Photovoltaic inverter

Abstract

The utility model relates to the technical field of power electronics, in particular to a photovoltaic inverter. The utility model aims to solve the problem that temperature cascade is generated between an electronic device and other devices, which affects the normal operation of a photovoltaic inverter. The utility model provides a photovoltaic inverter. The photovoltaic inverter comprises a circuit board, a shell, at least one air duct structure and at least one fan. A first cavity is defined by the shell, the circuit board is arranged in the first cavity, the shell comprises a cover plate, and an electronic device is arranged on the surface, facing the cover plate, of the circuit board. The air channel structure comprises a first surrounding plate and a second surrounding plate, the end, away from the cover plate, of the first surrounding plate and the end, away from the cover plate, of the second surrounding plate abut against the circuit board, the first surrounding plate and the second surrounding plate are arranged on the surface, facing the circuit board, of the cover plate, and the heat dissipation air channel is a sealed channel. According to the photovoltaic inverter, air in the heat dissipation air channel can be prevented from transferring heat to other devices outside the heat dissipation air channel, temperature cascade between electronic devices and other devices is avoided, and normal work of the photovoltaic inverter is guaranteed.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, specifically to a photovoltaic inverter. Background Technology

[0002] A photovoltaic (PV) inverter consists of a circuit board and electronic components, with the electronic components mounted on the circuit board. These electronic components operate at high temperatures and are prone to overheating and damage. Typically, fans are placed near these hot components to dissipate heat. However, due to the lack of internal airflow management within the PV inverter, the airflow absorbing heat from the electronic components flows freely inside the inverter and comes into contact with other components on the circuit board. This causes temperature cascading between the electronic components and other devices, raising their temperatures and affecting the normal operation of the PV inverter. Utility Model Content

[0003] This application provides a photovoltaic inverter that can avoid temperature cascading between electronic components and other components, ensuring the normal operation of the photovoltaic inverter.

[0004] In a first aspect, embodiments of this application provide a photovoltaic inverter, including a circuit board and a housing. The housing forms a first cavity, and the circuit board is disposed within the first cavity. The housing includes a cover plate facing the circuit board, and electronic components are disposed on the surface of the circuit board facing the cover plate. The photovoltaic inverter further includes at least one air duct structure and at least one fan. The air duct structure includes a first enclosure and a second enclosure disposed on the surface of the cover plate facing the circuit board. The second enclosure is located inside the first enclosure. The end of the first enclosure facing away from the cover plate abuts against the circuit board, and the end of the second enclosure facing away from the cover plate abuts against the circuit board. The cover plate, the circuit board, the first enclosure, and the second enclosure form a heat dissipation air duct, and the electronic components are located within the heat dissipation air duct. The fan is disposed within the heat dissipation air duct and is used to drive airflow within the heat dissipation air duct.

[0005] The first enclosure plate and the second enclosure plate, located opposite the cover plate, abut against the circuit board. The first and second enclosure plates are positioned on the surface of the cover plate facing the circuit board. The heat dissipation duct is a sealed channel, which ensures that the air inside the heat dissipation duct will not flow into the first cavity. This prevents the air inside the heat dissipation duct from transferring heat to other components outside the heat dissipation duct, thus preventing temperature cascading between the electronic components inside the heat dissipation duct and other components outside the heat dissipation duct, and ensuring the normal operation of the photovoltaic inverter.

[0006] Meanwhile, the fan and electronic components are all located inside the heat dissipation duct, which can drive the airflow within the duct. This allows the air to carry away the heat from the electronic components and transfer it to the outside of the photovoltaic inverter through the cover plate, thereby reducing the temperature of the electronic components within the heat dissipation duct and ensuring their normal operation.

[0007] In some embodiments that may include the above embodiments, the fan is disposed on the surface of the cover plate facing the circuit board, the plane where the fan inlet is located is perpendicular to the circuit board, and the plane where the fan outlet is located is perpendicular to the circuit board.

[0008] The fan's airflow direction aligns with the airflow direction within the cooling duct, increasing airflow speed and thus improving heat dissipation. Additionally, the fan's placement on the cover plate prevents it from taking up space on the circuit board.

[0009] In some embodiments that may include the above embodiments, a plurality of heat dissipation teeth are also provided in the heat dissipation duct. The heat dissipation teeth are connected to the cover plate and extend toward the circuit board. In the direction parallel to the circuit board, the extension direction of each heat dissipation tooth is parallel to the extension direction of the heat dissipation duct.

[0010] The heat dissipation fins are set inside the heat dissipation duct. The heat dissipation fins are connected to the cover plate and extend towards the circuit board. This can increase the contact area between the cover plate and the air in the heat dissipation duct, thereby improving the heat dissipation capacity of the cover plate. The larger the heat transfer area, the faster the heat dissipation rate of electronic components, which can improve the heat dissipation capacity of the photovoltaic inverter and ensure the normal operation of the photovoltaic inverter.

