Heat dissipation back splint

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation back splint. Comprising a heat dissipation assembly and two clamping assemblies, the heat dissipation assembly comprises a shell and a heat dissipation piece arranged in the shell, a connecting frame is further arranged in the shell, and sliding grooves are formed in the two ends, in the length direction, of the connecting frame correspondingly; the heat dissipation piece is arranged on the connecting frame and located between the two sliding grooves, and the heat dissipation piece is of a rectangular structure. Each of the two clamping assemblies comprises a clamping part and a sliding part which are connected with each other, avoiding grooves are formed in the sliding parts, the two sliding parts are correspondingly arranged in the two sliding grooves respectively, and a group of opposite angles of the heat dissipation piece can correspondingly extend into the two avoiding grooves respectively; the clamping part is located outside the shell and used for clamping the electronic equipment. According to the structure, the internal space of the shell is effectively and fully utilized, and the arrangement area of the heat dissipation piece in the shell is increased, so that the heat dissipation effect of the heat dissipation back splint is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to a heat dissipation back clip. Background Technology

[0002] Cooling clips (such as mobile phone cooling clips, tablet cooling clips, etc.) are used to fix the back of electronic devices to accelerate the heat dissipation of electronic devices.

[0003] The heat dissipation back clip includes a heat dissipation component and clamping components respectively located at both ends of the heat dissipation component. Both clamping components are provided with sliding parts to adjust the distance between the two clamping components, so as to clamp them on the side of electronic devices of different sizes, thereby improving the applicability of the heat dissipation back clip.

[0004] The sliding part of the clamping component is located inside the heat dissipation component. Since the thermoelectric cooler inside the heat dissipation component is the core component for heat dissipation of electronic devices, the sliding part will occupy the internal space of the heat dissipation component, thereby reducing the area of ​​the thermoelectric cooler and affecting the heat dissipation effect of the heat dissipation back clip on electronic devices. Utility Model Content

[0005] The technical problem to be solved by this utility model embodiment is to provide a heat dissipation back clip to solve the problem that the setting of the sliding part in the prior art occupies the internal space of the heat dissipation component, thereby reducing the area of ​​the semiconductor cooling chip and affecting the heat dissipation effect of the heat dissipation back clip on electronic devices.

[0006] This utility model discloses a heat dissipation back clip, comprising: a heat dissipation assembly and two clamping assemblies. The heat dissipation assembly includes a housing and a heat dissipation component disposed within the housing. A connecting frame is also disposed within the housing, and sliding grooves are formed at both ends of the connecting frame along its length. The heat dissipation component is disposed on the connecting frame and located between the two sliding grooves, and the heat dissipation component has a rectangular structure. Each of the two clamping assemblies includes a clamping part and a sliding part connected to each other. A clearance groove is formed on the sliding part, and the two sliding parts are respectively disposed in the two sliding grooves. A set of diagonal parts of the heat dissipation component can respectively extend into the two clearance grooves. The clamping part is located outside the housing and is used to clamp electronic devices.

[0007] Optionally, the connecting frame includes a first connecting platform, a second connecting platform, and heat dissipation fins. Two grooves are formed on the first connecting platform, and the second connecting platform is disposed between the two grooves. The heat dissipation component is disposed on the second connecting platform. The heat dissipation fins are disposed on the side of the first connecting platform away from the second connecting platform. The heat dissipation fins surround the first connecting platform circumferentially, and the heat dissipation fins enclose an installation space. A fan is disposed within the installation space.

[0008] Optionally, the first connecting platform has an elliptical structure, and a set of diagonals of the heat sink extends to the edge of the first connecting platform in the width direction.

[0009] Optionally, the outer casing includes a first casing and a second casing, which are fastened together to form an accommodating space, and the connecting frame and the heat dissipation component are both disposed within the accommodating space.

[0010] Optionally, the first housing has an opening and four mounting slots on the side opposite to the second housing. The size of the opening matches the heat sink, and the heat sink protrudes from the opening. The mounting slots are arranged around the opening, and each mounting slot is provided with a magnetic attractor.

[0011] Optionally, a first cover plate is provided on the side of the first housing opposite to the second housing, and the first cover plate covers the heat dissipation component and the magnetic component.

[0012] Optionally, a plurality of first heat dissipation windows are formed on the side wall of the first housing, and a portion of the heat dissipation fins are exposed through the first heat dissipation windows; a second heat dissipation window is formed on the side of the second housing opposite to the first housing, and the fan can be exposed through the second heat dissipation window.

