High-temperature liquid supply system and semiconductor manufacturing apparatus

Abstract

The utility model provides a high-temperature liquid supply system and a semiconductor manufacturing device. The high-temperature liquid supply system comprises a tank body, an outer circulation pipeline, a nozzle and a first valve. The tank body is used for storing liquid with a preset temperature range. The outer circulation pipeline is connected with the tank body to convey liquid. The first valve is arranged on the outer circulation pipeline and used for adjusting the liquid to be small in flow and conveying the small-flow liquid to the nozzle, and the rest liquid flows back to the groove body.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a high-temperature liquid supply system and a semiconductor manufacturing device. BACKGROUND

[0002] In the cleaning and etching process of a wafer, it is required that a nozzle can stably spray a small flow and high-temperature chemical liquid to the wafer surface. However, if the chemical liquid tank is directly heated to a high temperature, since the chemical liquid conveying pipeline is relatively long, significant heat loss will occur during the transmission process, which makes it difficult to maintain accurate control of the temperature of the chemical liquid finally reaching the nozzle, further affecting the stability of the process.

[0003] In the prior art, in order to solve the above problems, a heating element is installed near the nozzle to compensate for the heat loss in the conveying process. Although it can theoretically improve the temperature control of the chemical liquid, in practice, it will face the risk of corrosion of the chemical liquid to the heating element. Since the cleaning and etching process involves strong acid chemicals, the wire and heating sheet of the heating element are exposed to the acid gas environment for a long time, which may affect its stability and service life due to corrosion, thereby increasing the equipment maintenance cost and downtime risk.

[0004] Therefore, it is necessary to provide a high-temperature liquid supply system and a semiconductor manufacturing device to solve the above technical problems. SUMMARY

[0005] To solve the above problems of the prior art, the purpose of the present application is to provide a high-temperature liquid supply system and a semiconductor manufacturing device which can stably convey liquid under the conditions of micro-flow and high temperature, and solve the problems of heat loss, insufficient micro-flow stability and acid resistance of the equipment in the prior art.

[0006] In a first aspect, the present application provides a high-temperature liquid supply system, comprising: a tank for storing and maintaining a liquid with a predetermined temperature range; an outer circulation pipeline connected to the tank and forming an outer circulation loop to convey the liquid, wherein the outer circulation pipeline comprises: a main path, one end of the main path being connected to a liquid outlet of the tank; a first shunt path, one end of the first shunt path being connected to a liquid inlet of the tank; and a second shunt path, one end of the second shunt path being connected to a node together with the other end of the main path and the other end of the first shunt path; a nozzle connected to the other end of the second shunt path for spraying the liquid with the predetermined temperature range to the wafer surface; and a first valve arranged on the second shunt path for adjusting the liquid to a small flow, and conveying the small flow of the liquid to the nozzle, and wherein the rest of the liquid is returned to the tank through the first shunt path.

[0007] In some embodiments, the high-temperature liquid supply system further includes a second valve disposed on the main path for controlling the total flow rate of the liquid delivered from the tank to the external circulation pipeline.

[0008] In some embodiments, the high-temperature liquid supply system further includes a third valve disposed on the first diversion path for controlling the flow rate of the liquid returning to the tank.

[0009] In some embodiments, the high-temperature liquid supply system further includes an internal circulation pipeline connected to the tank and forming an internal circulation loop.

[0010] In some embodiments, the high-temperature liquid supply system further includes: a first switching valve disposed on the main path of the external circulation pipeline for selectively opening or closing the external circulation loop; and a second switching valve disposed on the internal circulation pipeline for selectively opening or closing the internal circulation loop.

[0011] In some embodiments, the high-temperature liquid supply system further includes a temperature sensor disposed on the tank and / or the nozzle for measuring the temperature of the liquid in the tank and / or the nozzle.

[0012] Secondly, this application also provides a semiconductor manufacturing apparatus, comprising: a wafer holding section rotatable about an axis and configured to hold a wafer; a tank for storing and maintaining a liquid having a predetermined temperature range; an external circulation pipeline connected to the tank and forming an external circulation loop to transport the liquid, wherein the external circulation pipeline includes: a main path, one end of which is connected to the outlet of the tank; a first diversion path, one end of which is connected to the inlet of the tank; and a second diversion path, one end of which, together with the other end of the main path and the other end of the first diversion path, is connected to a node; a nozzle connected to the other end of the second diversion path and correspondingly disposed with the wafer holding section for spraying the liquid having the predetermined temperature range onto the surface of the wafer; and a first valve disposed on the second diversion path for adjusting the liquid to a small flow rate and delivering the small flow rate of liquid to the nozzle, wherein the remaining liquid flows back to the tank through the first diversion path.

