Robot automatic feeder for semiconductor module conveying

Abstract

The utility model discloses a robot automatic feeder for conveying semiconductor modules, and belongs to the technical field of automatic feeders. Comprising a conveyor and a supporting frame, the supporting frame is arranged outside the conveyor, a supporting frame is arranged outside the supporting frame, a first feeding machine is arranged outside the supporting frame, a mechanical arm is arranged outside the first feeding machine, and a second feeding machine is arranged outside the mechanical arm; a longitudinal lead screw moving assembly is arranged outside the second feeding machine. According to the utility model, the automatic feeder can conveniently detect and distinguish multiple positions of the semiconductor module, the accuracy of identifying the quality of the semiconductor module is increased, the efficiency of distinguishing the quality of the semiconductor module by the automatic feeder is improved, the quality of the semiconductor module can be conveniently classified and conveyed, and the production efficiency is improved. And the convenience of classifying and conveying the semiconductor modules by the automatic feeder is improved.

Description

Technical Field

[0001] This utility model relates to the field of automatic feeding machine technology, specifically to a robotic automatic feeding machine for semiconductor module conveying. Background Technology

[0002] Improving production efficiency is one of the main advantages of robotic automatic feeders. Through automated handling and transmission, robots can work 24 hours a day without interruption, significantly improving the operating efficiency of the production line. For example, mobile collaborative robots can transfer wafer boxes between various devices, avoiding the tedious and time-consuming manual handling, further improving production cycle and equipment utilization. Reducing labor costs is another significant benefit. Using robots to replace manual operations can reduce the demand for human labor, thereby reducing the company's labor costs. In addition, robots can perform high-intensity, repetitive work, avoiding the decline in production efficiency caused by fatigue.

[0003] For example, the fully automatic feeding mechanism for semiconductor packaging disclosed in the authorization announcement number CN220627767U includes a feeding mechanism body, two limiting plates are symmetrically fixedly installed inside the feeding mechanism body, a guide plate is fixedly installed at one end of the limiting plate, a sliding groove is opened on the outer wall of the guide plate, and an extension plate is slidably connected inside the sliding groove.

[0004] Although it achieves the goal of adjusting the distance between the two limit plates by controlling the lead screw through the drive motor to push the support arm, thereby improving the feeding efficiency, during use, when the distance between the limit plates is reduced, the material on the feeding device will be conveyed from the back of the limit plate to the other end, failing to play the role of limiting the material.

[0005] However, this does not solve the problem that existing automatic feeders of this type are generally not conducive to convenient multi-position detection and differentiation of semiconductor modules, affecting the accuracy of semiconductor module quality identification, the efficiency of automatic feeder in differentiating semiconductor module quality, and the convenience of automatic feeder in classifying and transporting semiconductor modules. Utility Model Content

[0006] The purpose of this utility model is to provide a robotic automatic feeder for semiconductor module conveying, so as to solve the problems mentioned in the background art, which are that the automatic feeder is not convenient for the automatic feeder to detect and distinguish multiple positions of semiconductor modules, which affects the accuracy of semiconductor module quality identification, the efficiency of the automatic feeder in distinguishing semiconductor module quality, and the convenience of automatic feeder in classifying and conveying semiconductor modules.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0008] An automated robotic feeder for semiconductor module conveying includes a conveyor and a support frame. The support frame is externally mounted on the conveyor, and a support frame is externally mounted on the support frame. A first feeder is externally mounted on the support frame, a robotic arm is externally mounted on the first feeder, a second feeder is externally mounted on the robotic arm, a longitudinal lead screw moving assembly is externally mounted on the second feeder, and a rotary disk is externally mounted on the longitudinal lead screw moving assembly. A fixed frame is mounted on the top side wall of the support frame, a movable bracket is mounted on the side wall of the fixed frame, and a servo motor is mounted on the side wall of the movable bracket.

[0009] Optionally, the output end of the servo motor is equipped with a threaded rod, which extends into the interior of the movable bracket and is movably connected thereto, and a threaded block is fitted on the surface of the threaded rod.

