Optical module

Abstract

The utility model relates to the technical field of optical communication, in particular to an optical module. The optical module comprises an upper shell, a lower shell, a circuit board and a vapor chamber, a containing cavity is formed in the lower shell, a plurality of heat dissipation holes communicated with the containing cavity and the outside are formed in the lower shell, and the upper shell is connected with the lower shell and covers the containing cavity; the circuit board is arranged in the accommodating cavity, and at least one first heat source is arranged on one side, facing the upper shell, of the circuit board; the vapor chamber comprises a vapor chamber body and at least one heat dissipation protrusion formed by protruding the vapor chamber body towards the lower shell, the vapor chamber body is internally provided with a first cavity, the heat dissipation protrusion is internally provided with a second cavity, the second cavity is communicated with the first cavity, and the first cavity and the second cavity are both filled with liquid working media. The vapor chamber body is fixed to the inner wall of the upper shell in an attached mode, and each heat dissipation protrusion directly abuts against the corresponding first heat source. According to the scheme, the thermal resistance is small, the heat dissipation efficiency of the optical module can be improved, and the overall heat dissipation effect is good.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] Optical modules are used for high-speed interconnects between data centers and are an indispensable part of modern communications. As the speed and integration of optical modules increase, their power consumption also increases, making heat dissipation a crucial issue.

[0003] The existing optical module uses a zinc alloy shell and a heat spreader is set inside the shell (the inner wall of the heat spreader has a capillary structure, and heat is conducted through the vaporization and condensation of the liquid working fluid). The heat spreader contacts the heat source on the circuit board through a gasket, avoiding interference between the heat spreader and other components on the circuit board, while realizing heat dissipation of the heat source with large heat generation inside the optical module.

[0004] However, due to the thermal resistance of the gasket, the heat dissipation effect of the above-mentioned optical module heat dissipation method needs to be further improved.

[0005] There is a need to provide an optical module with better heat dissipation. Utility Model Content

[0006] The technical problem to be solved by this utility model embodiment is to provide an optical module with better heat dissipation effect.

[0007] This utility model discloses an optical module, comprising:

[0008] Upper casing;

[0009] The lower housing has a cavity inside, and the lower housing has multiple heat dissipation holes that connect the cavity to the outside. The upper housing is connected to the lower housing and covers the cavity.

[0010] A circuit board is disposed in the accommodating cavity, and at least one first heat source is disposed on the side of the circuit board facing the upper housing;

[0011] A heat spreader includes a heat spreader body and at least one heat dissipation protrusion formed by the heat spreader body protruding towards the lower housing. The heat spreader body has a first cavity built in it, and the heat dissipation protrusion has a second cavity built in it. The second cavity communicates with the first cavity. Both the first cavity and the second cavity are filled with a liquid working fluid. The heat spreader body is attached and fixed to the inner wall of the upper housing. Each heat dissipation protrusion directly abuts against a first heat source.

[0012] Optionally, an air-proof groove is provided on the inner wall of the upper shell, and the heat-spreading plate body is embedded and fixed in the air-proof groove, with the heat-spreading plate body conforming to the bottom wall of the air-proof groove.

[0013] Optionally, a second heat source is provided on the side of the circuit board facing the lower housing. The heat generated by the second heat source is less than that generated by the first heat source. A boss is provided on the inner wall of the lower housing, and the boss abuts against the second heat source.

[0014] Optionally, the optical module further includes a thermally conductive pad sandwiched between the second heat source and the boss.

[0015] Optionally, the circuit board can be detachably installed in the accommodating cavity.

[0016] Optionally, the optical module further includes a plurality of first locking members, a plurality of first positioning holes are provided on the circuit board, and a plurality of second positioning holes are provided on the lower housing. The plurality of first positioning holes and the plurality of second positioning holes are provided in a one-to-one correspondence. Each first locking member is provided with one first positioning hole and one second positioning hole respectively, so as to lock the circuit board onto the lower housing.

