Heat dissipation device
By setting a locally thinned groove structure on the heat dissipation device housing, the problem of damage to electronic devices caused by housing rupture under high pressure is solved, and smooth pressure relief and diffusion of fluid are achieved, thereby improving heat dissipation efficiency.
Patent Information
- Application Number
- CN202520438848.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-12
AI Technical Summary
Existing low-temperature heat pipes or vapor chambers may crack under excessive pressure at high temperatures, and the deformation during cracking may damage electronic components.
A first groove with localized thinning is provided on the housing of the heat dissipation device, so that it will rupture at a specific location when the pressure is too high, and the fluid is guided to the heat dissipation fins through a second groove and through hole, using airflow diffusion to avoid fluid accumulation.
It effectively avoids the impact of casing rupture on electronic components, ensures smooth fluid depressurization, prevents resistance bottlenecks, and improves heat dissipation efficiency.
Smart Images
Figure CN223943044U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of heat dissipation equipment technology, and more specifically, relates to a heat dissipation device. Background Technology
[0002] Currently, electronic devices generally need to be equipped with heat dissipation devices to alleviate the heat generated during operation and reduce the device temperature.
[0003] Common heat dissipation devices use low-temperature heat pipes or vapor chambers to transfer heat. Low-temperature heat pipes and vapor chambers usually use working fluids with boiling points below room temperature, such as liquid ammonia, 134a, methane, ethane, etc. Through the phase change of the working fluid, heat in electronic devices can be quickly carried away to achieve heat dissipation.
[0004] The outer shell of a low-temperature heat pipe or vapor chamber is usually made of extruded aluminum, and some are made of finely drawn copper tubes. The thickness of the outer shell is relatively uniform. These low-boiling-point working fluids will generate extremely high pressure at high temperatures. If the temperature exceeds a certain limit, the outer shell of the low-temperature heat pipe or vapor chamber will burst. Because the outer shell is of uniform thickness, it may break from any unconstrained surface. The deformation generated when it breaks may damage nearby electronic devices. Utility Model Content
[0005] The main purpose of this invention is to provide a heat dissipation device that locally thins the housing, so that the housing will rupture at a specific location when the pressure is too high, thus avoiding damage to electronic components.
[0006] According to a first aspect of the present invention, a heat dissipation device is provided, comprising a heat-conducting element and a heat dissipation element. The heat-conducting element includes a housing, a sealed cavity is provided in the housing, the cavity is filled with a phase-change working fluid, the heat dissipation element is connected to the housing, and a first groove is provided on the outer wall of the housing, which opens toward the heat dissipation element.
[0007] In the above-mentioned heat dissipation device, the heat-conducting component is divided into an evaporation section and a condensation section along its length. The condensation section includes a first contact surface and a second contact surface arranged opposite to each other. The heat dissipation component is in contact with the first contact surface and the second contact surface. The first groove is disposed on the first contact surface and / or the second contact surface.
[0008] In the above-mentioned heat dissipation device, the heat dissipation component includes a substrate, the substrate includes a heat absorption surface and a heat dissipation surface, the heat absorption surface and the heat dissipation surface are arranged opposite to each other, the heat conduction component is connected to the heat absorption surface, and a plurality of heat dissipation fins are provided on the heat dissipation surface.
[0009] The housing includes a first contact surface and a second contact surface, which are arranged opposite to each other. The first contact surface is used to contact the device to be cooled, and the second contact surface is used to contact the substrate. The substrate is provided with a second groove corresponding to the first groove. The second groove is open toward the first groove, and the bottom of the second groove is provided with a through hole that extends to the heat dissipation surface.
[0010] In the above-mentioned heat dissipation device, a third groove is provided on the heat-absorbing surface, the heat-conducting element is embedded in the third groove, the second contact surface contacts the bottom of the third groove, and the second groove is disposed at the bottom of the third groove.
[0011] In the above-mentioned heat dissipation device, there are multiple cavities arranged side by side along the width direction of the heat-conducting element.
