, either one of the first and second mask members further including: a protruding portion protruding in a direction toward the other one, and the other one of the first and second mask members further including: a recessed portion overlapping the protruding portion in the third direction and having a shape corresponding to the protruding portion.

[0025] In one embodiment, the first mask member can further include: a first conductive member overlapping the protruding portion and the recessed portion in the third direction; and a second conductive member not overlapping the protruding portion and the recessed portion in the third direction, the first conductive member and the second conductive member being applied with voltages of different polarities from each other.

[0026] In one embodiment, the support member can include a first power supply electrode to which either of a positive voltage and a negative voltage is applied to the first conductive member, and a second power supply electrode to which the other of the positive voltage and the negative voltage is applied to the second conductive member.

[0027] The means for solving the problem of the present application is not limited to the above-described means, and the means not mentioned can be clearly understood by a person having ordinary knowledge in the technical field to which the present application pertains from the present specification and the accompanying drawings.

[0028] According to the evaporation mask and the evaporation apparatus including the same according to the embodiments of the present application, by disposing the mask sticker including the alignment portion for alignment with the substrate under the evaporation mask, misalignment of the substrate and the evaporation mask can be improved. Further, a gap between the substrate and the evaporation mask can be minimized to improve evaporation precision.

[0029] However, the effects of the present application are not limited to the above-mentioned effects, and various extensions can be made without departing from the concept and the scope of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a perspective view showing an embodiment of an evaporation mask.

[0031] Figure 2 is a conceptual view briefly showing a pixel formed by Figure 1 the evaporation mask shown in FIG. 1.

[0032] Figure 3 is a conceptual view briefly showing a display panel including Figure 2 the pixel shown in FIG. 2.

[0033] Figure 4 is a plan view showing an embodiment of the first mask member shown in Figure 1 FIG. 3.

[0034] Figure 5 is a plan view showing an embodiment of the second mask member shown in Figure 1 FIG. 4.

[0035] Figure 6 is a plan view showing another embodiment of the first mask member shown in Figure 4 FIG. 5.

[0036] Figure 7 is a plan view showing another embodiment of the second mask member shown in Figure 5 FIG. 6.

[0037] Figure 8 is a conceptual view showing together along Figure 4I-I' line of FIG. 1 and Figure 5 a plan view of a portion of a cross section of the first mask member and the second mask member respectively taken along the II-II' line of FIG. 2.

[0038] Figure 9 is a plan view showing Figure 8 a plan view of another embodiment of the first mask member shown in FIG. 3.

[0039] Figure 10 is a plan view showing Figure 1 a conceptual view of an evaporation apparatus using the evaporation mask shown in FIG. 4. DETAILED DESCRIPTION

[0040] Hereinafter, preferred embodiments according to the present application will be described in detail with reference to the accompanying drawings. In the following description, it should be noted that only parts necessary for understanding operations according to the present application are explained, and explanations about parts other than the parts are omitted in order not to obscure the gist of the present application. In addition, the present application is not limited to the embodiments described herein, and can be embodied in other forms. The embodiments described herein are provided in order to explain the technical idea of the present application in such a degree that those skilled in the art can easily embody the present application to the extent that the technical idea of the present application is conveyed.

[0041] Throughout the specification, when any part and other parts are said to be "connected", this includes not only the case where they are "directly connected", but also the case where they are "indirectly connected" with other constituent elements interposed therebetween. The terms used herein are used to explain specific embodiments, and are not used to limit the present application. For example, unless clearly different in context, a singular expression includes a plural expression. In addition, when any part is said to "include" any constituent element, unless clearly stated to the contrary, this means that other constituent elements can also be included and can further include other constituent elements. "At least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as any one of X, Y, Z, or any combination of two or more of X, Y, and Z (for example, XYZ, XYY, YZ, ZZ). Herein, "and / or" includes all combinations of one or more of the corresponding items.

[0042] Herein, terms such as first, second, and the like can be used to explain various constituent elements, and are used to distinguish the constituent elements from other constituent elements. Thus, a first constituent element can also be referred to as a second constituent element without departing from the scope of the disclosure.

[0043] Spatially relative terms, such as "below", "above", and the like, can be used herein for ease of description to explain the relationships of one element or feature to another element(s) or feature(s) as illustrated in the drawings. Unless otherwise noted, the spatially relative terms are intended to encompass different orientations of the device in use or manufacture in addition to the orientations depicted in the drawings. For example, if a device is inverted relative to the orientation shown in the drawing, a region depicted below other regions would then be oriented above the other regions or vice versa. Thus, the term "below" can encompass both an orientation of above and below. Moreover, the device can be otherwise oriented (for example, rotated 90 degrees or at other orientations) and the spatially relative terms used herein interpreted accordingly.

[0044] Various embodiments are described in terms of sequences of actions to be performed by, for example, elements of a computing device. It will be understood that various embodiments can be performed by specific apparatus, such as a computing device, and that the actions described can be performed by components of the computer device other than those specifically described. Unless otherwise specified, the various embodiments can be implemented in hardware, firmware, software, or any combination thereof. For example, various embodiments can implemented using computer-readable media having instructions stored thereon that, when executed by one or more processors, perform the techniques described herein. Computer-readable media can include computer storage media and communication media. Computer storage media can include volatile and non-volatile media, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information. Communication media can include wired media such as a wired network or direct-wired connection, and wireless media such as acoustic, RF, infrared, Bluetooth, Wi-Fi, or other wireless media. Combinations of the any of the above can also be included within the scope of computer-readable media.

[0045] Figure 1 is a perspective view showing an embodiment of a mask for evaporation.

[0046] Referring to Figure 1 , the mask for evaporation MSK can include a first mask member MSK1 and a second mask member MSK2.

