Laser

Abstract

The utility model provides a laser, which relates to the technical field of lasers and comprises a base, a mounting seat and a light-emitting device. The base is provided with a first assembling surface; the mounting seat is provided with a heat dissipation surface and a second assembly surface opposite to the heat dissipation surface; the second assembling surface is connected with the first assembling surface; a flow channel is defined between the mounting seat and the base; the light-emitting device is connected with the heat dissipation surface, and the contact area of the heat dissipation surface and the light-emitting device is a first area; in the direction perpendicular to the heat dissipation face, the projection, on the heat dissipation face, of the flow channel coincides with the first area, or the first area is located on the inner side of the projection, on the heat dissipation face, of the flow channel. The area where the projection of the first area on the first assembling face is located is a second area, gaps exist between all positions of the second area and the second assembling face, and the second area has no supporting effect on the installation base.

Description

TECHNICAL FIELD

[0001] The utility model relates to a laser technology field especially is a kind of laser. BACKGROUND

[0002] In the laser, a large amount of heat is generated by the working of light emitting device, and the heat accumulation can cause the abnormal working of light emitting device, therefore, how to realize rapid heat dissipation becomes an important problem for the stable working of light emitting device. SUMMARY

[0003] The utility model aims at providing a kind of laser to alleviate the technical problem of higher temperature of light emitting device in the existing laser.

[0004] In the first aspect, the utility model provides a kind of laser, it includes: pedestal, mounting seat and light emitting device;Pedestal is provided with first assembly surface;Mounting seat is provided with heat dissipation surface and the second assembly surface with the heat dissipation surface opposite direction;Second assembly surface is connected with first assembly surface;

[0005] Mounting seat and pedestal define flow channel between them;

[0006] Light emitting device is connected with heat dissipation surface, and the area that heat dissipation surface contacts with light emitting device is first area;

[0007] Along the direction perpendicular to heat dissipation surface, the projection of flow channel on heat dissipation surface coincides with first area, or, first area is located in the inside of the projection of flow channel on heat dissipation surface;And the projection area of first area on first assembly surface is second area, and all positions of second area exist gap with second assembly surface, and second area has no supporting effect to mounting seat.

[0008] Further, first assembly surface is provided with first flow guide groove, and first flow guide groove defines flow channel with second assembly surface.

[0009] Further, second assembly surface is provided with second flow guide groove, and second flow guide groove defines flow channel with first assembly surface.

[0010] Further, first assembly surface is provided with first flow guide groove, and second assembly surface is provided with second flow guide groove, and first flow guide groove and second flow guide groove are aligned up and down and define flow channel.

[0011] Further, the inside of pedestal is provided with inlet flow channel and outlet flow channel, and the inner end of inlet flow channel and the inner end of outlet flow channel are communicated with the head and tail ends of flow channel respectively;

[0012] The outer end of inlet flow channel and the outer end of outlet flow channel are communicated with the outer wall of pedestal respectively and form the inlet and outlet of cooling liquid respectively.

[0013] Further, the first assembly surface and the second assembly surface are welded or connected by an adhesive.

[0014] Further, an annular groove is arranged on the first assembly surface and / or the second assembly surface and surrounds the flow channel, and the annular groove is filled with at least one of a sealing element, solder and an adhesive.

[0015] Further, the number of the first regions on the heat dissipation surface is at least two.

[0016] Further, the heat dissipation surface is provided with a first positioning structure for positioning the light emitting device.

[0017] The first assembly surface and the second assembly surface are correspondingly provided with a second positioning structure.

[0018] Further, the second positioning structure comprises a positioning hole and a positioning column, one of which is located on the first assembly surface and the other of which is located on the second assembly surface.

[0019] The utility model at least has the following advantages or beneficial effects:

[0020] The laser device provided by the utility model comprises a base, a mounting seat and a light emitting device; the base is provided with a first assembly surface; the mounting seat is provided with a heat dissipation surface and a second assembly surface which is opposite to the heat dissipation surface; the second assembly surface is connected with the first assembly surface; a flow channel is defined between the mounting seat and the base; the light emitting device is connected with the heat dissipation surface, and the region, where the heat dissipation surface contacts the light emitting device, is a first region; in the direction perpendicular to the heat dissipation surface, the projection of the flow channel on the heat dissipation surface coincides with the first region, or the first region is located on the inner side of the projection of the flow channel on the heat dissipation surface; and the projection of the first region on the first assembly surface is located in a second region, and all positions of the second region have gaps with the second assembly surface, and the second region has no supporting effect on the mounting seat.

