Coating device for lead-free silver-based soldering paste

Abstract

The utility model belongs to the technical field of coating devices, and particularly relates to a lead-free silver-based soldering paste coating device which comprises a bottom plate, supports, a motor, a threaded rod, a limiting rod, a movable plate and a first telescopic piece. The supports are fixedly installed on the left side and the right side of the top of the bottom plate, the motor is fixedly installed on the left side of the left support, and the coating device is arranged above the bottom plate. The coating device comprises a material receiving unit, a coating unit and a clamping unit. According to the coating device for the lead-free silver-based soldering paste, by arranging the material receiving unit, in the process that a first telescopic piece pulls a pressing plate to move upwards, a connecting piece rotates around a mounting frame, so that a material receiving box is pushed to move rightwards, the lead-free silver-based soldering paste dripping from the bottom of a charging barrel is received, the lead-free silver-based soldering paste is prevented from dripping on a PCB, and the coating quality is not affected; the problem that in the background technology, after the lead-free silver-based soldering paste is coated in the using process, the lead-free silver-based soldering paste at the bottom of an injection cylinder can drip on a PCB, and therefore the coating quality is affected is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to coating device technical field, concretely is a kind of lead-free silver-based solder paste's coating device. BACKGROUND

[0002] Lead-free silver-based solder paste is a kind of welding material commonly used in electronic manufacturing and other fields, it is mainly composed of various metal powders, flux and matrix etc., paste mixture formed, in the production process of spare part, lead-free silver-based solder paste coating device is needed to be used to the welding of spare part.

[0003] The existing solder paste dipping coating device is generally coated manually, which is time-consuming and laborious, and is not convenient for large-scale coating operation, thereby affecting the production process.

[0004] As disclosed in the publication No. CN216632928U, a lead-free solder paste dipping coating device is provided, which is provided with a clamping mechanism on the top surface of the bottom plate, and the two clamping mechanisms can limit the position of the PCB. The two sides of the support frame are fixedly connected with guide rails, and the one end of the screw rod is fixedly connected with a hand wheel. The screw rod is threadedly connected with the middle part of the cross bar, and the hand wheel is rotated to drive the cross bar to slide along the inside of the two guide rails. The coating mechanism is driven to move by the air cylinder and the connecting frame, and the electric push rod in the coating mechanism is extended to synchronously push the four injection barrels to apply solder paste on the PCB. The labor intensity of the user is reduced, and the overall structure is simple and easy to operate.

[0005] However, the lead-free silver-based solder paste at the bottom of the injection barrel may drop on the PCB after coating, which affects the coating quality.

[0006] Therefore, there is an urgent need for a lead-free silver-based solder paste coating device. INVENTION CONTENTS

[0007] The utility model aims at providing a lead-free silver-based solder paste coating device to solve the problem of lead-free silver-based solder paste dropping on the PCB after coating in the use process, which affects the coating quality.

[0008] In order to achieve the above object, the utility model provides following technical scheme: a leadless silver base soldering paste's coating device, including bottom plate, support, motor, threaded rod, limit rod, moving plate and telescopic part one, the support fixed mounting is in the bottom plate top left and right sides, the motor fixed mounting is in left side support left side, the threaded rod fixed mounting is in the output of motor, the limit rod fixed mounting is in adjacent side of left and right two supports, the moving plate installation is in threaded rod and limit rod outside, telescopic part one fixed mounting is in moving plate top, the bottom plate top is provided with coating device, the coating device includes receiving unit, coating unit and clamping unit.

[0009] The receiving unit is arranged above the bottom plate, the coating unit is arranged above the bottom plate, and the clamping unit is arranged on the top of the bottom plate.

[0010] The receiving unit includes a pressing plate, a side plate, a mounting box, a mounting frame, a connecting piece, a receiving box and a connecting rod, the pressing plate is fixedly installed at the bottom of the telescopic part one, the side plate is fixedly installed at the bottom of the moving plate, the mounting box is fixedly installed at the adjacent side of the two side plates, the mounting frame is fixedly installed at the left side of the mounting box, the connecting piece is rotatably connected to the inside of the mounting frame, the receiving box is rotatably connected to the lower end of the connecting piece, and the connecting rod is rotatably connected to the side of the side plate at one end and to the side of the receiving box at the other end.