[0047] The mask for evaporation MSK can be used to evaporate an evaporation substance on a substrate SUB formed with at least two first alignment portions ALP1. At least a portion of the first alignment portions ALP1 can be formed of a material different from the substrate SUB. For example, the first alignment portions ALP1 can be formed of a metal material such as tungsten (W) and include a region that can reflect light and another region that can absorb light.

[0048] The first mask member MSK1 can be configured to face one side (the lower side in the drawing with reference to the third direction DR3) of the substrate SUB on which the evaporation substance is evaporated. The first mask member MSK1 can include a plurality of first cell opening regions COA1 configured along a first direction DR1 and a second direction DR2 intersecting the first direction DR1 and at least two second alignment portions ALP2 overlapping each of the at least two first alignment portions ALP1 in a third direction DR3 intersecting the first and second directions DR1, DR2.

[0049] The first mask member MSK1 can be composed of a dielectric material. For example, the first mask member MSK1 can be composed of aluminum oxide and titanium dioxide. In an embodiment, the first mask member MSK1 can be a wafer composed of a dielectric material such as aluminum oxide and coated with titanium dioxide on an outer surface thereof.

[0050] On the other hand, at least a portion of the second alignment portion ALP2 can be composed of a material different from the first mask member MSK1. For example, the second alignment portion ALP2 can be composed of a metal material such as tungsten as with the first alignment portion ALP1 and include a region that can reflect light and another region that can absorb light.

[0051] The second mask member MSK2 can be disposed between the substrate SUB and the first mask member MSK1. The second mask member MSK2 can include a plurality of second unit opening regions COA2 overlapping the plurality of first unit opening regions COA1 in the third direction DR3.

[0052] In each of the plurality of second unit opening regions COA2 can be formed a plurality of pattern holes PH disposed along the first direction DR1 and the second direction DR2. Such a plurality of pattern holes PH are holes through the second mask member MSK2 in the third direction, and an evaporation material sprayed toward the substrate SUB side can be evaporated on the substrate SUB through the plurality of pattern holes PH.

[0053] The second mask member MSK2 can include at least one of silicon, silicon oxide, and silicon nitride. In an embodiment, the second mask member MSK2 can be composed of a first layer (not shown) defining the second unit opening regions COA2, a second layer (not shown) and a third layer (not shown) defining the pattern holes PH, the first layer including silicon, the second layer including silicon oxide, and the third layer including silicon or silicon nitride, but is not limited thereto. For example, the second mask member MSK2 can be composed of a plurality of layers, each layer can be made of any one of silicon, silicon oxide, and silicon nitride or a combination of two or more thereof.

[0054] The second mask member MSK2 can include at least two third alignment portions ALP3 overlapping each of the at least two first alignment portions ALP1 and the at least two second alignment portions ALP2. In an embodiment, the third alignment portion ALP3, as a portion of a body constituting the second mask member MSK2, can be composed of substantially the same material as the second mask member MSK2.

[0055] The third alignment portion ALP3 can refer to a portion of the area overlapping the first and second alignment portions ALP1, ALP2, but is not limited thereto. For example, the third alignment portion ALP3 can be a hole that penetrates the second mask member MSK2. This will be described later, but in the process of aligning the substrate SUB and the evaporation mask MSK, the laser beam LB incident to the second alignment portion ALP2 can be transmitted through the third alignment portion ALP3 and guided to the first alignment portion ALP1. At this time, in the case where the third alignment portion ALP3 is a hole, the laser beam LB can directly pass through the third alignment portion ALP3, and in the case where the third alignment portion ALP3 is a portion constituting the body of the second mask member MSK2, it can be that a portion of the laser beam LB incident to the third alignment portion ALP3 is reflected and another portion is transmitted through the third alignment portion ALP3. Figure 10 Figure 10

[0056] According to such a configuration, the second mask member MSK2 including a plurality of pattern holes PH does not need to form a portion of the reflected light as the first and second alignment portions ALP1, ALP2. Thus, the portion of the reflected light includes a metal different from the material of the second mask member MSK2, and thus in order to form such a structure in the second mask member MSK2, a separate process is required. In addition, when the portion of the reflected light is formed in the second mask member MSK2, in the process of cleaning the second mask member MSK2 in order to repeatedly perform the evaporation process, it can be corroded or damaged, and in this case, misalignment of the substrate SUB and the evaporation mask MSK occurs, and the possibility of occurrence of an evaporation defect increases. In contrast, when the third alignment portion ALP3 of the second mask member MSK2 is constituted of substantially the same material as the second mask member MSK2, a separate process is not required, and the possibility of corrosion or damage in the process of cleaning the second mask member MSK2 can be considered.

[0057] Next, before a more detailed description of the evaporation mask MSK is made, a description will be made of a process of forming a pixel PXL constituting a display panel DP by evaporating an evaporation material on a substrate SUB using the first and second mask members MSK1, MSK2 described above. Figure 2 Figure 3 A first to third organic emission layer EL1, EL2, EL3 of a pixel PXL constituting a display panel DP can be formed by evaporating an evaporation material on a substrate SUB using the first and second mask members MSK1, MSK2 described above. Figure 3 Figure 2 Figure 3

[0058] Figure 2 is a conceptual view briefly showing a pixel formed by the evaporation mask shown in Figure 1

[0059] Referring to Figure 2 ​​​​​​​The pixel PXL can include a pixel circuit PC and an organic light emitting layer EL.

[0060] The pixel circuit PC can be connected to the gate line GL and the data line DL. The pixel circuit PC can control the organic light emitting layer EL and emit light according to a data signal received through the data line DL in response to a gate signal received through the gate line GL. For such an operation, the pixel circuit PC can include circuit elements such as a transistor and one or more capacitors.

[0061] The organic light emitting layer EL can be connected between the first power supply voltage node VDDN and the second power supply voltage node VSSN. The first power supply voltage node VDDN can receive a first power supply voltage. The second power supply voltage node VSSN can receive a second power supply voltage. The first power supply voltage can have a voltage level higher than the second power supply voltage.