[0013] In some embodiments, the semiconductor manufacturing apparatus further includes a second valve disposed on the main path for controlling the total flow rate of the liquid delivered from the tank to the external circulation pipeline.

[0014] In some embodiments, the semiconductor manufacturing apparatus further includes a third valve disposed on the first diversion path for controlling the flow rate of the liquid returning to the tank.

[0015] In some embodiments, the semiconductor manufacturing apparatus further includes an internal circulation pipeline connected to the tank and forming an internal circulation loop.

[0016] In some embodiments, the semiconductor manufacturing apparatus further includes: a first switching valve disposed on the main path of the external circulation pipeline for selectively opening or closing the external circulation loop; and a second switching valve disposed on the internal circulation pipeline for selectively opening or closing the internal circulation loop.

[0017] In some embodiments, the semiconductor manufacturing apparatus further includes a temperature sensor disposed on the tank and / or the nozzle for measuring the temperature of the liquid within the tank and / or the nozzle.

[0018] Compared to previous technologies, this application effectively ensures that the liquid at the nozzle can be stably delivered at a small flow rate while maintaining it within the temperature range required by the process by prioritizing the output of a large flow rate of high-temperature liquid and cooperating with a precise flow distribution system. Attached Figure Description

[0019] The following detailed description of the specific embodiments of this application, in conjunction with the accompanying drawings, will make the technical solution and other beneficial effects of this application readily apparent.

[0020] Figure 1 A schematic diagram of a semiconductor manufacturing apparatus according to an embodiment of this application is shown.

[0021] Figure 2 show Figure 1 An enlarged view of part A of the semiconductor manufacturing apparatus.

[0022] Figure 3 A flowchart illustrating a high-temperature liquid supply method according to an embodiment of this application is shown. Detailed Implementation

[0023] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0024] With the continuous development of semiconductor technology, the requirements for process precision and stability are also increasing. This is especially true in wafer cleaning and etching processes, where micro-flow control and high-precision temperature stability of the chemical solutions are paramount. Current technologies face several challenges in addressing these issues: First, due to the long-distance transport of the chemical solution tank, the solution is prone to heat loss during its flow through the pipes, making it difficult to maintain a stable high temperature. This poses a significant challenge for processes requiring operation at high temperatures (e.g., 80±1℃). Second, maintaining micro-flow stability is also a challenge, particularly in single-wafer cleaning and etching equipment where the chemical solution needs to be sprayed at an extremely low flow rate (e.g., 100ml / min), placing higher demands on existing technologies. Furthermore, while traditional methods using heating elements at the nozzle can solve some heating problems, prolonged exposure to acidic environments can easily cause equipment corrosion, shortening its lifespan and increasing maintenance costs. To address these issues, this application provides a high-temperature liquid supply system and a semiconductor manufacturing apparatus. By utilizing the continuous circulation of high-flow-rate and high-temperature fluids, the heat loss problem can be effectively solved. At the same time, by combining precise flow control with a needle valve, stable delivery of micro-flow (e.g., 100 ml / min) and high-temperature (e.g., 80 ± 1 °C) pharmaceutical solutions can be achieved. The specific details are as follows.

[0025] Please refer to Figure 1 This diagram illustrates a semiconductor manufacturing apparatus according to an embodiment of this application. The semiconductor manufacturing apparatus 1 includes a high-temperature liquid supply system 10 and a wafer holding section 20. The wafer holding section 20 is designed to rotate about an axis to stably support and hold the wafer 30, ensuring stable positioning and rotational movement during processing. The high-temperature liquid supply system 10 is responsible for maintaining and supplying high-temperature liquid, ensuring its accurate delivery to the surface of the wafer 30 at a low and stable flow rate to meet the high-precision requirements of cleaning, etching, or other processes. The high-temperature liquid supply system 10 is specifically designed to provide precise liquid control under high-temperature conditions, avoiding fluctuations in liquid temperature or flow rate, thereby improving process stability and consistency, and ensuring the efficiency and precision of wafer processing.