[0021] The light emitting device is located directly above the flow channel, and the base has no supporting structure for the mounting seat below the first region, so that in the flow channel, the cooling liquid flowing below the first region can fully contact the second assembly surface and absorb heat, the heat dissipation area is larger, and the heat dissipation efficiency is higher. When the laser device works, the light emitting device generates heat, compared with other positions of the heat dissipation body formed by the base and the mounting seat, the part of the heat dissipation body between the flow channel and the light emitting device is thinner, the cooling liquid flowing through the flow channel is closer to the light emitting device above it, and the cooling liquid can more easily absorb the heat generated by the light emitting device above the flow channel, so that faster heat exchange can be realized, and the heat exchange efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the description of the specific embodiments or the prior art. Obviously, the drawings described in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0023] Figure 1 A schematic diagram of the laser provided for the embodiment 1 of the present application is shown in the figure.

[0024] Figure 2 A top view of the laser provided for the embodiment 1 of the present application is shown in the figure.

[0025] Figure 3 An exploded view of the heat sink of the laser provided for the embodiment 1 of the present application is shown in the figure.

[0026] Figure 4 A sectional view of the laser provided for the embodiment 1 of the present application is shown in the figure.

[0027] Figure 5 A schematic diagram of another base of the laser provided for the embodiment 1 of the present application is shown in the figure.

[0028] Figure 6 A sectional view of the laser provided for the embodiment 2 of the present application is shown in the figure.

[0029] Figure 7 A sectional view of the laser provided for the embodiment 3 of the present application is shown in the figure.

[0030] Icon: 1-emitting device; 2-base; 21-first assembly surface; 211-first flow guide groove; 3-mounting seat; 31-second assembly surface; 311-second flow guide groove; 4-liquid inlet channel; 5-liquid outlet channel; 6-annular groove; 7-channel. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the application.

[0033] Embodiment 1

[0034] As Figure 1 shown, the laser provided by the application comprises a base 2, a mounting seat 3 and a light emitting device 1.

[0035] The back surface (second assembly surface 31) of the mounting seat 3 is connected with the front surface (first assembly surface 21) of the base 2 as a complete heat sink, and the top surface (heat dissipation surface of the mounting seat 3) of the heat sink is provided with the light emitting device 1. In addition, a flow channel 7 is defined between the mounting seat 3 and the base 2, and the cooling liquid flowing through the flow channel 7 can cool the heat sink.

[0036] The front surface of the mounting seat 3 is a heat dissipation surface, the light emitting device 1 is connected with the heat dissipation surface, the area where the heat dissipation surface contacts the light emitting device 1 is a first area, and the heat generated by the light emitting device 1 is transmitted to the heat sink through the first area.

[0037] As Figure 2 shown, the flow channel 7 is located below the heat dissipation surface. According to the shape of the light emitting device 1, the topography of the flow channel 7 is set to meet the following conditions: along the direction perpendicular to the heat dissipation surface, the projection of the flow channel 7 on the heat dissipation surface coincides with the first area, or the first area is located inside the projection of the flow channel 7 on the heat dissipation surface, so that the first area is completely covered by the flow channel. In addition, the front surface of the base 2 is the first assembly surface 21, along the direction perpendicular to the heat dissipation surface, the projection of the first area on the first assembly surface 21 is located in a second area, and all positions of the second area have gaps with the second assembly surface 31, and the second area has no supporting effect on the mounting seat 3. That is, the part of the flow channel 7 located below the first area is sufficient to cover the first area, and there is no supporting structure such as a supporting column in the flow channel, and the part of the flow channel 7 located below the first area is a passageway through which the cooling liquid can flow, thereby improving the heat exchange efficiency of the cooling liquid flowing through the passageway.

