Electronic package
By placing a protective layer on the optical device within the semiconductor package and removing the protective layer after dicing, the problem of removing dicing residue is solved, thus improving the yield of the package.
Patent Information
- Application Number
- CN202422759412.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-11-06
- Filing Date
- 2024-11-12
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2034-11-12
AI Technical Summary
In existing semiconductor packaging technology, when cutting residue 10a is generated during cutting, the cutting residue 10a between the photonic integrated circuit element 13 and the fan-out module 10 is difficult to remove, which affects the yield of the package.
Optical devices are installed on the electronic module and a protective layer is formed. The protective layer is removed after cutting to remove cutting waste and prevent damage to the optical devices.
This effectively avoids damage to optical devices from cutting waste and improves the yield of packaged components.
Smart Images
Figure CN223928822U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor packaging structure and an electronic package and its manufacturing method. Background Technology
[0002] With the booming development of the electronics industry, electronic products are trending towards multifunctionality and high performance. In particular, the demand for data transmission has surged, leading the industry to replace electricity with light as the data transmission medium. This aims to improve transmission capacity, efficiency, and / or distance, while reducing energy consumption during transmission. Against this backdrop, co-packaged optics structures and technologies, encompassing both optical (photonic) and optoelectronic components, have become a future trend in semiconductor and packaging technologies.
[0003] Figures 1A to 1C This is a schematic diagram of existing semiconductor packaging processes. Figure 1C Then it is Figure 1B A partial top-view diagram.
[0004] First, the fan-out module 10 is adhered to a carrier plate 12 via an adhesive layer 11. Electronic integrated circuit (EIC) components 104 are embedded in the molding compound (M / C) 103 of the fan-out module 10. Next, a first cut is made along longitudinal grooves to remove portions of the fan-out module 10 located along these grooves, forming multiple longitudinal trenches 101. Then, photonic integrated circuit (PIC) components 13 are placed on top of the fan-out module 10, and the photonic integrated circuit components 13 are then fixedly attached to the fan-out module 10 by thermoforming. After all photonic integrated circuit components 13 are fixedly attached to the fan-out module 10, the remaining components are then... Figure 1C Each of the transverse slits 102 shown is then cut a second time. Finally, the carrier plate 12 and the adhesive layer 11 are removed to obtain multiple semiconductor packages.
[0005] However, the cutting residue 10a generated during the aforementioned cutting operation will run into the space between the photonic integrated circuit element 13 and the fan-out module 10, making subsequent cleaning difficult. As a result, the cutting residue 10a remains on the photonic integrated circuit element 13, which in severe cases will affect the yield of the semiconductor package.
[0006] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0007] To address the aforementioned issues, this application provides an electronic package comprising: an electronic module; an optical device disposed on and electrically connected to the electronic module; and a protective layer formed on the outer surface of the optical device.
[0008] This application also provides a method for manufacturing an electronic package, comprising: disposing of a plurality of electronic modules on a first carrier, wherein the plurality of electronic modules are spaced apart by mutually perpendicular first direction cutting channels and second direction cutting channels, and performing a cutting operation on the first direction cutting channel; disposing of an optical device on the electronic module; forming a protective layer on the outer surface of the optical device; performing a cutting operation on the second direction cutting channel to separate each electronic module; and removing the protective layer.
[0009] The aforementioned electronic package and its manufacturing method further include: performing a first cleaning on the outer surface of the optical device to remove the protective layer on the upper and side surfaces of the optical device.
[0010] The aforementioned electronic package and its manufacturing method further include: inverting the electronic module with the optical device so that one side of the optical device is attached to the second carrier and removing the first carrier.
[0011] The aforementioned electronic package and its manufacturing method further include: performing a second cleaning on the outer surface of the optical device to remove the protective layer on the lower surface of the optical device.
[0012] In the aforementioned electronic packaging components and their manufacturing methods, multiple electronic modules are arranged in an array in a wafer or panel form.
[0013] In the aforementioned electronic package and manufacturing method thereof, the electronic module includes a circuit structure, an electronic component disposed on the circuit structure and electrically connected to the circuit structure and a plurality of conductive pillars, a covering layer formed on the circuit structure to cover the electronic component and the plurality of conductive pillars, and a wiring structure formed on the covering layer and electrically connected to the electronic component and the plurality of conductive pillars.