[0062] The organic light emitting layer EL can be connected between the anode electrode AE and the cathode electrode CE. The anode electrode AE can be connected to the first power supply voltage node VDDN through the pixel circuit PC. For example, the anode electrode AE can be connected to the first power supply voltage node VDDN through one or more transistors included in the pixel circuit PC. The cathode electrode CE can be connected to the second power supply voltage node VSSN. The organic light emitting layer EL can be configured to emit light according to a current flowing from the anode electrode AE to the cathode electrode CE.

[0063] Figure 3 is a conceptual view schematically showing a display panel including Figure 2 The display panel DP can include a substrate SUB, a pixel circuit layer PCL, first to third anode electrodes AE1, AE2, AE3, first to third organic light emitting layers EL1, EL2, EL3, a pixel definition film PDL, and a cathode electrode CE.

[0064] Referring to Figure 3 The display panel DP can include a substrate SUB, a pixel circuit layer PCL, first to third anode electrodes AE1, AE2, AE3, first to third organic light emitting layers EL1, EL2, EL3, a pixel definition film PDL, and a cathode electrode CE.

[0065] The substrate SUB can be configured of an insulating material such as glass, resin, etc. For example, the substrate SUB can include a glass substrate. As another example, the substrate SUB can include a Polyimide substrate. As yet another example, the substrate SUB can include a silicon wafer substrate formed using a semiconductor process.

[0066] A pixel circuit layer PCL can be disposed on the substrate SUB. The pixel circuit layer PCL can include insulating layers and semiconductor patterns and conductive patterns disposed between the insulating layers. The conductive patterns of the pixel circuit layer PCL can function as circuit elements, wirings, and the like. The circuit elements of the pixel circuit layer PCL can define first to third pixel circuits PC1, PC2, PC3. Each of the first to third pixel circuits PC1, PC2, PC3 can be connected to Figure 2 a gate line GL, a data line DL, and a first power voltage node VDDN of the first to third pixel circuits PC1, PC2, PC3.

[0067] First to third anode electrodes AE1, AE2, AE3 can be disposed on the pixel circuit layer PCL. The first anode electrode AE1 can be connected to the first pixel circuit PC1. The second anode electrode AE2 can be connected to the second pixel circuit PC2. The third anode electrode AE3 can be connected to the third pixel circuit PC3.

[0068] A pixel defining film PDL can be disposed on the pixel circuit layer PCL and the first to third anode electrodes AE1, AE2, AE3. The pixel defining film PDL can define first to third pixel openings PO1, PO2, PO3 that expose a portion of the first to third anode electrodes AE1, AE2, AE3. The pixel defining film PDL can be configured to include a light-blocking substance that prevents light mixing between adjacent pixels. In an embodiment, the pixel defining film PDL can include an organic material. For example, the pixel defining film PDL can include an organic insulating substance such as an acryl resin, an epoxy resin, a phenol resin, a polyamide resin, a polyimide resin, or the like.

[0069] A first organic light emitting layer EL1 can be disposed on the first anode electrode AE1 exposed through the first pixel opening PO1 and a side surface of the pixel defining film PDL adjacent thereto. A second organic light emitting layer EL2 can be disposed on the second anode electrode AE2 exposed through the second pixel opening PO2 and a side surface of the pixel defining film PDL adjacent thereto. A third organic light emitting layer EL3 can be disposed on the third anode electrode AE3 exposed through the third pixel opening PO3 and a side surface of the pixel defining film PDL adjacent thereto. The first to third organic light emitting layers EL1, EL2, EL3 can include an organic substance that can emit light based on a signal provided from the first to third anode electrodes AE1, AE2, AE3.

[0070] The cathode electrode CE can cover the pixel defining film PDL and the first to third organic light emitting layers EL1, EL2, EL3. The cathode electrode CE can be connected to the first to third organic light emitting layers EL1, EL2, EL3. In this way, the cathode electrode CE can be a common electrode commonly provided to the first to third organic light emitting layers EL1, EL2, EL3. The cathode electrode CE can be connected to Figure 2 the second power supply voltage node VSSN.

[0071] According to the structure as described above, Figure 2 The pixel PXL can include first to third pixels PXL1, PXL2, PXL3. In an embodiment, a first pixel PXL1 including a first pixel circuit PC1, a first anode electrode AE1, a cathode electrode CE, and a first organic light emitting layer EL1 disposed between the first anode electrode AE1 and the cathode electrode CE can be provided. Likewise, a second pixel PXL2 including a second pixel circuit PC2, a second anode electrode AE2, the cathode electrode CE, and a second organic light emitting layer EL2 disposed between the second anode electrode AE2 and the cathode electrode CE can be provided, and a third pixel PXL3 including a third pixel circuit PC3, a third anode electrode AE3, the cathode electrode CE, and a third organic light emitting layer EL3 disposed between the third anode electrode AE3 and the cathode electrode CE can be provided.

[0072] In an embodiment, the evaporation material can be evaporated as the pixel PXL in the cell area CA of the substrate SUB through the first cell opening area COA1 and the pattern hole PH in sequence.

[0073] Hereinafter, referring to Figures 4 to 9 , a more specific description will be made for the evaporation mask MSK.

[0074] Figure 4 is a plan view illustrating an embodiment of the first mask member shown in Figure 1 . Figure 5 is a plan view illustrating an embodiment of the second mask member shown in Figure 1 . Figure 6 is a plan view illustrating another embodiment of the first mask member shown in Figure 4 . Figure 7 is a plan view illustrating another embodiment of the second mask member shown in Figure 5 .

