Power module
By adjusting the X/Y distance ratio of the molding compound and increasing the X-direction distance of the molding compound, the problem of limited output current capability of power devices in a limited area of the power module is solved, enabling a greater number or larger size of power devices and a 20% increase in output current capability.
Patent Information
- Application Number
- CN202520108636.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-01-16
AI Technical Summary
Existing power modules have limited output current capability of power devices within a limited area, and there is a need to improve the output current capability of power devices.
By increasing the ratio of the X-direction distance to the Y-direction distance of the molding compound, making the X-direction distance of the molding compound 80%-140% of the Y-direction distance, the X-direction distance of the molding compound can be increased to accommodate more or larger power devices.
Within a limited power module area, the output current capability of power devices is increased by 20%, and the number or size of power devices is increased.
Smart Images
Figure CN223912874U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the packaging technical field especially relates to a power block and power module. BACKGROUND
[0002] With the progress of power electronics technology, power module develops rapidly, and the area of power module is restricted by the influence of the use environment, and the current output capacity of the power module is also limited. Therefore, it is necessary to solve how to improve the current output capacity of the power device in the power module under the limited area of the power module. SUMMARY
[0003] Therefore, the utility model discloses the purpose at to provide a kind of power module by increasing the ratio of X direction distance and Y direction distance of power module plastic package body, so that the power device of power module is more or the area of power device is larger, to improve the current output capacity of the power device in power module.
[0004] The utility model provides power module, power module includes:
[0005] Second substrate;
[0006] At least six power modules, the power module is located on the second substrate;
[0007] Further, power module, including:
[0008] First substrate;
[0009] At least one power device, power device is located on the first surface of first substrate;
[0010] Plastic package body, cladding first substrate and power device, plastic package body includes opposite first side and second side and opposite third side and fourth side, the first side and third side of plastic package body are perpendicular, the distance of third side to fourth side of plastic package body is plastic package body X direction distance, the distance of first side to second side of plastic package body is plastic package body Y direction distance;
[0011] First power end, from the first side of plastic package body, first power end is connected with power device in plastic package body electricity;
[0012] Second power end, from the second side of plastic package body, second power end is connected with power device in plastic package body electricity;And
[0013] Signal terminal, from the first side of plastic package body, signal terminal is connected with power device in plastic package body electricity;
[0014] Plastic package body X direction distance is 80%-140% of plastic package body Y direction distance.
[0015] Preferably, the plastic package X-direction distance is 80-110% of the plastic package Y-direction distance.
[0016] Preferably, the plastic package Y-direction distance is 25-31mm, and the plastic package X-direction distance is 22-28mm.
[0017] Preferably, the first substrate comprises a heat dissipation base plate, the heat dissipation base plate is exposed to the lower surface of the plastic package, the heat dissipation base plate comprises opposite fifth and sixth side edges and opposite seventh and eighth side edges, the fifth side edge of the heat dissipation base plate is perpendicular to the seventh side edge, the fifth side edge of the heat dissipation base plate is parallel to the first side edge of the plastic package, the distance between the seventh side edge and the eighth side edge of the heat dissipation base plate is the heat dissipation base plate X-direction distance, the distance between the fifth side edge and the sixth side edge of the heat dissipation base plate is the heat dissipation base plate length, and the heat dissipation base plate Y-direction distance is 90-150% of the heat dissipation base plate X-direction distance.
[0018] Preferably, the heat dissipation base plate Y-direction distance is 90-120% of the heat dissipation base plate X-direction distance.
[0019] Preferably, the heat dissipation base plate X-direction distance is 17-23mm, and the heat dissipation base plate X-direction distance is less than the plastic package X-direction distance.
[0020] Preferably, the number of power devices is 1, 2, 3, or 4.
[0021] Preferably, when the number of power devices is 1, the length of the power device is 13-20mm, and the width of the power device is 10-19mm.
[0022] Preferably, when the number of power devices is 4, the power device is a SiC MOS, and the surface size of the SiC MOS is at least one of 5mmx4mm, 5mmx5mm, and 5mmx6mm.