[0026] like Figure 1As shown, the high-temperature liquid supply system 10 includes a tank 11, an external circulation pipeline, a nozzle 13, and a first valve 14. The external circulation pipeline consists of a main path 121, a first branch path 122, and a second branch path 123. The main function of the tank 11 is to store and maintain the high-temperature liquid and ensure a stable supply of liquid. To achieve the precise temperature required by the process, the tank 11 is equipped with heating elements that can heat the liquid to the desired target temperature, typically maintained within a predetermined range, such as 80±1℃. In other words, the tank 11 not only stores the liquid but also effectively heats and maintains it within the required temperature range. Furthermore, the liquid can be water or various chemical liquids, selected according to different process requirements.

[0027] like Figure 1 As shown, the external circulation pipeline connects to the tank 11 and forms an external circulation loop, ensuring stable liquid delivery and maintaining the required temperature and flow control. Specifically, one end of the main path 121 of the external circulation pipeline is connected to the outlet 111 of the tank 11, allowing the heated liquid to exit from the tank 11 and enter the external circulation pipeline. The other end of the main path 121 is connected to the first node N1, which serves as a liquid diversion and adjustment point, ensuring that the liquid can be distributed according to different flow requirements. One end of the first diversion path 122 is connected to the inlet 112 of the tank 11, and the other end is connected to the first node N1, allowing liquid not sprayed onto the wafer to flow back to the tank 11, forming a stable circulation mechanism. The second diversion path 123 is responsible for delivering the diverted and regulated liquid to the nozzle 13, with one end connected to the first node N1 and the other end connected to the nozzle 13, ensuring that the liquid can be sprayed onto the surface of the wafer 30 at an appropriate flow rate and temperature. In other words, in this application, when the external circulation loop is activated, the liquid first enters the external circulation pipeline through the main path 121, and the flow rate is distributed at the first node N1 according to process requirements. A portion of the liquid flows back to the tank 11 through the first branch path 122 to maintain liquid circulation and temperature stability within the system; the other portion of the liquid is transported to the nozzle 13 through the second branch path 123, and further sprayed onto the surface of the wafer 30 to achieve cleaning or etching of the wafer.

[0028] In this application, "high-temperature liquid" refers to a liquid with a temperature higher than room temperature, and more specifically, a temperature higher than the ambient temperature of the device or system. The core objective of this application is to ensure that the temperature of the liquid sprayed from nozzle 13 is the same as or very close to the temperature of the liquid stored in tank 11, thereby maintaining process stability and uniformity. During the high-temperature liquid transport process, since a large flow rate of liquid has a higher total heat content than a small flow rate, it can more effectively resist heat loss and maintain a stable high-temperature state during transport. When the system prioritizes the output of a large flow rate of high-temperature liquid, it can improve the thermal balance effect within the system, making the liquid temperature gradient within the pipeline more gradual and reducing local overcooling or overheating. Through appropriate flow distribution and control, it helps to ensure that the liquid temperature at the nozzle is maintained within the process requirement range, such as 80±1℃, avoiding a rapid drop in liquid temperature due to long-distance transport or environmental cooling effects, which could affect the stability and uniformity of the cleaning or etching process. Therefore, by prioritizing the output of a large flow rate, the stability and reliability of the high-temperature liquid supply system in semiconductor processes can be effectively improved, ensuring the accuracy and consistency of critical processes.

[0029] It should be understood that the diversion and flow regulation of the aforementioned liquid are mainly achieved through the first valve 14. For example... Figure 1 As shown, the first valve 14 is located on the second diversion path 123, specifically between the nozzle 13 and the first node N1. The main function of the first valve 14 is to finely regulate the liquid flow rate to the nozzle 13, ensuring it meets the low flow rate output conditions required by the process, such as 100 ml / min. That is, the low flow rate of liquid regulated by the flow rate is delivered to the nozzle 13 through the second diversion path 123. Simultaneously, to maintain the overall flow rate and temperature stability within the system, the remaining liquid not output from the nozzle 13 flows back to the tank 11 through the first diversion path 122. This flow control mechanism ensures that the liquid maintains a predetermined temperature range (e.g., 80 ± 1 °C) before entering the nozzle, thereby improving the accuracy of the process. Furthermore, the remaining liquid flowing back to the tank 11 can still participate in the next round of heating and circulation, improving the overall system's thermal efficiency, reducing energy consumption, and minimizing chemical liquid waste, thus enhancing the economic benefits and environmental performance of the process.