[0075] Referring to Figures 4 to 7, either of the first and second mask components MSK1, MSK2 can further include a protruding portion PRP protruding in a direction toward the other, and the other of the first and second mask components MSK1, MSK2 can further include a concave portion CCP overlapping the protruding portion PRP in the third direction DR3 and having a shape corresponding to the protruding portion PRP. In other words, in a case where the first mask component MSK1 includes the protruding portion PRP, the second mask component MSK2 can include the concave portion CCP, and conversely, in a case where the first mask component MSK1 includes the concave portion CCP, the second mask component MSK2 can include the protruding portion PRP. Hereinafter, for the sake of convenience of explanation, a structure in which the first mask component MSK1 includes the protruding portion PRP and the second mask component MSK2 includes the concave portion CCP will be explained as a center.

[0076] Referring to Figure 4 , the first mask component MSK1 can further include a protruding portion PRP protruding in a direction toward the second mask component MSK2.

[0077] The protruding portion PRP can be arranged between first cell opening regions COA1 adjacent to each other among the plurality of first cell opening regions COA1. In an embodiment, the protruding portion PRP can be arranged between first cell opening regions COA1 adjacent to each other among the plurality of first cell opening regions COA1 in a direction along the first direction DR1 and the second direction DR2. Figure 4 and Figure 6 illustrate an appearance in which the first cell opening regions COA1 are arranged in a matrix form along the first direction DR1 and the second direction DR2, and thus the protruding portion PRP can also extend along each of the first and second directions DR1, DR2 as illustrated in Figure 4 , but is not limited thereto. For example, the protruding portion PRP can also include two or more sub-protruding portions SPRP spaced apart from each other along each of the first and second directions DR1, DR2 as illustrated in Figure 6 , but is not limited thereto. For example, the protruding portion PRP can also include two or more sub-protruding portions SPRP spaced apart from each other along each of the first and second directions DR1, DR2 as illustrated in Figure 4 , but is not limited thereto. For example, the protruding portion PRP can also include two or more sub-protruding portions SPRP spaced apart from each other along each of the first and second directions DR1, DR2 as illustrated in Figure 6 , but is not limited thereto. For example, the protruding portion PRP can also include two or more sub-protruding portions SPRP spaced apart from each other along each of the first and second directions DR1, DR2 as illustrated in

[0078] The structure of such a protruding portion PRP or sub-protruding portion SPRP serves to align the first mask component MSK1 and the second mask component MSK2 in conjunction with the concave portion CCP or sub-concave portion SCCP of the other, and in consideration of such an object, the sub-protruding portion SPRP can also be constituted in a number sufficient to allow the first mask component MSK1 and the second mask component MSK2 to be in close contact with each other without a specific rule. Figure 7

[0079] Referring to Figure 5 and Figure 7 ​The second mask component MSK2 may also include a recess CCP on the third direction DR3 that overlaps with the protrusion PRP and has a shape corresponding to the protrusion PRP.

[0080] The recessed CCP can be disposed between adjacent second unit opening regions COA2 in a plurality of second unit opening regions COA2. In an embodiment, in Figure 7 The diagram shows the arrangement of the second unit opening region COA2 in a matrix form along the first direction DR1 and the second direction DR2, thus... Figure 5 The recessed CCP shown may also extend along each of the first and second directions DR1 and DR2, but is not limited thereto. For example, the recessed CCP may also be as follows: Figure 7 The diagram shows two or more sub-recesses SCCP spaced apart from each other along each of the first and second directions DR1, DR2. In other words, it can be configured to... Figure 5 The area formed by the concave CCP shown, Figure 7 The multiple sub-recesses SCCP shown are spaced apart from each other at certain intervals along the first and second directions DR1, DR2.

[0081] Such a recessed CCP or sub-recessed SCCP structure is used to match the protrusion PRP or sub-protrusion SPRP to align the first mask component MSK1 and the second mask component MSK2. For this purpose, the sub-recessed SCCP can also be configured in sufficient quantities without specific rules so that the first mask component MSK1 and the second mask component MSK2 are in close contact with each other.

[0082] However, for ease of explanation, the following will be as follows: Figure 4 as well as Figure 5 The description focuses on the structure of the first mask component MSK1, which includes a protrusion PRP, and the second mask component MSK2, which includes a recess CCP.

[0083] The following will refer to Figure 8 The structure for aligning the first mask component MSK1 and the second mask component MSK2 will be described in detail.

[0084] Figure 8 It is shown together along Figure 4 The I-I' line and Figure 5 Plan views of the first mask component and a portion of the second mask component, respectively, taken from line II-II'.

[0085] Reference Figure 8The first mask member MSK1 can further include a first conductive member CP1 and a second conductive member CP2. In an embodiment, the first conductive member CP1 can overlap the protrusion PRP and the concave portion CCP in the third direction DR3, and the second conductive member CP2 can not overlap the protrusion PRP and the concave portion CCP in the third direction DR3.

[0086] The first and second conductive members CP1 and CP2 can include a conductive material. In an embodiment, the first and second conductive members CP1, CP2 can be composed of any one or a combination of two or more of silver (Ag), gold (Au), platinum (Pt), copper (Cu), manganese (Mn), titanium (Ti), cobalt (Co), nickel (Ni), and tungsten (W).

[0087] A voltage of different polarity can be applied to the first conductive member CP1 and the second conductive member CP2. For example, when a positive voltage is applied to the first conductive member CP1, a negative voltage can be applied to the second conductive member CP2. Conversely, when a negative voltage is applied to the first conductive member CP1, a positive voltage can be applied to the second conductive member CP2. Hereinafter, for convenience of explanation, a case where a positive voltage is applied to the first conductive member CP1 and a negative voltage is applied to the second conductive member CP2 will be mainly described.