[0038] The light emitting device 1 is located directly above the flow channel, and the base 2 has no supporting structure for the mounting seat 3 below the first area, so that in the flow channel, the cooling liquid flowing below the first area can be in full contact with the second assembly surface and absorb heat, the heat dissipation area is larger, and the heat dissipation efficiency is higher. When the laser works, the light emitting device 1 generates heat, compared with other positions of the heat sink formed by the base 2 and the mounting seat 3, the part of the heat sink located between the flow channel and the light emitting device 1 is thinner, the cooling liquid flowing through the flow channel is closer to the light emitting device 1 above it, and the cooling liquid can more easily absorb the heat generated by the light emitting device 1 above the flow channel, so that faster heat exchange can be achieved and the heat exchange efficiency is improved.

[0039] As shown in Figure 3 In this embodiment, the first assembly surface 21 and the second assembly surface 31 are welded or connected by an adhesive, and the base 2 and the mounting seat 3 are connected to form a whole, which is not easy to disassemble and has better sealing performance.

[0040] It should be understood that the mounting seat 3 and the light emitting device 1 mentioned in this application can be referred to as a heat sink and a chip of a cos, respectively.

[0041] As shown in Figure 4 The base 2 and the mounting seat 3 can be connected together by welding or adhesive, and the first assembly surface 21 and / or the second assembly surface 31 is provided with an annular groove 6 arranged around the flow channel 7. In this embodiment, the base 2 and the mounting seat 3 are connected by welding, and the annular groove 6 is arranged on the first assembly surface 21. The annular groove 6 is arranged around the circumferential outer side of the flow channel 7, and before welding, the annular groove 6 is filled with solder, which can avoid the overflow of solder during welding. Of course, in other implementable schemes, a sealing element such as a sealing ring can be arranged in the annular groove 6, so as to avoid the leakage of the cooling liquid in the flow channel 7 when the first assembly surface 21 and the second assembly surface 31 are combined.

[0042] As shown in Figure 5 The first assembly surface 21 is provided with a first flow guide groove 211, and the first assembly surface 21 and the second assembly surface 31 define the flow channel 7 after being combined. The base 2 can also be provided with an inlet flow channel 4 and an outlet flow channel 5, and the inner ends of the inlet flow channel 4 and the outlet flow channel 5 are respectively communicated with the first end and the second end of the flow channel 7. The inlet flow channel 4 and the outlet flow channel 5 can be perpendicular to the flow channel 7. The outer ends of the inlet flow channel 4 and the outlet flow channel 5 are communicated with the bottom surface of the base 2 and form the inlet and outlet of the cooling liquid, respectively. In other implementable schemes, the extension directions of the inlet flow channel 4 and the outlet flow channel 5 can be different, for example, the inlet flow channel 4 and the outlet flow channel 5 are not perpendicular to the flow channel 7; the positions of the inlet and outlet of the cooling liquid can also be different, for example, the inlet and outlet of the cooling liquid are arranged on the circumferential side wall of the base 2.

[0043] The flow channel 7 is closest to the light emitting device 1 and has better heat conduction effect, and therefore, the shape of the first flow channel 211 can be prepared according to the outer contour shape of the light emitting device 1, so as to match the light emitting device 1.

[0044] The heat dissipation surface is provided with a first positioning structure for positioning the light emitting device 1, and the first assembly surface 21 and the second assembly surface 31 are correspondingly provided with a second positioning structure.

[0045] During assembly, the worker can first position and connect the base 2 and the mounting seat 3 together by using the second positioning structure, and then install the light emitting device 1 on the heat dissipation surface according to the first positioning structure, so that the laser formed by positioning and installing is fixed in position, and the light emitting device 1 and the flow channel 7 are prevented from being deviated, thereby improving the product yield.

[0046] The first positioning structure can be a positioning frame, and the light emitting device 1 can be placed in the positioning frame. The second positioning structure includes a positioning hole and a positioning column, one of which is located on the first assembly surface 21, and the other is located on the second assembly surface 31. After the positioning column is inserted into the positioning hole, the base 2 and the mounting seat 3 are relatively extruded, so that the first assembly surface 21 and the second assembly surface 31 are attached.