[0011] Preferably, the upper end of the connecting piece is rotatably connected to the left side of the pressing plate, when the telescopic part one pushes the pressing plate to move downward to coat the PCB, the connecting piece rotates around the mounting frame, thereby pushing the mounting frame to move left, so that the receiving box moves away from the barrel, when the telescopic part one pulls the pressing plate to move upward after coating, the connecting piece pushes the receiving box to move right and locates at the bottom of the barrel, so that the leadless silver base soldering paste leaked from the barrel drops on the receiving box.

[0012] Preferably, the coating unit includes a sliding rail, a mounting plate, a barrel, a piston rod, a mounting block, a box door and a lock rod, the sliding rail is fixedly installed at the inside of the mounting box, the mounting plate is slidably connected to the inside of the sliding rail, the barrel is fixedly installed at the inside of the mounting plate, the piston rod is installed at the inside of the barrel, the mounting block is fixedly installed at the top of the piston rod, the box door is hingedly connected to the right side of the mounting box, and the lock rod is installed at the top of the mounting box and the box door.

[0013] Preferably, the bottom of the pressing plate is provided with a mounting groove, the mounting block is slidably connected in the inside of the mounting groove, and the inside of the sliding rail is provided with a sliding groove, the two sides of the mounting plate are slidably connected in the inside of the sliding groove, the mounting plate and the sliding rail are matched, the barrel is installed in the inside of the mounting box, the mounting block at the top of the piston rod is connected with the pressing plate, and the piston rod is installed at the bottom of the pressing plate.

[0014] Preferably, the installation box is provided with a socket on the upper surface of the box door, and the lock rod is inserted into the socket to fix the installation box and the box door.

[0015] Preferably, the clamping unit comprises a second telescopic member and a clamping plate, the second telescopic member is fixedly installed on the top of the bottom plate and left and right sides, and the clamping plate is installed on the output end of the second telescopic member.

[0016] Preferably, the rubber pad is fixedly installed on the inner side of the clamping plate, so that the rubber pad can avoid scratching the PCB when the clamping plate clamps the PCB.

[0017] Compared with the prior art, the utility model has the beneficial effects that:

[0018] 1. The lead-free silver-based solder paste coating device is provided with a receiving unit, and when the first telescopic member pulls the pressing plate to move upwards, the connecting piece rotates around the mounting frame, thereby pushing the receiving box to move to the right to receive the lead-free silver-based solder paste dropped from the bottom of the barrel, so that the lead-free silver-based solder paste is prevented from being dropped on the PCB to affect the coating quality, and the problem that the lead-free silver-based solder paste dropped from the bottom of the injection barrel on the PCB to affect the coating quality during use is solved.

[0019] 2. The lead-free silver-based solder paste coating device is provided with a clamping unit, and the second telescopic member is started to push the left and right clamping plates to move close to each other to clamp the PCB, so that the PCB is prevented from shaking during coating to affect the coating quality. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a whole structure schematic view of the utility model;

[0021] Figure 2 It is a receiving unit structure schematic view of the utility model;

[0022] Figure 3 It is a coating unit structure schematic view of the utility model;

[0023] Figure 4 It is an installation box internal structure split view of the utility model;

[0024] Figure 5 It is an installation box and installation block connection structure schematic view of the utility model.

[0025] In the figure: 1, the base plate; 2, the support; 3, the motor; 4, the threaded rod; 5, the limiting rod; 6, the moving plate; 7, the first telescopic part; 801, the pressing plate; 802, the side plate; 803, the mounting box; 804, the mounting frame; 805, the connecting piece; 806, the receiving box; 807, the connecting rod; 901, the sliding rail; 902, the mounting plate; 903, the barrel; 904, the piston rod; 905, the mounting block; 906, the box door; 907, the locking rod; 1001, the second telescopic part; 1002, the clamping plate. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0027] Please refer to Figures 1-5 The present application provides a technical solution:

[0028] Embodiment one: a lead-free silver-based solder paste coating device, comprising a base plate 1, a support 2, a motor 3, a threaded rod 4, a limiting rod 5, a moving plate 6 and a first telescopic part 7, the support 2 is fixedly installed on the top of the base plate 1 on both sides, the motor 3 is fixedly installed on the left side of the left support 2, the threaded rod 4 is fixedly installed on the output end of the motor 3, the limiting rod 5 is fixedly installed on one side adjacent to the two supports 2, the moving plate 6 is installed on the outer side of the threaded rod 4 and the limiting rod 5, the moving plate 6 is threadedly connected with the threaded rod 4, the first telescopic part 7 is fixedly installed on the top of the moving plate 6, the first telescopic part 7 comprises a hydraulic cylinder and a hydraulic rod, the hydraulic cylinder is fixedly installed on the top of the moving plate 6, the hydraulic rod is installed on the output end of the hydraulic cylinder, a coating device is arranged above the base plate 1, the coating device comprises a receiving unit, a coating unit and a clamping unit.

