Semiconductor laser packaging structure

Abstract

The utility model relates to a semiconductor laser packaging structure, which comprises a substrate and a laser, a packaging assembly positioned on the outer side of the laser is arranged between the substrate and the laser, and the laser is fixedly connected to the top of the substrate through the packaging assembly; the packaging assembly comprises a clamping groove fixedly formed in the top of the substrate and the outer side of the laser, the clamping groove is in a transverse U shape, a clamping ring is inserted into the clamping groove and fixedly connected to the outer surface of the laser, a gluing piece is embedded into the bottom of the clamping ring, and a front clamping stop assembly and a rear clamping stop assembly are clamped to the bottom of the clamping ring. The clamping ring can be firmly clamped in the clamping groove through the cooperation of the clamping assembly, thereby guaranteeing the stable connection of the laser and the substrate, and effectively avoiding the final falling-off caused by gluing or welding. And AB glue can be conveniently smeared between the substrate and the laser through the glue coating sheet, so that the sealing performance of connection between the substrate and the laser is ensured, and the packaging effect is ensured.

Description

Technical Field

[0001] This utility model relates to the field of lasers, specifically a semiconductor laser packaging structure. Background Technology

[0002] Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as their working medium. Due to differences in material structure, the specific processes by which different types of lasers are generated are quite unique. Commonly used working media include gallium arsenide, cadmium sulfide, indium phosphide, and zinc sulfide. There are three types of excitation methods: electrical injection, electron beam excitation, and optical pumping. Semiconductor laser devices can be divided into several types, such as homojunction, single heterojunction, and double heterojunction.

[0003] The packaging structure of semiconductor lasers directly affects their performance, heat dissipation, reliability, and application scenarios. Common semiconductor laser packaging technologies mainly include substrate packaging, butterfly packaging, high-power packaging, and XMD standardized packaging. Among them, substrate packaging mostly uses AB glue or soldering to directly connect the laser chip to the heat sink substrate. Soldering is complex and the operation process poses significant safety hazards. While bonding is simple, practical, and safe, its connection strength is relatively low. In particular, the adhesion effect of AB glue decreases significantly after long-term use, leading to the detachment of the laser chip from the substrate. Therefore, it is necessary to develop a new packaging technology for semiconductor lasers to address the shortcomings of existing technologies. Utility Model Content

[0004] This invention addresses the technical problems existing in the prior art by providing a semiconductor laser packaging structure.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: a semiconductor laser packaging structure, including a substrate and a laser, wherein a packaging component located outside the laser is disposed between the substrate and the laser, and the laser is fixedly connected to the top of the substrate through the packaging component;

[0006] The encapsulation assembly includes a slot that is fixedly mounted on the top of the substrate and the outside of the laser. The slot is a horizontal "U" shape. A retaining ring is inserted into the slot and fixedly connected to the outer surface of the laser. An adhesive film is embedded in the bottom of the retaining ring. Two locking components are engaged at the bottom of the retaining ring. The lower ends of the locking components are integrated into the interior of the substrate. An adhesive is applied between the outer surface of the adhesive film and the facing surfaces of the retaining ring.

[0007] Preferably, the retaining ring follows the laser as it moves laterally along the top of the substrate and is eventually inserted into the slot. As the retaining ring moves laterally with the laser, it presses against the locking assembly to embed it into the substrate.

[0008] Preferably, the locking component includes a limiting slide groove, a positioning slide groove, and a connecting hole formed inside the substrate. The upper and lower ends of the limiting slide groove are respectively connected to the positioning slide groove and the connecting hole. The inner diameter of the positioning slide groove and the connecting hole is smaller than the inner diameter of the limiting slide groove.

[0009] Preferably, the upper end of the positioning groove extends to the top of the substrate, and the lower end of the connecting hole extends to the bottom of the substrate.

[0010] Preferably, the limiting slide groove has a limiting slider inside it, and the top of the limiting slider is fixedly connected to a positioning block. The outer diameter of the limiting slider is adapted to the inner diameter of the limiting slide groove, and the outer diameter of the positioning block is adapted to the inner diameter of the positioning slide groove.

[0011] Preferably, the end of the positioning latch block near the slot opening is a vertical plane, the end of the outer surface of the positioning latch block away from the slot opening is a smooth inclined surface, the upper end of the outer surface of the positioning latch block extends to the top of the substrate and is embedded in the bottom of the retaining ring, and the upper end of the outer surface of the positioning latch block is adapted to the inner wall of the retaining ring.

[0012] Preferably, a positioning spring is provided inside the limiting slide groove. The positioning spring is in a compressed state, with its upper end abutting against the bottom of the limiting slider and its lower end abutting against the bottom of the inner cavity of the limiting slide groove.