[0088] As described above, the first mask member MSK1 is composed of a dielectric, and thus when a positive voltage is applied to the first conductive member CP1, negative charges move to the vicinity of the first conductive member CP1, and thus positive charges can be concentrated in an area relatively far from the first conductive member CP1. For example, positive charges can be concentrated on the surface of the protrusion PRP adjacent to the concave portion CCP, and thus negative charges can be concentrated on the surface of the concave portion CCP adjacent to the protrusion PRP. In this way, as positive charges and negative charges are concentrated across the space between the protrusion PRP and the concave portion CCP, an attractive force can be generated between the first mask member MSK1 and the second mask member MSK2 in the third direction DR3 and the opposite direction of the third direction DR3.

[0089] Similarly, in a case where a negative voltage is applied to the second conductive member CP2, positive charges move to the vicinity of the second conductive member CP2, whereby negative charges can be gathered in regions relatively far from the second conductive member CP2. For example, negative charges can be gathered on the surfaces of the regions other than the protruding portion PRP of the first mask member MSK1 that face each other with the remaining regions other than the concave portion CCP of the second mask member MSK2, whereby positive charges can be gathered on the surfaces of the regions other than the concave portion CCP of the second mask member MSK2 that face the remaining regions other than the protruding portion PRP of the first mask member MSK1. In this way, as positive charges and negative charges concentrate with the space between the protruding portion PRP and the concave portion CCP in between, an attractive force can be generated between the first mask member MSK1 and the second mask member MSK2 in the third direction DR3 and the direction opposite to the third direction DR3.

[0090] On the other hand, between the positive charges gathered on the surfaces of the regions other than the concave portion CCP of the second mask member MSK2 that face the remaining regions other than the protruding portion PRP of the first mask member MSK1 and the positive charges gathered on the surface of the protruding portion PRP that faces the concave portion CCP, a repulsive force can be generated in the first direction DR1 and the direction opposite to the first direction DR1.

[0091] Here, the first width W1 of the protruding portion PRP can be smaller than the second width W2 of the concave portion CCP. Thus, the side surface of the protruding portion PRP can enter the empty space provided by the concave portion CCP while maintaining a state of being separated from the concave portion CCP by a predetermined interval. In other words, by the repulsive force generated between the outer side surface of the protruding portion PRP and the inner side surface of the concave portion CCP, the protruding portion PRP can be restricted from moving in the first direction DR1 and the direction opposite to the first direction DR1, and the first mask member MSK1 and the second mask member MSK2 can be aligned with the third direction DR3 as a reference by this action.

[0092] In addition, the third width W3 of the first conductive member CP1 and the fourth width W4 of the second conductive member CP2 can be substantially the same. In addition, the distance W5 between the first conductive member CP1 and the second conductive member CP2 can be greater than the third and fourth widths W3, W4. According to such a structure, in a case where different voltages are applied to the first and second conductive members CP1, CP2, respectively, a Johnsen-Rahbek effect can be exhibited, whereby an electrostatic attractive force and a repulsive force can act between the first mask member MSK1 and the second mask member MSK2 to maintain a state of being separated from each other.

[0093] In the embodiment, the first mask member MSK1 and the second mask member MSK2 can be brought into close contact with each other by an attractive force generated between the first mask member MSK1 and the second mask member MSK2 in the third direction DR3. In addition, the first mask member MSK1 and the second mask member MSK2 can be aligned in a plane constituted by the first and second directions DR1, DR2 by a repulsive force generated between the first and second mask members MSK1, MSK2 in the first and second directions DR1, DR2 and in a direction opposite to each of the first and second directions DR1, DR2.

[0094] Figure 9 is a plan view showing Figure 8 a plan view showing another embodiment of the first mask member.

[0095] Figure 9 The protruding portions PRP, the concave portions CCP shown in Figure 8 The protruding portions PRP and the concave portions CCP of the first mask member 1 are similarly constituted, and thus repeated explanations will be omitted hereinafter.

[0096] Referring to Figure 9 In the embodiment, the first conductive member CP1' can overlap the protruding portions PRP and the concave portions CCP in the third direction DR3, and the second conductive member CP2' can overlap the first conductive member CP1' in the third direction DR3. Hereinafter, explanations will be made centering on a case where the first conductive member CP1' is disposed above the second conductive member CP2' with the third direction DR3 as a reference.

[0097] The first and second conductive members CP1', CP2' can contain a conductive substance. In the embodiment, the first and second conductive members CP1', CP2' can be constituted by any one of silver (Ag), gold (Au), platinum (Pt), copper (Cu), manganese (Mn), titanium (Ti), cobalt (Co), nickel (Ni), and tungsten (W) or a combination of two or more of them.

[0098] A voltage of different polarity from each other can be applied to the first conductive member CP1' and the second conductive member CP2'. For example, when a positive voltage is applied to the first conductive member CP1', a negative voltage can be applied to the second conductive member CP2'. Conversely, when a negative voltage is applied to the first conductive member CP1', a positive voltage can be applied to the second conductive member CP2'. Hereinafter, explanations will be made centering on a case where a positive voltage is applied to the first conductive member CP1' and a negative voltage is applied to the second conductive member CP2'.

[0099] As described above, the first mask member MSK1' is composed of a dielectric, and thus when a positive voltage is applied to the first conductive member CP1', negative charges move to the vicinity of the first conductive member CP1', whereby positive charges can be accumulated in regions relatively far from the first conductive member CP1'. For example, the surface of the protrusion PRP adjacent to the first conductive member CP1' can accumulate positive charges, and thus relatively the surface of a portion of the concave portion CCP adjacent to the first conductive member CP1' can accumulate negative charges. In this way, as positive charges and negative charges concentrate in the space between the protrusion PRP and the concave portion CCP in the middle, an attractive force can be generated between the first mask member MSK1' and the second mask member MSK2' in the first direction DR1, the direction opposite to the first direction DR1, and the third direction DR3.