[0011] In the direction parallel to the circuit board, the extension direction of each heat dissipation fin is parallel to the extension direction of the heat dissipation duct. That is, the extension direction of the heat dissipation fin is consistent with the airflow direction within the heat dissipation duct. This prevents the air within the heat dissipation duct from being slowed down by the heat dissipation fin, increasing the contact area between the air and the cover plate while maintaining the airflow velocity within the heat dissipation duct. This improves the heat transfer capacity between the air and the cover plate, thereby enhancing the heat dissipation capacity of the photovoltaic inverter. In some embodiments that may include the above examples, in the direction perpendicular to the circuit board, the electronic device includes a first device and a second device. The length of the first device is greater than the length of the second device, and the length of the heat dissipation fin corresponding to the first device is less than the length of the heat dissipation fin corresponding to the second device.

[0012] In the direction perpendicular to the circuit board, the length of the heat dissipation channel is fixed. The length of the first device is greater than the length of the second device. Correspondingly, the length of the heat dissipation fins at the first device is less than the length of the heat dissipation fins at the second device. This ensures that the heat dissipation fins match the electronic devices, ensuring that the cover plate can fit with the circuit board and form a heat dissipation channel. In some embodiments that may include the above embodiments, in the direction perpendicular to the circuit board, the heat dissipation fins are spaced apart from the electronic devices.

[0013] The spacing between the heat dissipation fins and electronic components increases the contact area between the air and the cover plate within the heat dissipation duct, while ensuring airflow space and maintaining the contact area between the air and electronic components.

[0014] In some embodiments that may include the above embodiments, the heat dissipation teeth contact the electronic devices in a direction perpendicular to the circuit board.

[0015] The heat sink contacts the electronic components, allowing heat to be transferred from the components to the sink and then to the cover plate. Besides convection cooling, the electronic components can also dissipate heat through contact with the heat sink. This contact between the electronic components and the circuit board increases the heat dissipation pathways for the electronic components, improving the heat dissipation rate and thus enhancing the heat dissipation capacity of the photovoltaic inverter.

[0016] In some embodiments that may include the above embodiments, the heat dissipation teeth contact the circuit board in a direction perpendicular to the circuit board.

[0017] The heat dissipation fins contact the circuit board, allowing heat to be transferred from the board to the fins and then to the cover plate. The circuit board dissipates heat through this contact with the fins, increasing the heat dissipation pathways and improving the heat dissipation rate, thereby enhancing the heat dissipation capacity of the photovoltaic inverter.

[0018] In some embodiments that may include the above embodiments, the photovoltaic inverter further includes a thermal pad disposed between the heat dissipation teeth and the electronic components, and the thermal pad is in contact with the heat dissipation teeth and the electronic components respectively.

[0019] Thermal pads have a certain degree of flexibility, which allows them to fit well with electronic components and heat dissipation fins, ensuring good thermal conductivity between the electronic components and heat dissipation fins.

[0020] In the embodiment where the heat sink is connected to the circuit board, a thermal pad is disposed between the heat sink and the circuit board, and the thermal pad contacts both the heat sink and the circuit board. The thermal pad has a certain degree of flexibility, which allows it to fit well against the circuit board and the heat sink, ensuring good thermal conductivity between the circuit board and the heat sink.

[0021] In some embodiments that may include the above embodiments, the heat dissipation duct includes a first section duct, a second section duct, a third section duct, and a fourth section duct that are interconnected. The air outlet of the first section duct is connected to the air inlet of the second section duct, the air outlet of the second section duct is connected to the air inlet of the third section duct, the air outlet of the third section duct is connected to the air inlet of the fourth section duct, and the air outlet of the fourth section duct is connected to the air inlet of the first section duct.

[0022] The heat dissipation air duct includes a first section, a second section, a third section, and a fourth section, and the air outlet and air inlet are connected. That is to say, in the direction parallel to the circuit board, the heat dissipation air duct is ring-shaped, and the air can circulate in the heat dissipation air duct to carry away the heat of the electronic components and achieve heat dissipation of the electronic components.

[0023] In some embodiments that may include the above embodiments, the first enclosure includes a first plate, a second plate, a third plate, and a fourth plate. The first and third plates are parallel and spaced apart, and the second and fourth plates are parallel and spaced apart, connected between the first and third plates. The second enclosure includes a fifth, a sixth, a seventh, and an eighth plate. The fifth and seventh plates are parallel and spaced apart, and the sixth and eighth plates are parallel and spaced apart, connected between the fifth and seventh plates. The first and fifth plates form a first air duct, the second and sixth plates form a second air duct, the third and seventh plates form a third air duct, and the fourth and eighth plates form a fourth air duct.

[0024] The air duct structure includes a first enclosure and a second enclosure. The first and second enclosures are of regular shape, which reduces the processing difficulty and cost of the air duct structure. The first and second enclosures form a heat dissipation air duct, allowing air to flow within it and carry away the heat from the electronic components, thus achieving heat dissipation.

[0025] In some embodiments that may include the above embodiments, at least one fan includes a plurality of fans that are interconnected, wherein the air outlet of one fan is connected to the air inlet of the next fan in its air outlet direction.

[0026] Multiple fans are interconnected, with the air outlet of one fan connected to the air inlet of the next fan in the same direction. This allows the air in the cooling duct to flow in a certain direction, thereby improving the heat exchange rate between the air and electronic components, as well as between the air and the cover plate.

[0027] The presence of multiple fans increases the work done by the fans on the air, offsetting the energy loss generated by the airflow and improving the stability of the airflow velocity in the heat dissipation duct. This ensures the heat dissipation effect of electronic components on the circuit board and, in turn, the normal operation of the photovoltaic inverter.