[0017] Optionally, the upper housing and the lower housing are detachably connected.

[0018] Optionally, the optical module further includes a plurality of second locking members, the upper housing is provided with a plurality of third positioning holes, and the lower housing is provided with a plurality of fourth positioning holes. The plurality of fourth positioning holes are provided in a one-to-one correspondence with the plurality of third positioning holes. Each second locking member is provided with one third positioning hole and one fourth positioning hole to lock the upper housing onto the lower housing.

[0019] Optionally, the heat spreader is made of copper.

[0020] Optionally, the upper housing and the lower housing are made of aluminum, copper, or aluminum alloy.

[0021] Compared with the prior art, the beneficial effects of the optical module provided by this utility model embodiment are as follows: by setting an upper shell, a lower shell, a circuit board, and a heat dissipation plate, the upper shell and the lower shell are connected, and the accommodating cavity of the lower shell is covered to protect the circuit board set in the accommodating cavity; the heat dissipation plate is attached and fixed to the inner wall of the upper shell, and the heat dissipation plate includes a heat dissipation plate body and at least one heat dissipation protrusion formed by the heat dissipation plate body protruding towards the lower shell, each heat dissipation protrusion directly abutting against a first heat source on a circuit board. Since the heat dissipation protrusion is integrated with the heat dissipation plate body, the heat dissipation protrusion has a second cavity filled with liquid working fluid inside, and the second cavity is connected to the first cavity of the heat dissipation plate body. Compared with the existing method of conducting heat to the existing heat dissipation plate through a gasket, this method achieves a more efficient heat dissipation plate. In this application, the heat dissipation protrusion with a second cavity in the heat spreader directly contacts the first heat source, resulting in low thermal resistance. The heat spreader can evenly conduct the heat generated by the first heat source to the upper shell through the vaporization and condensation of the liquid working medium in the first and second cavities, making the surface temperature of the upper shell uniform and avoiding local overheating. Furthermore, the heat dissipation holes on the lower shell that communicate with the accommodating cavity generate convective heat transfer within the lower shell, which can dissipate the heat inside the optical module to the outside, reduce the temperature of the optical module, and greatly improve the heat dissipation efficiency of the optical module. Overall, it has a better heat dissipation effect, ensuring the thermal conductivity of the optical module, the working stability under harsh conditions, greatly improving the applicability of the optical module, and extending the service life of the optical module. Attached Figure Description

[0022] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0023] Figure 1 This is a three-dimensional schematic diagram of the optical module provided in an embodiment of the present utility model;

[0024] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the AA direction;

[0025] Figure 3 This is a three-dimensional structural schematic diagram of the upper shell provided in an embodiment of the present utility model;

[0026] Figure 4 This is a three-dimensional structural diagram of the heat spreader provided in this embodiment of the utility model;

[0027] Figure 5 This is an exploded structural diagram of the optical module provided in this embodiment of the utility model.

[0028] The labels for the attached figures are as follows:

[0029] 110. Upper housing; 110a. Clearance groove; 110b. Third positioning hole; 120. Lower housing; 120a. Receiving cavity; 120b. Heat dissipation hole; 120c. Second positioning hole; 120d. Fourth positioning hole; 130. Circuit board; 130a. First positioning hole; 131. First heat source; 140. Heat dissipation plate; 141. Heat dissipation plate body; 141a. First cavity; 142. Heat dissipation protrusion; 142a. Second cavity; 150. Boss; 160. First locking member; 170. Second locking member. Detailed Implementation

[0030] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0031] This utility model provides an optical module, which can be a high-power CFP2 optical module or an optical module with a similar CFP2 package.

[0032] like Figure 1 , Figure 2 and Figure 4 As shown, the optical module includes an upper housing 110, a lower housing 120, a circuit board 130, and a heat spreader 140.