[0012] In the above-mentioned heat dissipation device, the depth of the cavity in the thickness direction of the heat-conducting component is D1; the width of the first groove is W1, where W1>2D1.
[0013] In the heat dissipation device described above, the width of the first groove is W1, the width of the second groove is W2, and W2 ≥ W1.
[0014] In the above-mentioned heat dissipation device, the depth of the cavity in the thickness direction of the heat-conducting component is D1; the depth of the second groove is D2, and D2≥D1 / 2.
[0015] In the above-mentioned heat dissipation device, the cross-sectional area of the cavity in the thickness direction of the heat-conducting component is S1;
[0016] The second groove is provided with N through holes, and the cross-sectional area of the through holes is S2, where N·S2≥2S1.
[0017] One of the above-described technical solutions of this utility model has at least one of the following advantages or beneficial effects:
[0018] In this invention, a first groove is provided on the second contact surface of the shell, which is equivalent to locally thinning the shell. When the internal pressure of the shell is too high, the shell will break at the specific position of the first groove. At this time, the deformation of the shell will not affect the electronic device. Moreover, the first groove is facing the heat sink, and the leaked liquid will be blown away by the airflow in the heat sink and will not accumulate. Attached Figure Description
[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments;
[0020] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this utility model;
[0021] Figure 2 This is an exploded view of the structure of Embodiment 1 of this utility model;
[0022] Figure 3 This is another exploded view of the structure of Embodiment 1 of this utility model;
[0023] Figure 4 This is a structural cross-sectional view of Embodiment 1 of this utility model;
[0024] Figure 5 This is Embodiment 1 of the present utility model. Figure 4 A magnified view of a portion of A;
[0025] Figure 6 This is an exploded view of the structure of Embodiment 2 of this utility model;
[0026] Figure 7 This is another exploded view of the structure of Embodiment 2 of this utility model;
[0027] Figure 8 This is a structural schematic diagram of Embodiment 3 of the present invention;
[0028] Figure 9 This is an exploded view of the structure of Embodiment 3 of this utility model.
[0029] The figure labels for each figure are as follows:
[0030] 1. Heat-conducting component; 11. Housing; 12. Cavity; 13. First contact surface; 14. Second contact surface; 15. First groove; 2. Substrate; 21. Heat-absorbing surface; 22. Heat-dissipating surface; 23. Heat-dissipating fins; 24. Second groove; 25. Through hole; 26. Third groove. Detailed Implementation
[0031] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0032] The following disclosure provides many different implementation methods or examples for different solutions to implement this utility model.
[0033] Example 1
[0034] Reference Figures 1 to 5 As shown, in one embodiment of the present invention, a heat dissipation device includes a heat-conducting component 1 and a heat dissipation component. The heat dissipation component includes a substrate 2. The substrate 2 includes a heat-absorbing surface 21 and a heat-dissipating surface 22. The heat-absorbing surface 21 and the heat-dissipating surface 22 are arranged opposite to each other. The heat-conducting component 1 is connected to the heat-absorbing surface 21. A plurality of heat dissipation fins 23 are provided on the heat dissipation surface 22.
[0035] The heat-conducting component 1 includes a housing 11, within which a sealed cavity 12 is provided. The cavity 12 is filled with a phase-change working fluid. The housing 11 includes a first contact surface 13 and a second contact surface 14, which are arranged opposite to each other. The first contact surface 13 is used to contact the device to be cooled, and the second contact surface 14 is used to contact the substrate 2. The second contact surface 14 has a first groove 15 that opens toward the substrate 2, and the substrate 2 has a second groove 24 that corresponds to the first groove 15 and opens toward the first groove 15. The bottom of the second groove 24 has a through hole 25 that extends to the heat dissipation surface 22. The through hole 25 is located in the gap of the heat dissipation fins 25. The heat dissipation fins 25 are generally connected to a fan.