[0028] In some embodiments that may include the above embodiments, at least one air duct structure includes multiple air duct structures, which are spaced apart on the surface of the cover plate facing the circuit board. The electronic device includes a third device and a fourth device. The third device is located in a heat dissipation air duct formed by the cover plate, the circuit board and one air duct structure, and the fourth device is located in a heat dissipation air duct formed by the cover plate, the circuit board and another air duct structure.

[0029] The use of multiple air duct structures increases the contact area between air and the cover plate while reducing the airflow distance within each duct structure. This reduces energy loss during airflow within each duct structure, increases airflow velocity, and ultimately improves the heat dissipation capacity of the photovoltaic inverter. The spaced arrangement of multiple air duct structures allows for zoned heat dissipation on the circuit board, further enhancing the heat dissipation rate of the photovoltaic inverter.

[0030] The electronic components include a third component and a fourth component. The third component is located within a heat dissipation duct formed by a cover plate, a circuit board, and an air duct structure. The fourth component is located within a heat dissipation duct formed by a cover plate, a circuit board, and another air duct structure. In other words, each air duct structure covers a portion of the circuit board, and one or more electronic components are correspondingly located within each air duct. Multiple air duct structures can achieve zoned heat dissipation on the circuit board, improving the heat dissipation rate of the photovoltaic inverter.

[0031] Meanwhile, the airflow structure can zone electronic components on the circuit board according to their heat generation levels, preventing temperature cascading between high-temperature and low-temperature components, which could lead to overheating of the low-temperature components. The spacing of multiple airflow structures further prevents temperature cascading between adjacent areas, thus avoiding overheating of electronic components within the entire area and affecting their normal operation.

[0032] In some embodiments that may include the above embodiments, the housing includes a back plate facing the circuit board, the circuit board is located between the cover plate and the back plate, power devices are disposed on the surface of the circuit board facing the back plate, and a heat sink is disposed on the back plate and connected to the power devices.

[0033] Power devices are mounted on the surface of the circuit board facing the backplane. These power devices and electronic components are located on different sides of the circuit board, allowing for a more dispersed layout and increasing the heat dissipation space for both components, thus improving heat dissipation. A heat sink is mounted on the backplane and connected to the power devices, enabling them to dissipate heat directly through the heat sink. This shortens the heat transfer distance and increases the heat dissipation rate of the power devices. Attached Figure Description

[0034] Figure 1 A schematic diagram of the structure of the photovoltaic inverter provided in the embodiments of this application. Figure 1 ;

[0035] Figure 2 A schematic diagram of the structure of a photovoltaic inverter including heat dissipation fins provided in the embodiments of this application. Figure 1 ;

[0036] Figure 3 A schematic diagram of the structure of a photovoltaic inverter including heat dissipation fins provided in the embodiments of this application. Figure 2 ;

[0037] Figure 4 This is a schematic diagram of the heat dissipation duct provided in an embodiment of this application;

[0038] Figure 5 This is a schematic diagram of the structure of the cover plate provided in an embodiment of this application;

[0039] Figure 6 A schematic diagram of a cover plate with multiple fans provided in an embodiment of this application;

[0040] Figure 7 A schematic diagram of a structure with multiple air ducts provided in the embodiments of this application. Figure 1 ;

[0041] Figure 8 A schematic diagram of a structure with multiple air ducts provided in the embodiments of this application. Figure 2 .

[0042] Explanation of reference numerals in the attached figures:

[0043] 10: Photovoltaic inverter; 11: Circuit board; 12: Housing; 13: First cavity; 14: Electronic components; 141: First component; 142: Second component; 143: Third component; 144: Fourth component; 15: Air duct structure; 16: Heat dissipation air duct; 17: Fan; 20: Cover plate; 21: Heat dissipation fins; 22: Thermal pad; 23: Back plate; 24: Power device; 25: Heat sink; 31: First section air duct; 32: Second section air duct; 33: Third section air duct; 34: Fourth section air duct; 41: First enclosure plate; 42: Second enclosure plate; 51: First plate; 52: Second plate; 53: Third plate; 54: Fourth plate; 55: Fifth plate; 56: Sixth plate; 57: Seventh plate; 58: Eighth plate. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0046] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0047] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0048] In related technologies, photovoltaic inverters include circuit boards, housings, and electronic components. The housings form a first cavity, the circuit boards are housed within the first cavity, and the electronic components are mounted on the circuit boards. When the electronic components are operating, they generate high temperatures. Fans are typically placed near these heat-generating components to allow air to carry away their heat. When the air comes into contact with the housing, it transfers heat to the housing, which is then carried away by the surrounding air, thus cooling the electronic components.

[0049] However, the air that has absorbed heat from the electronic components will flow freely within the first cavity. Other components on the circuit board that do not easily generate heat will absorb the heat from the air and heat up, causing the components to overheat and be damaged, thus affecting the normal operation of the photovoltaic inverter.

