Laser module and laser heating device

Abstract

The utility model relates to a laser module and a laser heating device. The laser module comprises heat dissipation blocks and a chip assembly, the multiple heat dissipation blocks are sequentially arranged in the X-axis direction, and heat dissipation channels allowing cooling media to flow through are formed in the heat dissipation blocks. An X-axis direction and a Y-axis direction are arranged on the surface of the heat dissipation block, a plurality of chip assemblies are arranged on the heat dissipation block, each heat dissipation block is provided with the plurality of chip assemblies, the chip assemblies on the same heat dissipation block are sequentially arranged in the Y-axis direction, and the X-axis direction and the Y-axis direction are two mutually perpendicular directions on the surface, used for arranging the chip assemblies, of the heat dissipation block. According to the laser module, the light-emitting area and the light-emitting power are improved, and the large-area and high-power laser heating requirements can be met.

Description

Technical Field

[0001] This application relates to the field of laser heating technology, and in particular to a laser module and a laser heating device. Background Technology

[0002] With the rapid development of laser heating technology, laser heating devices are increasingly being used in industrial manufacturing, medical, scientific research, food, and agricultural fields. For example, in the repair process of power batteries, it is usually necessary to remove the insulating film layer on the surface of the power battery using laser heating to facilitate subsequent processes. However, traditional power battery panels are typically large in area, and the heating efficiency of using laser heating devices to heat the power batteries is low, affecting production efficiency. Utility Model Content

[0003] Therefore, it is necessary to provide a laser module and a laser heating device to address the problem of low heating efficiency when using laser heating devices to heat power batteries.

[0004] A laser module, comprising:

[0005] Multiple heat sinks are arranged sequentially along the X-axis, and each heat sink has a heat dissipation channel through which the cooling medium flows; and,

[0006] Multiple chip components are disposed on the heat sink, wherein each heat sink is provided with multiple chip components, and the chip components on the same heat sink are arranged sequentially in the Y-axis direction. The X-axis direction and the Y-axis direction are two mutually perpendicular directions on the surface of the heat sink used to set the chip components.

[0007] The aforementioned laser module features multiple heat sinks along the X-axis, and each heat sink has multiple chip components along the Y-axis. This array integration of multiple chip components increases the emitting area and power of the laser module. Therefore, when heating large workpieces such as power batteries, multiple laser modules are unnecessary to meet the demands of large-area, high-power laser heating, improving heating efficiency and ease of installation and use. Furthermore, distributing the chip components across multiple heat sinks means each heat sink only needs to handle the heat dissipation of its own chip component, enhancing the module's heat dissipation performance. Additionally, the relative independence of different heat sinks and their chip components facilitates replacement and maintenance of individual heat sinks and their chip components, further improving the ease of maintenance for the laser module.

[0008] In one embodiment, each heat sink is provided with a plurality of chip components arranged sequentially along the X-axis, and the plurality of chip components of the same heat sink are arranged in a row and column array along the X-axis and Y-axis. This increases the number of chip components in the laser module and improves the chip component density, which is beneficial for further increasing the emitting area and emitting power of the laser module, meeting the requirements for larger area and higher power laser heating.

[0009] In one embodiment, multiple heat sinks are sequentially abutted against each other in the X-axis direction. This helps to reduce the space occupied by the laser module, while also enabling heat conduction between adjacent heat sinks, preventing individual heat sink failures or reduced heat dissipation efficiency from affecting the performance of the chip assembly.

[0010] In one embodiment, the laser module further includes a shaping lens, which is fixed relative to the heat sink and located on the light-emitting side of the plurality of chip components. The orthographic projection of the shaping lens onto the heat sink covers the plurality of chip components. The shaping lens shapes the laser emitted by the chip components, which helps to meet the heating requirements of specific light spot shapes. The fixed arrangement of the shaping lens and the heat sink also helps to form a unified structural unit for the laser module, facilitating its installation and use.

[0011] In one embodiment, the light-emitting surface of the shaping lens has a planar cross-section in the X-axis direction and a convex cross-section in the Y-axis direction. Thus, the light spot emitted after being shaped by the shaping lens can be elongated, and the power density in the Y-axis direction is increased, which can meet the heating requirements of workpieces with specific shapes.