[0100] Similarly thereto, when a negative voltage is applied to the second conductive member CP2', positive charges move to the vicinity of the second conductive member CP2', whereby negative charges can be accumulated in regions relatively far from the second conductive member CP2'. For example, the surface of the protrusion PRP adjacent to the second conductive member CP2' can accumulate negative charges, and thus relatively the surface of a portion of the concave portion CCP adjacent to the second conductive member CP2' can accumulate positive charges. In this way, as positive charges and negative charges concentrate in the space between the protrusion PRP and the concave portion CCP in the middle, an attractive force can be generated between the first mask member MSK1' and the second mask member MSK2' in the first direction DR1, the direction opposite to the first direction DR1.

[0101] Here, the first width W1 of the protrusion PRP can be smaller than the second width W2 of the concave portion CCP. Thus, the side surface of the protrusion PRP can enter the empty space provided by the concave portion CCP while maintaining a state of being separated from the concave portion CCP by a predetermined interval. In other words, by the attractive force generated between the outer side surface of the protrusion PRP and the inner side surface of the concave portion CCP, the protrusion PRP can be simultaneously subjected to an attractive force in the first direction DR1 and an attractive force in the direction opposite to the first direction DR1. Here, the attractive force applied to the protrusion PRP achieves a balance of forces, and thus the protrusion PRP can be restricted from moving in the first direction DR1 and the direction opposite to the first direction DR1, and the first mask member MSK1' and the second mask member MSK2' can be aligned with each other with the third direction DR3 as a reference by this action.

[0102] In addition, the third width W3 of the first conductive member CP1' and the fourth width W4 of the second conductive member CP2' can be substantially the same. In addition, the distance W5 between the first conductive member CP1' and the second conductive member CP2' can be greater than the third and fourth widths W3, W4. According to such a structure, in a case where different voltages are applied to the first and second conductive members CP1', CP2' respectively, a Johnsen-Rahbek effect can be exhibited, whereby the first mask member MSK1' and the second mask member MSK2' can be held in a state of being spaced apart from each other by electrostatic attractive and repulsive forces.

[0103] In an embodiment, the first mask member MSK1 and the second mask member MSK2 can be brought into close contact with each other by an attractive force generated between the first mask member MSK1 and the second mask member MSK2 in the third direction DR3. In addition, attractive forces generated between the first mask member MSK1 and the second mask member MSK2 in the first and second directions DR1, DR2 and directions opposite to each of the first and second directions DR1, DR2 form a balance of forces with each other, whereby the first mask member MSK1 and the second mask member MSK2 can be aligned in a plane constituted by the first and second directions DR1, DR2.

[0104] Thus, the first mask member MSK1 and the second mask member MSK2 are in close contact and aligned, and the second alignment portion ALP2 formed in the first mask member MSK1 is aligned with the first alignment portion ALP1 formed in the substrate SUB, whereby misalignment of the substrate SUB and the evaporation mask MSK can be improved, and further, a gap between the substrate SUB and the evaporation mask MSK can be minimized to improve evaporation precision.

[0105] Figure 10 is a conceptual view illustrating an evaporation apparatus including Figure 1 the evaporation mask shown in FIG. 1.

[0106] Referring to Figure 10 , the evaporation apparatus DA can include a chamber CH, an electrostatic chuck ESC, a moving member MOV, an evaporation mask MSK, and a support member SUP.

[0107] The chamber CH provides an internal space which can be arranged in a specific atmospheric condition, and an evaporation process can be performed in the internal space of such a chamber CH.

[0108] Although not illustrated in the drawings, the chamber CH can include a suction pipe and a vacuum pump. The suction pipe can be a passage that discharges air of the internal space to the outside of the chamber CH or introduces outside air into the internal space. The vacuum pump can be provided to the suction pipe to provide a driving force to discharge air of the internal space to the outside. In other words, the vacuum pump can adjust the pressure of the internal space according to whether it is operating or not. For example, the vacuum pump can create the internal space as one of an atmospheric pressure condition and a vacuum condition.

[0109] The internal space of the chamber CH can be configured with the evaporation mask MSK and the support member SUP.

[0110] Although not illustrated in the drawings, an evaporation source (not illustrated) that emits an evaporation material can be configured in the internal space of the chamber CH.

[0111] The evaporation source can be configured in the internal space of the chamber CH. The evaporation source can accommodate a material to be evaporated on the substrate SUB. The evaporation source can evaporate, vaporize, or sublimate at least any one of an organic material, an inorganic material, and a conductive material as an evaporation material to the substrate SUB side. The evaporation material evaporated from the evaporation source can be evaporated on the unit region CA of the substrate SUB through the pattern hole PH formed in the evaporation mask MSK. For example, the evaporation source can evaporate the evaporation material on the unit region CA of the substrate SUB by a method of evaporating the evaporation material by heating the evaporation material with high temperature. To this end, the evaporation source can include a heater (not illustrated) for heating the evaporation material.

[0112] The evaporation source can include at least one nozzle (not illustrated) that directs an evaporation material evaporated, vaporized, or sublimated from the evaporation source toward the substrate SUB. In other words, the nozzle can be connected to the evaporation source to guide the evaporation material evaporated, vaporized, or sublimated in the internal space of the evaporation source to the outside of the evaporation source, that is, the internal space of the chamber. In the case where a plurality of nozzles are formed in the evaporation source, the nozzles can be configured as point nozzles spaced apart from each other by a predetermined distance. In an embodiment, the nozzles can also be provided as line nozzles that spray the evaporation material to a certain region of the substrate SUB.

[0113] The electrostatic chuck ESC can form an electrostatic force using an electrostatic induction phenomenon to chuck or dechuck the substrate SUB. In an embodiment, the electrostatic chuck ESC can repeatedly chuck the substrate SUB for a process of processing the substrate SUB, and dechuck the substrate SUB after the evaporation material is evaporated on the substrate SUB for processing of the next step.