[0050] Please refer to Figure 1 and Figure 2 This application provides a photovoltaic inverter 10, including a circuit board 11 and a housing 12. The housing 12 forms a first cavity 13, and the circuit board 11 is disposed within the first cavity 13. The housing 12 includes a cover plate 20 facing the circuit board 11, and electronic components 14 are disposed on the surface of the circuit board 11 facing the cover plate 20. This application does not limit the electronic components 14; for example, the electronic components 14 may include resistors, capacitors, inductors, relays, etc.

[0051] The photovoltaic inverter 10 also includes at least one air duct structure 15 and at least one fan 17. The air duct structure 15 includes a first enclosure 41 and a second enclosure 42 disposed on the surface of the cover plate 20 facing the circuit board 11. The second enclosure 42 is located inside the first enclosure 41. The end of the first enclosure 41 facing away from the cover plate 20 abuts against the circuit board 11, and the end of the second enclosure 42 facing away from the cover plate 20 abuts against the circuit board 11.

[0052] The cover plate 20, circuit board 11, first enclosure plate 41, and second enclosure plate 42 form a heat dissipation duct 16, and the electronic device 14 is located inside the heat dissipation duct 16. A fan 17 is installed inside the heat dissipation duct 16 to drive the airflow within the heat dissipation duct 16.

[0053] The first enclosure plate 41 and the second enclosure plate 42, which are opposite to the cover plate 20, abut against the circuit board 11. The first enclosure plate 41 and the second enclosure plate 42 are disposed on the surface of the cover plate 20 facing the circuit board 11. The heat dissipation duct 16 is a sealed channel, which can ensure that the air in the heat dissipation duct 16 will not flow into the first cavity 13. This can prevent the air in the heat dissipation duct 16 from transferring heat to other devices outside the heat dissipation duct 16, and prevent temperature cascading between the electronic device 14 inside the heat dissipation duct 16 and other devices outside the heat dissipation duct 16, thus ensuring the normal operation of the photovoltaic inverter 10.

[0054] Meanwhile, the fan 17 and the electronic device 14 are both located inside the heat dissipation duct 16, which can drive the airflow inside the heat dissipation duct 16, so that the air carries away the heat from the electronic device 14 and transfers it to the outside of the photovoltaic inverter 10 through the cover plate 20, thereby reducing the temperature of the electronic device 14 inside the heat dissipation duct 16 and ensuring the normal operation of the electronic device 14.

[0055] It is understandable that convective heat dissipation refers to the process of transferring heat through the movement of air or fluid.

[0056] Continue to refer to Figure 1 In some embodiments, the fan 17 is disposed on the surface of the cover plate 20 facing the circuit board 11, with the plane containing the air inlet of the fan 17 perpendicular to the circuit board 11, and the plane containing the air outlet of the fan 17 perpendicular to the circuit board 11. That is, the air inlet and outlet directions of the fan 17 are consistent with the airflow direction within the heat dissipation duct 16, which can increase the airflow speed and thus improve the heat dissipation rate. At the same time, disposing of the fan 17 on the cover plate 20 avoids the fan 17 occupying space on the circuit board 11.

[0057] Please refer to Figure 2 and Figure 3 In the above embodiment, a plurality of heat dissipation teeth 21 are also provided in the heat dissipation duct 16. The heat dissipation teeth 21 are connected to the cover plate 20 and extend toward the circuit board 11. In the direction parallel to the circuit board 11, the extension direction of each heat dissipation tooth 21 is parallel to the extension direction of the heat dissipation duct 16.

[0058] The heat dissipation fins 21 are set inside the heat dissipation duct 16. The heat dissipation fins 21 are connected to the cover plate 20 and extend toward the circuit board 11. This can increase the contact area between the cover plate 20 and the air in the heat dissipation duct 16, improve the heat dissipation capacity of the cover plate 20, thereby improving the heat dissipation rate of the electronic device 14, enhancing the heat dissipation capacity of the photovoltaic inverter 10, and ensuring the normal operation of the photovoltaic inverter 10.

[0059] In the direction parallel to the circuit board 11, the extension direction of each heat dissipation tooth 21 is parallel to the extension direction of the heat dissipation duct 16. That is to say, the extension direction of the heat dissipation tooth 21 is consistent with the air flow direction in the heat dissipation duct 16. This can prevent the air in the heat dissipation duct 16 from being slowed down by the heat dissipation tooth 21. While increasing the contact area between the air and the cover plate 20, it ensures the air flow rate in the heat dissipation duct 16, thereby improving the heat transfer capacity between the air and the cover plate 20, and thus improving the heat dissipation capacity of the photovoltaic inverter 10.

[0060] In some embodiments, the heat dissipation fins 21 and the cover plate 20 can be an integral structure, which can reduce the processing difficulty and processing cost of the photovoltaic inverter 10.

[0061] Please refer to Figure 4 In some embodiments, in the direction perpendicular to the circuit board 11, the electronic device 14 includes a first device 141 and a second device 142. The length of the first device 141 is greater than the length of the second device 142, and the length of the heat dissipation tooth 21 corresponding to the first device 141 is less than the length of the heat dissipation tooth 21 corresponding to the second device 142. This application does not limit the first device 141 and the second device 142. For example, the first device 141 can be a resistor, and the second device 142 can be a capacitor, inductor, etc.