[0012] In one embodiment, the divergence angle of the chip assembly in the X-axis direction is greater than that in the Y-axis direction. This allows for good matching with the surface profile of the shaping lens in both the X and Y axes, effectively increasing the power of the emitted light spot and meeting the requirements for higher power laser heating.

[0013] In one embodiment, the laser module is equipped with a shaping lens, and the orthographic projection of the shaping lens onto the heat sink covers the chip components on multiple heat sinks. This simplifies the installation of the shaping lens and reduces installation difficulty and cost.

[0014] The laser module is equipped with multiple shaping lenses, which are fixedly positioned one-to-one with multiple heat sinks. The orthographic projection of each shaping lens onto a heat sink covers multiple chip components on a corresponding heat sink. In this way, the shaping lens and the corresponding heat sink form a structural unit, facilitating the individual replacement and maintenance of each shaping lens and heat sink, thus improving maintenance convenience.

[0015] In one embodiment, the heat sink includes a support portion and two fixing portions. The two fixing portions are respectively connected to opposite ends of the support portion in the Y-axis direction. The two fixing portions are used to fix the laser module to the housing, and the chip assembly is disposed on the support portion. Providing fixing portions at both ends of the support portion improves the ease and stability of installation of the heat sink on the laser heating device, and also facilitates improved heat dissipation performance of the laser module through heat conduction.

[0016] In one embodiment, the heat sink has an inlet and an outlet on the side facing away from the chip assembly, which communicate with the heat dissipation channel. The inlet and outlet correspond to the two opposite ends of the support portion in the Y-axis direction. This arrangement of the inlet and outlet with the chip assembly's layout area simplifies the structural design, avoids interference between the water inlet / outlet mechanism and the fixing portion, and improves the heat dissipation performance of the chip assembly.

[0017] A laser heating device includes a housing and a laser module as described in any of the above embodiments, wherein the laser module is disposed within the housing. By employing the aforementioned laser module in the laser heating device, the device can achieve a larger luminous area and luminous power, thus meeting the laser heating requirements for large workpieces such as power batteries. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the laser module structure in some embodiments.

[0019] Figure 2 This is a schematic diagram of the laser module from another angle in some embodiments.

[0020] Figure 3 This is a cross-sectional schematic diagram of the heat sink in some embodiments.

[0021] Figure 4 This is a structural schematic diagram of the laser module at another angle in some embodiments.

[0022] Figure 5 This is a schematic diagram of the laser chip structure in some embodiments.

[0023] Figure 6This is a diagram showing the light emission effect of the laser module in the X-axis direction in some embodiments.

[0024] Figure 7 This is a diagram showing the light emission effect of the laser module in the Y-axis direction in some embodiments.

[0025] Figure 8 This is a diagram showing the incoherent irradiance curves of the laser module in the Y-axis direction in some embodiments.

[0026] Figure 9 This is a graph showing the incoherent irradiance curves of the laser module in the X-axis direction in some embodiments.

[0027] Figure label:

[0028] 10. Laser module; 11. Heat sink; 111. Supporting part; 112. Fixing part; 113. Fixing hole; 114. Heat dissipation channel; 115. Water inlet; 116. Water outlet; 117. Heat dissipation structure; 12. Chip assembly; 121. Heat sink; 122. Laser chip; 13. Shaping lens; 131. Light emitting surface; 132. Light receiving surface. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0035] During the repair process of power batteries, laser heating devices are needed to heat the surface of the battery to remove the insulation and facilitate subsequent processes. However, traditional power batteries typically have a large panel area, and the luminous area and power of traditional laser heating devices are insufficient to meet the heating requirements. Traditional laser heating devices usually require multiple laser modules to heat different areas of the battery surface, resulting in low efficiency in the repair process and inconvenient installation of the laser modules.

[0036] To address the aforementioned issues, this application provides a laser module and a laser heating device.

