High-frequency chip type electronic component testing device

Abstract

The utility model relates to a high-frequency chip type electronic component testing device, which is characterized by comprising a testing host (1), a testing position (12) with a conductive terminal is arranged on a table board; the conveying assembly (2) comprises a conveying rotary table (21), a peripheral check ring (22) and a rotary driving mechanism, and the conveying rotary table (21) rotates to enable the positioning notches (211) to convey the tested electronic elements to the testing positions (12) one by one; the picking and pressing mechanism (3) is provided with a pressing head (31); the lower pressing head (31) is arranged in a high-frequency shielding cover (32) in a surrounding manner; the part, correspondingly located below the picking and pressing mechanism (3), of the peripheral check ring (22) serves as a high-frequency shielding part (221), and the surface of the high-frequency shielding part (221) is close to or makes contact with the bottom end face of the high-frequency shielding cover (32). Therefore, the high-frequency shielding cover (32) and the high-frequency shielding part (221) form a high-frequency signal leakage prevention structure.

Description

Technical Field

[0001] This invention relates to the field of electronic component testing equipment, and more specifically to a high-frequency surface-mount electronic component testing device. Background Technology

[0002] Chip-type electronic components, including individual components such as filters, as well as integrated circuit chips, all require electrical performance testing, necessitating the design of specialized testing equipment.

[0003] As surface-mount electronic components become increasingly miniaturized, extremely small, and relatively fragile and easily damaged, the design of handling and pressing mechanisms in testing devices is very challenging.

[0004] Existing surface mount electronic component testing equipment typically includes a test host, a transport component, and a pick-and-press mechanism. This testing unit has a test platform with a detection position equipped with conductive terminals. The transport component delivers the electronic component under test to the detection position. The pick-and-press mechanism is positioned above the detection position and has a vertically moving pressing head that applies a downward thrust to the electronic component under test, ensuring a good electrical connection between the pins of the electronic component under test and the conductive terminals of the detection position.

[0005] When the aforementioned existing surface-mount electronic component testing equipment is used to test high-frequency electronic components, high-frequency leakage will occur, emitting high-frequency noise, which will lead to a decrease in testing accuracy. Utility Model Content

[0006] The purpose of this invention is to provide a high-frequency surface-mount electronic component testing device to reduce high-frequency leakage during testing and ensure the accuracy of test results.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is: a high-frequency surface-mount electronic component testing device, comprising:

[0008] A test host has a test platform, on which test positions with conductive terminals are provided;

[0009] A conveying assembly includes a conveying turntable, an outer peripheral retaining ring, and a rotary drive mechanism. The conveying turntable is rotatably mounted on the test platform, and its outer edge is uniformly provided with positioning notches for placing electronic components under test. The outer peripheral retaining ring is located around the outer periphery of the conveying turntable and fixed relative to the test platform surface to prevent the electronic components under test from falling out of the positioning notches. The conveying turntable rotates under the drive of the rotary drive mechanism, so that each positioning notch delivers the electronic components under test to the test position one by one.

[0010] A pickup and pressing mechanism has a pressing head and an up-and-down driving mechanism. The pressing head is located above the test position and can move up and down under the action of the up-and-down driving mechanism, so that the pressing head acts on the electronic component under test and electrically connects the pin of the electronic component with the conductive terminal of the test position.

[0011] The pressing head is enclosed within a high-frequency shield, which surrounds the pressing head from all sides. The portion of the outer perimeter ring corresponding to the area below the picking and pressing mechanism is made of high-frequency shielding material as a high-frequency shielding part, and the surface of the high-frequency shielding part is close to or in contact with the bottom surface of the high-frequency shield. Thus, the high-frequency shield and the high-frequency shield together constitute a high-frequency signal leakage prevention structure.

[0012] In the above scheme, the conveyor turntable is thick in the middle and thin at the edges to form a ring of steps on it, and the step corresponds to the blocking position in front of the pressing head.

[0013] In the above scheme, the thick middle disk surface and the thin edge disk surface of the conveying turntable are connected by an inclined surface, that is, the step is an inclined step; the side of the high frequency shielding cover near the conveying turntable is also provided with an inclined surface, and the inclined surface is face to face with the inclined surface of the inclined step.

[0014] In the above scheme, the surface of the high-frequency shielding part is provided with a groove that matches the bottom end of the high-frequency shielding cover, and the bottom end of the high-frequency shielding cover is embedded in the groove.