[0029] The receiving unit is arranged above the base plate 1, the coating unit is arranged above the base plate 1, and the clamping unit is arranged on the top of the base plate 1.

[0030] The receiving unit comprises a pressing plate 801, side plates 802, a mounting box 803, a mounting frame 804, a connecting piece 805, a receiving box 806 and a connecting rod 807. The pressing plate 801 is fixedly installed at the bottom of the telescopic piece one 7. The side plates 802 are fixedly installed at the front and rear sides of the bottom of the moving plate 6. The mounting box 803 is fixedly installed at one side adjacent to the two side plates 802. The mounting frame 804 is fixedly installed at the left side of the mounting box 803. The connecting piece 805 is rotatably connected to the inside of the mounting frame 804 at the middle part. The upper end of the connecting piece 805 is rotatably connected to the left side of the pressing plate 801. When the telescopic piece one 7 pushes the pressing plate 801 to move downward to coat the PCB board, the connecting piece 805 rotates around the mounting frame 804, thereby pushing the mounting frame 804 to move leftward, so that the receiving box 806 moves away from the barrel 903. When the telescopic piece one 7 pulls the pressing plate 801 to move upward after the coating is completed, the connecting piece 805 pushes the receiving box 806 to move rightward to be located at the bottom of the barrel 903, so that the lead-free silver-based solder paste leaked from the barrel 903 falls on the receiving box 806. The left side of the receiving box 806 is rotatably connected to the lower end of the connecting piece 805. The connecting rod 807 is rotatably connected to the side of the side plate 802 at one end and to the side of the receiving box 806 at the other end.

[0031] Example two: based on example one: the coating unit comprises slide rails 901, a mounting plate 902, a barrel 903, a piston rod 904, a mounting block 905, a box door 906 and a lock rod 907. The slide rails 901 are fixedly installed at the inside of the mounting box 803. The mounting plate 902 is slidably connected to the inside of the slide rails 901. The barrel 903 is fixedly installed at the inside of the mounting plate 902. The piston rod 904 is installed at the inside of the barrel 903. The mounting block 905 is fixedly installed at the top of the piston rod 904. The bottom of the pressing plate 801 is provided with a mounting slot. The mounting block 905 is slidably connected to the inside of the mounting slot. The inside of the slide rails 901 is provided with a sliding groove. The front and rear sides of the mounting plate 902 are slidably connected to the inside of the sliding groove. Through the cooperation of the mounting plate 902 and the slide rails 901, the barrel 903 is conveniently installed in the inside of the mounting box 803. At the same time, the mounting block 905 at the top of the piston rod 904 is connected with the pressing plate 801, so as to realize the installation of the piston rod 904 at the bottom of the pressing plate 801. The box door 906 is hingedly connected to the right side of the mounting box 803. The lock rod 907 is installed at the top of the mounting box 803 and the box door 906. The upper surfaces of the mounting box 803 and the box door 906 are provided with insertion holes. The lock rod 907 is inserted into the insertion holes. The mounting box 803 and the box door 906 are fixed through the lock rod 907.

[0032] Example three: based on example one: the clamping unit comprises telescopic pieces two 1001 and clamping plates 1002. The telescopic pieces two 1001 are fixedly installed at the top of the left and right sides of the bottom plate 1. The telescopic pieces two 1001 are electric push rods. The clamping plates 1002 are installed at the output ends of the telescopic pieces two 1001. The PCB board is fixed through the clamping plates 1002.

[0033] In the fourth embodiment, the rubber pad is fixedly installed inside the clamping plate 1002 to avoid scratching the PCB when the clamping plate 1002 clamps the PCB.

[0034] In use, the PCB to be coated is placed on the top of the clamping plate 1002, then the telescopic part two 1001 is started to push the two clamping plates 1002 to each other to clamp the PCB, the motor 3 is started to drive the threaded rod 4 to rotate and move the moving plate 6 connected by the screw thread, so that the moving plate 6 drives the barrel 903 to move to the appropriate position, then the telescopic part one 7 is started to push the pressing plate 801 to move downward, the pressing plate 801 pushes the connecting part 805 to drive the receiving box 806 to move left, so that the receiving box 806 moves away from the bottom of the barrel 903, at the same time, the pressing plate 801 pushes the piston rod 904 to move downward, so that the lead-free silver-based solder paste in the barrel 903 is pushed out and drops on the PCB, so as to complete the coating. In the process of pulling the telescopic part one 7 to move the pressing plate 801 upward, the connecting part 805 rotates around the mounting frame 804, so as to push the receiving box 806 to move right, so as to receive the lead-free silver-based solder paste dropped from the bottom of the barrel 903, to avoid the lead-free silver-based solder paste dropping on the PCB to affect the coating quality. When the lead-free silver-based solder paste in the barrel 903 is used up, the locking rod 907 is pulled out to open the box door 906, then the mounting plate 902 is pulled to take out the barrel 903 from the inside of the mounting box 803, and then the barrel 903 is installed in the mounting box 803.

