Heat dissipation device and electronic equipment

Abstract

The utility model discloses a heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation, the heat dissipation device comprises a heat dissipation shell, the bottom of the heat dissipation shell is provided with an air inlet channel, the top of the heat dissipation shell is provided with an air outlet channel, and a heating component is arranged in the heat dissipation shell; the air inlet assembly is arranged in the air inlet channel, and the air inlet assembly comprises a first filter screen and a drainage component; the air outlet assembly is arranged in the air outlet channel, the air outlet assembly comprises a second filter screen, and the second filter screen is used for leading airflow after heat dissipation of the heating component out of the heat dissipation shell; the liquid cooling structure is arranged in the heat dissipation shell, and the liquid cooling structure is located between the air inlet assembly and the heating component so as to carry out liquid cooling on the heating component; the problems of low heat dissipation efficiency and impurity accumulation during heat dissipation of the electronic equipment in the prior art are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation device and an electronic device. BACKGROUND

[0002] In today's digital age, electronic devices (such as servers) serve as the central hub for information processing, handling massive data storage and computation tasks. To ensure the continuous and efficient operation of electronic devices, effective heat dissipation solutions are particularly important. Traditionally, electronic devices are cooled mainly by air cooling systems, which use fans to push air flow and utilize air convection heat exchange to reduce the internal temperature of electronic devices. This simple and direct cooling method is suitable for most low to medium power electronic device scenarios. The air cooling system usually consists of a heat sink, a fan and a cooling channel, where the heat sink is tightly attached to the main heat-generating components of the electronic device, such as the CPU, GPU and memory modules, and the fan is responsible for guiding air circulation to facilitate heat dissipation.

[0003] However, traditional air cooling heat dissipation technology has some obvious limitations. First, the cooling efficiency is limited by the heat capacity and heat conduction ability of air. For high-power, high-heat electronic devices, simply relying on air cooling is difficult to quickly and effectively transfer heat, especially under high load conditions, the internal temperature of the electronic device can quickly rise, affecting hardware performance and lifespan. Second, because air contains a large amount of dust and particles, these impurities can accumulate on the cooling fins and internal components over a long period of operation, forming a layer of insulating film that hinders the effective conduction and dissipation of heat, reducing the efficiency of the entire cooling system. CONTENT OF THE INVENTION

[0004] The present application provides a heat dissipation device and an electronic device to solve the problems of low heat dissipation efficiency and impurity accumulation in the prior art when cooling electronic devices.

[0005] The present application provides a heat dissipation device for cooling heat-generating components, wherein the heat dissipation device comprises: a heat dissipation housing, the bottom of the heat dissipation housing is provided with an air inlet channel, the top of the heat dissipation housing is provided with an air outlet channel, and the heat-generating components are arranged in the heat dissipation housing;

[0006] An air inlet assembly is arranged in the air inlet channel, the air inlet assembly comprises a first filter screen and a flow guide component, the flow guide component has a flow guide channel, the air flow in the air inlet channel is introduced into the heat dissipation housing through the flow guide channel to cool the heat-generating components;

[0007] An air outlet assembly is arranged in the air outlet channel, the air outlet assembly comprises a second filter screen to guide the air flow after cooling the heat-generating components out of the heat dissipation housing;

[0008] The liquid cooling structure is arranged in the heat dissipation shell and located between the air inlet assembly and the heat generating component to perform liquid cooling on the heat generating component.

[0009] Further, the air inlet assembly further comprises an air inlet cover, a plurality of air inlets are arranged on the air inlet cover, and each air inlet is communicated with the cavity of the heat dissipation shell.

[0010] Further, the air guiding component comprises an air guiding body, the air guiding body is detachably arranged between the air inlet channel, a plurality of air guiding channels are arranged on the air guiding body, and each air guiding channel is arranged obliquely relative to the bottom of the heat dissipation shell, wherein the air inlet cover and the first filter screen are detachably arranged on the air guiding body; the air inlet cover, the first filter screen and the air guiding component are sequentially arranged along the inflow direction of the airflow.