[0033] The lower housing 120 has a receiving cavity 120a, and the lower housing 120 has a plurality of heat dissipation holes 120b that connect the receiving cavity 120a to the outside. The upper housing 110 is connected to the lower housing 120 and covers the receiving cavity 120a.

[0034] The circuit board 130 is disposed in the accommodating cavity 120a, and at least one first heat source 131 is disposed on the side of the circuit board 130 facing the upper housing 110.

[0035] The heat spreader 140 includes a heat spreader body 141 and at least one heat dissipation protrusion 142 formed by the heat spreader body 141 protruding towards the lower housing 120. The heat spreader body 141 has a first cavity 141a inside, and the heat dissipation protrusion 142 has a second cavity 142a inside. The second cavity 142a communicates with the first cavity 141a. Both the first cavity 141a and the second cavity 142a are filled with liquid working fluid. The heat spreader body 141 is fixed on the inner wall of the upper housing 110, and each heat dissipation protrusion 142 directly abuts against a first heat source 131.

[0036] The optical module of this embodiment comprises an upper housing 110, a lower housing 120, a circuit board 130, and a heat spreader 140. The upper housing 110 is connected to the lower housing 120 and covers the accommodating cavity 120a of the lower housing 120 to protect the circuit board 130 disposed within the accommodating cavity 120a. The heat spreader 140 is attached and fixed to the inner wall of the upper housing 110. The heat spreader 140 includes a heat spreader body 141 and at least one heat dissipation protrusion 1 formed by the heat spreader body 141 protruding towards the lower housing 120. 42. Each heat dissipation protrusion 142 directly contacts a first heat source 131 on a circuit board 130. Since the heat dissipation protrusion 142 is integrated with the heat spreader body 141, the heat dissipation protrusion 142 has a second cavity 142a filled with liquid working fluid inside. The second cavity 142a is connected to the first cavity 141a of the heat spreader body 141. Compared with the existing method of conducting heat to the existing heat spreader plate through a gasket, the solution of this application directly uses the heat dissipation of the heat spreader 140 with the second cavity 142a. The protrusion 142 abuts against the first heat source 131, resulting in low thermal resistance. The heat spreader 140 can evenly conduct the heat generated by the first heat source 131 to the upper shell 110 through the vaporization and condensation of the liquid working medium in the first cavity 141a and the second cavity 142a. In this application, the heat dissipation protrusion 142 of the heat spreader 140 directly abuts against the first heat source 131, resulting in low thermal resistance. The heat spreader 140 can evenly conduct the heat generated by the first heat source 131 to the upper shell through the vaporization and condensation of the liquid working medium. The upper housing 110 ensures a uniform surface temperature, preventing localized overheating. Furthermore, the heat dissipation holes 120b on the lower housing 120, which communicate with the accommodating cavity 120a, generate convective heat transfer within the lower housing 120. This dissipates heat from the optical module to the outside, reducing its temperature and significantly improving its heat dissipation efficiency. Overall, this design provides excellent heat dissipation, ensuring the optical module's thermal conductivity and operational stability under harsh conditions. This greatly enhances the applicability of the optical module and extends its lifespan.

[0037] Specifically, the inner wall of the heat spreader 140 has a conventional capillary structure and is manufactured through processes such as die stamping and high-temperature sintering. It is filled with a liquid working fluid. The heat dissipation protrusions 142 of the heat spreader 140 abut against the first heat source 131 of the circuit board 130. The heat spreader body 141 is attached to the inner wall of the upper housing 110. When the first heat source 131 heats up, the liquid working fluid absorbs heat and turns into vapor. The heat then diffuses with the vapor to the entire surface of the heat spreader 140. When the vapor diffuses to areas with lower temperatures, it condenses into liquid. The liquid flows back to the heat-generating area under the action of the capillary structure inside the heat spreader 140, continuously repeating the heat dissipation cycle. Designers can also increase the area of ​​the heat spreader body 141 to allow more heat to be transferred to lower-temperature areas, thereby further improving the module's heat dissipation effect. Since the heat dissipation protrusion 142 of the heat dissipation plate 140 is integrated with the heat dissipation plate body 141, and the built-in second cavity 142a is also filled with liquid working fluid, it directly contacts the first heat source 131, resulting in lower thermal resistance and better heat dissipation effect than the existing method of contacting the heat source through a gasket on a heat dissipation plate.