[0023] The utility model embodiment provides a plastic package of power module, and the first substrate and power device are covered, the plastic package comprises opposite first side edge and second side edge and opposite third side edge and fourth side edge, the first side edge of the plastic package and the third side edge are perpendicular, the distance between the third side edge and the fourth side edge of the plastic package is the plastic package X-direction distance, the distance between the first side edge and the second side edge of the plastic package is the plastic package Y-direction distance, the plastic package X-direction distance is 80-140% of the plastic package Y-direction distance,
[0024] The power module in the limited size of the power module improves the ability of the power device output current in the power module. Especially, under the premise of the distance of the power module plastic package Y direction unchanged, the distance of the plastic package X direction is increased, so that the power device in the power module is more or the size of the power device is larger, thereby improving the ability of the power device output current in the power module, compared with the traditional technology, the power device output current in the power module is improved by 20%. BRIEF DESCRIPTION OF DRAWINGS
[0025] The above and other objects, features and advantages of the present application will become more apparent from the following description of embodiments of the present application taken in conjunction with the accompanying drawings, in which:
[0026] Figure 1 is a schematic diagram of the power module provided by the embodiment of the present application;
[0027] Figure 2 is a schematic diagram of the power module provided by the embodiment of the present application;
[0028] 21-first power terminal; 22-second power terminal, 23-signal terminal; 24-plastic package; 25-first substrate (including heat dissipation bottom plate); 26-power device; 27-sintered material
[0029] Figure 3 is a schematic diagram of the power device in the power module provided by the embodiment of the present application DETAILED DESCRIPTION
[0030] The present application is described below based on the embodiments, but the present application is not limited to only these embodiments. In the following detailed description of the present application, some specific details are described in detail. The present application can also be completely understood without the description of these details by those skilled in the art. In order to avoid confusion of the essence of the present application, the well-known methods, processes, flows, elements and circuits are not described in detail.
[0031] In addition, those skilled in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.
[0032] Unless otherwise clearly defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be broadly understood, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0033] For ease of description, spatially relative terms, such as "inner," "outer," "beneath," "below," "lower," "above," "upper," and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device is inverted or rotated by 90 degrees, an element described as "below" or "beneath" another element or feature would then be oriented "above" the other element or feature. Thus, the example term "below" can encompass both an orientation of above and below. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0034] Unless otherwise defined, all terms used in describing the application, including technical terms, should be interpreted as is customary in the art. Unless otherwise required by context, it will be understood that when a term is used in this specification (including the claims) that term is also intended to encompass the same meaning throughout the specification (including the claims) and the terms "comprising," "comprises" and "comprised of" as used herein are used in the inclusive, open sense and not the exclusive or closed sense.
[0035] In the description of the present application, it should be understood that the terms "first", "second" and the like are used only for the purpose of description, and cannot be understood as indicating or implying relative importance. In addition, in the description of the present application, the meaning of "multiple" is two or more, unless otherwise specified.
[0036] Figure 1 is a schematic diagram of the power module provided by the embodiment of the present application
[0037] Figure 2 is a three-dimensional schematic diagram of the power module provided by the embodiment of the present application
[0038] Figure 3 is a schematic diagram of the power device in the power module provided by the embodiment of the present application
[0039] The embodiment of the present application further provides a power module, referring to Figure 1 、 Figure 2 The power module of the present application, the power module, comprising:
[0040] The first substrate 25, referring to Figure 3 as shown;
[0041] At least one power device 26, referring to Figure 3 as shown, the power device 26 is located on the first surface of the first substrate 25;
[0042] The plastic package 24 covers the first substrate 25 and the power device 26, and includes opposite first and second side edges and opposite third and fourth side edges. The first and third side edges of the plastic package 24 are perpendicular to each other. The distance between the third and fourth side edges of the plastic package 24 is the X-direction distance of the plastic package 24. The distance between the first and second side edges of the plastic package 24 is the Y-direction distance of the plastic package 24.
[0043] The first power terminal 21 extends from the first side edge of the plastic package 24 and is electrically connected to the power device 26 in the plastic package 24.
[0044] The second power terminal 22 extends from the second side edge of the plastic package 24 and is electrically connected to the power device 26 in the plastic package 24.
[0045] The signal terminal 23 extends from the first side edge of the plastic package 24 and is electrically connected to the power device 26 in the plastic package 24.
[0046] The X-direction distance of the plastic package 24 is 80%-140% of the Y-direction distance of the plastic package 24.
[0047] The X-direction distance of the plastic package 24 is 80%-110% of the Y-direction distance of the plastic package 24.
[0048] The Y-direction distance of the plastic package 24 is 25mm-31mm, and the X-direction distance of the plastic package 24 is 22mm-28mm.
[0049] The first substrate 25 includes a heat dissipation bottom plate, which is exposed to the lower surface of the plastic package 24. The heat dissipation bottom plate includes opposite fifth and sixth side edges and opposite seventh and eighth side edges. The fifth and seventh side edges of the heat dissipation bottom plate are perpendicular to each other. The fifth side edge of the heat dissipation bottom plate is parallel to the first side edge of the plastic package 24. The distance between the seventh and eighth side edges of the heat dissipation bottom plate is the X-direction distance of the heat dissipation bottom plate. The distance between the fifth and sixth side edges of the heat dissipation bottom plate is the length of the heat dissipation bottom plate, which is the Y-direction distance of the heat dissipation bottom plate. The Y-direction distance of the heat dissipation bottom plate is 90%-150% of the X-direction distance of the heat dissipation bottom plate.
[0050] The Y-direction distance of the heat dissipation bottom plate is 90%-120% of the X-direction distance of the heat dissipation bottom plate.