[0011] Further, the air outlet assembly further comprises an air outlet component, the air outlet component is rotatably arranged in the air outlet channel to guide the airflow in the heat dissipation shell after heat dissipation of the heat generating component to the outside of the heat dissipation shell through the air outlet component; wherein the air outlet component and the second filter screen are sequentially arranged along the outflow direction of the airflow.

[0012] Further, the liquid cooling structure comprises a liquid cooling support, a liquid cooling tank and a liquid cooling pipe, wherein the liquid cooling tank is arranged on one side of the liquid cooling support, the liquid cooling pipe is arranged in the liquid cooling support, the inlet and outlet of the liquid cooling pipe respectively extend from the liquid cooling support and are communicated with the liquid cooling tank, so as to cool the heat generating component through the liquid cooling structure.

[0013] Further, the heat dissipation device further comprises a connecting structure arranged between the heat generating component and the liquid cooling support, the connecting structure comprises a first connecting part and a second connecting part, a heat dissipation space is formed between the first connecting part and the second connecting part, the first connecting part is arranged on the liquid cooling support, the second connecting part is used for bearing the heat generating component, a first flow channel communicated with the heat dissipation space is arranged on the liquid cooling support, so as to guide the airflow cooled by the liquid cooling structure into the heat dissipation space through the first flow channel to dissipate heat of the heat generating component.

[0014] Further, the connecting structure further comprises a fixing component arranged on the side of the second connecting part away from the first connecting part, the heat generating component is arranged on the fixing component, the connecting structure further comprises a heat conduction component arranged on the fixing component, at least part of the heat conduction component is in contact with the heat generating component, a second flow channel communicated with the heat dissipation space is arranged on the first connecting part, the outlet end of the second flow channel corresponds to at least part of the heat conduction component, so as to guide the airflow in the heat dissipation space to at least part of the heat conduction surface of the heat conduction component through the second flow channel to take away heat on at least part of the heat conduction surface.

[0015] Further, the heat conduction component is a plurality of, and the second flow channel is a plurality of, each heat conduction component and each second flow channel are arranged one by one.

[0016] Further, the connecting structure further comprises a locking member, the locking member comprising a first locking part, the first locking part being provided with a movable part, the second connecting part being provided with a movable position, the movable position movably cooperating with the movable part, the first connecting part being provided with a locking position, at least part of the first locking part being locked with the locking position, so that the first connecting part and the second connecting part form a heat dissipation space through the locking member; and / or, the heat dissipation device further comprises a supporting structure, the supporting structure being arranged at the bottom of the heat dissipation shell to support the heat dissipation shell.

[0017] According to another aspect of the present application, the present application also provides an electronic device comprising the heat dissipation device.

[0018] The present application provides a high-efficiency cooling solution by integrating the heat dissipation shell, the air inlet assembly, the air outlet assembly and the liquid cooling structure. Specifically, the heat dissipation shell constitutes a closed cooling environment, and the air inlet channel arranged at the bottom and the air outlet channel arranged at the top ensure smooth circulation of air flow and optimize internal heat convection. In the air inlet assembly, the first filter screen effectively blocks dust and particles in the air, avoiding the influence of impurities on the heat dissipation fins and internal components, and improving the long-term reliability of the cooling system. The design of the flow guide part guides the air flow directly to the heat-generating components, promotes the rapid dissipation of heat, and improves the cooling efficiency.

[0019] The second filter screen in the air outlet assembly serves as another line of defense for the system, further filtering the air flow after the heat-generating components, reducing dust emission, maintaining the cleanliness of the electronic device operating environment, and reducing subsequent maintenance costs. More importantly, the introduction of the liquid cooling structure fills the limitations of air cooling technology in high-power scenarios. By arranging the liquid cooling structure between the air inlet assembly and the heat-generating components, direct liquid cooling of the core heat-generating components not only significantly improves the heat transfer efficiency, but also effectively suppresses the surge of internal temperature of the electronic device, providing a solid guarantee for the high-performance operation of the electronic device.

[0020] In summary, the heat dissipation device of the present application, through the synergistic effect of the heat dissipation shell, the air inlet assembly, the air outlet assembly and the liquid cooling structure, not only greatly improves the heat dissipation efficiency and ensures the stable operation of the electronic device under high load, but also reduces the influence of dust on the system performance through the double protection of the first filter screen and the second filter screen, prolonging the service life of the hardware. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced. Obviously, the drawings described below are only some of the embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0022] Figure 1 The overall structure schematic diagram of the heat dissipation device of the embodiment of the present application is shown.