[0037] Please see Figure 1 and Figure 2 , Figure 1 and Figure 2 The diagrams show structural schematics of the laser module 10 at different angles in some embodiments of this application. The laser module 10 provided in this application is capable of emitting laser light and can be used to project a laser spot onto the surface of a workpiece for laser heating. The laser module 10 has applications including, but not limited to, in industrial manufacturing, medical, scientific research, food, and agricultural fields. For example, the laser module 10 can be used to laser heat the surface of a power battery to abrade and remove the insulation from the battery surface.

[0038] In some embodiments, the laser module 10 includes a plurality of heat sinks 11 and a plurality of chip components 12, each chip component 12 capable of emitting laser light. The plurality of heat sinks 11 are arranged sequentially along the X-axis, and each heat sink 11 has a heat dissipation channel 114 through which a cooling medium flows. The plurality of chip components 12 are disposed on the same surface of the heat sinks 11, and a plurality of chip components 12 are disposed on the same surface of each heat sink 11. The chip components 12 on the same heat sink 11 are arranged sequentially along the Y-axis. The X-axis and Y-axis are two mutually perpendicular directions on the surface of the heat sink 11 used to house the chip components 12. The X-axis is parallel to the arrangement direction of the plurality of heat sinks 11 and may correspond to the width direction of the heat sink 11, while the Y-axis may be parallel to the length direction of the heat sink 11.

[0039] Understandably, during the laser heating operation of the laser module 10, multiple chip components 12 emit lasers towards the side facing away from the heat sink 11, that is, projecting laser spots onto the surface of workpieces such as power batteries on the same side to heat the workpieces. The heat generated by the chip components 12 is conducted to the heat sink 11, and the cooling medium flows through the heat dissipation channels 114 within the heat sink 11 to remove the heat conducted to the heat sink 11, thereby dissipating heat from the chip components 12 and improving the performance stability and service life of the chip components 12. The cooling medium includes, but is not limited to, any suitable coolant such as water, ethylene glycol aqueous solution, oil, or fluorinated liquid.

[0040] The aforementioned laser module 10 has multiple heat sinks 11 arranged in the X-axis direction, and each heat sink 11 has multiple chip components 12 arranged in the Y-axis direction. This allows for the array integration of multiple chip components 12, thereby increasing the emitting area and emitting power of the laser module 10. Therefore, when using the laser module 10 to heat large-area workpieces such as power batteries, it is not necessary to use multiple laser modules 10 to meet the large-area laser heating requirements, which improves heating efficiency and the ease of installation and use. Furthermore, distributing the chip components 12 across multiple heat sinks 11 means that each heat sink 11 only needs to handle the heat dissipation of its own chip component 12, improving the heat dissipation performance of the laser module 10. Additionally, the relative independence of different heat sinks 11 and their respective chip components 12 facilitates independent replacement and maintenance of individual heat sinks 11 and their chip components 12, further enhancing the ease of maintenance of the laser module 10.

[0041] In some embodiments, each heat sink 11 is provided with a plurality of chip components 12 arranged sequentially in the X-axis direction, and the plurality of chip components 12 on the same heat sink 11 are arranged in a row and column array in the X-axis and Y-axis directions. In this way, the number of chip components 12 in the laser module 10 can be increased, the arrangement density of the chip components 12 can be improved, which is beneficial to further improve the light-emitting area and light-emitting power of the laser module 10, and meet the requirements of larger area and higher power laser heating.

[0042] The number of heat sinks 11 is unlimited. The number of chip components 12 on each heat sink 11 in the row direction (X-axis direction) and column direction (Y-axis direction), as well as the arrangement density of the chip components 12, can be set according to the laser heating area and power requirements of the workpiece, and are not limited in this application. It is understood that the more heat sinks 11 there are, the more chip components 12 the laser module 10 can support, which is more conducive to improving the light-emitting area and light-emitting power. The more chip components 12 there are, the higher the light-emitting power of the laser module 10; the larger the light-emitting area, the greater the arrangement density of the chip components 12, and the higher the light-emitting power of the laser module 10. Figure 1 In the embodiment shown, taking the laser module 10 as having eight heat sinks 11 as an example, and taking the chip components 12 on each heat sink 11 as having three in the X-axis direction and eight in the Y-axis direction as an example, then each heat sink 11 has 24 chip components 12, and the laser module 10 has a total of 192 chip components 12, which can meet the requirements of high power and large area laser heating.