[0114] The moving member MOV can be disposed on the electrostatic chuck ESC, connected to the electrostatic chuck ESC, and reciprocate up and down and left and right on a plane constituted by the first direction DR1 and the second direction DR2. In addition, the moving member MOV can be configured to be tiltable with the third direction DR3 as a reference, so that the substrate SUB attracted to the electrostatic chuck ESC can reciprocate up and down and left and right on the plane constituted by the first direction DR1 and the second direction DR2 or tilt according to the movement of the moving member MOV.

[0115] The evaporation mask MSK can be disposed between the evaporation source and the substrate SUB. The evaporation mask MSK can include a first mask member MSK1 disposed to face one side of the substrate SUB to be evaporated with an evaporated substance and a second mask member MSK2 disposed between the substrate SUB and the first mask member MSK1.

[0116] Figure 10 The illustrated first and second mask members MSK1, MSK2 can be configured identically to the first and second mask members MSK1, MSK2 described above. Figure 1 and Figures 4 to 9 The illustrated first and second mask members can be configured identically to the first and second mask members described above. Therefore, the repeated description will be omitted below.

[0117] The evaporation device DA can further include a light source LS, a light dividing section BS, a mirror MR, a light detecting section DE, and an alignment box AB for aligning the substrate SUB and the evaporation mask MSK.

[0118] The light source LS can generate a laser beam LB. The laser beam LB can be any one of an ultraviolet ray and a visible ray.

[0119] The light dividing section BS can be disposed on the downstream side of the light source LS on the optical path of the laser beam LB. The light dividing section BS can reflect a part of the incident light and transmit another part. For example, the light dividing section BS can be a beam splitter.

[0120] The mirror MR can be disposed between the light dividing section BS and the second alignment section ALP2 on the optical path of the laser beam LB. The mirror MR can totally reflect the incident light.

[0121] The laser beam LB generated from the light source LS can be irradiated toward the second alignment section ALP2 of the first mask member MSK. In this case, the laser beam LB can be irradiated toward the second alignment section ALP2 of the second mask member MSK2. Figure 10In order to guide the laser beam LB generated from the light source LS to the second alignment portion ALP2, a light splitting portion BS and a mirror MR or the like are illustrated as constituent elements arranged on the optical path of the laser beam LB, but the embodiments are not limited thereto. The light splitting portion BS and the mirror MR are exemplary constituent elements for transmitting the laser beam LB to the third direction DR3 of the second alignment portion ALP2, and various optical components can be arranged to form a suitable optical path in which the laser beam LB can be incident on the second alignment portion ALP2. For example, a plurality of mirrors can be arranged on the optical path of the laser beam LB, although not illustrated in the drawings, and a compensator or the like that corrects the optical path of the laser beam LB can also be arranged on the optical path.

[0122] In addition, in order to facilitate explanation, one laser beam LB is illustrated as being emitted from one light source LS, but the embodiments are not limited thereto. The light source LS can also be provided with a plurality of light sources and can simultaneously irradiate a plurality of second alignment portions ALP2, or can be configured such that one light source LS can move and sequentially irradiate the laser beam LB to each of a plurality of second alignment portions ALP2.

[0123] The laser beam LB generated from the light source LS can be transmitted from the light splitting portion BS, and the laser beam LB transmitted through the light splitting portion BS can be guided to the mirror MR side. Thus, a portion of the laser beam LB generated from the light source LS and transmitted through the light splitting portion BS is referred to as first transmitted light.

[0124] The first transmitted light that is totally reflected from the mirror MR can be guided to the second alignment portion ALP2. A portion of the first transmitted light that is irradiated to the second alignment portion ALP2 can be reflected again to the mirror MR side (hereinafter, referred to as first reflected light). Thus, the first reflected light that is reflected from the second alignment portion ALP2 and guided to the mirror MR can be totally reflected again from the mirror MR and guided to the light splitting portion BS. The first reflected light that is incident on the light splitting portion BS can be reflected from the light splitting portion BS and a portion thereof can be guided to the light detection portion DE. Hereinafter, the portion of the first reflected light that is reflected from the light splitting portion BS and guided to the light detection portion DE is referred to as second reflected light.

[0125] On the other hand, another portion of the first transmitted light that is irradiated to the second alignment portion ALP2 and is not reflected to the mirror MR side can be transmitted through the second alignment portion ALP2 and guided to the third alignment portion ALP3 of the second mask member MSK2. Hereinafter, the other portion of the first transmitted light that is transmitted through the second alignment portion ALP2 and guided to the third alignment portion ALP3 is referred to as second transmitted light.

[0126] A part or all of the second transmitted light that is incident on the third alignment portion ALP3 can be transmitted through the third alignment portion ALP3 to be guided to the first alignment portion ALP1 side of the substrate SUB. Here, a part or all of the second transmitted light that is transmitted through the third alignment portion ALP3 is referred to as third transmitted light.

[0127] A part of the third transmitted light that is incident on the first alignment portion ALP1 can be absorbed at the first alignment portion ALP1, and another part can be reflected from the first alignment portion ALP1 to be guided to the light splitting portion BS after sequentially passing through the third alignment portion ALP3 and the second alignment portion ALP2 again and being totally reflected from the mirror MR. Hereinafter, the other part of the third transmitted light that is incident on the light splitting portion BS is referred to as fourth reflected light. The fourth reflected light that is incident on the light splitting portion BS can be reflected from the light splitting portion BS to be guided to the light detecting portion DE. Hereinafter, the part of the fourth reflected light that is guided to the light detecting portion DE from the light splitting portion BS is referred to as fifth reflected light.

[0128] The light detecting portion DE can receive the second reflected light that is reflected from the second alignment portion ALP2 (i.e., the first mask member MSK1) and the fifth reflected light that is reflected from the first alignment portion ALP1 (i.e., the substrate SUB), thereby confirming whether the first mask member MSK1 and the substrate are correctly aligned at a predetermined position.