[0030] In some embodiments, the first valve 14 employs a high-precision needle valve design to achieve precise control of the liquid flow rate. Specifically, please refer to... Figure 2 Its display Figure 1 An enlarged view of part A of the semiconductor manufacturing apparatus. Figure 2The first valve 14, employing a needle valve design, is shown. The needle valve's structural characteristics allow for flexible adjustment of the liquid output according to process requirements, ensuring a stable supply of liquid to the nozzle 13 under varying environmental conditions, thereby achieving optimal cleaning or etching results. Specifically, through the precise control of the needle valve, the micro-flow rate of the liquid can be maintained within a stable range, for example, 100 ml / min, while ensuring that the liquid maintains the target temperature (e.g., 80 ± 1 °C) when delivered to the nozzle. This high-precision flow control mechanism is particularly critical for semiconductor processes, as even minute flow fluctuations can affect etching uniformity or cleaning effectiveness. Furthermore, the needle valve can be flexibly adjusted according to different process stages or material properties, giving the system greater adaptability and meeting various semiconductor manufacturing needs.

[0031] like Figure 1 As shown, the high-temperature liquid supply system 10 of this application further includes a second valve 15 and a pump 18. The pump 18 is located on the main path 121 and is positioned between the outlet 111 of the tank 11 and the second valve 15. The pump 18 is responsible for providing power to the liquid to ensure a stable and continuous delivery of the liquid. The second valve 15 is located on the main path 121 and is used to control the total flow rate of the liquid delivered from the tank 11 to the external circulation pipeline. Through the precise control of the second valve 15, the system can flexibly adjust the liquid supply (e.g., 2000 ml / min) according to process requirements, ensuring that the liquid flow rate and temperature are maintained within the optimal operating conditions to meet the high precision requirements of cleaning or etching processes.

[0032] like Figure 1 As shown, the high-temperature liquid supply system 10 of this application further includes a third valve 16. The third valve 16 is disposed on the first diversion path 122 and is used to control the flow rate of liquid returning to the tank 11. Through the dynamic control of the third valve 16, the system can flexibly adjust the liquid return rate according to real-time needs to maintain the fluid stability within the circulation system and ensure the uniformity and efficiency of the liquid supply. In the embodiments of this application, the third valve 16 can be a precision needle valve, a proportional valve, or other high-precision regulating valve to adapt to the needs of different process conditions. When the external circulation mode is started, the third valve 16 can work in conjunction with the first valve 14 to achieve optimal distribution of liquid flow between the second diversion path 123 and the first diversion path 122. For example, the first valve 14 controls the small flow rate of high-temperature liquid delivered to the nozzle 13, while the third valve 16 is responsible for regulating the return rate of excess liquid to ensure the continuity of liquid flow and temperature stability within the system.

[0033] It should be understood that in this application, a third valve 16 with flow control function is selected, rather than a valve with only on / off function. This effectively prevents excessive liquid backflow into the tank 11, thereby ensuring a stable liquid volume delivered to the second diversion path 123. If only a simple on / off valve is used, excessive liquid backflow may occur, resulting in insufficient liquid volume delivered to the nozzle 13, which in turn affects the stability and uniformity of the cleaning or etching process. Through the precise flow control of the third valve 16, the system can dynamically adjust the backflow ratio according to process requirements, ensuring a stable delivery of an appropriate amount of high-temperature liquid to the nozzle 13, maintaining the continuity and consistency of liquid supply, and avoiding the impact of flow fluctuations on process results.

[0034] like Figure 1 As shown, the high-temperature liquid supply system 10 described in this application further includes an internal circulation pipeline 17, which is connected to the tank 11 to form an internal circulation loop, ensuring that the liquid can still circulate during non-process operation to maintain a stable and uniform high-temperature state within the tank 11. Furthermore, the system also includes a first switching valve 124 and a second switching valve 171, which control the opening and closing of the external circulation pipeline 17 and the internal circulation pipeline 17, respectively. The first switching valve 124 and the second switching valve 171 can be electric valves, pneumatic valves, or high-precision mechanical valves, but are not limited to these.