[0043] In some embodiments, multiple heat sinks 11 are sequentially abutted against each other in the X-axis direction, that is, the opposite sides of two adjacent heat sinks 11 abut against each other. This helps to reduce the space occupied by the laser module 10 and increase the arrangement density of the chip assembly 12, which is beneficial for improving the luminous power density of the laser module 10. Simultaneously, heat conduction can also be achieved between adjacent heat sinks 11, preventing individual heat sink 11 failures or reduced heat dissipation efficiency from affecting the performance of the chip assembly 12. Of course, in other embodiments, two adjacent heat sinks 11 can also be spaced apart in the X-axis direction to facilitate the disassembly of individual heat sinks 11, which is beneficial for the replacement and maintenance of the heat sinks 11 and the chip assembly 12.

[0044] In some embodiments, each heat sink 11 includes a support portion 111 and two fixing portions 112. The two fixing portions 112 are respectively connected to the two opposite ends of the support portion 111 in the Y-axis direction. The two fixing portions 112 are used to fix the laser module 10 to the housing of the laser heating device, and the chip assembly 12 is disposed on the support portion 111. Providing fixing portions 112 at both ends of the support portion 111 is beneficial to improving the ease and stability of installation of the heat sink 11 on the laser heating device. It is also beneficial to improve the heat dissipation performance of the laser module 10 by means of heat conduction through the fixing portions 112. For example, the fixing portions 112 can increase the heat dissipation area of ​​the heat sink 11 and can also conduct some of the heat to the housing of the laser heating device. In addition, by installing or removing the fixing portions 112, the individual heat sink 11 can be installed and removed independently, which is beneficial for the replacement and maintenance of the heat sink 11 and the chip assembly 12.

[0045] In some embodiments, each fixing part 112 is provided with a fixing hole 113 penetrating the fixing part 112. When the laser module 10 is installed on the laser heating device, the fixing hole 113 is used to cooperate with fasteners such as screws, or with structures such as positioning posts on the housing of the laser heating device, so as to realize the positioning and fixing of the heat sink 11 on the housing. The number and arrangement of the fixing holes 113 are not limited, and can be set according to the positioning and fixing requirements of the heat sink 11. In this application, taking two fixing holes 113 spaced apart in the X-axis direction in each fixing part 112 as an example, it is possible to position and fix the four corners of the heat sink 11, thereby improving the positioning accuracy and fixing reliability of the heat sink 11.

[0046] In some embodiments, the heat sink 11 has an inlet 115 and an outlet 116 on the side facing away from the chip assembly 12, which are connected to the heat dissipation channel 114. The cooling medium can flow into the heat dissipation channel 114 from the inlet 115 and flow out from the outlet 116 through the heat dissipation channel 114, thereby carrying away the heat generated by the chip assembly 12 and providing heat dissipation for the chip assembly 12.

[0047] In some embodiments, the laser module 10 further includes a cooling power mechanism for driving the cooling medium to circulate through the inlet 115, the outlet 116, and the heat dissipation channel 114. The cooling power mechanism may include an outlet pipe, an inlet pipe, and a liquid pump. The outlet pipe connects the inlet 115 and the liquid pump, and the inlet pipe connects the outlet 116 and the liquid pump. Powered by the liquid pump, the cooling medium flows from the outlet pipe through the inlet 115 into the heat dissipation channel 114, and after passing through the heat dissipation channel 114, flows out from the outlet 116 back to the inlet pipe, thus flowing back into the outlet pipe via the liquid pump, achieving the circulation of the cooling medium.

[0048] In some embodiments, the cooling power mechanism further includes a cooling module, which may be located between the water inlet pipe and the liquid pump, for cooling the heat-carrying cooling medium flowing out from the water outlet 116, thereby improving the cooling efficiency of the laser module 10. The cooling module includes, but is not limited to, a combination of fins and a fan.