[0038] The heat spreader body 141 can be fixed to the inner wall of the upper shell 110 by welding. The strength of welded connection is usually higher than that of mechanical connection (such as screws, bolts, etc.), which can withstand greater mechanical stress and ensure close contact between the heat spreader body 141 and the upper shell 110, thus ensuring efficient heat conduction.

[0039] The number of heat dissipation protrusions 142 can be set according to the number of first heat sources 131. The first heat source 131 can be a heat source such as an optical signal processing chip or a digital signal processing chip of an optical module. For example, two first heat sources 131 are provided on the side of the circuit board 130 facing the upper housing 110, and two heat dissipation protrusions 142 are formed on the heat dissipation plate body 141.

[0040] Optionally, the heat spreader 140 is made of copper. The thermal conductivity of the heat spreader 140 can reach over 5000 W / mK, which is 10 to 100 times that of other materials. The liquid working fluid filled in the heat spreader 140 can be distilled water. Distilled water has a high latent heat of vaporization and can absorb a large amount of heat during evaporation, thereby effectively removing heat from the first heat source 131.

[0041] Optionally, the upper housing 110 and the lower housing 120 are made of aluminum, copper, or aluminum alloy. For example, both the upper housing 110 and the lower housing 120 are made of aluminum. Both can be die-cast using a mature die-casting process, with high thermal conductivity aluminum die-casting. Its thermal conductivity is more than 30% higher than that of zinc alloy, and it has good thermal conductivity. Moreover, it can be mass-produced through mold opening to meet the huge demand for optical modules.

[0042] The opening area of ​​the heat dissipation hole 120b can be set according to actual needs. For example, increasing the opening area of ​​the heat dissipation hole 120b allows more air to pass through the inside of the module, thereby improving the heat dissipation effect.

[0043] refer to Figures 1 to 3 In an optional embodiment of this application, an air-proof groove 110a is provided on the inner wall of the upper shell 110, and the heat-spreading plate body 141 is embedded and fixed in the air-proof groove 110a, with the heat-spreading plate body 141 conforming to the bottom wall of the air-proof groove 110a.

[0044] By creating a recessed groove 110a on the inner wall of the upper housing 110 and embedding and fixing the heat spreader body 141 therein, space can be effectively utilized, making the internal structure of the optical module more compact, optimizing the internal spatial layout of the optical module, facilitating installation and use in limited space, and improving the overall integration. At the same time, the heat spreader body 141 is tightly fitted and fixed to the bottom wall of the recessed groove 110a, which can reduce displacement or loosening caused by thermal expansion or mechanical vibration, and strengthen the structural strength of the heat spreader 140.

[0045] refer to Figure 2 and Figure 5 In an optional embodiment of this application, a second heat source (not shown) is provided on the side of the circuit board 130 facing the lower housing 120. The heat generated by the second heat source is less than the heat generated by the first heat source 131. A boss 150 is provided on the inner wall of the lower housing 120, and the boss 150 abuts against the second heat source.

[0046] By setting the boss 150 to contact the second heat source, the heat from the second heat source can be transferred to the lower housing 120 more quickly than through air conduction, thus more effectively reducing the temperature of the second heat source. Furthermore, the heat dissipation holes 120b on the lower housing 120 connecting the accommodating cavity 120a and the outside can generate convective heat transfer, greatly improving the heat dissipation efficiency of the optical module. Since the heat generated by the second heat source is less than that of the first heat source 131, the heat generated is relatively small. Using the boss 150 to conduct the heat generated by the second heat source to the lower housing 120 allows for heat dissipation of the lower-heat-generating second heat source at a lower cost. The second heat source can be some auxiliary circuit components, such as resistors, capacitors, connectors, etc.

