Half-wafer cutting machine for BC battery silicon wafer

What is AI technical title?
AI technical title is built by Patsnap AI team. It summarizes the technical point description of the patent document.
By designing a half-wafer cutting machine for BC solar cells, and combining laser cutting with robotic arm inspection, the problem of automated wafer picking and cutting of BC solar cells was solved, improving production efficiency and facilitating subsequent stringing processes.

CN223947059UActive Publication Date: 2026-02-27FOLUNGWIN AUTOMATIC EQUIP CO LTD

View PDF 0 Cites 0 Cited by

Patent Information

Application Number: CN202520439219.5
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2025-03-12
Publication Date: 2026-02-27
Estimated Expiration: 2035-03-12

AI Technical Summary

Technical Problem

Existing technologies make it difficult to automate the picking and precise cutting of BC cell silicon wafers, resulting in low production efficiency.

Method used

A half-wafer cutting machine for BC solar cells was designed, comprising a pick-and-place assembly, a wafer conveying track, and a half-wafer cutting mechanism. It adopts laser cutting technology, combined with a robotic arm and an inspection camera, to achieve automated picking, inspection, and cutting of silicon wafers.

Benefits of technology

It enables automated wafer picking and precise positioning and cutting, improving production efficiency and facilitating subsequent string bonding.

✦ Generated by Eureka AI based on patent content.

Smart Images

Figure CN223947059U_ABST

Patent Text Reader

Abstract

The utility model discloses a half-wafer cutting machine for BC battery silicon wafers, which comprises a pick-and-place assembly, a silicon wafer conveying track and a half-wafer cutting mechanism, and the silicon wafer conveying track is connected with the pick-and-place assembly and the half-wafer cutting mechanism; the pick-and-place assembly comprises a transverse moving pick-and-place module, a silicon wafer jacking module and a partition paper jacking module; the silicon wafer conveying track clamps a silicon wafer flatly through a clamping plate arm, and the rear end of the silicon wafer conveying track is provided with a pick-and-place detection light source and a pick-and-place detection camera. The half-wafer cutting mechanism comprises a scribing support, a mechanical arm and a half-wafer output module, a jacking motor and a jacking frame are arranged on the scribing support, the jacking motor moves front and back along the scribing support, the driving end of the jacking motor is connected with a cam, and a scribing laser head and a scribing detection camera are arranged in the middle of the scribing support. According to the half-wafer cutting machine for the BC battery silicon wafer, the partition paper and the silicon wafer are taken at intervals, the qualified silicon wafer is subjected to middle laser cutting and slicing after detection, follow-up series welding treatment and automatic treatment with a tin bar are facilitated, and the productivity is improved.

Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer cutting, especially to a BC battery silicon wafer half-cutting machine. BACKGROUND

[0002] Photovoltaic solar silicon wafer is the core part of the solar power generation system and the most valuable part of the solar power generation system. The role of the silicon wafer is to convert solar energy into electric energy, which is stored by the battery or directly loaded for work. Currently, the customers of BC battery (full name: back contact cell, which can be combined with multiple routes) need to cut the whole silicon wafer into half, and use welding wire for string welding. The cutting part needs to automatically take out the stacked whole silicon wafer and cut it piece by piece at the middle position to realize the production and manufacturing of the assembly line. UTILITY MODEL CONTENT

[0003] One purpose of the utility model is to provide a BC battery silicon wafer half-cutting machine, which automatically grabs the silicon wafer piece by piece, performs laser cutting processing after determining the position, and is convenient for subsequent string welding processing.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] A BC battery silicon wafer half-cutting machine, comprising a taking and placing assembly, a silicon wafer conveying track and a half-cutting mechanism, wherein the silicon wafer conveying track is connected to the taking and placing assembly and the half-cutting mechanism;

[0006] The taking and placing assembly comprises a horizontal movement taking and placing module, a silicon wafer jacking module and a paper separator jacking module, a paper separator grabbing plate and a silicon wafer grabbing plate are installed on the driving end of the horizontal movement taking and placing module, a silicon wafer box is connected to the driving end of the silicon wafer jacking module, and a paper separator box is connected to the driving end of the paper separator jacking module;

[0007] A silicon wafer clamping plate motor is installed below the middle part of the silicon wafer conveying track, a clamping plate synchronous wheel is connected to the driving end of the silicon wafer clamping plate motor, a clamping plate synchronous belt is drivingly connected to the clamping plate synchronous wheel, a clamping plate arm is installed on the clamping plate synchronous belt, two clamping plate arms are respectively located on the two sides of the silicon wafer conveying track, a taking and placing detection light source is installed below the rear end of the silicon wafer conveying track, and a taking and placing detection camera is installed above the rear end of the silicon wafer conveying track;

[0008] The half-cutting mechanism comprises a cutting support, a mechanical arm and a half output module, the cutting support is provided with a jacking motor and a jacking frame, the jacking motor moves back and forth along the cutting support, the driving end of the jacking motor is connected with a cam, the cam is in the middle part of the jacking frame, the middle part of the cutting support is provided with a cutting laser head and a cutting detection camera, the half output module comprises a half horizontal movement module, a half vertical movement module and a half suction rod, the half vertical movement module is installed on the driving end of the half horizontal movement module, the half suction rod is installed on the driving end of the half vertical movement module, and the half suction rod is fixed with a half suction nozzle.

[0009] As a preferred technical scheme, the driving end of the horizontal movement module is provided with a separator lifting cylinder and a silicon wafer lifting cylinder on both sides, the driving end of the separator lifting cylinder is connected with the separator grabbing plate, and the driving end of the silicon wafer lifting cylinder is connected with the silicon wafer grabbing plate.