[0049] In some embodiments, the support portion 111 and the fixing portion 112 are an integral structure, with the water inlet 115 and the water outlet 116 corresponding to the opposite ends of the support portion 111 in the Y-axis direction. Thus, the water inlet 115 and the water outlet 116 correspond to the arrangement area of ​​the chip assembly 12, which simplifies the structural setup, avoids interference between the water inlet / outlet mechanism and the fixing portion 112, and improves the heat dissipation performance of the chip assembly 12. In other embodiments, the support portion 111 and the fixing portion 112 can also be a separate structure, in which case the water inlet 115 and the water outlet 116 can be respectively located at opposite ends of the support portion 111 in the Y-axis direction.

[0050] Combination Figure 1 and Figure 3 As shown, Figure 3 The diagram shows a cross-sectional view of a single heat sink 11 along the X-axis in some embodiments of this application. In some embodiments, the heat sink 11 further includes a plurality of heat dissipation structures 117 disposed within a heat dissipation channel 114, the plurality of heat dissipation structures 117 being spaced apart along the X-axis. The heat dissipation structures 117 can increase the heat dissipation area of ​​the heat sink 11 and the contact area between the heat sink 11 and the cooling medium, thereby improving the heat dissipation efficiency of the laser module 10.

[0051] The heat dissipation structure 117 can be a structure protruding from the inner wall of the heat sink 11 and arranged in an array. The heat dissipation structure 117 includes, but is not limited to, any applicable shape such as fins, toothed structures, or columnar structures, as long as it can increase the heat dissipation area of ​​the heat sink 11 to improve heat dissipation efficiency. For example, in some embodiments, the heat dissipation structure 117 is a toothed structure protruding from the bottom wall of the heat dissipation channel 114, and the height of the heat dissipation structure 117 is 1.5mm lower than the height of the heat dissipation channel 114. The end face shape of the heat dissipation structure 117 is a rhombus structure with a side length of 1.5mm-2mm. Multiple heat dissipation structures 117 are arranged in an array with an array spacing of 1.5mm-3mm, which can effectively improve the heat dissipation performance of the heat dissipation module.

[0052] refer to Figure 2 and Figure 4 As shown, in some embodiments, the laser module 10 further includes a shaping lens 13. The shaping lens 13 is fixed relative to the heat sink 11 and located on the light-emitting side of the multiple chip components 12. The orthogonal projection of the shaping lens 13 onto the heat sink 11 covers the multiple chip components 12. The shaping lens 13 may have positive optical power in at least one direction in the X-axis and Y-axis directions to focus the laser emitted by the chip components 12, thereby improving the luminous power density of the laser module 10. Simultaneously, setting the shaping lens 13 to shape the laser emitted by the chip components 12 is beneficial for meeting the heating requirements of specific shaped light spots, such as shaping the laser into a linear light spot. Furthermore, the fixed arrangement of the shaping lens 13 relative to the heat sink 11 facilitates the formation of a single structural unit for the laser module 10, making its installation and use convenient.

[0053] In some embodiments, the laser module 10 is provided with a shaping lens 13. The orthographic projection of the shaping lens 13 onto the heat sink 11 covers the chip components 12 on multiple heat sinks 11. The shaping lens 13 can be fixedly connected to multiple heat sinks 11 simultaneously through an intermediate structural component, or it can be disposed on the housing of the laser heating device to be fixed relative to the heat sinks 11. This simplifies the setting of the shaping lens 13 and reduces the difficulty and cost of setting it.

[0054] In other embodiments, the laser module 10 is provided with multiple shaping lenses 13, which are fixedly positioned relative to multiple heat sinks 11 in a one-to-one correspondence. For example, the shaping lens 13 and the corresponding heat sink 11 can be fixedly connected through an intermediate structural component. The orthographic projection of the shaping lens 13 onto the heat sink 11 covers multiple chip components 12 on the corresponding heat sink 11. In this way, the shaping lens 13 and the corresponding heat sink 11 form a structural unit, which facilitates the individual replacement and maintenance of each shaping lens 13 and heat sink 11, improving the convenience of maintenance.