[0036] A first groove 15 is provided on the second contact surface 14 of the housing 11, which is equivalent to locally thinning the housing 11. When the internal pressure of the housing 11 is too high, the housing 11 will break at the specific position of the first groove 15. At this time, the deformation of the housing 11 will not affect the electronic device. At the same time, a second groove 24 corresponding to the first groove 15 is also provided on the substrate 2. The working fluid flowing out after the housing 11 breaks can enter the second groove 24. Using the through hole 25 in the second groove 24, the working fluid will flow to the heat dissipation fins 23. The vapor of the working fluid will quickly diffuse with the air flowing on the heat dissipation fins 23 and will not accumulate.
[0037] In this embodiment, in order to facilitate the arrangement of the heat-conducting component 1, a third groove 26 is provided on the heat-absorbing surface 21. The heat-conducting component 1 is embedded in the third groove 26, and the second contact surface 14 contacts the bottom of the third groove 26. The second groove 24 is provided at the bottom of the third groove 26. Therefore, neither the first groove 15 nor the second groove 24 will be exposed. When the housing 11 breaks at the first groove 15, the deformation of the housing 11 will be concealed and will not affect the electronic device.
[0038] In this embodiment, the length direction of the housing 11 is the first direction, and the width direction of the housing 11 is the second direction; in order to enable the heat conductor 1 to transfer heat with maximum efficiency, the length direction of the second contact surface 14 is the first direction, and the width direction of the second contact surface 14 is the second direction.
[0039] Multiple cavities 12 are arranged side by side along the second direction, and the length direction of the cavity 12 is parallel to the first direction;
[0040] The length direction of the first groove 15 is parallel to the second direction, and the width direction of the first groove 15 is parallel to the first direction. Therefore, the second groove 24 can span all cavities 12. If the pressure in any cavity 12 is too high, it can cause a rupture at the first groove 15.
[0041] In this embodiment, the direction perpendicular to both the first and second directions is the third direction, which is the thickness direction of the heat-conducting component 1. The depth of the cavity 12 in the third direction is D1; the width of the first groove 15 is W1, where W1 > 2D1. When the cavity ruptures, the working fluid flows out of the cavity 12. If the width of the first groove 15 is insufficient, the gushing working fluid will quickly be squeezed to both sides, thus creating a resistance bottleneck. Therefore, it is necessary to ensure that the width of the first groove 15 is greater than twice the depth of the cavity 12 to ensure that no resistance bottleneck is generated during pressure relief.
[0042] In this embodiment, the width of the second groove 24 is W2, where W2 ≥ W1. This allows the working fluid flowing out of the ruptured section to smoothly flow into the second groove 24.
[0043] Meanwhile, the depth of the second groove 24 is D2, where D2 ≥ D1 / 2; with such depth and width, the second groove 24 can smoothly accommodate the working fluid, thus preventing the generation of a bottleneck during pressure relief.
[0044] In this embodiment, the cross-sectional area of the cavity 12 in the third direction is S1;
[0045] The second groove 24 is provided with N through holes 25, and the cross-sectional area of the through holes 25 is S2, N·S2≥2S1; that is, the total cross-sectional area of the through holes 25 is not less than twice the cross-sectional area of the cavity 12. The through holes 25 can smoothly guide the working fluid away, and no resistance bottleneck will be generated when the working fluid is depressurized.
[0046] Example 2
[0047] Reference Figures 6 to 7 As shown, it is largely the same as in Embodiment 1, except that the length direction of the first groove 15 intersects with the second direction but is not perpendicular, so that the vapor of the working fluid can diffuse to a larger area, that is, diffuse to more fin gaps.
[0048] Meanwhile, the shape of the second groove 24 also corresponds to the first groove 15. For the substrate 2, the non-perpendicular structure has better structural strength than the vertical structure.