[0014] In the aforementioned electronic package and its manufacturing method, the electronic component is an electronic integrated circuit component.
[0015] In the aforementioned electronic package and its manufacturing method, the electronic module also includes multiple conductive elements disposed on the other side of the circuit structure.
[0016] In the aforementioned electronic packaging components and their manufacturing methods, the optical device is an optical chip module or an optical chip.
[0017] In the aforementioned electronic packaging components and their manufacturing methods, the optical chip module includes a coupler, an optical chip, a total reflection mirror, and an optical fiber array unit.
[0018] Therefore, the electronic package and its manufacturing method of this application mainly involve placing the optical device on the electronic module and forming a protective layer on its surface after the electronic module is cut in the first direction. After the electronic module is cut in the second direction, even if cutting waste is generated, the cutting waste will only adhere to the protective layer. Subsequently, the cutting waste can be removed by removing the protective layer and removing the cutting waste attached to it, thus avoiding damage to the optical device or affecting the yield of the electronic package. Attached Figure Description
[0019] Figures 1A to 1C This is a cross-sectional schematic diagram of the manufacturing process of existing semiconductor packages.
[0020] Figures 2A to 2G This is a cross-sectional schematic diagram of the electronic package and manufacturing method of this application.
[0021] Explanation of reference numerals in the attached figures
[0022] 10 Fan-out Modules
[0023] 10a Cutting residue
[0024] 101 Longitudinal trench
[0025] 102 Horizontal Cutting Channel
[0026] 103 Encapsulating Adhesive
[0027] 104 Electronic Integrated Circuit Components
[0028] 11 Adhesive layer
[0029] 12 carrier boards
[0030] 13 Photonic integrated circuit elements
[0031] 201 First load-bearing component
[0032] 202 Second bearing component
[0033] 21 Electronic Modules
[0034] 21a Cutting waste
[0035] 211 Circuit Structure
[0036] 212 Electronic Components
[0037] 213 Conductive Post
[0038] 214 Coating Layer
[0039] 215 Wiring Structure
[0040] 216 Conductive Components
[0041] 22 Optical devices
[0042] 23. Protective layer. Detailed Implementation
[0043] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0044] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "below," "one," "first," and "second" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0045] Please see Figures 2A to 2G This is a cross-sectional schematic diagram illustrating the manufacturing method of the electronic package of this application.
[0046] like Figure 2A As shown, a plurality of electronic modules 21 are disposed on the first carrier 201 (for the sake of simplification, only a single electronic module 21 is shown in this embodiment). The plurality of electronic modules 21 are arranged in an array in a wafer form or a panel form, and the plurality of electronic modules 21 are spaced apart by mutually perpendicular first direction cutting channels (longitudinal cutting channels) and second direction cutting channels (transverse cutting channels), and cutting operations are performed on the first direction cutting channels.
[0047] The electronic module 21 includes a circuit structure 211, an electronic component 212 disposed on the circuit structure 211 and electrically connected to the circuit structure, a plurality of conductive pillars 213, a covering layer 214 formed on the circuit structure 211 to cover the electronic component 212 and the plurality of conductive pillars 213, and a wiring structure 215 formed on the covering layer 214 and electrically connected to the electronic component 212 and the plurality of conductive pillars 213.
[0048] The circuit structure 211 includes an insulating layer and a circuit layer bonded to the insulating layer. For example, the material forming the circuit layer may be copper or other conductive material, and the material forming the insulating layer may be polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or other dielectric material.
[0049] The electronic component 212 is, for example, an electronic integrated circuit (EIC) component.
[0050] The material forming the conductive post 213 can be copper or other conductive materials.
[0051] The material forming the coating layer 214 is an insulating material, such as polyimide (PI), epoxy resin encapsulant or encapsulation material.
[0052] The wiring structure 215 includes an insulating layer and a wiring layer bonded to the insulating layer. For example, the material forming the wiring layer may be copper or other conductive material, and the material forming the insulating layer may be the aforementioned poly(p-diazole)benzene (PBO), polyimide (PI), prepreg (PP), or other dielectric material.
[0053] Alternatively, multiple conductive elements 216 may be disposed on the other side of the circuit structure 211, such as conductive bumps.