[0051] The X-direction distance of the heat dissipation bottom plate is 17mm-23mm, and the X-direction distance of the heat dissipation bottom plate is smaller than the X-direction distance of the plastic package 24.
[0052] The number of the power device 26 is one, two, three or four.
[0053] The power device 26 has a length of 13mm-20mm and a width of 10mm-19mm when the number of power devices 26 is 1.
[0054] The distance of the plastic package of the conventional power module in the X direction is 18.9mm, the distance of the plastic package of the conventional power module in the Y direction is 28mm, and the distance of the plastic package of the conventional power module in the X direction is 67.5% of the distance of the plastic package in the Y direction. The distance of the plastic package of the power module in the X direction is 80%-140% of the distance of the plastic package in the Y direction, which is much larger than that of the conventional power module. The power device of the plastic package of the power module can be more or the size of the power device can be larger. For example, when the number of power devices is 1, the length of the power device is 13mm-20mm and the width is 10-19mm, and the width of the power device of the conventional power module can only be less than 14mm. When the number of power devices is 4, the power device is SiC MOS, and the surface size of the SiC is at least one of 5mmx4mm, 5mmx5mm and 5mmx6mm, and the surface size of the power device of the conventional power module cannot be 5mmx6mm.
[0055] The utility model discloses an embodiment of a kind of power module, the plastic package of power module, cladding first substrate and power device, plastic package includes opposite first side and second side and opposite third side and fourth side, the first side and third side of plastic package are perpendicular, the distance of third side to fourth side of plastic package is plastic package X direction distance, the distance of first side to second side of plastic package is plastic package Y direction distance, plastic package X direction distance is 80%-140% of plastic package Y direction distance,
[0056] The power device output current capacity in the power module is improved under the limited size of the power module. Especially, under the premise that the plastic package Y direction distance of the power module is unchanged, the plastic package X direction distance is increased, so that the power device in the power module is more or the size of the power device is larger, thereby improving the power device output current capacity in the power module. Compared with the conventional technology, the power device output current capacity in the power module is improved by 20%.
[0057] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A power module, characterized by Comprising: a first substrate; at least one power device, the power device being located on a first surface of the first substrate; a plastic package, covering the first substrate and the power device, the plastic package comprising opposite first and second side edges and opposite third and fourth side edges, the first side edge and the third side edge of the plastic package being perpendicular, a distance between the third side edge and the fourth side edge of the plastic package being a plastic package X-direction distance, a distance between the first side edge and the second side edge of the plastic package being a plastic package Y-direction distance; a first power terminal, extending from the first side edge of the plastic package, the first power terminal being electrically connected to the power device in the plastic package; a second power terminal, extending from the second side edge of the plastic package, the second power terminal being electrically connected to the power device in the plastic package; and a signal terminal, extending from the first side edge of the plastic package, the signal terminal being electrically connected to the power device in the plastic package; the plastic package X-direction distance being 80%-140% of the plastic package Y-direction distance. the plastic package X-direction distance being 80%-110% of the plastic package Y-direction distance.
2. The power module of claim 1, wherein, the plastic package Y-direction distance being 25mm-31mm, and the plastic package X-direction distance being 22mm-28mm.
3. The power module according to claim 1 or 2, characterized in that the first substrate comprising a heat dissipation base plate, the heat dissipation base plate being exposed on a lower surface of the plastic package, the heat dissipation base plate comprising opposite fifth and sixth side edges and opposite seventh and eighth side edges, the fifth side edge and the seventh side edge of the heat dissipation base plate being perpendicular, the fifth side edge of the heat dissipation base plate being parallel to the first side edge of the plastic package, a distance between the seventh side edge and the eighth side edge of the heat dissipation base plate being a heat dissipation base plate X-direction distance, a distance between the fifth side edge and the sixth side edge of the heat dissipation base plate being a heat dissipation base plate length, a heat dissipation base plate Y-direction distance being 90%-150% of the heat dissipation base plate X-direction distance.
4. The power module of claim 1, wherein, the heat dissipation base plate Y-direction distance being 90%-120% of the heat dissipation base plate X-direction distance.
5. The power module according to claim 1 or 2, characterized in that the heat dissipation base plate X-direction distance being 17mm-23mm, and the heat dissipation base plate X-direction distance being smaller than the plastic package X-direction distance.
6. The power module of claim 5, wherein, the number of the power devices being 1, 2, 3 or 4.
7. The power module of claim 1, wherein, when the number of the power devices is 1, a length of the power device being 13mm-20mm, and a width of the power device being 10mm-19mm.
8. The power module of claim 1, wherein, when the number of the power devices is 4, the power device being a SiC MOS, and a surface size of the SiC MOS being at least one of 5mmx4mm, 5mmx5mm or 5mmx6mm.
9. The power module of claim 1, wherein,