[0047] Embodiment 2

[0048] As shown in Figure 6 , the difference between this embodiment and embodiment 1 is that the second assembly surface 31 is provided with a second flow channel 311 in this embodiment, and the second flow channel 311 and the first assembly surface 21 define the flow channel 7.

[0049] When the thicknesses of the base 2 and the mounting seat 3 are the same, the vertical distance between the flow channel 7 and the light emitting device 1 in this embodiment is shorter than that between the flow channel 7 and the light emitting device 1 in embodiment 1. However, due to the thin thickness of the mounting seat 3 itself, the difficulty of forming the second flow channel 311 is increased.

[0050] Embodiment 3

[0051] As shown in Figure 7 , this embodiment combines embodiment 1 and embodiment 2, and the first assembly surface 21 is provided with a first flow channel 211, and the second assembly surface 31 is provided with a second flow channel 311. The first flow channel 211 and the second flow channel 311 are aligned in the up-down direction, and the openings of the two are opposite to each other, and the two define the flow channel 7 together.

[0052] Since the heat exchange flow channel is formed by the first flow channel 211 and the second flow channel 311 arranged in the up-down direction, compared with embodiment 1 and embodiment 2, the inner diameter of the heat exchange flow channel can be prepared to be larger in this embodiment, so that the flow of the cooling liquid is larger, and the heat dissipation efficiency can be further improved.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A laser characterized by, The application relates to a light-emitting device (1) comprising a base (2), a mounting seat (3) and the light-emitting device (1); the base (2) is provided with a first assembly surface (21); the mounting seat (3) is provided with a heat dissipation surface and a second assembly surface (31) opposite to the heat dissipation surface; the second assembly surface is connected with the first assembly surface (21); a flow channel (7) is defined between the mounting seat (3) and the base (2); the light-emitting device (1) is connected with the heat dissipation surface, and a first area where the heat dissipation surface contacts the light-emitting device (1) is formed; the projection of the flow channel (7) on the heat dissipation surface is coincident with the first area or the first area is located on the inner side of the projection of the flow channel (7) on the heat dissipation surface; and the projection of the first area on the first assembly surface (21) is a second area, all positions of the second area have gaps with the second assembly surface (31), and the second area has no supporting effect on the mounting seat (3). The first assembly surface (21) is provided with a first flow guide groove (211), and the first flow guide groove (211) and the second assembly surface (31) define the flow channel (7). The second assembly surface (31) is provided with a second flow guide groove (311), and the second flow guide groove (311) and the first assembly surface (21) define the flow channel (7). The first assembly surface (21) is provided with a first flow guide groove (211), and the second assembly surface (31) is provided with a second flow guide groove (311); the first flow guide groove (211) and the second flow guide groove (311) are vertically aligned and define the flow channel (7). The base (2) is internally provided with an inlet flow channel (4) and an outlet flow channel (5); the inner end of the inlet flow channel (4) and the inner end of the outlet flow channel (5) are respectively communicated with the head end and tail end of the flow channel (7).

2. The laser of claim 1, wherein, The outer end of the inlet flow channel (4) and the outer end of the outlet flow channel (5) are respectively communicated with the outer wall of the base (2) and form the inlet and outlet of the cooling liquid.

3. The laser of claim 1, wherein, The first assembly surface (21) and the second assembly surface (31) are welded or connected through an adhesive.

4. The laser of claim 1, wherein, The first assembly surface (21) and / or the second assembly surface (31) are provided with an annular groove (6) surrounding the flow channel (7); the annular groove (6) is filled with at least one of a sealing element, solder and an adhesive.

5. The laser of any of claims 1-4, wherein, The number of the first areas on the heat dissipation surface is at least two. The heat dissipation surface is provided with a first positioning structure for positioning the light-emitting device (1).

6. The laser of any of claims 1-4, wherein, The first assembly surface (21) and the second assembly surface (31) are correspondingly provided with a second positioning structure.

7. The laser of claim 6, wherein, The second positioning structure comprises a positioning hole and a positioning column, one of the positioning hole and the positioning column is located on the first assembly surface (21), and the other is located on the second assembly surface (31).

8. The laser of any of claims 1-4, wherein, ​ 9. The laser of any of claims 1-4, wherein, ​ ​ 10. The laser of claim 9, wherein, ​

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