[0054] like Figure 2B As shown, an optical device 22 is provided on the electronic module. This optical device 22 is, for example, a PIC module, which includes a coupler, an optical chip, a total reflection mirror, and a fiber optic array unit (FAU). Alternatively, the optical device 22 may be, for example, an optical chip. The optical device 22 can be electrically connected to the wiring structure 215 through multiple conductive bumps such as solder bumps and copper bumps.
[0055] like Figure 2C As shown, a protective layer 23 is formed on the outer surface of the optical device 22. This protective layer 23 is, for example, a water-resistant coating agent to protect the optical device 22, since cutting operations often involve the use of large amounts of water.
[0056] like Figure 2D As shown, a cutting operation is performed on the second direction cutting channel to separate each electronic module 21. Even if cutting waste 21a is generated at this time, the cutting waste 21a will adhere to the protective layer 23.
[0057] The cutting waste 21a may be, for example, part of the material of the electronic module 21 through which the cutting path passes, such as part of the circuit structure 211, the covering layer 214 and / or the wiring structure 215.
[0058] like Figure 2E As shown, the outer surface of the optical device 22 is first cleaned to remove the protective layer 23 on the upper and side surfaces of the optical device 22, or even the cutting waste 21a attached thereto.
[0059] like Figure 2F As shown, the electronic module 21 with the optical device 22 is inverted so that one side of the optical device 22 is attached to the second carrier 202 and the first carrier 201 is removed.
[0060] like Figure 2G As shown, the outer surface of the optical device 22 is cleaned a second time to remove the protective layer 23 on the lower surface of the optical device 22 and the cutting waste 21a attached thereto.
[0061] Through the aforementioned manufacturing method, this application also discloses an electronic package, including: an electronic module 21, an optical device 22 disposed on the electronic module 21, and a protective layer 23 covering the outer surface of the optical device 22.
[0062] The electronic module 21 includes a circuit structure 211, electronic components 212 and a plurality of conductive pillars 213 disposed on the circuit structure 211, a covering layer 214 formed on the circuit structure 211 to cover the electronic components 212 and the plurality of conductive pillars 213, and a wiring structure 215 formed on the covering layer 214. The electronic component 212 is, for example, an electronic integrated circuit (EIC) component.
[0063] The optical device 22 is, for example, a PIC module, which includes a coupler, an optical chip, a total reflection mirror, a fiber optic array unit (FAU), etc., and the optical device 22 is electrically connected to the wiring structure 215.
[0064] The protective layer 23 is, for example, a water-resistant coating agent to protect the optical device, and the protective layer 23 can be removed after the electronic module 21 has completed the order cutting process.
[0065] In summary, the electronic package and its manufacturing method of this application mainly involve placing an optical device on the electronic module after the electronic module is cut in the first direction and forming a protective layer on its surface. After the electronic module is cut in the second direction, even if cutting waste is generated, the cutting waste will only adhere to the protective layer. Subsequently, the cutting waste can be removed by removing the protective layer, thus avoiding damage to the optical device or affecting the yield of the electronic package.
[0066] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An electronic package, characterized by Comprising: an electronic module, including a circuit structure, an electronic component disposed on the circuit structure and electrically connected to the circuit structure, a plurality of conductive pillars, a coating layer formed on the circuit structure to cover the electronic component and the plurality of conductive pillars, and a wiring structure formed on the coating layer and electrically connected to the electronic component and the plurality of conductive pillars; an optical device disposed on the electronic module and electrically connected to the electronic module; and a protective layer formed on an outer surface of the optical device. A plurality of the electronic modules are arranged in an array in a wafer type or a panel type, and are spaced apart by a first direction cutting path and a second direction cutting path perpendicular to each other.
2. The electronic package of claim 1, wherein, The electronic component is an electronic integrated circuit component.
3. The electronic package of claim 1, wherein, The electronic module further includes a plurality of conductive components disposed on the other side of the circuit structure.
4. The electronic package of claim 1, wherein, The optical device is an optical chip module or an optical chip.
5. The electronic package of claim 1, wherein, The optical chip module includes a coupler, an optical chip, a total reflection mirror, and an optical fiber array unit.
6. The electronic package of claim 5, wherein,