[0062] It is understandable that the length of the heat dissipation channel 16 is fixed in the direction perpendicular to the circuit board 11. The length of the first device 141 is greater than the length of the second device 142. Correspondingly, the length of the heat dissipation tooth 21 at the first device 141 is less than the length of the heat dissipation tooth 21 at the second device 142. This ensures that the heat dissipation tooth 21 matches the electronic device 14, and ensures that the cover plate 20 can cooperate with the circuit board 11 to form the heat dissipation channel 16.

[0063] Continue to refer to Figure 3 In some embodiments, the heat dissipation fins 21 are spaced apart from the electronic components 14 in a direction perpendicular to the circuit board 11. The spaced arrangement of the heat dissipation fins 21 and the electronic components 14 can increase the contact area between the air in the heat dissipation duct 16 and the cover plate 20, while ensuring airflow space and the contact area between the air and the electronic components 14.

[0064] Continue to refer to Figure 4 In some embodiments, the heat dissipation fins 21 are in contact with the electronic device 14.

[0065] The heat dissipation fins 21 contact the electronic device 14, allowing heat from the electronic device 14 to be transferred to the heat dissipation fins 21 and then to the cover plate 20. In addition to convection cooling, the electronic device 14 can also dissipate heat through contact with the heat dissipation fins 21. This contact with the heat dissipation fins 21 increases the heat dissipation pathways for the electronic device 14, improving its heat dissipation rate and thus enhancing the heat dissipation capacity of the photovoltaic inverter 10.

[0066] Continue to refer to Figure 4 In some embodiments, the heat dissipation fins 21 also contact the circuit board 11.

[0067] The heat dissipation fins 21 contact the circuit board 11, allowing heat from the circuit board 11 to be transferred to the heat dissipation fins 21 and then to the cover plate 20. The circuit board 11 dissipates heat through contact with the heat dissipation fins 21. This contact increases the heat dissipation pathways of the circuit board 11, improving its heat dissipation rate and thus enhancing the heat dissipation capacity of the photovoltaic inverter 10.

[0068] Continue to refer to Figure 4 In the above embodiment, the photovoltaic inverter 10 also includes a thermal pad 22, which is disposed between the heat dissipation teeth 21 and the electronic device 14, and the thermal pad 22 contacts the heat dissipation teeth 21 and the electronic device 14 respectively.

[0069] The thermal pad 22 has a certain degree of flexibility, which can fit well with the electronic device 14 and the heat dissipation tooth 21, ensuring the thermal conductivity between the electronic device 14 and the heat dissipation tooth 21.

[0070] In the embodiment where the heat dissipation fins 21 contact the circuit board 11, a thermal pad 22 is disposed between the heat dissipation fins 21 and the circuit board 11, and the thermal pad 22 contacts both the heat dissipation fins 21 and the circuit board 11. The thermal pad 22 has a certain degree of flexibility, which can fit well with the circuit board 11 and the heat dissipation fins 21, ensuring the thermal conductivity between the circuit board 11 and the heat dissipation fins 21.

[0071] It is understood that heat dissipation fins 21 and thermal pads 22 can be provided according to the heat dissipation requirements of electronic device 14. It is also understood that the greater the heat generated by electronic device 14, the greater the corresponding heat dissipation requirement. For example, in embodiments where electronic device 14 is a resistor or other electronic device with relatively low heat generation, heat dissipation fins 21 can be spaced apart from electronic device 14. In embodiments where electronic device 14 is a capacitor, inductor, or other device with relatively high heat generation, heat dissipation fins 21 can be connected to electronic device 14. Furthermore, when electronic device 14 has a greater heat dissipation requirement, thermal pads 22 can be provided between heat dissipation fins 21 and electronic device 14.

[0072] Please refer to Figure 5 In the above embodiment, the heat dissipation duct 16 includes a first section duct 31, a second section duct 32, a third section duct 33, and a fourth section duct 34 that are interconnected. The air outlet of the first section duct 31 is connected to the air inlet of the second section duct 32, the air outlet of the second section duct 32 is connected to the air inlet of the third section duct 33, the air outlet of the third section duct 33 is connected to the air inlet of the fourth section duct 34, and the air outlet of the fourth section duct 34 is connected to the air inlet of the first section duct 31.

[0073] The heat dissipation duct 16 includes a first section duct 31, a second section duct 32, a third section duct 33, and a fourth section duct 34, and the air outlet and air inlet are connected. That is to say, in the direction parallel to the circuit board 11, the cross-section of the heat dissipation duct 16 is annular, and the air can circulate in the heat dissipation duct 16 to carry away the heat of the electronic device 14, thereby achieving heat dissipation of the electronic device 14.

[0074] This application embodiment does not limit the cross-sectional shape of the heat dissipation duct 16. For example, the cross-section of the heat dissipation duct 16 can be an annular shape, a spiral shape, or an irregular annular shape. The heat dissipation duct 16 of a corresponding shape can be set according to the specific distribution of electronic components 14 on the circuit board 11.

[0075] Fan 17 can be installed in the first air duct 31, the second air duct 32, the third air duct 33, and the fourth air duct 34 (e.g. Figure 5 As shown), it can also be set at the junction of any two air duct sections (such as...). Figure 2 (As shown). It is understood that in embodiments where the fan 17 is disposed within the first air duct 31, the second air duct 32, the third air duct 33, and the fourth air duct 34, the fan 17 may be an axial fan 17. The exhaust direction of the axial fan 17 is parallel to the intake direction, which allows the intake and exhaust directions of the fan 17 to be parallel to the extension directions of the first air duct 31, the second air duct 32, the third air duct 33, and the fourth air duct 34, thereby allowing air to flow within the heat dissipation air duct 16.