[0049] Example 3
[0050] Reference Figures 8 to 9As shown, a heat dissipation device includes a heat-conducting component 1 and a heat dissipation component. The heat dissipation component includes heat dissipation fins 23. The heat-conducting component 1 includes a housing 11, in which a sealed cavity 12 is provided. The cavity 12 is filled with a phase-change working fluid. The outer wall of the heat-conducting component 1 is provided with a first groove 15 that opens toward the heat dissipation fins. The heat-conducting component 1 is divided into an evaporation section and a condensation section along its length. The condensation section includes a first contact surface 13 and a second contact surface 14 arranged opposite to each other. The heat dissipation fins 23 are in contact with the first contact surface 13 and the second contact surface 14. The first groove 15 is provided on the first contact surface 13 and / or the second contact surface 14.
[0051] The evaporation section comes into contact with the device to be cooled. The phase change working fluid absorbs the heat from the device in the evaporation section and evaporates. It then flows to the condensation section and dissipates the heat under the action of the heat dissipation fins 23, thus condensing and flowing back to the evaporation section, thereby circulating the heat dissipation.
[0052] A first groove 15 is provided on the first contact surface 13 and / or the second contact surface 14 of the housing 11, which is equivalent to locally thinning the housing 11. When the internal pressure of the housing 11 is too high, the housing 11 will break at the specific position of the first groove 15. At this time, the deformation of the housing 11 will not affect the electronic device. The working fluid will flow to the heat sink fins 23, and the vapor of the working fluid will quickly diffuse with the air flowing on the heat sink fins 23 and will not accumulate.
[0053] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A heat dissipation device, characterized in that, It includes a heat-conducting component and a heat-dissipating component. The heat-conducting component includes a housing with a sealed cavity filled with a phase-change working fluid. The heat-dissipating component is connected to the housing, and the outer wall of the housing has a first groove that opens toward the heat-dissipating component.
2. The heat dissipation device according to claim 1, characterized in that, The heat-conducting component is divided into an evaporation section and a condensation section along its length. The condensation section includes a first contact surface and a second contact surface arranged opposite to each other. The heat dissipation component is in contact with the first contact surface and the second contact surface. The first groove is disposed on the first contact surface and / or the second contact surface.
3. The heat dissipation device according to claim 1, characterized in that, The heat sink includes a substrate, the substrate includes a heat absorption surface and a heat dissipation surface, the heat absorption surface and the heat dissipation surface are arranged opposite to each other, the heat conduction component is connected to the heat absorption surface, and the heat dissipation surface is provided with a plurality of heat dissipation fins. The housing includes a first contact surface and a second contact surface, which are arranged opposite to each other. The first contact surface is used to contact the device to be cooled, and the second contact surface is used to contact the substrate. The substrate is provided with a second groove corresponding to the first groove. The second groove is open toward the first groove, and the bottom of the second groove is provided with a through hole that extends to the heat dissipation surface.
4. The heat dissipation device according to claim 3, characterized in that, The heat-absorbing surface is provided with a third groove, the heat-conducting element is embedded in the third groove, the second contact surface contacts the bottom of the third groove, and the second groove is disposed at the bottom of the third groove.
5. The heat dissipation device according to claim 1, characterized in that, The cavity is a plurality of them and is arranged side by side along the width direction of the heat-conducting element.
6. The heat dissipation device according to claim 1, characterized in that, The cavity has a depth D1 in the thickness direction of the heat-conducting component; the width of the first groove is W1, where W1 > 2D1.
7. The heat dissipation device according to claim 3, characterized in that, The width of the first groove is W1, and the width of the second groove is W2, where W2 ≥ W1.
8. The heat dissipation device according to claim 3, characterized in that, The cavity has a depth of D1 in the thickness direction of the heat-conducting component; the second groove has a depth of D2, where D2 ≥ D1 / 2.
9. The heat dissipation device according to claim 3, characterized in that, The cross-sectional area of the cavity in the thickness direction of the heat-conducting component is S1; The second groove is provided with N through holes, and the cross-sectional area of the through holes is S2, where N·S2≥2S1.