[0010] Optionally, an L-shaped frame is installed on the side wall of the threaded block, a first cylinder is installed at the top of the L-shaped frame, the output end of the first cylinder extends through the L-shaped frame to its outside, a connecting plate is installed at the output end of the first cylinder, a dual-shaft cylinder is installed at the bottom end of the connecting plate, and a support plate is installed at the output end of each dual-shaft cylinder.

[0011] Optionally, each of the support plates is equipped with a stepper motor on its sidewall, and each stepper motor has a rotating shaft installed at its output end.

[0012] Optionally, all the rotating shafts extend through the support plate to its outside, and a clamping plate is installed at the end of each rotating shaft away from the stepper motor.

[0013] Optionally, a rotating shaft is installed at the center of the bottom end of the rotating disk, and the rotating shaft extends to the top of the support frame and is movably connected thereto.

[0014] Optionally, a worm gear is fitted onto the surface of the rotating shaft, and a power motor is mounted on the top of the external support frame of the rotating shaft.

[0015] Optionally, a worm gear is installed at the output end of the power motor, and the worm gear meshes with a worm wheel.

[0016] Optionally, the top of the rotary disk is provided with six sets of equally spaced grooves, and a detection device is installed on the side wall of the longitudinal lead screw moving assembly.

[0017] Optionally, a control panel is installed on the top of the support frame away from the fixed frame. The output end of the control panel is electrically connected to the input end of the conveyor, the first feeder, the second feeder, the robot, the longitudinal lead screw moving assembly, the servo motor, the first cylinder, the dual-axis cylinder, the stepper motor, the power motor, and the detection device.

[0018] Compared with the prior art, the beneficial effects of this utility model are: the automatic feeder not only realizes the convenient detection and differentiation of semiconductor modules at multiple positions, increases the accuracy of semiconductor module quality identification, and improves the efficiency of the automatic feeder in differentiating semiconductor module quality, but also facilitates the classification and transportation of semiconductor modules by quality, thus improving the convenience of the automatic feeder in classifying and transporting semiconductor modules.

[0019] The semiconductor module is placed on the surface of the conveyor, which transports it to the working area. A dual-axis cylinder drives the support plate to move in opposite directions. The first cylinder drives the connecting plate, dual-axis cylinder, support plate, stepper motor, rotating shaft, and clamping plate to move downwards to the surface of the semiconductor module. The dual-axis cylinder is then reversed, causing the clamping plates to move in opposite directions to clamp the semiconductor module. A servo motor drives the threaded rod to rotate, which in turn moves the threaded block. The threaded block then moves the L-shaped frame, the first cylinder, connecting plate, dual-axis cylinder, support plate, stepper motor, rotating shaft, clamping plate, and semiconductor module into the groove. The semiconductor module is placed on the surface and inspected by the detection device. Then, it rotates to the bottom of the clamping plate, where the clamping plate picks it up. The stepper motor drives the rotating shaft to rotate, which in turn rotates the clamping plate and the semiconductor module to the required angle, placing them inside the groove. This allows the detection device to inspect and distinguish the quality of the semiconductor module from the other side, facilitating convenient inspection of the semiconductor module. This enables the automatic feeder to conveniently inspect and distinguish the semiconductor module at multiple locations, increasing the accuracy of semiconductor module quality identification and improving the efficiency of the automatic feeder in distinguishing semiconductor module quality.

[0020] When it is necessary to classify and transport the sorted semiconductor modules, the detection device transmits the classification results to the control panel for display. The power motor drives the worm gear to rotate, which in turn drives the worm wheel to rotate. The worm wheel then drives the rotating shaft, rotating disk, groove, and semiconductor module to rotate to a certain position for transport. The control panel is used to activate the robotic arm, placing good semiconductor modules on the surface of the second feeder for transport and placing defective semiconductor modules on the surface of the first feeder for transport. This facilitates convenient and efficient classification and transport of semiconductor modules based on their quality, realizing the convenient and efficient classification and transport of semiconductor modules by the automatic feeder and improving the convenience of the automatic feeder for semiconductor module classification and transport. Attached Figure Description

[0021] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present invention and, together with the specification, further serve to explain the principles of the present invention and enable those skilled in the art to implement and use the present invention.