[0076] Please refer to Figure 2 and Figure 5 In embodiments where the fan 17 is positioned at the junction of any two air duct sections, the fan 17 can be an axial fan or a centrifugal fan. The outlet direction of the centrifugal fan 17 is perpendicular to the inlet direction. By positioning the fan 17 at the junction, the air can be redirected within the cooling air duct 16, reducing energy loss caused by the redirection when the air flows from the first air duct 31 to the second air duct 32.

[0077] In addition, in the embodiment where the fan 17 is located at the junction, the fan 17 can drive the airflow in the heat dissipation duct 16 and ensure the integrity of the heat dissipation teeth 21. While ensuring the airflow in the heat dissipation duct 16, the length of the heat dissipation teeth 21 is also ensured, thereby ensuring the contact area between the air and the cover plate 20 and ensuring the heat dissipation capacity of the photovoltaic inverter 10.

[0078] Continue to refer to Figure 2 and Figure 5 In the above embodiment, the first enclosure 41 includes a first plate 51, a second plate 52, a third plate 53 and a fourth plate 54. The first plate 51 and the third plate 53 are arranged in parallel and spaced apart, the second plate 52 and the fourth plate 54 are arranged in parallel and spaced apart, and the second plate 52 and the fourth plate 54 are connected between the first plate 51 and the third plate 53.

[0079] The second enclosure 42 includes a fifth plate 55, a sixth plate 56, a seventh plate 57, and an eighth plate 58. The fifth plate 55 and the seventh plate 57 are arranged in parallel and spaced apart, and the sixth plate 56 and the eighth plate 58 are arranged in parallel and spaced apart. The sixth plate 56 and the eighth plate 58 are connected between the fifth plate 55 and the seventh plate 57.

[0080] The first plate 51 and the fifth plate 55 form the first air duct 31, the second plate 52 and the sixth plate 56 form the second air duct 32, the third plate 53 and the seventh plate 57 form the third air duct 33, and the fourth plate 54 and the eighth plate 58 form the fourth air duct 34.

[0081] It is understood that in the above embodiment, the cross-section of the air duct structure 15 is a loop. The air duct structure 15 includes a first enclosure plate 41 and a second enclosure plate 42. The first enclosure plate 41 and the second enclosure plate 42 are of regular shape, which can reduce the processing difficulty and processing cost of the air duct structure. The first enclosure plate 41 and the second enclosure plate 42 form a heat dissipation air duct 16, allowing air to flow within the heat dissipation air duct 16, carrying away the heat of the electronic device 14, thereby achieving heat dissipation of the electronic device 14.

[0082] In some embodiments, the first plate 51, the second plate 52, the third plate 53 and the fourth plate 54 are an integral structure, and the fifth plate 55, the sixth plate 56, the seventh plate 57 and the eighth plate 58 are an integral structure, which can reduce the processing difficulty and processing cost of the first enclosure plate 41 and the second enclosure plate 42.

[0083] Please refer to Figure 6In the above embodiments, at least one fan 17 includes a plurality of fans 17, which are interconnected, and the air outlet of one fan 17 is connected to the air inlet of the next fan 17 in its air outlet direction. This application embodiment does not limit the position of the fans 17. For example, the plurality of fans 17 can be arranged in the same section of the heat dissipation duct 16; the plurality of fans 17 can also be arranged in different sections.

[0084] Multiple fans 17 are interconnected, with the air outlet of one fan 17 connected to the air inlet of the next fan 17 in its air outlet direction. This allows the air in the heat dissipation duct 16 to flow in a certain direction, thereby improving the heat exchange rate between the air and the electronic device 14, as well as between the air and the cover plate 20.

[0085] It is understandable that the flow of air within the heat dissipation duct 16 leads to energy dissipation. Simultaneously, the collisions between the air and the heat dissipation fins 21 or the duct structure 15 during the flow also result in energy loss, causing the airflow velocity to gradually decrease. The presence of multiple fans 17 increases the work done by the fans on the air, offsetting the energy loss during airflow and improving the stability of the airflow velocity within the heat dissipation duct 16. This ensures the heat dissipation effect of the electronic components 14 on the circuit board 11, thereby ensuring the performance of the photovoltaic inverter 10. Figure 5 (As shown) is working normally.

[0086] In some embodiments, the plurality of fans 17 may be arranged symmetrically about the center of the heat dissipation duct 16. For example, in an embodiment where the cross-section of the heat dissipation duct 16 is annular, the center of the heat dissipation duct 16 is the center of the annulus; in an embodiment where the cross-section of the heat dissipation duct 16 is a loop, the center of the heat dissipation duct 16 is the intersection of the diagonals.

