Silicon carbide module structure
By employing a plastic shell and ceramic substrate structure in the silicon carbide module, directly welding capacitors, resistors, and MOSFETs, and using sealing silicone and thermal grease for encapsulation, the problems of complex processes and high costs are solved, achieving more competitive low cost and good thermal conductivity.
Patent Information
- Application Number
- CN202520485721.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-19
AI Technical Summary
The existing silicon carbide module has a complex and costly manufacturing process.
It adopts a plastic shell and ceramic substrate structure, directly solders capacitors, resistors, MOSFETs and solder pins, and uses sealing silicone and thermal grease for encapsulation, which simplifies the process and reduces costs.
It simplifies the manufacturing process, reduces costs, and improves thermal conductivity and stress uniformity.
Smart Images
Figure CN223943148U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon carbide module technology, specifically to the structure of a silicon carbide module. Background Technology
[0002] Currently, the structure of a silicon carbide module involves integrating a silicon carbide chip onto a ceramic substrate, then providing a plastic package, and finally pressing the entire ceramic substrate onto a heat sink using the plastic package. This manufacturing process is complex and expensive. Utility Model Content
[0003] This invention aims to solve the above-mentioned technical problems by providing a structure for silicon carbide modules that reduces the cost of traditional silicon carbide modules and makes products more competitive.
[0004] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:
[0005] A silicon carbide module structure includes a plastic housing, and a circuit board assembly is mounted on the lower end of the plastic housing;
[0006] The circuit board assembly includes a ceramic substrate disposed at the lower end of the plastic housing, and capacitors, resistors, MOSFETs and solder pins are mounted on the ceramic substrate and inside the plastic housing;
[0007] A temperature sampling NTC is installed on the lower inner side of the plastic shell;
[0008] A sealing component is installed between the plastic housing and the circuit board assembly.
[0009] Preferably, the capacitors, resistors, MOS transistors, and soldering pins are directly soldered onto the ceramic substrate.
[0010] Preferably, the lower end of the plastic shell has a U-shaped groove, the upper end of the ceramic substrate has an edge groove for mounting, and the plastic shell has a mounting groove for use with a temperature sampling NTC.
[0011] Preferably, the sealing component includes a mounting groove and a single-component sealing silicone applied in the groove to form a single-component sealing silicone layer, and the lower end of the temperature sampling NTC is fitted with self-adhesive thermal conductive grease.
[0012] Preferably, a potting hole is provided on the plastic casing, through which AB electronic potting compound is injected between the plastic casing and the ceramic substrate.
[0013] Preferably, the plastic shell has pinholes for use with welding pins.
[0014] Preferably, the lower end of the plastic housing is equipped with a support pin.
[0015] Preferably, the temperature sampling NTC is attached to the inside of the plastic housing with double-sided adhesive and extends to the outside through the mounting groove.
[0016] Preferably, the plastic housing has through holes for mounting.
[0017] With the above structure, this utility model has the following advantages:
[0018] This invention replaces the silicon carbide chip with a MOS single transistor, directly soldering it onto a ceramic substrate to form a module, which is then protected by plastic encapsulation. This simplifies the manufacturing process and saves costs. Compared with similar products, the manufacturing process is simpler and the production cost is lower. The optimized pressing structure ensures more uniform stress on the ceramic substrate, better contact with the heat sink, and improved thermal conductivity.
[0019] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the structure of this utility model;
[0022] Figure 2 This is an exploded view of the present invention;
[0023] Figure 3 This is a schematic diagram showing the position of the ejector pin column of this utility model.
[0024] As shown in the figure: 1. Plastic shell; 2. Solder pins; 3. Capacitors and resistors; 4. MOS transistor; 5. Temperature sampling NTC; 6. Ceramic substrate; 7. U-shaped groove; 8. Edge groove; 9. Mounting groove; 10. Potting hole; 11. Pin hole; 12. Ejector pin; 13. Through hole; 14. Self-adhesive thermal grease. Detailed Implementation
[0025] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0027] The present invention will now be described in further detail in conjunction with the full text.
[0028] Combined with appendix Figures 1-3 A structure of a silicon carbide module includes a plastic shell 1, and a circuit board assembly is mounted on the lower end of the plastic shell 1. Specifically, the plastic shell 1 is a MOS board plastic shell, and the circuit board assembly includes a ceramic substrate 6 disposed at the lower end of the plastic shell 1. Capacitors, resistors, MOS single tubes, and solder pins 2 are mounted on the ceramic substrate 6 and located inside the plastic shell 1.
[0029] A temperature sampling NTC5 is installed on the lower inner side of the plastic housing 1;
[0030] A sealing component is installed between the plastic housing 1 and the circuit board assembly.
[0031] Capacitor 3, resistor 4, MOSFET 4, and solder pin 2 are directly soldered to the ceramic substrate 6. The ceramic substrate 6 has a simple structure, without complex wiring or other processes, resulting in lower cost.
[0032] A U-shaped groove 7 is provided at the lower end of the plastic shell 1, an edge groove 8 is provided at the upper end of the ceramic substrate 6 for mounting, and a mounting groove 9 is provided on the plastic shell 1 for use with the temperature sampling NTC5.