[0035] Specifically, such as Figure 1 As shown, the first switching valve 124 is located on the main path 121 of the external circulation pipeline. Its function is to control the opening and closing of the external circulation loop, allowing the liquid to selectively flow through the external circulation pipeline according to process requirements. The second switching valve 171 is located on the internal circulation pipeline 17 and is used to control the start and stop of the internal circulation loop. Through the coordinated control of these two switching valves, the system can dynamically adjust its operating mode according to real-time needs, ensuring the stability of liquid supply and the efficiency of the process.

[0036] In practical applications, the internal circulation pipeline 17 and the external circulation pipeline are usually selectively used; that is, when the internal circulation pipeline 17 is open, the external circulation pipeline is closed, and vice versa. The internal circulation mode is mainly used when the liquid is not temporarily supplied to the wafer, keeping the liquid circulating between the tank and the pipeline to prevent stagnation that could lead to a drop in temperature or changes in chemical properties. The external circulation mode is used in actual cleaning or etching processes, ensuring that the high-temperature liquid is stably delivered to the nozzle 13 and uniformly applied to the surface of the wafer 30. In addition, to enhance the system's intelligence and precise control capabilities, the first switching valve 124 and the second switching valve 171 can be connected to the process control unit, dynamically adjusting the opening and closing timings based on real-time temperature, flow rate data, and process steps through an automated program. For example, the dynamic switching between internal and external circulation modes can be automated according to process requirements. For instance, during standby, internal circulation mode is used to ensure the liquid maintains the target temperature at all times, reducing preheating time and improving production efficiency. When wafer processing begins, it automatically switches to external circulation mode to ensure a stable, low-flow-rate delivery of high-temperature liquid to the wafer surface. This dual-circulation mechanism not only effectively reduces heat loss in long delivery pipelines but also reduces excessive liquid consumption, extending equipment lifespan and improving the stability and accuracy of semiconductor processes.

[0037] like Figure 1 As shown, the high-temperature liquid supply system 10 described in this application further includes a first temperature sensor 191 and a second temperature sensor 192 to accurately monitor the liquid temperature and ensure output stability. Specifically, the first temperature sensor 191 is disposed inside the tank 11 or near its outlet 111 or inlet 112 to measure the temperature of the liquid in the tank 11 in real time, ensuring that it is maintained within a set range. The second temperature sensor 192 is disposed near the nozzle 13 to directly monitor the temperature of the liquid delivered to the surface of the wafer 30. Through these two sensors, the temperature change of the liquid from the tank 11 to the nozzle 13 can be dynamically monitored, potential heat loss can be identified, and the thermal stability during the delivery process can be evaluated. In addition, the first temperature sensor 191 and the second temperature sensor 192 can be connected to the process control unit to form a real-time feedback control mechanism. When the liquid temperature output from the nozzle 13 is detected to be lower than the preset range, the system can automatically adjust the power output of the heating element in the tank 11 or change the liquid flow rate to ensure that the liquid at the nozzle end is always maintained at the optimal cleaning or etching conditions. In addition, through temperature difference data analysis, the system can also optimize the switching timing of the external circulation pipeline in a timely manner, reduce heat loss, improve liquid utilization efficiency, and further enhance the stability and precision of semiconductor processes.

[0038] In some embodiments, the first temperature sensor 191 and the second temperature sensor 192 may employ thermocouples or other suitable temperature sensing technologies to ensure accurate measurement of liquid temperature and adapt to different process requirements. For example, when a thermocouple is used as the temperature sensor, its sensing end can be directly inserted into the tank 11 or near the outlet of the nozzle 13 to acquire liquid temperature data in real time. Thermocouples are suitable for high-precision temperature control due to their high sensitivity, high temperature resistance, and fast response characteristics. In addition, to improve durability and chemical stability, the temperature sensor may be designed with an anti-corrosion coating, such as a fluoropolymer or ceramic protective tube, to ensure stable operation in high-temperature and strong acid / alkali environments. Alternatively, other types of temperature sensing technologies, such as platinum resistance temperature sensors, thermistors, or infrared non-contact sensors, may be used to meet the needs of different process conditions. For example, platinum resistance temperature sensors provide higher temperature measurement accuracy and long-term stability, making them suitable for precision processes; while infrared temperature sensors are suitable for non-contact measurement of liquid surface temperature, reducing the risk of contamination that may occur due to sensor contact with liquid.