[0013] The beneficial effects of this utility model are: the locking component can securely lock the retaining ring inside the slot, thereby ensuring a stable connection between the laser and the substrate and effectively avoiding the eventual detachment caused by adhesive or welding; and the adhesive film can easily apply AB glue between the substrate and the laser to ensure the sealing of the connection between the substrate and the laser, thereby ensuring the encapsulation effect. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the installation of the packaging component of this utility model;

[0016] Figure 3 This is a disassembly diagram of the packaging component of this utility model;

[0017] Figure 4 This is a cross-sectional view of the front of the locking component in the substrate;

[0018] Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0019] The attached diagram lists the components represented by each number as follows:

[0020] 1. Substrate; 2. Laser; 3. Packaging assembly; 31. Slot; 32. Snap ring; 33. Locking assembly; 331. Limiting slide; 332. Positioning slide; 333. Connecting hole; 334. Limiting slider; 335. Positioning snap block; 336. Positioning spring; 34. Coated sheet. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0023] In the description of this application, the term "for example" is used to mean "used as an example, illustration, or description." Any embodiment described as "for example" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to implement and use the present invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the present invention can be implemented without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the present invention with unnecessary detail. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0024] Example 1

[0025] like Figures 1 to 5 As shown, a semiconductor laser packaging structure includes a substrate 1 and a laser 2. A packaging component 3 located outside the laser 2 is disposed between the substrate 1 and the laser 2. The laser 2 is fixedly connected to the top of the substrate 1 through the packaging component 3.

[0026] The encapsulation component 3 includes a slot 31 fixedly mounted on the top of the substrate 1 and the outside of the laser 2. The slot 31 is a horizontal "U" shape. A retaining ring 32 is inserted into the slot 31 and fixedly connected to the outer surface of the laser 2. An adhesive sheet 34 is embedded in the bottom of the retaining ring 32. Two locking components 33 are engaged at the bottom of the retaining ring 32. The lower end of the locking components 33 is integrated into the interior of the substrate 1. Adhesive is applied between the outer surface of the adhesive sheet 34 and the facing surfaces of the retaining ring 32. The locking components 33 can securely lock the retaining ring 32 into the slot 31, thereby ensuring a stable connection between the laser 2 and the substrate 1 and effectively preventing the eventual detachment caused by adhesive or welding. The adhesive sheet 34 facilitates the application of AB glue between the substrate 1 and the laser 2 to ensure the sealing of the connection between the substrate 1 and the laser 2, thereby ensuring the encapsulation effect.

[0027] like Figure 2 and Figure 3 As shown, the retaining ring 32 moves laterally along the top of the substrate 1 following the laser 2 and is eventually inserted into the inside of the retaining slot 31. When the retaining ring 32 moves laterally following the laser 2, it presses the retaining component 33 to embed it into the inside of the substrate 1.

[0028] like Figure 4 and Figure 5 As shown, the locking component 33 includes a limiting slide groove 331, a positioning slide groove 332, and a connecting hole 333 formed inside the substrate 1. The upper and lower ends of the limiting slide groove 331 are connected to the positioning slide groove 332 and the connecting hole 333, respectively. The inner diameter of the positioning slide groove 332 and the connecting hole 333 is smaller than the inner diameter of the limiting slide groove 331. Due to the setting of the limiting slide groove 331, the movement of the limiting slider 334 and the positioning locking block 335 can be ensured, thereby ensuring that the limiting slider 334 and the positioning locking block 335 can extend and retract, so that the locking ring 32 and the laser 2 as a whole can be inserted into the interior of the locking groove 31 from one side. At the same time, it can also ensure that the positioning locking block 335 is locked at the bottom of the locking ring 32.

[0029] like Figure 4 and Figure 5 As shown, the upper end of the positioning groove 332 extends to the top of the substrate 1, and the lower end of the connecting hole 333 extends to the bottom of the substrate 1. Due to the setting of the connecting hole 333, it is convenient for the staff to actively adjust the limiting slider 334 and the positioning latch block 335 under special circumstances, so that the positioning latch block 335 can be disengaged from the latch ring 32, thereby ensuring that the laser 2 and the substrate 1 can be separated.

[0030] like Figure 5As shown, a limiting slider 334 is slidably engaged inside the limiting groove 331. A positioning block 335 is fixedly connected to the top of the limiting slider 334. The outer diameter of the limiting slider 334 matches the inner diameter of the limiting groove 331, and the outer diameter of the positioning block 335 matches the inner diameter of the positioning groove 332. Due to the setting of the limiting slider 334, with the cooperation of the limiting groove 331, the positioning block 335 can slide stably up and down along the inside of the positioning groove 332, thereby ensuring that the upper end of the positioning block 335 can be accurately inserted into the bottom of the retaining ring 32, and at the same time, preventing the limiting slider 334 and the positioning block 335 from disengaging from the limiting groove 331 and the positioning groove 332.