[0055] In some embodiments, the light-emitting surface 131 of the shaping lens 13 (i.e., the surface facing away from the chip assembly 12) has a planar cross-section in the X-axis direction, and the cross-section in the Y-axis direction is convex. The light-incident surface 132 of the shaping lens 13 (i.e., the back side facing the chip assembly 12) has planar cross-sections in both the X-axis and Y-axis directions. In other words, the shaping lens 13 has no optical power in the X-axis direction but positive optical power in the Y-axis direction. Thus, the light spot emitted after being shaped by the shaping lens 13 can be elongated, and the power density in the Y-axis direction is increased, which can meet the heating requirements of workpieces with specific shapes.

[0056] The focal length of the shaping lens 13 is, but is not limited to, 150mm, 200mm or 300mm, which can be set according to the spot area and luminous power requirements.

[0057] refer to Figure 5 As shown, in some embodiments, the chip assembly 12 includes a heat sink 121 and a laser chip 122 disposed on the heat sink 121. The laser chip 122 is disposed on the heat sink 121, which is disposed on the heat sink 11. The laser chip 122 is used to emit laser light, and the heat generated by the laser chip 122 can be conducted to the heat sink 11 through the heat sink 121. The heat sink 121 can improve the structural and performance reliability of the chip assembly 12, while also improving the heat dissipation efficiency of the laser chip 122.

[0058] In some embodiments, the laser chip 122 can be bonded to the heat sink 121 by pre-made gold solder sheet, and the heat sink 121 can be encapsulated and bonded by solder sheet or silver paste.

[0059] In some embodiments, the slow axis (SAC) of the laser chip 122 is parallel to the Y-axis, and the fast axis (FAC) is parallel to the X-axis. The divergence angle of the chip assembly 12 in the X-axis direction is greater than that in the Y-axis direction. Therefore, the laser spot emitted by a single chip assembly 12, after being converged by the shaping lens 13, can present an elongated strip-shaped spot extending along the X-axis, and the laser spot, after being converged by the shaping lens 13 in the Y-axis direction, has an increased luminous power density. Thus, the laser spots emitted by multiple chip assemblies 12 arranged sequentially in the Y-axis direction are combined to form an elongated strip-shaped spot extending along the Y-axis, which can meet the laser heating requirements of specific shapes and simultaneously improve the luminous power density of the elongated strip-shaped spot emitted by the laser module 10.

[0060] refer to Figure 6 and Figure 7 As shown, Figure 6 and Figure 7 Schematic diagrams showing the light emission effects of the laser module 10 in the X-axis and Y-axis directions in some embodiments of this application are provided. Figure 6 It can be seen that the lasers emitted by the laser chips 122 sequentially arranged on the same heat sink 11 along the X-axis direction, after passing through the shaping lens 13, are exactly connected or partially overlapped in the X-axis direction, so that the lasers emitted by the same heat sink 11 form a single spot in the X-axis direction after passing through the shaping lens 13. However, the lasers emitted by different heat sinks 11 are spaced apart in the X-axis direction, so that the lasers emitted by the laser module 10 form multiple spaced spots in the X-axis direction, and the number of spots is the same as the number of heat sinks 11. For example, Figure 6 In the embodiment shown, the laser module 10 emits eight light spots in the X-axis direction.

[0061] Depend on Figure 7 As can be seen, the lasers emitted by the laser modules 10, which are positioned correspondingly and arranged sequentially along the Y-axis, are exactly connected or partially overlap, resulting in a continuous light spot formed by the lasers emitted by the laser modules 10 along the Y-axis. In other words, in some embodiments, the laser module 10 can emit eight linear light spots, the length of which is parallel to the Y-axis, the width of which is parallel to the X-axis, and they are spaced apart sequentially along the X-axis. Furthermore, because the laser emitted by the chip assembly 12 is converged by the shaping lens 13 along the Y-axis, the luminous power density of the eight linear light spots emitted by the laser module 10 is significantly improved.