[0039] In the high-temperature liquid supply system 10 of this application, the configuration of the internal circulation pipeline 17 and the external circulation pipeline can be flexibly designed according to actual process requirements. They can share some pipelines or be set up independently to ensure the stability and efficiency of fluid delivery. Specifically, the pipeline design of the internal circulation pipeline 17 and the external circulation pipeline can adopt two modes: a partially shared pipeline design and a completely independent pipeline design. In the partially shared pipeline design, the internal circulation pipeline 17 and the external circulation pipeline share some pipelines to reduce pipeline space occupation and optimize fluid delivery efficiency. For example, as... Figure 1 As shown, the main path 121 of the external circulation pipeline can share a portion of the pipeline with the internal circulation pipeline 17, and the flow can be split at a specific node (such as the second node N2) to ensure that the liquid can flow according to the selected circulation mode. This design helps to reduce pipeline length, reduce heat loss of the liquid during transportation, and improve the overall thermal management efficiency of the system. On the other hand, in some application scenarios, in order to ensure that the liquid flow under different circulation modes does not interfere with each other, the internal circulation pipeline 17 and the external circulation pipeline can be designed as completely independent pipeline systems, avoiding sharing any pipelines. This design can minimize the cross-influence between fluids and is particularly suitable for high-precision processes, ensuring precise control of liquid flow direction, pressure, and temperature.

[0040] This application also provides a high-temperature liquid supply method, which is executed by the aforementioned high-temperature liquid supply system 10, the structure of which is as described above and will not be repeated here. It should be understood that the high-temperature liquid supply system 10 may further include a host computer in addition to the above structure. The host computer is communicatively connected to each component of the high-temperature liquid supply system 10 and includes an electrically connected processor and memory. The processor and memory of the host computer are mounted on a circuit board. The memory is configured to store executable program code. The processor reads the executable program code stored in the memory and runs a program corresponding to this executable program code to execute the high-temperature liquid supply method of this application.

[0041] In this embodiment, the processor is typically configured to control the overall operation of the host. The processor may include one or more processors to execute instructions that perform actions in all or part of the steps of the operation of the high-temperature liquid supply system 10 described above. Furthermore, the processor may include one or more modules that facilitate interaction between the processor and other components. For example, the processor may include a communication module to facilitate interaction between communication components and the processor. The memory is configured to store various types of data to support the operation of the host. Examples of such data include instructions for any application or method operating on the host. The memory may be implemented using any type of volatile or non-volatile memory device or a combination thereof. Power supply circuitry supplies power to various components of the host. The power supply circuitry may include a power management system, one or more power supplies, and any other components associated with the generation, management, and distribution of power to the host. In an exemplary embodiment, the host may be implemented as a separate terminal device or as an electronic component such as a controller or microcontroller integrated into the high-temperature liquid supply system 10.

[0042] Please refer to Figure 3 The flowchart illustrates a high-temperature liquid supply method according to an embodiment of this application. The high-temperature liquid supply method of this application includes: first, providing a high-temperature liquid supply system 10 as described above. Figure 1 As shown, the high-temperature liquid supply system 10 includes a tank 11, an external circulation pipeline, a nozzle 13, and a first valve 14, etc., wherein the external circulation pipeline consists of a main path 121, a first branch path 122, and a second branch path 123. The structures of the plurality of additional components are as described above and will not be repeated here.

[0043] In step S31, the system first selects to activate the external circulation loop and controls the tank to output liquid to the external circulation pipeline. At this time, the liquid in the tank has been heated to a predetermined temperature range, ready for the subsequent supply process.

[0044] Subsequently, in step S32, the liquid flow rate is adjusted to a low flow rate via the first valve 14, and this low flow rate is delivered to the nozzle 13. The liquid flow rate is adjusted to the desired low flow rate. This step ensures that the liquid enters the nozzle at a precise micro-flow rate and is ready to be sprayed onto the wafer surface.

[0045] In step S33, the nozzle 13 is controlled to spray a small flow rate of liquid with a predetermined temperature range onto the wafer surface. Temperature control of the liquid is crucial in this step, ensuring it remains within the ideal range to achieve optimal cleaning or etching results.

[0046] In step S34, the remaining liquid is controlled to flow back to the tank 11 through the external circulation pipeline. That is, when the external circulation loop is activated, the liquid first enters the external circulation pipeline through the main path 121, and the flow rate is distributed by the first valve 14 according to process requirements. This liquid is then appropriately guided to different branch paths. A portion of the liquid flows back to the tank 11 through the first branch path 122, ensuring continuous circulation of the liquid within the system and maintaining a stable temperature environment. Another portion of the liquid is delivered to the nozzle 13 through the second branch path 123 and sprayed to achieve cleaning or etching of the wafer 30 surface.