[0023] Figure 2 The internal structure schematic diagram of the heat dissipation device of the embodiment of the present application is shown.

[0024] Figure 3 The enlarged schematic diagram of the structure at A in the embodiment of the present application is shown. Figure 2

[0025] Figure 4 The exploded view of the air inlet assembly of the embodiment of the present application is shown.

[0026] Among the above drawings, the following reference signs are included:

[0027] 10, heat generating component; 20, heat dissipation shell; 30, air outlet channel; 40, air inlet assembly; 401, first filter screen; 402, flow guiding component; 4021, flow guiding body; 4022, flow guiding channel; 403, air inlet cover; 404, air inlet; 50, air outlet assembly; 501, second filter screen; 502, air outlet component; 60, liquid cooling structure; 601, liquid cooling support; 602, liquid cooling tank; 603, liquid cooling pipe; 604, first flow channel; 70, connecting structure; 701, first connecting part; 702, second connecting part; 703, fixing component; 704, heat conducting component; 705, second flow channel; 706, locking component; 7061, first locking component; 7062, second locking component; 80, support structure. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0029] ​It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case similar to the described case, and the approximate case is within an acceptable deviation range, wherein the acceptable deviation range is determined by considering the measurement being discussed and the error related to the measurement of a specific quantity (i.e. the limitation of the measurement system) by a person skilled in the art. For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, less than or equal to 5% of the difference between the two. For a person skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0030] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0031] In today's digital age, electronic devices serve as the hub of information processing, bearing the task of storing and operating massive amounts of data. In order to ensure the continuous and efficient operation of electronic devices, an effective cooling scheme is particularly important. Traditional electronic device cooling technology mainly relies on air cooling systems, that is, air flow is pushed by a fan to reduce the internal temperature of the electronic device by using air convection heat exchange. This cooling method is simple and direct, and is suitable for most low to medium power electronic device scenarios. The air cooling system is usually composed of a heat sink, a fan and a cooling channel, wherein the heat sink is closely attached to the main heat generating components of the electronic device, such as CPU, GPU and memory modules, and the fan is responsible for guiding air circulation to facilitate heat dissipation.

[0032] However, the traditional air cooling technology has some obvious limitations. First, the heat dissipation efficiency is limited by the heat capacity and heat conduction ability of air. For high-power and high-heat electronic devices, it is difficult to quickly and effectively transfer heat by relying solely on air cooling, especially in high-load conditions, the internal temperature of the electronic device can quickly rise, affecting the performance and life of the hardware. Second, because the air contains a large amount of dust and particles, these impurities can accumulate on the cooling fins and internal components over a long period of operation, forming a layer of thermal insulation film that hinders the effective conduction and dissipation of heat, reducing the efficiency of the entire cooling system.

[0033] Therefore, the present application provides a heat dissipation device and electronic equipment to solve the problems of low heat dissipation efficiency and impurity accumulation in the prior art when dissipating heat from electronic equipment.

[0034] Embodiment 1

[0035] First, as Figures 1 to 4 shown, the present application provides a heat dissipation device for dissipating heat from a heat generating component 10, the heat dissipation device comprising a heat dissipation housing 20, the bottom of the heat dissipation housing 20 being provided with an air inlet channel, the top of the heat dissipation housing 20 being provided with an air outlet channel 30, the heat generating component 10 being arranged in the heat dissipation housing 20;

[0036] An air inlet assembly 40 is arranged in the air inlet channel, the air inlet assembly 40 comprising a first filter screen 401 and a flow guide component 402, so as to introduce the air flow in the air inlet channel into the heat dissipation housing 20 through the flow guide component 402, so as to dissipate heat from the heat generating component 10;

[0037] An air outlet assembly 50 is arranged in the air outlet channel 30, the air outlet assembly 50 comprising a second filter screen 501, so as to guide the air flow after dissipating heat from the heat generating component 10 to the outside of the heat dissipation housing 20;

[0038] A liquid cooling structure 60 is arranged in the heat dissipation housing 20, the liquid cooling structure 60 being located between the air inlet assembly 40 and the heat generating component 10, so as to cool the heat generating component 10 by liquid cooling.