[0047] Furthermore, the optical module also includes a thermal pad (not shown), which is sandwiched between the second heat source and the boss 150.

[0048] Thermal pads are made of highly thermally conductive materials, with a thermal conductivity typically much higher than that of air. By placing a thermal pad between the second heat source and the boss 150, the air gap between them can be reduced, thereby lowering thermal resistance. Lower thermal resistance means that heat can be conducted more quickly from the second heat source to the boss 150, and then dissipated to the outside through the lower housing 120, improving the heat dissipation efficiency of the second heat source. In addition, thermal pads usually have a certain degree of elasticity. During the use of the optical module, the thermal pads can absorb mechanical stress and vibration, reducing the impact of mechanical stress and vibration on heat conduction and improving the stability of heat conduction.

[0049] refer to Figure 5 In an optional embodiment of this application, the circuit board 130 is detachably mounted in the receiving cavity 120a. This detachable design allows maintenance personnel to quickly remove and replace faulty circuit boards 130, simplifying the maintenance process, reducing the risk of errors and damage during maintenance, and improving maintenance efficiency and quality. Furthermore, the detachable design also allows users to replace circuit boards 130 with those of different functions as needed, thereby expanding the functionality of the optical module.

[0050] Specifically, please refer to Figure 5 The optical module also includes multiple first locking members 160, multiple first positioning holes 130a are provided on the circuit board 130, and multiple second positioning holes 120c are provided on the lower housing 120. The multiple first positioning holes 130a and multiple second positioning holes 120c are arranged one-to-one. Each first locking member 160 is provided with one first positioning hole 130a and one second positioning hole 120c to lock the circuit board 130 onto the lower housing 120.

[0051] The first locking member 160 passes through the first positioning hole 130a and the second positioning hole 120c, which can firmly fix the circuit board 130 to the lower housing 120. Multiple first locking members 160 can evenly distribute the fixing force, ensuring that the circuit board 130 is stably fixed in multiple directions. During operation, the circuit board 130 will not loosen or shift due to vibration or mechanical stress, thereby improving the structural stability of the entire optical module. The design of the first positioning hole 130a and the second positioning hole 120c ensures that the circuit board 130 can be precisely aligned during installation, reducing installation errors. During installation, simply inserting the first locking member 160 into the second positioning hole 120c and the first positioning hole 130a locks the circuit board 130 onto the lower housing 120, simplifying the assembly process. Furthermore, the circuit board 130, locked to the lower housing 120 by the first locking member 160 passing through the first positioning hole 130a and the second positioning hole 120c, can also transfer heat from the circuit board 130 to the lower housing 120 for effective heat dissipation.

[0052] Optionally, the first locking member 160 can be a bolt, screw, etc., passing through the first positioning hole 130a of the upper housing 110 and the second positioning hole 120c of the lower housing 120, so as to realize the detachable connection between the upper housing 110 and the lower housing 120.

[0053] refer to Figure 1 and Figure 5 In an optional embodiment of this application, the upper housing 110 and the lower housing 120 are detachably connected.

[0054] The upper housing 110 and the lower housing 120 are detachably connected, allowing maintenance personnel to quickly disassemble the upper housing 110 and perform tests, repairs, and other operations on the circuit board 130 inside the lower housing 120. Testing, inspection, repair, or replacement is convenient, significantly reducing maintenance time and costs, and improving the availability and reliability of the optical module.

[0055] Specifically, the optical module also includes multiple second locking members 170. The upper housing 110 is provided with multiple third positioning holes 110b, and the lower housing 120 is provided with multiple fourth positioning holes 120d. The multiple fourth positioning holes 120d are provided in a one-to-one correspondence with the multiple third positioning holes 110b. Each second locking member 170 is provided with one third positioning hole 110b and one fourth positioning hole 120d to lock the upper housing 110 onto the lower housing 120.