[0047] In this application, because high-flow-rate liquids have a higher total heat content, they can more effectively resist heat loss and maintain a stable high-temperature state during transmission compared to low-flow-rate liquids. Therefore, when the system prioritizes the delivery of high-flow-rate, high-temperature liquids, it helps improve the overall system's thermal balance, making the liquid temperature gradient in the pipeline more gradual and avoiding localized overcooling or overheating.

[0048] In some embodiments, such as Figure 1 As shown, the high-temperature liquid supply system 10 of this application further includes a third valve 16. The third valve 16 is disposed on the first diversion path 122. Furthermore, in step S31, the method further includes controlling the flow rate of the liquid returning to the tank 11 through the third valve 16.

[0049] In some embodiments, such as Figure 1 As shown, the high-temperature liquid supply system 10 of this application further includes an internal circulation pipeline 17 connecting the tank 11. When the external circulation loop is closed, the high-temperature liquid supply method of this application further includes: controlling the tank to output liquid to the internal circulation pipeline to form an internal circulation loop, so as to ensure that the liquid can still circulate inside the system during non-process operation, thereby maintaining a stable and uniform high-temperature state of the liquid in the tank and avoiding temperature drop or chemical property change due to stagnation.

[0050] In addition, the system includes a first switching valve 124 and a second switching valve 171, which are used to control the opening and closing of the external circulation pipeline and the internal circulation pipeline 17, respectively. In practical applications, the internal circulation pipeline 17 and the external circulation pipeline are usually selectively activated; that is, when the internal circulation pipeline is open, the external circulation pipeline will be closed, and vice versa. Therefore, the high-temperature liquid supply method in this application also includes: when the first switching valve 124 is open, the second switching valve 171 will be automatically closed to activate the external circulation loop; and when the second switching valve 171 is open, the first switching valve 124 will be automatically closed to activate the internal circulation loop. The internal circulation mode is mainly used when the liquid is not supplied to the wafer, which helps to maintain the circulation flow of the liquid between the tank and the pipeline, avoid stagnation, and maintain temperature stability. The external circulation mode is used for actual cleaning or etching processes to ensure that the high-temperature liquid can be stably delivered from the system to the nozzle 13 and uniformly applied to the surface of the wafer 30.

[0051] In some embodiments, such as Figure 1 As shown, the high-temperature liquid supply system 10 described in this application further includes a first temperature sensor 191 and a second temperature sensor 192. The high-temperature liquid supply method of this application also includes controlling the first temperature sensor 191 and the second temperature sensor 192 to measure the temperature of the liquid in the tank 11 and the nozzle 13. Through the coordinated operation of the first temperature sensor 191 and the second temperature sensor 192, the system can promptly identify heat loss and perform real-time assessment of the liquid's thermal stability. Thus, when the liquid flows in the pipeline, the system can accurately detect temperature changes, identify any potential problems, and make timely adjustments to ensure the optimal process environment. Furthermore, these temperature sensors are connected to the host computer, forming an instant feedback control mechanism. When the liquid temperature output from the nozzle 13 is detected to be lower than a preset range, the system automatically adjusts the power output of the heating element in the tank, or adjusts the liquid flow rate to regulate the liquid temperature, ensuring that the liquid at the nozzle end is always maintained under optimal cleaning or etching conditions. Such a temperature control mechanism helps improve process consistency and accuracy, avoiding the impact of temperature deviations on process results.

[0052] In summary, this application effectively ensures that the liquid at the nozzle is stably delivered at a low flow rate while remaining within the temperature range required by the process by prioritizing the output of a large flow rate of high-temperature liquid and employing a precise flow distribution system. This approach effectively avoids a sharp drop in liquid temperature caused by long-distance transport or environmental cooling effects, thus ensuring that the liquid maintains ideal temperature conditions upon reaching the wafer surface. This application not only significantly improves the stability and reliability of high-temperature liquid supply systems in semiconductor processes but also guarantees precise control and consistency at each process step. Such a control strategy not only helps improve process stability but also ensures the quality and process precision of the final product, thereby enhancing overall production efficiency and providing strong support for high-precision semiconductor processes.