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a front view structural diagram of the present utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the conveyor of this utility model;

[0025] Figure 4 This is a three-dimensional structural diagram of the L-shaped frame of this utility model;

[0026] Figure 5 This is a front view structural diagram of the support frame of this utility model;

[0027] Figure 6 This is a three-dimensional structural diagram of the rotating disk of this utility model;

[0028] Figure 7 This is a three-dimensional structural diagram of the robotic arm of this utility model.

[0029] Figure label:

[0030] 1. Conveyor; 2. First feeder; 3. Second feeder; 4. Robotic arm; 5. Support frame; 6. Support frame; 7. Longitudinal screw moving assembly; 8. Fixed frame; 9. Moving bracket; 10. Rotary disk; 11. Servo motor; 12. Threaded rod; 13. Threaded block; 14. Control panel; 15. L-shaped frame; 16. First cylinder; 17. Dual-axis cylinder; 18. Support plate; 19. Stepper motor; 20. Rotating shaft; 21. Clamping plate; 22. Power motor; 23. Worm gear; 24. Worm wheel; 25. Detection device; 26. Groove; 27. Rotating shaft; 28. Connecting plate.

[0031] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiment of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0032] The present invention provides a robotic automatic feeder for semiconductor module conveying, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments; those skilled in the art can also use other alternative methods to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0033] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0034] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0035] It is understood that the meanings of “on”, “above”, and “above” in this utility model should be interpreted in the broadest manner, such that “on” not only means “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” not only means “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0036] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0037] like Figures 1 to 7As shown, an embodiment of this utility model provides a robotic automatic feeder for semiconductor module conveying, including a conveyor 1 and a support frame 5. The support frame 5 is disposed outside the conveyor 1, and a support frame 6 is disposed outside the support frame 5. A first feeder 2 is disposed outside the support frame 6, a robotic arm 4 is disposed outside the first feeder 2, a second feeder 3 is disposed outside the robotic arm 4, a longitudinal lead screw moving assembly 7 is disposed outside the second feeder 3, and a rotary disk 10 is disposed outside the longitudinal lead screw moving assembly 7. A fixed frame 8 is installed on the top side wall of the support frame 5, and a [missing information - likely a component or component] is installed on the side wall of the fixed frame 8. A movable support 9 has a servo motor 11 mounted on its side wall. A threaded rod 12 is mounted on the output end of the servo motor 11. The threaded rod 12 extends into the interior of the movable support 9 and is movably connected thereto. A threaded block 13 is fitted onto the surface of the threaded rod 12. An L-shaped frame 15 is mounted on the side wall of the threaded block 13. A first cylinder 16 is mounted on the top of the L-shaped frame 15. The output end of the first cylinder 16 extends through the L-shaped frame 15 to its exterior. A connecting plate 28 is mounted on the output end of the first cylinder 16. A dual-axis cylinder 17 is mounted on the bottom end of the connecting plate 28. A support plate 18 is mounted on the output end of each dual-axis cylinder 17.

[0038] Stepper motors 19 are installed on the side walls of the support plate 18, and a rotating shaft 20 is installed on the output end of each stepper motor 19.

[0039] All rotating shafts 20 extend through the support plate 18 to its outside, and a clamping plate 21 is installed on the end of each rotating shaft 20 away from the stepper motor 19.