[0035] It should be noted that the relational terms herein such as first and second, are used only to differentiate one entity or action from another, and do not necessarily require or imply that there is any such actual relationship or order between these entities or actions. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the presence of additional identical elements in the process, method, article or equipment including the element.

Claims

1. A lead-free silver-based solder paste coating device, comprising a base plate (1), a support (2), a motor (3), a threaded rod (4), a limiting rod (5), a moving plate (6) and an extension piece one (7), the support (2) is fixedly installed on the top of the base plate (1) left and right sides, the motor (3) is fixedly installed on the left side of the left support (2), the threaded rod (4) is fixedly installed on the output end of the motor (3), the limiting rod (5) is fixedly installed on the adjacent side of the left and right two supports (2), the moving plate (6) is installed on the outer side of the threaded rod (4) and the limiting rod (5), the extension piece one (7) is fixedly installed on the top of the moving plate (6), characterized in that: The bottom plate (1) is provided with a coating device above it, which includes a receiving unit, a coating unit and a clamping unit; The receiving unit is arranged above the bottom plate (1), the coating unit is arranged above the bottom plate (1), and the clamping unit is arranged on the top of the bottom plate (1). The receiving unit includes a pressing plate (801), a side plate (802), a mounting box (803), a mounting frame (804), a connecting piece (805), a receiving box (806) and a connecting rod (807), the pressing plate (801) is fixedly installed at the bottom of the first telescopic piece (7), the side plate (802) is fixedly installed at the bottom of the moving plate (6) on the left and right sides, the mounting box (803) is fixedly installed on one side adjacent to the two side plates (802), the mounting frame (804) is fixedly installed on the left side of the mounting box (803), the connecting piece (805) is rotatably connected to the inside of the mounting frame (804), the receiving box (806) is rotatably connected to the lower end of the connecting piece (805), and the connecting rod (807) is rotatably connected to the side of the side plate (802) on one end and to the side of the receiving box (806) on the other end.

2. A device for applying a lead-free silver-based solder paste according to claim 1, characterized in that: The upper end of the connecting piece (805) is rotatably connected to the left side of the pressing plate (801).

3. A lead-free silver-based solder paste application device as claimed in claim 1, wherein: The coating unit includes a sliding rail (901), a mounting plate (902), a barrel (903), a piston rod (904), a mounting block (905), a box door (906) and a locking rod (907), the sliding rail (901) is fixedly installed on the inside of the mounting box (803) on the left and right sides, the mounting plate (902) is slidably connected to the inside of the sliding rail (901), the barrel (903) is fixedly installed in the inside of the mounting plate (902), the piston rod (904) is installed in the inside of the barrel (903), the mounting block (905) is fixedly installed on the top of the piston rod (904), the box door (906) is hinged to the right side of the mounting box (803), and the locking rod (907) is installed on the top of the mounting box (803) and the box door (906).

4. A device for applying a lead-free silver-based solder paste according to claim 3, wherein: The bottom of the pressing plate (801) is provided with a mounting groove, the mounting block (905) is slidably connected in the inside of the mounting groove, and the inside of the sliding rail (901) is provided with a sliding groove, and the mounting plate (902) is slidably connected in the inside of the sliding groove.

5. A device for applying a lead-free silver-based solder paste according to claim 3, wherein: The upper surfaces of the mounting box (803) and the box door (906) are provided with a jack, and the locking rod (907) is inserted into the jack.

6. A lead-free silver-based solder paste application device as claimed in claim 1, wherein: The clamping unit includes a second telescopic piece (1001) and a clamping plate (1002), the second telescopic piece (1001) is fixedly installed on the top of the bottom plate (1) on the left and right sides, and the clamping plate (1002) is installed on the output end of the second telescopic piece (1001).

7. A device for applying a lead-free silver-based solder paste according to claim 6, wherein: The inner side of the clamping plate (1002) is fixedly installed with a rubber pad.

Images