[0039] The liquid cooling structure introduced in the technical solution can directly absorb the heat generated by the heat generating component 10. Since the heat capacity of liquid is much greater than that of air, a large amount of heat can be removed at a lower flow rate, greatly improving the heat exchange efficiency. Compared with air convection, the liquid cooling method can maintain the internal temperature of the heat generating component 10 stable in high-load conditions, avoiding the performance degradation and potential damage caused by excessive temperature.

[0040] Optionally, the heat generating component 10 is a server, switch, personal PC, etc. in an electronic device.

[0041] By setting the first filter screen 401 in the air inlet channel and the second filter screen 501 in the air outlet channel 30, the device can effectively filter the dust and particles in the incoming and outgoing air flow, preventing their accumulation inside the heat-generating component 10, forming a heat insulation layer, and hindering the normal dissipation of heat. This not only maintains the cleanliness of the heat dissipation fins and improves the heat dissipation efficiency, but also prolongs the service life of the heat-generating component 10.

[0042] The application of the liquid cooling system reduces the dependence on high-speed fans, and the air flow driven by the fan is the main source of noise in traditional air cooling systems. The air inlet assembly 40 and the air outlet assembly 50 in the device can maintain low air flow resistance and vibration even under high flow conditions through reasonable design, thereby reducing air flow noise. In addition, the operation sound of the liquid cooling circulation system is relatively light, further improving the overall noise level.

[0043] By combining liquid cooling and air cooling and optimizing the air flow path, the heat dissipation device can achieve comprehensive management and effective control of the heat inside the heat-generating component 10. Whether under light load or heavy load conditions, the temperature of the heat-generating component 10 can be maintained within a reasonable range, thereby optimizing energy consumption while ensuring stable operation of the heat-generating component 10.

[0044] Further, the air inlet assembly 40 further comprises an air inlet cover 403, and a plurality of air inlets 404 are arranged on the air inlet cover 403, each air inlet 404 being in communication with the chamber of the heat dissipation shell 20.

[0045] The heat dissipation device of the present application realizes more precise and uniform air inlet control by adding an air inlet cover 403 to the air inlet assembly 40 and arranging multiple air inlets 404, greatly optimizing the heat dissipation efficiency and stability. Specifically, the design of the air inlet cover 403 not only effectively seals the air inlet channel, preventing unfiltered external air from directly entering the heat-generating component 10, but also guides the air flow to be evenly distributed in the entire chamber of the heat dissipation shell 20 through the multiple precisely arranged air inlets 404 on it, avoiding the problem of uneven heat dissipation caused by excessive or insufficient air flow in local areas. This balanced air flow distribution, combined with the precise cooling of the liquid cooling structure, ensures that the temperature of the heat-generating component 10 under various load conditions is well controlled, prolonging the service life of the hardware. At the same time, the design of multiple air inlets 404 also helps to disperse the impact noise when the air flow enters, further improving the quietness of the heat-generating component 10 operation, providing a more efficient, reliable, and low-noise heat dissipation solution for high-density data centers and high-performance computing environments.

[0046] Further, the air guiding component 402 comprises an air guiding body 4021 which is detachably arranged between the air inlet channel, and the air guiding body 4021 is provided with a plurality of air guiding channels 4022 which are each arranged obliquely relative to the bottom of the heat dissipation shell 20, wherein the air inlet cover 403 and the first filter screen 401 are each detachably arranged with the air guiding body 4021; along the inflow direction of the airflow, the air inlet cover 403, the first filter screen 401 and the air guiding component 402 are sequentially arranged.

