Driving circuit board with good heat dissipation effect

Abstract

The utility model discloses a drive circuit board with a good heat dissipation effect, which relates to the technical field of LED circuit boards, and is characterized in that the drive circuit board comprises a metal substrate and a plurality of LED lamp beads, the top surface of the metal substrate is sequentially provided with an insulating layer, a circuit layer and a heat conduction enhancement layer, the heat conduction enhancement layer covers the circuit layer and forms a welding connection part, and the LED lamp beads are arranged on the metal substrate. A plurality of heat conduction plates are arranged on the insulating layer, and the LED lamp beads are located on the heat conduction plates and connected with the two adjacent welding connecting parts. According to the high-power LED module, through the collaborative design of the metal substrate, the heat conduction enhancement layer and the first honeycomb-shaped heat dissipation holes and the cooperation of the heat dissipation fins, convection heat dissipation is enhanced, the heat dissipation bottleneck of the high-power LED module is solved, the structure does not need to be externally connected with a radiator, and the high-power LED module has the advantages of being low in cost, long in service life and wide in application range.

Description

Technical Field

[0001] This utility model relates to the field of LED circuit board technology, and more specifically, to a driver circuit board with good heat dissipation. Background Technology

[0002] An LED light is an electroluminescent semiconductor chip. Its internal driver circuit board is used to provide a stable and reliable output voltage and can adjust the output current according to the load size, thereby protecting the LED light from burning out due to high current.

[0003] In the existing technology, due to the high density of electronic components on the driver circuit board inside the LED lamp, and the large amount of heat generated during its operation, the temperature of the driver circuit board will rise rapidly. Especially when the LED lamp is used continuously for a long time, poor heat dissipation will lead to a decrease in the luminous efficiency and lifespan of the LED chip, which will be severely reduced.

[0004] Therefore, a driver circuit board with good heat dissipation is needed to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a driver circuit board with good heat dissipation to solve the problems mentioned in the background art.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0007] A driver circuit board with good heat dissipation includes a metal substrate and a plurality of LED beads. An insulating layer, a circuit layer and a thermally conductive enhancement layer are sequentially disposed on the top surface of the metal substrate. The thermally conductive enhancement layer covers the circuit layer and forms a solder joint. A plurality of heat-conducting plates are disposed on the insulating layer. The LED beads are located on the heat-conducting plates and connected to two adjacent solder joints.

[0008] The technical solution of this utility model is further configured as follows: a plurality of heat dissipation holes are formed on the metal substrate, the heat dissipation holes penetrate the metal substrate and the insulating layer, and the plurality of heat dissipation holes are located below the heat-conducting plate and are distributed in a honeycomb pattern.

[0009] The technical solution of this utility model is further configured such that: a transition layer is provided on the side of the heat-conducting plate facing the LED lamp bead, and the transition layer is composed of thermally conductive silicone grease or a metal oxide composite coating.

[0010] The technical solution of this utility model is further configured as follows: a heat sink is detachably connected to the metal substrate, the bottom surface of the heat sink abuts against the surface of the thermally conductive enhancement layer, the heat sink is provided with receiving holes for accommodating the LED beads and the welding connection part, and a plurality of heat dissipation fins arranged in an array are fixedly connected to the top surface of the heat sink.

[0011] The technical solution of this utility model is further configured such that: the cross-section of the heat dissipation fins is wavy, and the height of the heat dissipation fins is lower than the height of the LED beads.

[0012] The technical solution of this utility model is further configured as follows: a plurality of heat dissipation holes are provided on the metal substrate, the heat dissipation holes penetrate the metal substrate and the insulating layer and are alternately arranged with the LED beads, and the inner wall of the heat dissipation holes is plated with a heat dissipation copper layer.

[0013] The technical solution of this utility model is further configured such that the heat dissipation copper layer abuts against the heat dissipation plate.

[0014] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0015] The heat dissipation effect of the circuit layer is enhanced by the metal substrate and thermally conductive reinforcement layer, so that the dissipated heat can diffuse along the metal substrate to the bottom surface or along the thermally conductive reinforcement layer to the top, thereby enhancing the overall heat dissipation effect. Furthermore, the heat dissipation effect of the LED beads is enhanced by the heat-conducting plate, heat dissipation hole one, and transition layer, so as to minimize the heat generation temperature of the LED beads. The honeycomb layout can increase the heat dissipation area of ​​heat dissipation hole one, further improving the heat dissipation effect. The heat dissipation plate that is against the thermally conductive reinforcement layer can optimize the airflow path with heat dissipation fins, allowing the heat dissipated by the circuit layer to be dissipated into the air more quickly. This driver circuit board has an integrated structure and does not require additional heat dissipation accessories, making it suitable for high-power LED lighting scenarios. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0018] Figure 3 This is a schematic diagram of the structure of the present invention with the heat sink concealed.

[0019] Figure 4 for Figure 3 Enlarged view of point B in the middle.

[0020] In the diagram: 1. Metal substrate; 2. LED beads; 3. Insulating layer; 4. Thermally conductive enhancement layer; 5. Welded connection; 6. Heat-conducting plate; 7. Heat dissipation hole one; 8. Transition layer; 9. Heat dissipation plate; 10. Receiving hole; 11. Heat dissipation fins; 12. Heat dissipation hole two; 13. Copper heat dissipation layer. Detailed Implementation

[0021] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model. Example

[0022] refer to Figures 1 to 4 As shown, this utility model provides a driver circuit board with good heat dissipation effect, including a metal substrate 1 and a number of LED beads 2. An insulating layer 3, a circuit layer and a thermally conductive enhancement layer 4 are sequentially provided on the top surface of the metal substrate 1. The thermally conductive enhancement layer 4 covers the circuit layer and forms a welding connection part 5. A number of heat-conducting plates 6 are provided on the insulating layer 3. The LED beads 2 are located on the heat-conducting plates 6 and connected to two adjacent welding connection parts 5.