[0013] Optionally, the clamping part is rotatably disposed on the sliding part so that the clamping part can switch between a clamping position and a retracted position. When the two clamping parts are in the clamping position, they can cooperate to clamp the electronic device; when the clamping part is in the retracted position, it can be attached to the first cover plate.

[0014] Optionally, the sliding part includes a sliding block and an elastic member disposed within the sliding block. The sliding block has the clearance groove formed on it and is disposed within the groove. Along the reverse length of the connecting frame, one end of the elastic member is connected to the inner wall of the sliding block, and the other end is connected to the side wall of the groove.

[0015] Optionally, the number of elastic elements is set to two, and the two elastic elements are distributed on both sides of the clearance groove.

[0016] Compared with the prior art, the beneficial effects of the heat dissipation back clip provided in this utility model embodiment are as follows: the heat dissipation assembly includes a shell and a heat dissipation component disposed within the shell, and a connecting frame is also provided inside the shell, dividing the connecting frame into three areas: two sliding grooves formed at both ends along the length direction of the connecting frame, and the portion between the two sliding grooves, with the heat dissipation component disposed between the two sliding grooves; at the same time, the two clamping components each include a clamping part and a sliding part connected to each other, with the two sliding parts respectively disposed in the two sliding grooves, and a clearance groove formed on the sliding part, allowing a set of diagonal parts of the heat dissipation component to extend into the two clearance grooves respectively. This arrangement effectively and fully utilizes the internal space of the shell without increasing the volume of the shell, ensuring the placement area of ​​the heat dissipation component within the shell, thereby improving the heat dissipation effect of the heat dissipation back clip. Attached Figure Description

[0017] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0018] Figure 1 This is one of the exploded views of the heat dissipation back clip provided in this embodiment of the utility model;

[0019] Figure 2 This is the second exploded view of the heat dissipation back clip provided in this embodiment of the utility model;

[0020] Figure 3 This is one of the structural schematic diagrams of the connecting frame provided in this utility model embodiment;

[0021] Figure 4 This is the second structural schematic diagram of the connecting frame provided in this embodiment of the utility model;

[0022] Figure 5 This is a schematic diagram of the connecting frame, the second housing, and the clamping assembly provided in this embodiment of the utility model;

[0023] Figure 6 This is one of the overall structural schematic diagrams of the heat dissipation back clip provided in this embodiment of the utility model;

[0024] Figure 7 This is the second schematic diagram of the overall structure of the heat dissipation back clip provided in this embodiment of the utility model.

[0025] The labels for the attached figures are as follows:

[0026] 10. Outer shell; 110. First shell; 1101. Opening; 1103. First heat dissipation window; 111. Magnetic suction element; 112. First cover plate; 120. Second shell; 1201. Second heat dissipation window; 20. Connecting bracket; 210. First connecting platform; 211. Slide groove; 230. Second connecting platform; 220. Heat dissipation fins; 2201. Installation space; 30. Heat dissipation component; 40. Clamping assembly; 410. Clamping part; 420. Sliding part; 421. Sliding block; 4211. Third shell; 4212. Second cover plate; 422. Elastic element; 4201. Clearance groove; 50. Fan. Detailed Implementation

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0028] This utility model embodiment provides a heat dissipation back clip, such as Figures 1 to 7 As shown, the device includes a heat dissipation assembly 1 and two clamping assemblies 40. The heat dissipation assembly 1 includes a housing 10 and a heat sink 30 disposed within the housing 10. A connecting frame 20 is also disposed within the housing 10, and sliding grooves 211 are formed at both ends of the connecting frame 20 along its length. The heat sink 30 is disposed on the connecting frame 20 and located between the two sliding grooves 211, and the heat sink 30 has a rectangular structure. Each of the two clamping assemblies 40 includes a clamping part 410 and a sliding part 420 connected to each other. A clearance groove 4201 is formed on the sliding part 420, and the two sliding parts 420 are respectively disposed in the two sliding grooves 211. A set of diagonal parts of the heat sink 30 can respectively extend into the two clearance grooves 4201. The clamping part 410 is located outside the housing 10 and is used to clamp electronic devices (not shown in the figure).