[0031] like Figure 5 As shown, the end of the positioning latch block 335 near the opening of the slot 31 is a vertical plane, and the end of the outer surface of the positioning latch block 335 away from the opening of the slot 31 is a smooth slope. The upper end of the outer surface of the positioning latch block 335 extends to the top of the substrate 1 and is embedded in the bottom of the retaining ring 32. The upper end of the outer surface of the positioning latch block 335 is adapted to the inner wall of the retaining ring 32.

[0032] like Figure 5 As shown, a positioning spring 336 is provided inside the limiting slide groove 331. The positioning spring 336 is in a compressed state. The upper end of the positioning spring 336 abuts against the bottom of the limiting slider 334, and the lower end of the positioning spring 336 abuts against the bottom of the inner cavity of the limiting slide groove 331. Due to the setting of the positioning spring 336, the limiting slider 334 and the positioning snap block 335 can automatically move upward under the action of its elastic restoring force, so that they can be inserted into the bottom of the snap ring 32.

[0033] Example 2

[0034] First, apply AB glue to the outer surface of the adhesive sheet 34. Then, place the laser 2 and its bottom retaining ring 32 on one side of the opening of the top slot 31 of the substrate 1, and ensure that it presses against the two front and rear retaining components 33, so that the positioning retaining block 335 and the limiting slider 334 are completely retracted into the interior of the limiting slide groove 331 and the positioning slide groove 332. Then, move the laser 2 and the retaining ring 32 laterally along the top of the substrate 1, so that the retaining ring 32 is gradually inserted into the interior of the slot 31. Finally, the adhesive sheet 34 is completely attached to the bottom of the retaining ring 32. Under the elastic restoring force of the positioning spring 336, the limiting slider 334 and the positioning retaining block 335 are pushed to move upward to the top of the substrate 1 and finally embedded into the bottom of the retaining ring 32.

[0035] It should be noted that the descriptions of each embodiment in the above embodiments have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0036] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0037] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A semiconductor laser packaging structure, comprising a substrate (1) and a laser (2), characterized in that: An encapsulation assembly (3) located outside the laser (2) is provided between the substrate (1) and the laser (2), and the laser (2) is fixedly connected to the top of the substrate (1) through the encapsulation assembly (3). The encapsulation component (3) includes a slot (31) fixedly mounted on the top of the substrate (1) and the outside of the laser (2). The slot (31) is a horizontal "U" shape. A retaining ring (32) is inserted into the inside of the slot (31). The retaining ring (32) is fixedly connected to the outer surface of the laser (2). A coated sheet (34) is embedded in the bottom of the retaining ring (32). Two locking components (33) are engaged at the bottom of the retaining ring (32). The lower end of the locking components (33) is integrated into the inside of the substrate (1). Adhesive is coated between the outer surface of the coated sheet (34) and the facing surfaces of the retaining ring (32).

2. The semiconductor laser packaging structure according to claim 1, characterized in that: The retaining ring (32) moves laterally along the top of the substrate (1) following the laser (2) and is eventually inserted into the inside of the slot (31). When the retaining ring (32) moves laterally following the laser (2), it presses the retaining component (33) to embed it into the inside of the substrate (1).

3. The semiconductor laser packaging structure according to claim 1, characterized in that: The locking component (33) includes a limiting slide groove (331), a positioning slide groove (332) and a connecting hole (333) formed inside the substrate (1). The upper and lower ends of the limiting slide groove (331) are connected to the positioning slide groove (332) and the connecting hole (333) respectively. The inner diameter of the positioning slide groove (332) and the connecting hole (333) is smaller than the inner diameter of the limiting slide groove (331).

4. The semiconductor laser packaging structure according to claim 3, characterized in that: The upper end of the positioning groove (332) extends to the top of the substrate (1), and the lower end of the connecting hole (333) extends to the bottom of the substrate (1).

5. A semiconductor laser packaging structure according to claim 3, characterized in that: The limiting slide groove (331) is internally connected to the limiting slider (334), and the top of the limiting slider (334) is fixedly connected to the positioning block (335). The outer diameter of the limiting slider (334) is adapted to the inner diameter of the limiting slide groove (331), and the outer diameter of the positioning block (335) is adapted to the inner diameter of the positioning slide groove (332).

6. A semiconductor laser packaging structure according to claim 5, characterized in that: The end of the positioning latch block (335) near the opening of the slot (31) is a vertical plane, and the end of the outer surface of the positioning latch block (335) away from the opening of the slot (31) is a smooth slope. The upper end of the outer surface of the positioning latch block (335) extends to the top of the substrate (1) and is embedded in the bottom of the retaining ring (32). The upper end of the outer surface of the positioning latch block (335) is adapted to the inner wall of the retaining ring (32).

7. A semiconductor laser packaging structure according to claim 5, characterized in that: The limiting slide groove (331) is provided with a positioning spring (336). The positioning spring (336) is in a compressed state. The upper end of the positioning spring (336) abuts against the bottom of the limiting slider (334), and the lower end of the positioning spring (336) abuts against the bottom of the inner cavity of the limiting slide groove (331).

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