[0087] The multiple fans 17 are arranged symmetrically about the center of the heat dissipation duct 16, which ensures that the air flows a consistent distance after passing through each fan 17. In other words, the energy loss of the air after passing through each fan 17 is almost the same. With the same work done by each fan 17, the air velocity before reaching the next fan 17 is almost the same, making the air velocity in the heat dissipation duct 16 more uniform. This allows for a more uniform heat dissipation rate for the electronic components 14, preventing local overheating of the electronic components 14 and thus affecting the heat dissipation effect of the photovoltaic inverter 10.

[0088] Please refer to Figure 7In the above embodiments, at least one air duct structure 15 includes multiple air duct structures 15, which are spaced apart on the surface of the cover plate 20 facing the circuit board 11. The electronic device 14 includes a third device 143 and a fourth device 144. The third device 143 is located within a heat dissipation air duct 16 formed by the cover plate 20, the circuit board 11, and one air duct structure 15, and the fourth device 144 is located within a heat dissipation air duct 16 formed by the cover plate 20, the circuit board 11, and another air duct structure 15.

[0089] The presence of multiple air duct structures 15 increases the contact area between air and the cover plate 20 while reducing the airflow distance within each air duct structure 15. This reduces energy loss during airflow within each air duct structure 15, increases airflow velocity within each air duct structure 15, and consequently improves the performance of the photovoltaic inverter 10. Figure 5 (as shown) heat dissipation capacity.

[0090] Electronic device 14 includes a third device 143 and a fourth device 144. The third device 143 is located within a heat dissipation duct 16 formed by the cover plate 20, the circuit board 11, and a duct structure 15. The fourth device 144 is located within another heat dissipation duct 16 formed by the cover plate 20, the circuit board 11, and another duct structure 15. That is, each duct structure 15 covers a portion of the circuit board 11, and one or more electronic devices 14 are correspondingly disposed within the heat dissipation duct 16. Multiple duct structures 15 can realize the circuit board 11 ( Figure 4 The upper partition heats up to improve the heat dissipation rate of the photovoltaic inverter 10.

[0091] Meanwhile, the air duct structure 15 can divide the electronic components 14 on the circuit board 11 into zones according to their heat generation levels, avoiding temperature cascading between high-temperature and low-temperature electronic components 14, which could cause the low-temperature electronic components 14 to overheat. The spaced arrangement of multiple air duct structures 15 can further prevent temperature cascading between adjacent areas, which could cause overheating of the electronic components 14 within the entire area and affect their normal operation.

[0092] It is understood that at least one fan 17 is provided in each air duct structure 15 to ensure airflow within the heat dissipation air duct 16. This application embodiment does not limit the position and number of fans 17; the position and number of fans 17 in each air duct structure 15 can be adjusted according to actual heat dissipation requirements. For example, in embodiments where the air duct structure 15 includes electronic devices 14 that generate significant heat, such as capacitors and inductors, multiple fans 17 can be provided in the air duct structure 15 to improve the heat dissipation rate within the air duct structure 15. In embodiments where the air duct structure 15 includes electronic devices 14 that generate less heat, such as resistors, only one fan 17 can be provided in the air duct structure 15 to ensure airflow within the heat dissipation air duct 16.

[0093] This application embodiment does not limit the airflow direction within each air duct structure 15. For example, the airflow direction within two adjacent air duct structures 15 can be the same (e.g., Figure 8 As shown), it can also be the opposite (as shown). Figure 7 (As shown).

[0094] Continue to refer to Figure 4 In the above embodiments, the housing 12 includes a back plate 23, which is disposed facing the circuit board 11. The circuit board 11 is located between the cover plate 20 and the back plate 23. A power device 24 is disposed on the surface of the circuit board 11 facing the back plate 23. This application embodiment does not limit the power device 24. For example, the power device 24 may include a power transistor.

[0095] A heat sink 25 is disposed on the side of the backplate 23 facing away from the circuit board 11. It is understood that the power device 24 generates heat during operation. The heat sink 25 on the side of the backplate 23 facing away from the circuit board allows the heat from the power device 24 to be transferred through the backplate 23 to the heat sink 25, and then from the heat sink 25 to the outside, thereby achieving heat dissipation for the power device 24 and ensuring its normal operation. This application embodiment does not limit the heat sink 25. For example, the heat sink 25 may include a fan and heat sink fins; heat dissipation may also include a liquid cooling plate. In embodiments where the heat sink 25 includes a fan and heat sink fins, the heat sink fins can contact the power device 24, and the fan drives airflow through the heat sink fins to cool the heat sink fins, thereby achieving cooling of the power device 24.

[0096] In embodiments where the heat sink 25 includes a liquid cooling plate, a coolant is disposed within the cavity enclosed by the liquid cooling plate. The liquid cooling plate contacts the power device 24 or the backplate 23, transferring heat from the power device 24 to the coolant to cool the power device 24. The heat sink 25 may also include a refrigeration device connected to the liquid cooling plate. The coolant can circulate within the cavity enclosed by the refrigeration device and the liquid cooling plate. Simultaneously, the refrigeration device can supply low-temperature coolant to the cavity enclosed by the liquid cooling plate to ensure effective cooling of the power device 24.