[0053] The high-temperature liquid supply system and semiconductor manufacturing apparatus provided in the embodiments of this application have been described in detail above. Specific embodiments have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions in the embodiments of this application.

Claims

1. A high-temperature liquid supply system, characterized in that, include: A tank is used to store and maintain liquids within a predetermined temperature range; An external circulation pipeline, connected to the tank and forming an external circulation loop, for conveying the liquid, wherein the external circulation pipeline comprises: The main path, one end of which is connected to the liquid outlet of the tank; The first diversion path, one end of which is connected to the liquid inlet of the tank; as well as The second branch path, one end of which is connected to the node together with the other end of the main path and the other end of the first branch path; A nozzle, connected to the other end of the second diversion path, is used to spray the liquid having the predetermined temperature range onto the wafer surface; as well as A first valve, disposed on the second diversion path, is used to adjust the liquid to a small flow rate and deliver the small flow rate of the liquid to the nozzle, wherein the remaining liquid flows back to the tank through the first diversion path.

2. The high-temperature liquid supply system as described in claim 1, characterized in that, The high-temperature liquid supply system also includes a second valve, located on the main path, for controlling the total flow rate of the liquid transported from the tank to the external circulation pipeline.

3. The high-temperature liquid supply system as described in claim 1, characterized in that, The high-temperature liquid supply system also includes a third valve, which is located on the first diversion path, for controlling the flow rate of the liquid returning to the tank.

4. The high-temperature liquid supply system as described in claim 1, characterized in that, The high-temperature liquid supply system also includes an internal circulation pipeline that connects to the tank and forms an internal circulation loop.

5. The high-temperature liquid supply system as described in claim 4, characterized in that, The high-temperature liquid supply system also includes: A first switching valve, disposed on the main path of the external circulation pipeline, is used to selectively open or close the external circulation loop; and A second switching valve is installed on the internal circulation pipeline to selectively open or close the internal circulation loop.

6. The high-temperature liquid supply system as described in claim 1, characterized in that, The high-temperature liquid supply system also includes a temperature sensor disposed on the tank and / or the nozzle for measuring the temperature of the liquid in the tank and / or the nozzle.

7. A semiconductor manufacturing apparatus, characterized in that, include: A wafer holder, rotatable about an axis, is configured to support the wafer. A tank is used to store and maintain liquids within a predetermined temperature range; An external circulation pipeline, connected to the tank and forming an external circulation loop, for conveying the liquid, wherein the external circulation pipeline comprises: The main path, one end of which is connected to the liquid outlet of the tank; The first diversion path, one end of which is connected to the liquid inlet of the tank; as well as The second branch path, one end of which is connected to the node together with the other end of the main path and the other end of the first branch path; A nozzle, connected to the other end of the second diversion path and correspondingly disposed to the wafer holding portion, is used to spray the liquid having the predetermined temperature range onto the wafer surface; as well as A first valve, disposed on the second diversion path, is used to adjust the liquid to a small flow rate and deliver the small flow rate of the liquid to the nozzle, wherein the remaining liquid flows back to the tank through the first diversion path.

8. The semiconductor manufacturing apparatus as claimed in claim 7, characterized in that, The semiconductor manufacturing apparatus further includes a second valve disposed on the main path for controlling the total flow rate of the liquid delivered from the tank to the external circulation pipeline.

9. The semiconductor manufacturing apparatus as claimed in claim 7, characterized in that, The semiconductor manufacturing apparatus further includes a third valve disposed on the first diversion path for controlling the flow rate of the liquid returning to the tank.

10. The semiconductor manufacturing apparatus as claimed in claim 7, characterized in that, The semiconductor manufacturing apparatus also includes an internal circulation pipeline that connects to the tank and forms an internal circulation loop.

11. The semiconductor manufacturing apparatus as claimed in claim 10, characterized in that, The semiconductor manufacturing apparatus further includes: A first switching valve, disposed on the main path of the external circulation pipeline, is used to selectively open or close the external circulation loop; and A second switching valve is installed on the internal circulation pipeline to selectively open or close the internal circulation loop.

12. The semiconductor manufacturing apparatus as claimed in claim 7, characterized in that, The semiconductor manufacturing apparatus further includes a temperature sensor disposed on the tank and / or the nozzle for measuring the temperature of the liquid in the tank and / or the nozzle.

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