[0015] In the above scheme, a negative pressure adsorption port is provided on the bottom end face of the lower pressure head. The negative pressure adsorption port extends upward through the internal channel of the lower pressure head to receive negative pressure, thus the lower pressure head becomes a suction nozzle.

[0016] In the above scheme, the pressing head is guided up and down relative to the test platform, and a spring acts on the pressing head, the spring force keeps it in the raised working position; the up and down driving mechanism is a motor cam mechanism, which includes a cam mechanism and a motor driving the cam. The cam mechanism applies force to the pressing head, driving the pressing head to overcome the spring force of the spring and descend to the pressed working position.

[0017] In the above scheme, an upwardly extending plunger rod is fixedly connected to the lower pressure head. The spring acts on the plunger rod. A drive seat is provided above the top of the plunger rod. The drive seat is guided vertically relative to the test platform surface and is provided with an elastic element. The elastic force of the elastic element causes the drive seat to move upward. The cam mechanism acts on the drive seat to push it downward. The drive seat is provided with an adjusting screw and a drive rod. The adjusting screw is threaded to the drive seat from top to bottom. Its lower end acts on the upper end of the drive rod, while the lower end of the drive rod extends downward and presses against the plunger rod.

[0018] This invention reduces high-frequency leakage and noise during testing by setting up a high-frequency signal anti-leakage structure, while also ensuring the accuracy of the test. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of the external structure of an embodiment of the present utility model;

[0020] Figure 2 This is a full sectional view of an embodiment of the present utility model;

[0021] Figure 3 This is a top-down view of the junction between the conveyor turntable and the high-frequency shielding part in an embodiment of the present invention.

[0022] In the attached diagrams above:

[0023] 1. Test host; 11. Test platform; 12. Test bit;

[0024] 2. Conveying assembly; 21. Conveying turntable; 211. Positioning notch; 212. Inclined surface; 22. Outer peripheral retaining ring; 221. High-frequency shielding part; 2211. Groove;

[0025] 3. Pick-up and pressing mechanism; 31. Press head; 311. Negative pressure suction port; 32. High frequency shield; 321. Inclined surface; 33. Spring; 34. Cam mechanism; 35. Motor; 36. Plunger rod; 37. Drive seat; 371. Adjusting screw; 372. Drive rod; 38. Elastic element. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0027] Example: See Figure 1-3 As shown,

[0028] A high-frequency chip electronic component testing device includes a testing host 1, a conveying component 2, and a pickup and pressing mechanism.

[0029] See Figure 1-3 As shown, the test host 1 has a test platform 11, and test positions 12 with conductive terminals are provided on the surface of the test platform 11. Figure 3 As shown.

[0030] See Figure 1-3 As shown, the conveying assembly includes a conveying turntable 21, an outer peripheral retaining ring 22, and a rotary drive mechanism. The conveying turntable 21 is rotatably mounted on the test platform 11, and its outer edge is uniformly provided with positioning notches 211 for placing the electronic components under test. The outer peripheral retaining ring 22 is located around the outer periphery of the conveying turntable 21 and fixed relative to the test platform 11, preventing the electronic components under test from falling out of the positioning notches 211. The conveying turntable 21 rotates under the drive of the rotary drive mechanism, so that each positioning notch 211 delivers the electronic components under test one by one to the test position 12. In this way, the conveying of the electronic components under test is more reliable, stable, and faster.

[0031] The conveyor turntable 21 typically uses an indexing plate and operates in an intermittent manner, moving and stopping intermittently.

[0032] See Figure 1-2 As shown, the pickup pressing mechanism 3 has a pressing head 31 and an up-down driving mechanism. The pressing head 31 is located above the test position 12 and can move up and down under the action of the up-down driving mechanism, so that the pressing head 31 acts on the electronic component under test and makes its pins electrically connected to the conductive terminals of the test position 12.

[0033] like Figure 1-2 As shown, a negative pressure adsorption port 311 is provided on the bottom end face of the pressure head 31. The negative pressure adsorption port 311 extends upward through the internal channel of the pressure head 31 to receive negative pressure, thus the pressure head 31 becomes a suction nozzle. Specifically, the number of negative pressure adsorption ports 311 on the pressure head 31 can be two side by side to more stably adsorb the electronic components under test.

[0034] Specifically, the downward-extending head on the pressure head 31 is designed to be roughly the same size as the electronic component being tested. It is best to use plastic as the material for this head to avoid damaging the electronic component.