[0040] When using the robotic automatic feeder for semiconductor module conveying, the semiconductor module is placed on the surface of conveyor 1. The control panel 14 is used to turn on conveyor 1, which then transports the semiconductor module to the working area. The dual-axis cylinder 17 is activated, and with the support of the connecting plate 28, it drives the support plate 18 to move in the opposite direction. The first cylinder 16 is activated, and with the support of the L-shaped frame 15, it drives the connecting plate 28, dual-axis cylinder 17, support plate 18, stepper motor 19, rotating shaft 20, and clamping plate 21 to move downwards to the surface of the semiconductor module. The dual-axis cylinder 17 is then activated in the opposite direction, causing the clamping plate 21 to move in the opposite direction to clamp the semiconductor module. The servo motor 11 is activated, and with the support of the moving bracket 9, it drives the threaded rod 12 to rotate. With the threaded connection between the threaded rod 12 and the threaded block 13, the threaded rod 12 drives the threaded block 13 to move, and the threaded block 13 drives... The L-shaped frame 15, the first cylinder 16, the connecting plate 28, the dual-axis cylinder 17, the support plate 18, the stepper motor 19, the rotating shaft 20, the clamping plate 21, and the semiconductor module are moved to the surface of the groove 26 for placement. After being inspected by the detection device 25, the module continues to rotate to the underside of the clamping plate 21, causing the clamping plate 21 to clamp it out. Multiple sets of stepper motors 19 are activated, and under the support of the support plate 18, the stepper motors 19 drive the rotating shaft 20 to rotate. The rotating shaft 20 drives the clamping plate 21 and the semiconductor module to rotate to the required angle and place them inside the groove 26. This allows the detection device 25 to inspect and distinguish the quality of the semiconductor module from the other side, facilitating convenient inspection of the semiconductor module. This enables the automatic feeder to conveniently inspect and distinguish the semiconductor module at multiple positions, increasing the accuracy of semiconductor module quality identification and improving the efficiency of the automatic feeder in distinguishing semiconductor module quality.

[0041] A rotating shaft 27 is installed at the center of the bottom end of the rotating disk 10, and the rotating shaft 27 extends to the top of the support frame 6 and is movably connected thereto.

[0042] A worm gear 24 is fitted on the surface of the rotating shaft 27. A power motor 22 is installed at the top of the external support frame 6 of the rotating shaft 27. A worm 23 is installed at the output end of the power motor 22. The worm 23 meshes with the worm gear 24.

[0043] The top of the rotating disk 10 is provided with six equally spaced grooves 26, and a detection device 25 is installed on the side wall of the longitudinal lead screw moving assembly 7.

[0044] A control panel 14 is installed on the top of the support frame 5 away from the fixed frame 8. The output end of the control panel 14 is electrically connected to the input end of the conveyor 1, the first feeder 2, the second feeder 3, the robot arm 4, the longitudinal screw moving assembly 7, the servo motor 11, the first cylinder 16, the dual-axis cylinder 17, the stepper motor 19, the power motor 22, and the detection device 25.

[0045] When it is necessary to classify and transport the sorted semiconductor modules, the detection device 25 transmits the sorting results to the control panel 14 for display. The control panel 14 is operated to turn on the power motor 22. Under the support of the support frame 6, the power motor 22 drives the worm gear 23 to rotate. Under the meshing of the worm gear 23 and the worm wheel 24, the worm gear 23 drives the worm wheel 24 to rotate. The worm wheel 24 drives the rotating shaft 27, the rotating disk 10, the groove 26, and the semiconductor module to rotate to a certain position for transport. The control panel 14 is operated to turn on the robot arm 4, placing the good semiconductor modules on the surface of the second feeder 3 for transport and placing the defective semiconductor modules on the surface of the first feeder 2 for transport. This facilitates the convenient classification and transport of semiconductor modules by quality, realizing the convenient classification and transport of semiconductor modules by the automatic feeder and improving the convenience of the automatic feeder for classifying and transporting semiconductor modules.