[0047] The heat dissipation device of the present application realizes accurate guidance and efficient utilization of the incoming airflow by integrating the detachable air guiding component 402 comprising the air guiding body 4021 and the plurality of obliquely arranged air guiding channels 4022 thereof, thereby significantly enhancing the heat dissipation efficiency. The detachable design between the air guiding body 4021 and the air inlet channel facilitates maintenance and cleaning, ensures smooth passage of the air inlet 404, reduces air flow resistance, and thus reduces the noise of fan operation. The obliquely arranged air guiding channels 4022 can guide the airflow to pass through the bottom of the heat dissipation shell 20 in the best path, accelerate heat exchange between the airflow and the liquid cooling structure, while avoiding direct impact of the airflow on the heat generating component 10, reducing hot air recirculation, and improving the overall heat dissipation efficiency. The sequential arrangement of the air inlet cover 403, the first filter screen 401 and the air guiding component 402 forms a perfect air purification and airflow guiding system, which not only effectively filters dust and impurities in the air, protecting the cleanliness inside the heat generating component 10, but also ensures uniform distribution of the airflow, avoiding local overheating, and providing strong support for the continuous and stable operation of the high-power heat generating component 10.

[0048] Further, the air outlet assembly 50 further comprises an air outlet component 502 which is rotatably arranged in the air outlet channel 30 to guide the airflow in the heat dissipation shell 20 after dissipating heat from the heat generating component 10 to the outside of the heat dissipation shell 20 through the air outlet component 502; wherein along the outflow direction of the airflow, the air outlet component 502 and the second filter screen 501 are sequentially arranged.

[0049] Further, the design of the air outlet assembly 50 in the present application greatly optimizes the air flow discharge efficiency and path by introducing a rotatable air outlet component 502, effectively relieving the air pressure inside the heat dissipation shell 20 and reducing the turbulence phenomenon when the air flow is discharged. The air outlet component 502 is rotatably arranged in the air outlet channel 30 and can automatically adjust its guide angle according to the internal air flow state, ensuring that the air flow is discharged in the most smooth way, which not only improves the heat dissipation efficiency, but also significantly reduces the air flow noise. In addition, the sequential arrangement of the air outlet component 502 and the second filter screen 501 further filters the dust that may be carried in the last stage of air flow discharge, maintains the cleanliness of the environment around the equipment, and reduces the risk of re-pollution caused by the reverse entry of external air flow. In summary, the design of the air outlet assembly 50 of the present application not only enhances the air flow guide and purification effect, but also effectively controls the noise, achieving efficient, clean and quiet heat dissipation management.

[0050] Further, the liquid cooling structure 60 includes a liquid cooling support 601, a liquid cooling tank 602, and a liquid cooling pipe 603; wherein the liquid cooling tank 602 is arranged on one side of the liquid cooling support 601, and the liquid cooling pipe 603 is arranged in the liquid cooling support 601, and the inlet and outlet of the liquid cooling pipe 603 respectively extend from the liquid cooling support 601 and communicate with the liquid cooling tank 602, so as to dissipate heat from the heat generating components 10 through the liquid cooling structure 60.

[0051] Further, the design of the liquid cooling structure 60 of the present application includes a liquid cooling support 601, a liquid cooling tank 602, and a liquid cooling pipe 603, which realizes efficient cooling of the heat generating components 10, and optimizes the circulation path and heat exchange efficiency of the cooling liquid. The combination of the liquid cooling tank 602 and the liquid cooling support 601 provides stable and reliable structural support for the storage and circulation of the cooling liquid, ensuring the continuous operation of the cooling system. The liquid cooling pipe 603 is arranged inside the liquid cooling support 601, and its inlet and outlet respectively extend from the liquid cooling support 601 and are in close communication with the liquid cooling tank 602, forming a closed-loop liquid cooling circulation system. Such design not only maximizes the contact area between the liquid cooling pipe 603 and the heat generating components 10, improving the heat conduction efficiency, but also effectively reduces the noise of the liquid cooling system during operation by precisely controlling the flow direction and flow rate of the cooling liquid, while reducing the risk of cooling liquid leakage, ensuring the safety and cleanliness of the operating environment of the heat generating components 10.

[0052] Further, the heat dissipation device further comprises a connecting structure 70, which is arranged between the heat generating component 10 and the liquid cooling support 601, and comprises a first connecting part 701 and a second connecting part 702, and a heat dissipation space is formed between the first connecting part 701 and the second connecting part 702, the first connecting part 701 is arranged on the liquid cooling support 601, and the second connecting part 702 is used for bearing the heat generating component 10, and the liquid cooling support 601 is provided with a first flow channel 604 in communication with the heat dissipation space, so as to introduce the airflow cooled by the liquid cooling structure 60 into the heat dissipation space through the first flow channel 604, and the heat generating component 10 is cooled.