[0029] In this embodiment, the heat dissipation assembly 1 includes a housing 10 and a heat dissipation component 30 disposed within the housing 10. A connecting frame 20 is also provided within the housing 10, dividing the connecting frame 20 into three areas: two sliding grooves 211 formed at both ends along the length of the connecting frame 20, and the portion between the two sliding grooves 211. The heat dissipation component 30 is disposed between the two sliding grooves 211. Simultaneously, two clamping assemblies 40 are provided, each including a clamping portion 410 and a sliding portion 420 connected to each other. The two sliding portions 420 are respectively disposed within the two sliding grooves 211, and clearance grooves 4201 are formed on the sliding portions 420. A set of diagonal sections of the heat dissipation component 30 can respectively extend into the two clearance grooves 4201. This arrangement effectively and fully utilizes the internal space of the housing 10 without increasing its volume, ensuring the placement area of ​​the heat dissipation component 30 within the housing 10, thereby improving the heat dissipation effect of the heat dissipation back clip.

[0030] The electronic device in this embodiment can be a mobile phone, tablet, etc. The aforementioned clearance groove 4201 has a V-shaped structure, which matches the diagonal of the heat sink 30.

[0031] As a preferred embodiment, refer to Figures 1 to 4 The connecting frame 20 includes a first connecting platform 210, a second connecting platform 230, and heat dissipation fins 220. Two sliding grooves 211 are formed on the first connecting platform 210, and the second connecting platform 230 is disposed between the two sliding grooves 211. The heat dissipation component 30 is disposed on the second connecting platform 230. The heat dissipation fins 220 are disposed on the side of the first connecting platform 210 away from the second connecting platform 230. The heat dissipation fins 220 surround the first connecting platform 210 along the circumference of the first connecting platform 210, and the heat dissipation fins 220 enclose an installation space 2201. A fan 50 is disposed in the installation space 2201.

[0032] The connecting frame 20 comprises a first connecting platform 210, a second connecting platform 230, and heat dissipation fins 220. The first connecting platform 210 has a groove 211, allowing the sliding part 420 of the clamping assembly 40 to slidably reside within the groove 211. The second connecting platform 230 is located between the two grooves 211, providing a stable mounting environment for the heat dissipation component 30, thus fixing the heat dissipation component 30 onto the connecting frame 20. Simultaneously, heat dissipation fins 220 are provided on the side of the first connecting platform 210 opposite to the second connecting platform 230, and the heat dissipation fins 220 surround the first connecting platform 210 circumferentially. The heat sink 30 in this example uses a thermoelectric cooler. After the thermoelectric cooler is put into operation, one side cools down while the other side heats up. During use, the cooled side faces the electronic device to achieve the purpose of heat dissipation and cooling of the electronic device. At the same time, the heat dissipation fins 220 can dissipate the heat generated by the thermoelectric cooler to the outside of the housing 10 in a timely manner. The heat dissipation fins 220 form an installation space 2201. A fan 50 is installed in the installation space 2201. With the assistance of the fan 50, the heat dissipation efficiency can be accelerated again to ensure the overall heat dissipation effect of the heat dissipation back clip. At the same time, the above layout is compact, makes full use of space, and improves the overall integration of the heat dissipation back clip.

[0033] As a preferred embodiment, refer to Figure 3 The first connecting platform 210 has an elliptical structure, and a set of diagonals of the heat sink 30 extends to the edge of the first connecting platform 210 in the width direction.

[0034] The aforementioned structural limitations on the first connecting platform 210 and the diagonal extension of the heat sink 30 along the width of the first connecting platform 210 extend to the edge of the first connecting platform 210. This maximizes the installation area of ​​the heat sink 30 within the housing 10, ensuring sufficient installation area of ​​the heat sink 30 within the housing 10 and further improving the heat dissipation effect of the heat dissipation back clip on the electronic device.

[0035] As a preferred embodiment, refer to Figure 1 and Figure 2 The outer casing 10 includes a first casing 110 and a second casing 120. The first casing 110 and the second casing 120 are fastened together to form an accommodating space. The connecting frame 20 and the heat sink 30 are disposed in the accommodating space.

[0036] In this embodiment, the outer shell 10 is composed of a first shell 110 and a second shell 120, and the first shell 110 and the second shell 120 are fastened together to form an accommodating space. This arrangement facilitates the assembly of the heat dissipation component 1. The connecting frame 20 and the heat dissipation component 30 are placed on the second shell 120, and the first shell 110 is fastened to the second shell 120, so that the connecting frame 20 and the heat dissipation component 30 are both placed in the accommodating space, thereby protecting the connecting frame 20 and the heat dissipation component 30.

[0037] In the application of the heat dissipation back clip of this embodiment, the first housing 110 is positioned close to the electronic device.