[0035] like Figure 1-2As shown, the pressing head 31 is guided vertically relative to the test platform 11, and a spring 33 acts on the pressing head 31, its spring force keeping it in the raised working position. The up-and-down driving mechanism is a motor cam mechanism, which includes a cam mechanism 34 and a motor 35 driving the cam. The cam mechanism 34 applies force to the pressing head 31, driving the pressing head 31 to descend to the pressed working position against the spring force of the spring 33. More specifically, an upwardly extending plunger rod 36 is fixedly connected to the pressing head 31, and the spring 33 acts on the plunger rod 36. A drive seat 37 is provided above the top of the plunger rod 36, and the drive seat 37 is guided vertically relative to the test platform 11, and an elastic element 38 is provided on it. The elastic force of the elastic element 38 is directed to make the drive seat 37 move upward, and the cam mechanism 34 acts on the drive seat 37 to push the drive seat 37 downward. The drive seat 37 is equipped with an adjusting screw 371 and a drive rod 372. The adjusting screw 371 is threaded to the drive seat 37 from top to bottom, and its lower end acts on the upper end of the drive rod 372. The lower end of the drive rod 372 extends downward and presses against the plunger rod 36. By adjusting the adjusting screw 371, the extension length of the drive rod 372 can be easily adjusted, thereby adjusting the stroke of the downward driving head 31. The adjustment is convenient.

[0036] When working, see Figure 1-2 As shown, when motor 35 starts, the contour of the working surface of cam mechanism 34 drives drive seat 37 to perform a reciprocating action of pressing down and lifting up, thereby driving the lower end of drive rod 372 to press down and drive plunger rod 36, which is transmitted to the pressing head 31. The pressing head 31 also presses down on the electronic component under test according to the required rhythm. At this time, in conjunction with the intermittent rotation rhythm of conveyor turntable 21, the action of electrically connecting and testing each electronic component under test on test position 12 can be completed. A negative pressure suction port 311 is provided on the bottom end face of pressing head 31. The negative pressure suction port 311 extends upward through the internal channel of pressing head 31 to receive negative pressure, making pressing head 31 a suction nozzle. This is so that when pressing head 31 presses down, the suction nozzle is used to adsorb and position the electronic component under test to guide the position of the electronic component under test, and then the pressing down is performed.

[0037] In particular, this embodiment employs the following design: See Figure 1-3As shown, the pressing head 31 is enclosed within a high-frequency shielding cover 32. The high-frequency shielding cover 32 is fixed relative to the test platform 11 and surrounds the pressing head 31 on all four sides. The portion of the outer peripheral retaining ring 22 located below the picking and pressing mechanism 3 uses high-frequency shielding material as a high-frequency shielding part 221. The surface of the high-frequency shielding part 221 is close to or in contact with the bottom surface of the high-frequency shielding cover 32. Thus, the high-frequency shielding cover 32 and the high-frequency shielding part 221 together constitute a high-frequency signal leakage prevention structure.

[0038] Thus, the high-frequency shielding part 221 protects and blocks the test circuit part of the test host 1 under the table, and the exposed test position 12 is also well blocked from leakage of high-frequency signals by the high-frequency shielding part 221 and the high-frequency shielding cover 32, ensuring the accuracy and precision of the test results.

[0039] See Figure 1-2 As shown, the conveyor turntable 21 is thicker in the middle and thinner at the edges, forming a stepped ring on it, which is located in front of the pressing head 31. The thick middle surface and the thin edge surface of the conveyor turntable 21 are connected by an inclined surface 212, thus making the step an inclined step; the high-frequency shielding cover 32 also has an inclined surface 321 on the side facing the conveyor turntable 21, and this inclined surface 321 faces the inclined surface 212 of the inclined step. Thus, the protection is in place without hindering the movement of the pressing head 31 and the rotation of the conveyor turntable 21, and there is no interference between the pressing head 31 and the conveyor turntable 21.

[0040] See Figure 3 As shown, for better protection, a groove 2211 matching the bottom end of the high-frequency shield 32 is provided on the surface of the high-frequency shield 221, and the bottom end of the high-frequency shield 32 is embedded in the groove 2211. A step may also be provided on the side wall of the groove 2211, and matching parts are also provided on both sides of the bottom end of the high-frequency shield 32 corresponding to the step, so as to fasten the shield with the bent step.