[0129] The support member SUP can support the evaporation mask MSK to be movable to and from in the third direction DR3 and the opposite direction of the third direction DR3. In other words, the support member SUP can be movable to and from in a direction approaching the substrate SUB and the opposite direction thereof in a state of supporting the evaporation mask MSK.

[0130] The support member SUP can include a first power supply electrode PSE1 that applies either one of a positive voltage and a negative voltage to the first conductive member CP1 and a second power supply electrode PSE2 that applies the other one of the positive voltage and the negative voltage to the second conductive member CP2. The above description has been made centering on a case where the positive voltage is applied to the first conductive member CP1 and the negative voltage is applied to the second conductive member CP2, and thus, for convenience of description, the description will be made centering on a case where the positive voltage is applied to the first power supply electrode PSE1 and the negative voltage is applied to the second power supply electrode PSE2.

[0131] The first and second power supply electrodes PSE1, PSE2 can be arranged to be exposed to the outside at a region of the support member SUP in contact with the first mask member MSK1. Similarly, the first and second conductive members CP1, CP2 can also be arranged to be exposed to the outside at a region of the first mask member MSK1 in contact with the support member SUP. In an embodiment, when the first mask member MSK1 is disposed on the support member SUP, the first conductive member CP1 and the first power supply electrode PSE1 can be arranged to face each other, and similarly the second conductive member CP2 and the second power supply electrode PSE2 can also be arranged to face each other. According to such a structure, in a case where the first mask member MSK1 is disposed on the support member SUP, the first conductive member CP1 and the first power supply electrode PSE1 and the second conductive member CP2 and the second power supply electrode PSE2 can be naturally grounded.

[0132] The alignment box AB can accommodate the light source LS, the light splitting section BS, and the light detection section DE, and can be provided in a separate space distinct from the chamber CH, but is not limited thereto. For example, the alignment box AB can also be arranged in the internal space of the chamber CH, but is not affected by a change in the atmospheric pressure condition of the internal space of the chamber CH, and can also be arranged in a separate space that is sealed so that the deposition material does not permeate into the inside.

[0133] Thus, the first mask member MSK1 including the second alignment section ALP2 for alignment with the substrate SUB is arranged below the second mask member MSK2, and the first and second conductive members CP1, CP2 of the first mask member MSK1 are caused to apply different voltages to each other to induce the Johnson-Rahbek effect, so that the first mask member MSK1 and the second mask member MSK2 can be closely supported and aligned. In other words, the manufacture of the second mask member MSK2 formed with the pattern hole PH and the alignment section at risk of management are not directly formed in the second mask member MSK2, but in the first mask member MSK1 that closely supports the second mask member MSK2, so that misalignment of the substrate SUB and the second mask member MSK2 can be improved. In addition, by supporting the lower portion of the second mask member MSK2 with the first mask member MSK1, the gap between the substrate SUB and the second mask member MSK2 can be minimized to improve the deposition precision.

[0134] Although specific embodiments and applications have been shown and described herein, it is understood that the application can take many different forms and that the application described herein is to be considered in all respects as illustrative and not restrictive.

Claims

1. A mask for evaporation for evaporating an evaporation material on a substrate having at least two first alignment portions, characterized in that The evaporation mask includes: a first mask member configured to face one side of the substrate to be evaporated with the evaporation substance, and including: a plurality of first unit opening regions configured along a first direction and a second direction intersecting the first direction; and at least two second alignment portions overlapping each of the at least two first alignment portions in a third direction intersecting the first direction and the second direction; and a second mask member configured between the substrate and the first mask member, and including: a plurality of second unit opening regions overlapping the plurality of first unit opening regions in the third direction, either of the first mask member and the second mask member further includes a protruding portion protruding toward the other, the other of the first mask member and the second mask member further includes a recessed portion overlapping the protruding portion in the third direction and having a shape corresponding to the protruding portion.

2. The evaporation mask according to claim 1, wherein the first mask member is composed of a dielectric, the second mask member is composed of any one of silicon, silicon oxide, and silicon nitride.

3. The evaporation mask according to claim 1, wherein the protruding portion is configured in any one of between first unit opening regions adjacent to each other among the plurality of first unit opening regions and between second unit opening regions adjacent to each other among the at least two second unit opening regions, the recessed portion is configured in the other of between first unit opening regions adjacent to each other among the plurality of first unit opening regions and between second unit opening regions adjacent to each other among the at least two second unit opening regions.

4. The evaporation mask according to claim 3, wherein the protruding portion extends in each of the first direction and the second direction, the recessed portion extends in each of the first direction and the second direction.

5. The evaporation mask according to claim 3, wherein the protruding portion includes two or more sub-protruding portions separated from each other along each of the first direction and the second direction, the recessed portion includes two or more sub-recessed portions separated from each other along each of the first direction and the second direction.

6. The evaporation mask according to claim 3, wherein a first width of the protruding portion is smaller than a second width of the recessed portion.

7. The evaporation mask according to claim 1, wherein the first mask member further includes: a first conductive member overlapping the protruding portion and the recessed portion in the third direction; and a second conductive member not overlapping the protruding portion and the recessed portion in the third direction, voltage of different polarities from each other is applied to the first conductive member and the second conductive member.

8. The evaporation mask according to claim 7, wherein a third width of the first conductive member and a fourth width of the second conductive member are the same, A distance between the first conductive member and the second conductive member is greater than the third width and the fourth width.

9. The mask for evaporation according to Claim 1, wherein The first mask member further includes: a first conductive member overlapping the protruding portion and the recess in the third direction; and a second conductive member overlapping the first conductive member in the third direction, A voltage of different polarity is applied to the first conductive member and the second conductive member.

10. The mask for evaporation according to Claim 9, wherein The third width of the first conductive member and the fourth width of the second conductive member are the same, A distance between the first conductive member and the second conductive member is greater than the third width and the fourth width.

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