[0056] The second locking member 170 passes through the third positioning hole 110b and the fourth positioning hole 120d, which can firmly lock the upper housing 110 onto the lower housing 120. Multiple second locking members 170 can evenly distribute the fixing force, ensuring stable fixation between the upper housing 110 and the lower housing 120 in multiple directions. During operation of the optical module, the upper housing 110 and the lower housing 120 will not loosen or shift due to vibration or mechanical stress, thereby improving the overall structural stability of the optical module. The design of the third positioning hole 110b and the fourth positioning hole 120d ensures precise alignment of the upper housing 110 and the lower housing 120 during assembly, reducing installation errors.

[0057] The assembly process of the optical module in this embodiment is as follows: Take out the lower housing 120 and add a thermal pad on the boss 150; place the circuit board 130 in the accommodating cavity 120a of the lower housing 120 to ensure good contact between the lower housing 120 and the second heat source, and lock the circuit board 130 on the lower housing 120; install the upper housing 110 on the lower housing 120 to ensure that the heat dissipation protrusion 142 of the heat dissipation plate 140 is in close contact with the first heat source 131 on the circuit board 130, lock the upper housing 110 on the lower housing 120, and then insert the optical module into the corresponding instrument for testing.

[0058] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.

Claims

1. An optical module, characterized in that, include: Upper shell; The lower housing has a cavity inside, and the lower housing has multiple heat dissipation holes that connect the cavity to the outside. The upper housing is connected to the lower housing and covers the cavity. A circuit board is disposed in the accommodating cavity, and at least one first heat source is disposed on the side of the circuit board facing the upper housing; A heat spreader includes a heat spreader body and at least one heat dissipation protrusion formed by the heat spreader body protruding towards the lower housing. The heat spreader body has a first cavity built in it, and the heat dissipation protrusion has a second cavity built in it. The second cavity communicates with the first cavity. Both the first cavity and the second cavity are filled with a liquid working fluid. The heat spreader body is attached and fixed to the inner wall of the upper housing. Each heat dissipation protrusion directly abuts against a first heat source.

2. The optical module according to claim 1, characterized in that, An air-proof groove is provided on the inner wall of the upper shell, and the heat-spreading plate body is embedded and fixed in the air-proof groove, with the heat-spreading plate body fitting against the bottom wall of the air-proof groove.

3. The optical module according to claim 1, characterized in that, A second heat source is provided on the side of the circuit board facing the lower housing. The heat output of the second heat source is less than that of the first heat source. A boss is provided on the inner wall of the lower housing, and the boss abuts against the second heat source.

4. The optical module according to claim 3, characterized in that, The optical module also includes a thermally conductive pad, which is sandwiched between the second heat source and the boss.

5. The optical module according to any one of claims 1-4, characterized in that, The circuit board is detachably installed in the accommodating cavity.

6. The optical module according to claim 5, characterized in that, The optical module also includes multiple first locking components. The circuit board is provided with multiple first positioning holes, and the lower housing is provided with multiple second positioning holes. The multiple first positioning holes and the multiple second positioning holes are provided one-to-one. Each first locking component is provided with one first positioning hole and one second positioning hole to lock the circuit board onto the lower housing.

7. The optical module according to any one of claims 1-4, characterized in that, The upper housing and the lower housing are detachably connected.

8. The optical module according to claim 7, characterized in that, The optical module also includes multiple second locking components. The upper housing is provided with multiple third positioning holes, and the lower housing is provided with multiple fourth positioning holes. The multiple fourth positioning holes are provided in a one-to-one correspondence with the multiple third positioning holes. Each second locking component is provided with one third positioning hole and one fourth positioning hole to lock the upper housing onto the lower housing.

9. The optical module according to any one of claims 1-4, characterized in that, The heat spreader is made of copper.

10. The optical module according to any one of claims 1-4, characterized in that, The upper and lower housings are made of aluminum, copper, or aluminum alloy.

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