[0046] The working principle of the technical solution provided by this utility model is as follows: A semiconductor module is placed on the surface of a conveyor 1. The conveyor 1 transports the semiconductor module to the working area. A dual-axis cylinder 17 drives a support plate 18 to move in the opposite direction, opening the first cylinder 16. Under the support of an L-shaped frame 15, the first cylinder 16 drives a connecting plate 28, a dual-axis cylinder 17, a support plate 18, a stepper motor 19, a rotating shaft 20, and a clamping plate 21 to move downwards to the surface of the semiconductor module. The dual-axis cylinder 17 is then opened in the opposite direction, causing the clamping plate 21 to move in the opposite direction and clamp the semiconductor module. A servo motor 11 drives a threaded rod 12 to rotate, which in turn drives a threaded block 13 to move. The threaded block 13 then drives the L-shaped frame 15, the first cylinder 16, the connecting plate 28, the dual-axis cylinder 17, the support plate 18, the stepper motor 19, the rotating shaft 20, the clamping plate 21, and the semiconductor module to move to the surface of a groove 26 for placement. After detection by a detection device 25, the module continues to rotate to the underside of the clamping plate 21, causing the clamping plate 21 to... The semiconductor module is clamped out, and the stepper motor 19 drives the rotating shaft 20 to rotate. The rotating shaft 20 drives the clamping plate 21 and the semiconductor module to rotate to the required angle and place them inside the groove 26. This allows the detection device 25 to detect and distinguish the quality of the semiconductor module from the other side, facilitating convenient detection of the semiconductor module. When it is necessary to classify and transport the classified semiconductor modules, the detection device 25 transmits the classification results to the control panel 14 for display. The power motor 22 drives the worm gear 23 to rotate, and the worm gear 23 drives the worm wheel 24 to rotate. The worm wheel 24 drives the rotating shaft 27, the rotating disk 10, the groove 26, and the semiconductor module to rotate to a certain position for transport. The control panel 14 is used to open the robot arm 4, placing the good semiconductor module on the surface of the second feeder 3 for transport and the defective semiconductor module on the surface of the first feeder 2 for transport. This facilitates convenient classification and transport of the semiconductor modules based on their quality, thus completing the operation of the automatic feeder.

[0047] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0048] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A robotic automatic feeder for semiconductor module conveying, characterized in that: Including conveyor and support frame, the outside of the conveyor is provided with the support frame, the outside of the support frame is provided with the support frame, the outside of the support frame is provided with the first feeder, the outside of the first feeder is provided with the mechanical arm, the outside of the mechanical arm is provided with the second feeder, the outside of the second feeder is provided with the longitudinal screw rod moving assembly, the outside of the longitudinal screw rod moving assembly is provided with the rotary disc, the top end side wall of the support frame is provided with the fixed frame, the side wall of the fixed frame is provided with the moving support, the side wall of the moving support is provided with the servo motor.

2. The semiconductor module conveying robot automatic feeder according to claim 1, characterized by: The output end of the servo motor is provided with a threaded rod, the threaded rod extends to the inside of the moving support and is movably connected thereto, and the surface of the threaded rod is provided with a threaded block.

3. The semiconductor module conveying robot automatic feeder according to claim 2, characterized by: The side wall of the threaded block is provided with an L-shaped frame, the top end of the L-shaped frame is provided with a first air cylinder, the output end of the first air cylinder extends to the outside of the L-shaped frame, the output end of the first air cylinder is provided with a connecting plate, the bottom end of the connecting plate is provided with a double-shaft air cylinder, and the output ends of the double-shaft air cylinder are provided with support plates.

4. The semiconductor module conveying robot automatic feeder according to claim 3, characterized by: The side wall of the support plate is provided with a stepping motor, and the output end of the stepping motor is provided with a rotating shaft.

5. The semiconductor module conveying robot automatic feeder according to claim 4, characterized by: The rotating shaft extends to the outside of the support plate, and the end of the rotating shaft away from the stepping motor is provided with a clamping plate.

6. The semiconductor module conveying robot automatic feeder according to claim 5, characterized by: The bottom end of the rotary disc is provided with a rotating shaft, and the rotating shaft extends to the top end of the support frame and is movably connected thereto.

7. The semiconductor module conveying robot automatic feeder according to claim 6, characterized by: The surface of the rotating shaft is provided with a worm gear, and the top end of the support frame outside the rotating shaft is provided with a power motor.

8. The semiconductor module conveying robot automatic feeder according to claim 7, characterized by: The output end of the power motor is provided with a worm gear, and the worm gear is engaged with the worm gear.

9. The semiconductor module conveying robot automatic feeder according to claim 8, characterized by: The top end of the rotary disc is provided with six groups of grooves at equal intervals, and the side wall of the longitudinal screw rod moving assembly is provided with a detection device.

10. The semiconductor module conveying robot automatic feeder according to claim 9, characterized by: The top end of the support frame is provided with a control panel away from the fixed frame, and the output end of the control panel is electrically connected with the input end of the conveyor, the first feeder, the second feeder, the mechanical arm, the longitudinal screw rod moving assembly, the servo motor, the first air cylinder, the double-shaft air cylinder, the stepping motor, the power motor and the detection device.

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