[0023] refer to Figures 1 to 4 As shown, a plurality of heat dissipation holes 7 are provided on the metal substrate 1. The heat dissipation holes 7 penetrate the metal substrate 1 and the insulating layer 3. The plurality of heat dissipation holes 7 are located below the heat-conducting plate 6 and are distributed in a honeycomb pattern. A transition layer 8 is provided on the side of the heat-conducting plate 6 facing the LED bead 2. The transition layer 8 is composed of thermally conductive silicone grease or a metal oxide composite coating.

[0024] refer to Figures 1 to 4 As shown, a heat sink 9 is detachably connected to the metal substrate 1. The bottom surface of the heat sink 9 abuts against the surface of the thermally conductive enhancement layer 4. The heat sink 9 has receiving holes 10 for accommodating LED beads 2 and welding connection parts 5. Several heat dissipation fins 11 arranged in an array are fixedly connected to the top surface of the heat sink 9. The cross-section of the heat dissipation fins 11 is wavy, which can further increase the heat dissipation area of ​​the heat dissipation fins 11. The height of the heat dissipation fins 11 is lower than the height of the LED beads 2, so as to avoid the heat dissipation fins 11 affecting the illumination effect of the LED beads 2. Several heat dissipation holes 12 are provided on the metal substrate 1. The heat dissipation holes 12 penetrate the metal substrate 1 and the insulating layer 3 and are alternately arranged with the LED beads 2. The inner wall of the heat dissipation holes 12 is plated with a heat dissipation copper layer 13. The heat dissipation copper layer 13 abuts against the heat sink 9, so that the heat on the metal substrate 1 can also be dissipated along the heat sink 9 and the heat dissipation fins 11 through the heat dissipation copper layer 13, further improving the heat dissipation performance of this circuit board.

[0025] refer to Figures 1 to 4As shown above, by strengthening the heat dissipation effect of the circuit layer through the metal substrate 1 and the thermally conductive enhancement layer 4, the dissipated heat can diffuse along the metal substrate 1 to the bottom surface or along the thermally conductive enhancement layer 4 to the top, thereby enhancing the overall heat dissipation effect. Furthermore, the heat dissipation effect of the LED bead 2 is enhanced by the heat-conducting plate 6, the heat dissipation hole 7, and the transition layer 8, so as to reduce the heating temperature of the LED bead 2 as much as possible. The honeycomb layout can increase the heat dissipation area of ​​the heat dissipation hole 7, further improving the heat dissipation effect. The heat dissipation plate 9, which is opposed to the thermally conductive enhancement layer 4, can optimize the airflow path by using the heat dissipation fins 11, so that the heat dissipated by the circuit layer can be dissipated into the air more quickly. This driver circuit board has an integrated structure and does not require additional heat dissipation accessories, making it suitable for high-power LED lighting scenarios.

[0026] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A driver circuit board with good heat dissipation, comprising a metal substrate (1) and a plurality of LED beads (2), characterized in that: An insulating layer (3), a circuit layer, and a thermally conductive enhancement layer (4) are sequentially provided on the top surface of the metal substrate (1). The thermally conductive enhancement layer (4) covers the circuit layer and forms a welding connection part (5). A plurality of heat-conducting plates (6) are provided on the insulating layer (3). The LED lamp bead (2) is located on the heat-conducting plate (6) and connected to the two adjacent welding connection parts (5).

2. The driver circuit board with good heat dissipation according to claim 1, characterized in that: The metal substrate (1) has a plurality of heat dissipation holes (7) that penetrate the metal substrate (1) and the insulating layer (3). The plurality of heat dissipation holes (7) are located below the heat-conducting plate (6) and are distributed in a honeycomb pattern.

3. The driver circuit board with good heat dissipation according to claim 2, characterized in that: The heat-conducting plate (6) has a transition layer (8) on the side facing the LED bead (2), and the transition layer (8) is composed of thermal grease or metal oxide composite coating.

4. The driver circuit board with good heat dissipation according to claim 1, characterized in that: A heat sink (9) is detachably connected to the metal substrate (1). The bottom surface of the heat sink (9) abuts against the surface of the thermally conductive enhancement layer (4). The heat sink (9) has a receiving hole (10) for accommodating the LED beads (2) and the welding connection part (5). A number of heat dissipation fins (11) arranged in an array are fixedly connected to the top surface of the heat sink (9).

5. The driver circuit board with good heat dissipation according to claim 4, characterized in that: The heat dissipation fins (11) have a wavy cross section, and the height of the heat dissipation fins (11) is lower than the height of the LED beads (2).

6. The driver circuit board with good heat dissipation according to claim 4, characterized in that: The metal substrate (1) has a plurality of heat dissipation holes (12) which penetrate the metal substrate (1) and the insulating layer (3) and are alternately arranged with the LED beads (2). The inner wall of the heat dissipation hole (12) is plated with a heat dissipation copper layer (13).

7. The driver circuit board with good heat dissipation according to claim 6, characterized in that: The heat dissipation copper layer (13) abuts against the heat dissipation plate (9).

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