[0053] Further, the heat dissipation device of the present application builds a heat exchange interface between the heat generating component 10 and the liquid cooling support 601 by adding the connecting structure 70. In the connecting structure 70, the heat dissipation space between the first connecting part 701 and the second connecting part 702 provides a path for the cooled airflow to directly act on the heat generating component 10, which significantly improves the efficiency and pertinence of air cooling. The first flow channel 604 provided on the liquid cooling support 601 is in communication with the heat dissipation space, which ensures that the cooling airflow generated after the cooling liquid circulates in the liquid cooling structure 60 can be quickly and uniformly introduced into the heat dissipation space to directly and efficiently cool the heat generating component 10, reducing energy loss in the heat conduction process. Such a design not only enhances the overall heat dissipation performance of the heat dissipation device, especially when dealing with high heat load, but also effectively reduces airflow noise, optimizes internal airflow distribution of the heat generating component 10, reduces hot air recirculation, and at the same time, the close cooperation of the first connecting part 701 and the second connecting part 702 ensures the sealing of the heat dissipation space, preventing the intrusion of external dust and impurities, maintaining the cleanliness of the heat generating component 10, thereby prolonging the service life of the hardware.

[0054] Further, the connecting structure 70 further comprises a fixing part 703 arranged on the side of the second connecting part 702 away from the first connecting part 701, and the heat generating component 10 is arranged on the fixing part 703, and the connecting structure 70 further comprises a heat conduction part 704 arranged on the fixing part 703, at least part of the heat conduction part 704 is in contact with the heat generating component 10, and the first connecting part 701 is provided with a second flow channel 705 in communication with the heat dissipation space, and the outlet end of the second flow channel 705 corresponds to at least part of the heat conduction part 704, so as to introduce the airflow in the heat dissipation space into at least part of the heat conduction surface of the heat conduction part 704 through the second flow channel 705, to carry away at least part of the heat on the heat conduction surface.

[0055] Further, the connection structure 70 in the present application constructs a direct and efficient heat conduction and airflow guiding system by integrating the fixing component 703 and the heat conduction component 704, significantly enhancing the cooling efficiency of the heat dissipation device on the heat generating component 10. The arrangement of the fixing component 703 ensures the stable installation of the heat generating component 10, while providing a precise contact surface for the heat conduction component 704, enabling the heat conduction component 704 to form a close contact with the heat generating component 10, improving the efficiency of heat conduction. At least part of the heat conduction component 704 is in direct contact with the heat generating component 10, significantly increasing the heat exchange area and effectively promoting the rapid dissipation of heat. Combined with the ingenious design of the second flow channel 705, the outlet end of which corresponds to at least part of the heat conduction surface of the heat conduction component 704, it ensures that the cooled airflow can be precisely and efficiently introduced into the heat conduction surface, carrying away the heat on the heat conduction component 704. At the same time, due to the direct introduction of the airflow, the secondary transmission loss of heat energy is significantly reduced, and the energy utilization rate of the entire cooling system is improved.

[0056] Further, the heat conduction component 704 is multiple, and the second flow channel 705 is multiple, each heat conduction component 704 and each second flow channel 705 are arranged in a one-to-one correspondence.

[0057] Further, the heat conduction component 704 in the present application adopts a design of multiple independent units, forming a one-to-one correspondence with multiple second flow channels 705, which significantly improves the cooling efficiency and precision of the heat dissipation device on the heat generating component 10. The layout of multiple heat conduction components 704 expands the contact area with the heat generating component 10, ensuring uniform heat dispersion and reducing local overheating, thereby prolonging the service life of the hardware. At the same time, each heat conduction component 704 is precisely aligned with the corresponding second flow channel 705, enabling the cooling airflow to directly and efficiently impact the heat conduction surface of the heat conduction component 704, carrying away the heat conducted from the heat generating component 10 to the heat conduction surface, significantly reducing the heat retention time and improving the heat dissipation efficiency.