[0062] Of course, in other embodiments, the lasers emitted by the chip components 12 on two adjacent heat sinks 11 in the X-axis direction may also be connected in the X-axis direction, or the lasers emitted by multiple chip components 12 that are correspondingly positioned in the Y-axis direction may also be spaced apart in the Y-axis direction. The specific settings can be made according to the shape and area requirements of laser heating, which will not be elaborated here.

[0063] refer to Figure 8 and Figure 9 As shown, Figure 8 and Figure 9 The incoherent irradiance maps of the laser emitted by the laser module 10 in the X-axis and Y-axis directions are shown in some embodiments. Figure 8 and Figure 9 In the corresponding embodiment, the focal length of the shaping lens 13 is 150mm. The laser emitted by the laser module 10 forms multiple spaced linear light spots after passing through the shaping lens 13. As the propagation distance increases, the multiple linear light spots gradually approach each other in the X-axis direction until they connect or overlap. The linear light spots emitted by the laser module 10 connect or overlap at a distance of 132-145mm from the incident surface of the focusing lens, with a light field size of 200*8mm and a power density of up to 390w / cm². 2It can be seen that the long, linear light spot emitted by the laser module 10 has a large area and high luminous power density, which can meet the laser heating requirements of large-area workpieces such as power batteries.

[0064] This application also provides a laser heating device, including a housing and a laser module 10 as described in any of the above embodiments. The laser module 10 is disposed within the housing. For example, each heat sink 11 of the laser module 10 is fixedly mounted on the housing by a fixing block. The laser emitted by the laser module 10 can exit through the light-emitting holes and other structures of the housing. By using the laser module 10 described above in the laser heating device, the laser heating device can have a large luminous area and luminous power, which can meet the laser heating requirements for workpieces with large areas, such as power batteries.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser module, characterized in that, include: Multiple heat sinks are arranged sequentially along the X-axis, and each heat sink has a heat dissipation channel through which the cooling medium flows. and, Multiple chip components are disposed on the heat sink, wherein each heat sink is provided with multiple chip components, and the chip components on the same heat sink are arranged sequentially in the Y-axis direction. The X-axis direction and the Y-axis direction are two mutually perpendicular directions on the surface of the heat sink used to set the chip components.

2. The laser module according to claim 1, characterized in that, Each heat sink is provided with a plurality of chip components arranged sequentially in the X-axis direction, and the plurality of chip components of the same heat sink are arranged in a row and column array in the X-axis direction and the Y-axis direction.

3. The laser module according to claim 1, characterized in that, Multiple heat sinks are sequentially abutted against each other in the X-axis direction.

4. The laser module according to claim 1, characterized in that, The laser module also includes a shaping lens, which is fixed relative to the heat sink and located on the light-emitting side of the multiple chip components. The orthogonal projection of the shaping lens onto the heat sink covers the multiple chip components.

5. The laser module according to claim 4, characterized in that, The light-emitting surface of the shaping lens has a planar cross-section in the X-axis direction at each point, and a convex cross-section in the Y-axis direction at each point.

6. The laser module according to claim 5, characterized in that, The divergence angle of the chip assembly in the X-axis direction is greater than that in the Y-axis direction.

7. The laser module according to claim 4, characterized in that, The laser module is provided with a shaping lens, and the orthographic projection of one shaping lens on the heat sink covers multiple chip components on the heat sink; or, The laser module is provided with a plurality of shaping lenses, and the plurality of shaping lenses are fixed relative to the plurality of heat sinks in a one-to-one correspondence. The orthogonal projection of the shaping lens on the heat sink covers the plurality of chip components on a corresponding heat sink.

8. The laser module according to claim 1, characterized in that, The heat sink includes a support portion and two fixing portions. The two fixing portions are respectively connected to the two opposite ends of the support portion in the Y-axis direction. The two fixing portions are used to fix the laser module on the housing. The chip assembly is disposed on the support portion.

9. The laser module according to claim 8, characterized in that, The heat sink has an inlet and an outlet on the side facing away from the chip assembly, which are connected to a heat dissipation channel. The inlet and outlet correspond to the two opposite ends of the support part in the Y-axis direction.

10. A laser heating device, characterized in that, It includes a housing and a laser module as described in any one of claims 1-9, wherein the laser module is disposed within the housing.

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