[0038] As a preferred embodiment, refer to Figure 1 and Figure 2 The first housing 110 has an opening 1101 and four mounting slots (not shown in the figure) on the side opposite to the second housing 120. The size of the opening 1101 matches the heat sink 30, and the heat sink 30 is exposed from the opening 1101. The mounting slots are arranged around the opening 1101, and each mounting slot is provided with a magnetic suction element 111.

[0039] In this embodiment, an opening 1101 and four mounting slots are formed on the side of the first housing 110 opposite to the second housing 120. The heat sink 30 protrudes from the opening 1101. When the heat sink back clip is attached to the electronic device, the cooling energy generated by the thermoelectric cooler diffuses to the electronic device through the opening 1101, ensuring the heat dissipation effect of the electronic device. Simultaneously, a magnetic suction element 111 is provided within the mounting slots surrounding the opening 1101. The magnetic suction element 111 can also cooperate with the electronic device to fix the housing 10 to the electronic device. The mounting slots surrounding the opening 1101 fully utilize the space of the first housing 110 without increasing the volume of the housing 10, thus improving the overall integration of the heat sink back clip. In this embodiment, the magnetic suction element 111 is a magnet.

[0040] As a preferred embodiment, refer to Figure 1 and Figure 2 The first housing 110 is provided with a first cover plate 112 on the side opposite to the second housing 120. The first cover plate 112 can cover the heat sink 30 and the magnetic suction component 111.

[0041] The first cover plate 112 serves to protect the heat sink 30 and the magnetic attachment 111. When using the heat sink back clip of this embodiment, the first cover plate 112 is attached to the electronic device.

[0042] As a preferred embodiment, refer to Figure 1 The first housing 110 has a plurality of first heat dissipation windows 1103 formed on its side wall, and a portion of the heat dissipation fins 220 are exposed through the first heat dissipation windows 1103; the second housing 120 has a second heat dissipation window 1201 formed on the side opposite to the first housing 110, and the fan 50 is exposed through the second heat dissipation window 1201.

[0043] The first heat dissipation window 1103 on the side wall of the first housing 110 and the second heat dissipation window 1201 formed on the second housing 120 can allow heat to be diffused from the first heat dissipation window 1103 and the second heat dissipation window 1201 to the outside of the outer shell 10 in a timely manner, thereby further improving the heat dissipation efficiency of the heat dissipation back clip.

[0044] As a preferred embodiment, refer to Figure 1 , Figure 2 , Figures 5 to 7 The clamping part 410 is rotatably disposed on the sliding part 420 so that the clamping part 410 can switch between a clamping position and a retracted position. When the two clamping parts 410 are in the clamping position, they can cooperate to clamp the electronic device; when the clamping part 410 is in the retracted position, it can be attached to the first cover plate 112.

[0045] In this embodiment, the clamping assembly 40 has a clamping part 410 rotatably mounted on the sliding part 420, allowing the clamping part 410 to have two working states. Specifically, the clamping part 410 can switch between a clamping position and a retracted position. When the heat dissipation back clip needs to be attached to the electronic device, both clamping parts 410 are in the clamping position. At this time, the clamping parts 410 are perpendicular to the sliding part 420 and clamp the sides of the electronic device along its width. Under the action of the two clamping parts 410, the heat dissipation assembly 1 is fixed to the electronic device, and the first cover plate 112 is attached to the surface of the electronic device. When the heat dissipation back clip is not in use, it is removed from the electronic device, and the clamping parts 410 are rotated to retract to the retracted position. At this time, the clamping parts 410 can adhere to the surface of the first housing 110, reducing the overall volume of the heat dissipation back clip and making it easier for users to store and carry.

[0046] This embodiment does not specifically limit the rotational connection method between the clamping part 410 and the sliding part 420. One example is provided: the rotating part is provided with a rotating shaft (not shown in the figure), and the clamping part 410 is sleeved on the rotating shaft to realize the rotational setting of the clamping part 410 in the sliding part 420.

[0047] Reference Figure 6 and Figure 7 , Figure 6 This is a schematic diagram showing the clamping part 410 in the retracted position. Figure 7 This is a schematic diagram of the clamping part 410 in the clamping position.

[0048] As a preferred embodiment, refer to Figure 1 and Figure 5 The sliding part 420 includes a sliding block 421 and an elastic member 422 disposed in the sliding block 421. An avoidance groove 4201 is formed on the sliding block 421, and the sliding block 421 is disposed in the sliding groove 211. Along the reverse of the length of the connecting frame, one end of the elastic member 422 is connected to the inner wall of the sliding block 421, and the other end is connected to the side wall of the sliding groove 211.