[0058] In addition, by adjusting the parameters of each heat conduction component 704 and second flow channel 705, such as the width and length of the flow channel, as well as the material and thickness of the heat conduction component, the cooling needs of different power heat generating components 10 can be flexibly met, realizing personalized customization and optimization of the cooling scheme and enhancing the adaptability of the cooling device. The efficient cooperation of the heat conduction component 704 and the second flow channel 705 not only improves the rapidity and uniformity of cooling, but also optimizes the utilization efficiency of airflow and reduces operating noise.

[0059] Further, the connecting structure 70 further comprises a locking member 706, the locking member 706 comprises a first locking part 7061, the first locking part 7061 is provided with a movable part, the second connecting part 702 is provided with a movable position, the movable position is movably matched with the movable part, the first connecting part 701 is provided with a locking position, at least part of the first locking part 7061 is locked and matched with the locking position, so that the first connecting part 701 and the second connecting part 702 form a heat dissipation space through the locking member 706; and / or, the heat dissipation device further comprises a supporting structure 80, the supporting structure 80 is arranged at the bottom of the heat dissipation shell 20 to support the heat dissipation shell 20.

[0060] Specifically, the locking member 706 is a locking bolt, the locking bolt is provided with a movable part, the movable part is cylindrical, the diameter of the movable part is smaller than the diameter of the locking bolt, the locking position is a threaded hole arranged on the first connecting part 701, the locking member 706 further comprises a second locking part 7062, the second locking part 7062 is a nut, the second locking part 7062 can be used in threaded cooperation with the first locking part 7061, so as to limit the movement of the first connecting part 701 through the locking action of the second locking part 7062, so that the first connecting part 701 and the second connecting part 702 form a heat dissipation space.

[0061] Further, the connecting structure 70 in the present application greatly improves the assembly precision and operation stability of the heat dissipation device by integrating the locking member 706, including the first locking part 7061 and the second locking part 7062, and the optimized design of the supporting structure 80, while simplifying the maintenance process. The locking member 706 cooperates with the unique movable part and the movable position to ensure the accurate alignment between the first connecting part 701 and the second connecting part 702, thereby forming an efficient heat dissipation space, which creates favorable conditions for the circulation of cooling air flow. Specifically, the locking position, i.e. the threaded hole on the first connecting part 701, is accurately matched with the threaded part of the first locking part 7061, combined with the use of the second locking part 7062, i.e. the nut, to realize the firm connection between the first connecting part 701 and the second connecting part 702, ensuring the structural stability and air tightness of the heat dissipation space, and reducing the heat energy leakage.

[0062] In addition, the arrangement of the supporting structure 80 at the bottom of the heat dissipation shell 20 not only enhances the mechanical stability of the entire device, but also optimizes the distribution and flow path of the internal air flow by adjusting the supporting height, promoting the improvement of the cooling effect.

[0063] Embodiment 2

[0064] The embodiments of the present application also provide an electronic device comprising the heat dissipation device, wherein the heat dissipation device is the heat dissipation device described above.

[0065] The above describes the heat dissipation device and the electronic equipment provided by the present application in detail. The principles and implementation manners of the present application are described by using specific examples in the present text, and the above description of the examples is only used to help understand the method of the present application and its core idea. It should be pointed out that, for those skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A heat dissipating device for dissipating heat from a heat generating component (10), characterized by, The heat dissipation device comprises: a heat dissipation shell (20), a bottom of the heat dissipation shell (20) is provided with an air inlet channel, a top of the heat dissipation shell (20) is provided with an air outlet channel (30), and the heat generating component (10) is arranged in the heat dissipation shell (20); an air inlet assembly (40) arranged in the air inlet channel, the air inlet assembly (40) comprising a first filter screen (401) and a flow guiding component (402), the flow guiding component (402) having flow guiding channels (4022) to guide the airflow in the air inlet channel into the heat dissipation shell (20) through the flow guiding channels (4022) to dissipate heat of the heat generating component (10); an air outlet assembly (50) arranged in the air outlet channel (30), the air outlet assembly (50) comprising a second filter screen (501) to guide the airflow after dissipating heat of the heat generating component (10) out of the heat dissipation shell (20); a liquid cooling structure (60) arranged in the heat dissipation shell (20), the liquid cooling structure (60) being located between the air inlet assembly (40) and the heat generating component (10) to liquid cool the heat generating component (10).