[0097] Power devices 24 are disposed on the surface of circuit board 11 facing back plate 23. Power devices 24 and electronic devices 14 are located on different sides of circuit board 11, which can make the layout on circuit board 11 more dispersed, increase the heat dissipation space of electronic devices 14 and power devices 24, and make the heat dissipation of electronic devices 14 and power devices 24 more sufficient.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A photovoltaic inverter, characterized in that, The photovoltaic inverter comprises: a circuit board; a housing, the housing enclosing a first cavity, the circuit board being arranged in the first cavity, the housing comprising a cover plate facing the circuit board, a surface of the cover plate facing the circuit board being provided with electronic devices; at least one air duct structure, the air duct structure comprising a first surrounding plate and a second surrounding plate arranged on the surface of the cover plate facing the circuit board, the second surrounding plate being located inside the first surrounding plate, one end of the first surrounding plate away from the cover plate being in abutment with the circuit board, one end of the second surrounding plate away from the cover plate being in abutment with the circuit board, the cover plate, the circuit board, the first surrounding plate and the second surrounding plate enclosing a heat dissipation air duct, the electronic devices being located in the heat dissipation air duct; at least one fan, the fan being arranged in the heat dissipation air duct, the fan being used to drive the air flow in the heat dissipation air duct.

2. The photovoltaic inverter of claim 1, wherein, The fan is arranged on the surface of the cover plate facing the circuit board, a plane where an air inlet of the fan is located being perpendicular to the circuit board, a plane where an air outlet of the fan is located being perpendicular to the circuit board.

3. The photovoltaic inverter according to claim 1 or 2, characterized in that The heat dissipation air duct is further provided with a plurality of heat dissipation fins, the heat dissipation fins being connected with the cover plate and extending towards the circuit board, and in a direction parallel to the circuit board, an extending direction of each of the heat dissipation fins is parallel to an extending direction of the heat dissipation air duct.

4. The photovoltaic inverter of claim 3, wherein, In a direction perpendicular to the circuit board, the electronic devices comprise a first device and a second device, a length of the first device being greater than a length of the second device, a length of the heat dissipation fin corresponding to the first device being less than a length of the heat dissipation fin corresponding to the second device.

5. The photovoltaic inverter according to claim 3 or 4, characterized in that In a direction perpendicular to the circuit board, the heat dissipation fins are arranged in a spaced manner with the electronic devices.

6. The photovoltaic inverter according to claim 3 or 4, characterized in that In a direction perpendicular to the circuit board, the heat dissipation fins are in contact with the electronic devices.

7. The photovoltaic inverter of claim 6, wherein, In a direction perpendicular to the circuit board, the heat dissipation fins are in contact with the circuit board.

8. The photovoltaic inverter according to claim 6 or 7, characterized in that The photovoltaic inverter further comprises a heat conduction pad, the heat conduction pad being arranged between the heat dissipation fins and the electronic devices, the heat conduction pad being in contact with the heat dissipation fins and the electronic devices respectively.

9. The photovoltaic inverter according to any of claims 1 to 8, characterized in that The heat dissipation air duct comprises a first section air duct, a second section air duct, a third section air duct and a fourth section air duct, an air outlet of the first section air duct being in communication with an air inlet of the second section air duct, an air outlet of the second section air duct being in communication with an air inlet of the third section air duct, an air outlet of the third section air duct being in communication with an air inlet of the fourth section air duct, an air outlet of the fourth section air duct being in communication with an air inlet of the first section air duct.

10. The photovoltaic inverter of claim 9, wherein, The first surrounding plate comprises a first plate body, a second plate body, a third plate body and a fourth plate body, the first plate body and the third plate body being arranged in parallel and in a spaced manner, the second plate body and the fourth plate body being arranged in parallel and in a spaced manner, the second plate body and the fourth plate body being connected between the first plate body and the third plate body; The second surrounding plate comprises a fifth plate body, a sixth plate body, a seventh plate body and an eighth plate body, the fifth plate body and the seventh plate body are arranged in parallel and at intervals, the sixth plate body and the eighth plate body are arranged in parallel and at intervals, and the sixth plate body and the eighth plate body are connected between the fifth plate body and the seventh plate body; The first plate body and the fifth plate body form the first section of the air duct, the second plate body and the sixth plate body form the second section of the air duct, the third plate body and the seventh plate body form the third section of the air duct, and the fourth plate body and the eighth plate body form the fourth section of the air duct.

11. The photovoltaic inverter according to any of claims 1 to 10, characterized in that The at least one fan comprises a plurality of fans, and the plurality of fans are in communication with each other, wherein an air outlet of one of the fans is in communication with an air inlet of a next fan in the air outlet direction of the one of the fans.

12. The photovoltaic inverter according to any of claims 1 to 11, characterized in that The at least one air duct structure comprises a plurality of air duct structures, and the plurality of air duct structures are arranged at intervals on a surface of the cover plate facing the circuit board, the electronic device comprises a third device and a fourth device, the third device is located in a heat dissipation air duct formed by the cover plate, the circuit board and one of the air duct structures, and the fourth device is located in a heat dissipation air duct formed by the cover plate, the circuit board and another of the air duct structures.

13. The photovoltaic inverter according to any of claims 1 to 12, characterized in that The shell comprises a back plate, the back plate is arranged on a side of the circuit board facing away from the electronic device, the circuit board is located between the cover plate and the back plate, a surface of the circuit board facing the back plate is provided with a power device, and the back plate away from the circuit board is provided with a heat sink.

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