[0049] The sliding part 420 is composed of a sliding block 421 and an elastic element 422. When using the clamping assembly 40, the elastic element 422 is arranged along the length direction of the connecting frame 20 to control the two sliding blocks 421 to move away from each other to adapt to electronic devices of different sizes. The elastic element 422 is stretched so that the two clamping parts 410 are firmly clamped on the electronic device, thereby improving the stability of the heat dissipation back clamp on the electronic device.

[0050] Reference Figure 1 The sliding block 421 is composed of a second cover plate 4212 and a third housing 4211. The second cover plate 4212 and the third housing 4211 are interlocked to form an accommodating space. The elastic element 422 is located in the accommodating space. This structural composition facilitates the assembly of the heat dissipation back clip.

[0051] As a preferred embodiment, refer to Figure 5 There are two elastic elements 422, which are distributed on both sides of the clearance groove 4201.

[0052] The number and layout of the elastic elements 422 save space for the sliding part 420 within the housing 10, improve the clamping force of the clamping assembly 40, and enhance the overall integration of the sliding part 420, thereby providing a more adequate environment for the heat sink 30 (semiconductor cooling chip) and ensuring the heat dissipation effect of the electronic device.

[0053] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.

Claims

1. A heat dissipation back clip, characterized in that, include: A heat dissipation assembly includes a housing and a heat dissipation component disposed within the housing. A connecting frame is also provided inside the housing, and sliding grooves are formed at both ends of the connecting frame along its length. The heat dissipation component is disposed on the connecting frame and located between the two sliding grooves, and the heat dissipation component has a rectangular structure. Both clamping assemblies include clamping parts and sliding parts connected to each other. The sliding parts are formed with clearance grooves. The two sliding parts are respectively disposed in the two clearance grooves. A set of diagonal parts of the heat sink can respectively extend into the two clearance grooves. The clamping part is located outside the housing and is used to clamp electronic devices.

2. The heat dissipation back clip according to claim 1, characterized in that, The connecting frame includes a first connecting platform, a second connecting platform, and heat dissipation fins. Two grooves are formed on the first connecting platform, and the second connecting platform is disposed between the two grooves. The heat dissipation component is disposed on the second connecting platform. The heat dissipation fins are disposed on the side of the first connecting platform away from the second connecting platform. The heat dissipation fins surround the first connecting platform circumferentially and form an installation space. A fan is disposed within the installation space.

3. The heat dissipation back clip according to claim 2, characterized in that, The first connecting platform has an elliptical structure, and a set of diagonals of the heat sink extends to the edge of the first connecting platform in the width direction.

4. The heat dissipation back clip according to claim 3, characterized in that, The outer casing includes a first casing and a second casing, which are fastened together to form an accommodating space. The connecting frame and the heat dissipation component are both disposed within the accommodating space.

5. The heat dissipation back clip according to claim 4, characterized in that, The first housing has an opening and four mounting slots on the side opposite to the second housing. The size of the opening matches the heat sink, and the heat sink protrudes from the opening. The mounting slots are arranged around the opening, and each mounting slot is provided with a magnetic attractor.

6. The heat dissipation back clip according to claim 5, characterized in that, A first cover plate is provided on the side of the first housing opposite to the second housing, and the first cover plate covers the heat dissipation component and the magnetic component.

7. The heat dissipation back clip according to claim 6, characterized in that, Multiple first heat dissipation windows are formed on the side wall of the first housing, and a portion of the heat dissipation fins are exposed through the first heat dissipation windows; The second housing has a second heat dissipation window on the side opposite to the first housing, and the fan is exposed through the second heat dissipation window.

8. The heat dissipation back clip according to claim 7, characterized in that, The clamping part is rotatably disposed on the sliding part so that the clamping part can switch between a clamping position and a retracted position. When the two clamping parts are in the clamping position, they can cooperate to clamp the electronic device; when the two clamping parts are in the retracted position, they can be attached to the first cover plate.

9. The heat dissipation back clip according to claim 8, characterized in that, The sliding part includes a sliding block and an elastic member disposed within the sliding block. The sliding block has the clearance groove formed on it and is disposed within the groove. Along the reverse length of the connecting frame, one end of the elastic member is connected to the inner wall of the sliding block, and the other end is connected to the side wall of the groove.

10. The heat dissipation back clip according to claim 9, characterized in that, The number of elastic elements is set to two, and the two elastic elements are distributed on both sides of the clearance groove.

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