2. The heat dissipating device according to claim 1, wherein The air inlet assembly (40) further comprises an air inlet cover (403) provided with a plurality of air inlets (404), each of the air inlets (404) being in communication with the cavity of the heat dissipation shell (20).

3. The heat dissipating device according to claim 2, wherein The flow guiding component (402) comprises a flow guiding body (4021) detachably arranged between the air inlet channel, the flow guiding body (4021) being provided with a plurality of the flow guiding channels (4022), each of the flow guiding channels (4022) being arranged obliquely relative to the bottom of the heat dissipation shell (20), wherein the air inlet cover (403) and the first filter screen (401) are detachably arranged with the flow guiding body (4021); along the inflow direction of the airflow, the air inlet cover (403), the first filter screen (401) and the flow guiding component (402) are arranged in sequence.

4. The heat dissipating device of claim 1, wherein The air outlet assembly (50) further comprises an air outlet component (502) rotatably arranged in the air outlet channel (30) to guide the airflow after dissipating heat of the heat generating component (10) in the heat dissipation shell (20) out of the heat dissipation shell (20) through the air outlet component (502); wherein, along the outflow direction of the airflow, the air outlet component (502) and the second filter screen (501) are arranged in sequence.

5. The heat dissipating device of claim 1, wherein The liquid cooling structure (60) comprises a liquid cooling support (601), a liquid cooling tank (602) and a liquid cooling pipe (603); the liquid cooling tank (602) is arranged on one side of the liquid cooling support (601), the liquid cooling pipe (603) is arranged in the liquid cooling support (601), the inlet and outlet of the liquid cooling pipe (603) respectively extend from the liquid cooling support (601) and communicate with the liquid cooling tank (602), so that the heat generating component (10) is cooled by the liquid cooling structure (60).

6. The heat dissipating device according to claim 5, wherein The heat dissipation device further comprises a connecting structure (70) arranged between the heat generating component (10) and the liquid cooling support (601), the connecting structure (70) comprises a first connecting part (701) and a second connecting part (702), a heat dissipation space is formed between the first connecting part (701) and the second connecting part (702), the first connecting part (701) is arranged on the liquid cooling support (601), the second connecting part (702) is used for carrying the heat generating component (10), a first flow channel (604) in communication with the heat dissipation space is arranged on the liquid cooling support (601), so that the airflow cooled by the liquid cooling structure (60) is introduced into the heat dissipation space through the first flow channel (604), and the heat generating component (10) is cooled.

7. The heat dissipating device according to claim 6, wherein The connecting structure (70) further comprises a fixing part (703) arranged on the side of the second connecting part (702) away from the first connecting part (701), the heat generating component (10) is arranged on the fixing part (703), the connecting structure (70) further comprises a heat conduction part (704) arranged on the fixing part (703), at least part of the heat conduction part (704) is in contact with the heat generating component (10), a second flow channel (705) in communication with the heat dissipation space is arranged on the first connecting part (701), the outlet end of the second flow channel (705) corresponds to at least part of the heat conduction part (704), so that the airflow in the heat dissipation space is introduced into at least part of the heat conduction surface of the heat conduction part (704) through the second flow channel (705), and at least part of the heat on the heat conduction surface is taken away.

8. The heat dissipating device according to claim 7, wherein The heat conduction part (704) is a plurality of, the second flow channel (705) is a plurality of, each heat conduction part (704) and each second flow channel (705) are arranged one-to-one.

9. The heat dissipating device of claim 6, wherein, The connecting structure (70) further comprises a locking member (706), the locking member (706) comprises a first locking part (7061), a movable part is arranged on the first locking part (7061), a movable position is arranged on the second connecting part (702), the movable position movably cooperates with the movable part, a locking position is arranged on the first connecting part (701), at least part of the first locking part (7061) is locked with the locking position, so that the first connecting part (701) and the second connecting part (702) form the heat dissipation space through the locking member (706); and / or the heat dissipation device further comprises a supporting structure (80), the supporting structure (80) is arranged at the bottom of the heat dissipation shell (20) to support the heat dissipation shell (20).

10. An electronic device comprising a heat dissipating device, characterized in that The heat dissipation device is the heat dissipation device according to any one of claims 1 to 9.

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