[0041] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high frequency chip electronic component testing apparatus characterized by comprising: The utility model relates to a test host (1) which has a test platform (11) with test sites (12) with conductive terminals on the surface of the test platform (11), a conveying assembly (2) which includes a conveying turntable (21), a peripheral retaining ring (22), and a rotating drive mechanism, the conveying turntable (21) is rotatably arranged on the surface of the test platform (11) and has positioning notches (211) for placing electronic components to be tested uniformly arranged on the outer edge of the conveying turntable (21), the peripheral retaining ring (22) is arranged at the periphery of the conveying turntable (21) and is fixed relative to the surface of the test platform (11) and is used for blocking the electronic components to be tested to prevent them from falling out of the positioning notches (211), and the conveying turntable (21) rotates under the drive of the rotating drive mechanism to send the electronic components to be tested to the test sites (12) one by one, a pickup and pressing mechanism (3) which has a pressing head (31) and an up-down drive mechanism, the pressing head (31) is arranged above the test sites (12) and can be displaced up and down under the action of the up-down drive mechanism to make the pressing head (31) act on the electronic components to be tested to make the pins of the electronic components to be tested electrically connected with the conductive terminals of the test sites (12), wherein the pressing head (31) is enclosed in a high-frequency shielding cover (32), the high-frequency shielding cover (32) is fixed relative to the surface of the test platform (11) and surrounds the front, back, left, and right of the pressing head (31), the part of the peripheral retaining ring (22) which is below the pickup and pressing mechanism (3) is made of high-frequency shielding material as a high-frequency shielding part (221), the surface of the high-frequency shielding part (221) is close to or in contact with the bottom end surface of the high-frequency shielding cover (32), and thus the high-frequency shielding cover (32) and the high-frequency shielding part (221) jointly form a high-frequency signal leakage prevention structure. The middle thick edge of the conveying turntable (21) is thin to form a step on it, and the step is located in front of the pressing head (31). The thick middle disc surface and the thin edge disc surface of the conveying turntable (21) are connected by an inclined surface (212), the step is an inclined step, the side of the high-frequency shielding cover (32) close to the conveying turntable (21) is also provided with an inclined surface (321), and the inclined surface (321) faces the inclined surface (212) of the inclined step. The surface of the high-frequency shielding part (221) is provided with a groove (2211) matched with the bottom end of the high-frequency shielding cover (32), and the bottom end of the high-frequency shielding cover (32) is embedded in the groove (2211). The bottom end surface of the pressing head (31) is provided with a negative pressure suction port (311) which is connected to negative pressure through the internal channel of the pressing head (31) and extends upward, and thus the pressing head (31) becomes a suction nozzle.

2. The high frequency chip electronic component testing apparatus according to claim 1, characterized by: ​ 3. The high frequency chip electronic component testing apparatus according to claim 2, characterized by: ​ 4. The high-frequency chip electronic component testing apparatus according to one of claims 1 to 3, characterized by: ​ 5. The high frequency chip electronic component testing apparatus according to claim 1, characterized by: ​ 6. The high frequency chip electronic component testing apparatus according to claim 1, characterized by: The lower pressing head (31) is guided up and down on the table surface of the test platform (11), and a spring (33) acts on the lower pressing head (31), and the spring force of the spring (33) keeps the lower pressing head (31) in the lifted working position; the up and down driving mechanism is a motor cam mechanism, which comprises a cam mechanism (34) and a motor (35) for driving the cam mechanism (34), the cam mechanism (34) applies force transmission to the lower pressing head (31) to drive the lower pressing head (31) to overcome the spring force of the spring (33) and descend to the pressed working position.

7. The high frequency chip electronic component testing apparatus according to claim 6, characterized by: An upward extending plunger rod (36) is fixedly connected to the lower pressing head (31) upward, the spring (33) acts on the plunger rod (36), a driving seat (37) is arranged above the top end of the plunger rod (36), the driving seat (37) is guided up and down on the table surface of the test platform (11), and an elastic element (38) is arranged on the driving seat (37), the elastic force of the elastic element (38) is in the direction of moving the driving seat (37) upward, and the cam mechanism (34) acts on the driving seat (37) to push the driving seat (37) to move downward; the driving seat (37) is internally provided with an adjusting screw (371) and a driving rod (372), the adjusting screw (371) is arranged in thread connection with the driving seat (37) from top to bottom, the lower end of the adjusting screw (371) acts on the upper end of the driving rod (372), and the lower end of the driving rod (372) extends downward to abut against the plunger rod (36).

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