[0033] The sealing components include single-component sealing silicone applied to the mounting groove 9 and the U-shaped groove 7 to form a single-component sealing silicone layer. Self-adhesive thermal grease is installed at the lower end of the temperature sampling NTC5. The circuit board components of the silicon carbide module are all pre-packaged materials, readily available and of stable quality.
[0034] An encapsulation hole 10 is provided on the plastic casing 1, and AB electronic potting compound is injected between the plastic casing 1 and the ceramic substrate 6 through the encapsulation hole 10.
[0035] The plastic casing 1 has pinholes 11 for use with soldering pins 2, and a support pin post 12 is installed at the lower end of the plastic casing 1. The plastic casing 1 of this MOS board is designed with a support pin post 12 structure to support the ceramic substrate 6 and prevent it from deforming or being damaged under stress. Specifically, the mounting holes of the plastic casing 1 of this MOS board are designed with reinforcing ribs and reinforcing beams, so that the mounting force can be better distributed around the ceramic substrate 6, thereby making the thermal paste more uniform and improving heat dissipation.
[0036] The temperature sampling NTC5 is attached to the inside of the plastic housing 1 with double-sided tape and extends to the outside through the mounting groove 9.
[0037] The plastic housing 1 has through holes 13 for mounting. The silicon carbide module has few components, is simple to assemble, and saves costs.
[0038] The working principle of this utility model:
[0039] During the assembly of this silicon carbide module, the first step is to solder the welding pins 2, resistors and capacitors 3, and MOS transistors 4 onto the ceramic substrate 6; the second step is to evenly apply single-component sealing silicone to the groove 7 at the bottom of the MOS board's plastic casing 1; the third step is to attach the temperature sampling NTC 5 to the inside of the MOS board's plastic casing 1 using double-sided tape, such as... Figure 2 As shown, apply 2mm of self-adhesive thermal grease 14 to the temperature sampling point of the NTC5 temperature sampling device; Step 4, invert the MOS board plastic shell 1 with the NTC5 temperature sampling device installed, and evenly apply 2mm thick single-component sealing silicone to the mounting groove 9 around it; Step 5, invert the soldering pins 2 on the ceramic substrate 6 with all electronic components soldered and insert them into the corresponding pin holes 11 of the MOS board plastic shell 1; Step 6, turn the entire module over and inject AB Electronics potting compound through the potting hole 10 on the front of the MOS board plastic shell 1; Step 7, let it stand for 24 hours to allow the compound to dry.
[0040] The present invention and its embodiments have been described above. This description is not restrictive, and the embodiments shown throughout the text are only one of the embodiments of the present invention. The actual structure is not limited to this. In conclusion, if a person skilled in the art is inspired by this description and designs a similar structure and embodiment without departing from the inventive spirit of the present invention, such design should fall within the protection scope of the present invention.
Claims
1. A structure of a silicon carbide module, characterized in that, It includes a plastic housing (1), and a circuit board assembly is mounted on the lower end of the plastic housing (1); The circuit board assembly includes a ceramic substrate (6) disposed at the lower end of the plastic housing (1), and capacitors, resistors (3), MOS transistors (4) and solder pins (2) are mounted on the ceramic substrate (6) and inside the plastic housing (1). A temperature sampling NTC (5) is installed on the inner side of the lower end of the plastic shell (1); A sealing component is installed between the plastic housing (1) and the circuit board assembly.
2. The structure of a silicon carbide module according to claim 1, characterized in that: The capacitors and resistors (3), MOS transistors (4), and solder pins (2) are directly soldered onto the ceramic substrate (6).
3. The structure of a silicon carbide module according to claim 1, characterized in that: The lower end of the plastic shell (1) has a U-shaped groove (7), the upper end of the ceramic substrate (6) has an edge groove (8) for installation, and the plastic shell (1) has a mounting groove (9) for use with the temperature sampling NTC (5).
4. The structure of a silicon carbide module according to claim 3, characterized in that: The sealing component includes a single-component sealing silicone applied in the mounting groove (9) and the U-shaped groove (7) to form a single-component sealing silicone layer, and a self-adhesive thermal conductive grease (14) is installed at the lower end of the temperature sampling NTC (5).
5. The structure of a silicon carbide module according to claim 1, characterized in that: The plastic shell (1) has a potting hole (10) through which AB electronic potting compound is injected between the plastic shell (1) and the ceramic substrate (6).
6. The structure of a silicon carbide module according to claim 1, characterized in that: The plastic shell (1) has pinholes (11) for use with welding pins (2).
7. The structure of a silicon carbide module according to claim 1, characterized in that: The lower end of the plastic shell (1) is fitted with a support pin (12).
8. The structure of a silicon carbide module according to claim 3, characterized in that: The temperature sampling NTC (5) is attached to the inside of the plastic housing (1) with double-sided tape and extends to the outside through the mounting groove (9).
9. The structure of a silicon carbide module according to claim 3, characterized in that: The plastic housing (1) has through holes (13) for installation.