[0010] As a preferred technical scheme, the rear end of the silicon wafer conveying track is provided with a wafer taking and placing limiting arm, and the wafer taking and placing limiting arm moves along the front and back directions.

[0011] As a preferred technical scheme, the wafer taking and placing cylinder is fixed on the silicon wafer conveying track, and the driving end of the wafer taking and placing cylinder is connected with the lower end of the wafer taking and placing limiting arm.

[0012] As a preferred technical scheme, the track wheels are rotatably connected on the silicon wafer conveying track, the track belts are transmissionally connected between the track wheels, and the track belts are located on both sides of the silicon wafer conveying track.

[0013] As a preferred technical scheme, the wafer taking and placing limiting arm is rotatably connected on the silicon wafer conveying track, the track belts are transmissionally connected between the track wheels, and the track belts are located on both sides of the silicon wafer conveying track.

[0014] As a preferred technical scheme, the wafer taking and placing limiting arm is rotatably connected on the silicon wafer conveying track, the track belts are transmissionally connected between the track wheels, and the track belts are located on both sides of the silicon wafer conveying track.

[0015] As a preferred technical scheme, the wafer taking and placing limiting arm is rotatably connected on the silicon wafer conveying track, the track belts are transmissionally connected between the track wheels, and the track belts are located on both sides of the silicon wafer conveying track.

[0016] As a preferred technical scheme, the wafer taking and placing limiting arm is rotatably connected on the silicon wafer conveying track, the track belts are transmissionally connected between the track wheels, and the track belts are located on both sides of the silicon wafer conveying track.

[0017] As a preferred technical scheme, the slice support is provided with a horizontal sliding table, the horizontal sliding table is connected with an L-shaped support, the L-shaped support is provided with a vertical sliding table, and the slice laser head and the slice detection camera are respectively arranged on one vertical sliding table.

[0018] The BC battery silicon wafer half cutting machine has the advantages that the BC battery silicon wafer half cutting machine is provided with interval type paper and silicon wafer taking and separating devices, and the qualified silicon wafer is subjected to intermediate laser cutting and separation after detection, so that the subsequent string welding treatment with tin bars is facilitated, automatic treatment is realized, and production capacity is improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] The utility model will be further explained in detail in the basis of drawings and embodiments.

[0020] Figure 1 The whole structure schematic view of the BC battery silicon wafer half cutting machine is described in the embodiments;

[0021] Figure 2 The combination structure schematic view of the taking and placing assembly and the silicon wafer conveying track is described in the embodiments;

[0022] Figure 3 The structure schematic view of the three groups of taking and placing assemblies is described in the embodiments;

[0023] Figure 4 The structure schematic view of the single group of taking and placing assemblies is described in the embodiments;

[0024] Figure 5 The structure schematic view of the transverse movement taking and placing module is described in the embodiments;

[0025] Figure 6 The rear end structure view of the silicon wafer conveying track is described in the embodiments;

[0026] Figure 7 The structure schematic view of the half cutting mechanism is described in the embodiments;

[0027] Figure 8 The first structure schematic view of the slice support is described in the embodiments;

[0028] Figure 9 The second structure schematic view of the slice support is described in the embodiments;

[0029] Figure 10 The structure schematic view of the half output module is described in the embodiments;

[0030] Figure 11 The structure schematic view of the transfer support is described in the embodiments.

[0031] Figures 1 to 11 MID:

[0032] 1. Silicon wafer conveyor track; 2. Lateral transfer pick-and-place module; 3. Silicon wafer lifting module; 4. Paper separator lifting module; 5. Paper separator gripper plate; 6. Silicon wafer gripper plate; 7. Silicon wafer cassette; 8. Paper separator cassette; 9. Silicon wafer clamping plate motor; 10. Clamping plate synchronous pulley; 11. Clamping plate synchronous belt; 12. Clamping plate arm; 13. Pick-and-place detection light source; 14. Pick-and-place detection camera; 15. Paper separator suction nozzle; 16. Back-blowing nozzle; 17. Paper separator lifting cylinder; 18. Silicon wafer lifting cylinder; 19. Anti-overlapping sensor; 20. Clamping plate guide wheel; 21. Pick-and-place wafer limit arm; 22. Pick-and-place wafer cylinder; 23. Track 24. Wheel; 25. Track belt; 26. Dicing bracket; 27. Robotic arm; 28. Half-wafer output module; 29. Lifting motor; 30. Lifting frame; 31. Cam; 32. Dicing laser head; 33. Dicing inspection camera; 34. Half-wafer horizontal movement module; 35. Half-wafer vertical movement module; 36. Half-wafer suction rod; 37. Half-wafer suction nozzle; 38. Adsorption plate; 39. Dicing front and rear modules; 40. Movable groove; 41. Transfer bracket; 42. Adsorption crossbar; 43. Paper replenishment box; 44. Defective placement box; 45. Horizontal slide; 46. L-shaped support; 47. Vertical slide; 48. Silicon wafer. Detailed Implementation

[0033] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0034] like Figures 1 to 11 As shown in this embodiment, a half-wafer cutting machine for BC battery silicon wafers includes a pick-and-place assembly, a silicon wafer conveying track 1, and a half-wafer cutting mechanism. The silicon wafer conveying track 1 connects the pick-and-place assembly and the half-wafer cutting mechanism.

[0035] The pick-and-place assembly comprises a horizontal movement pick-and-place module 2, a silicon wafer lifting module 3 and a paper separator lifting module 4. The driving end of the horizontal movement pick-and-place module 2 is provided with a paper separator grabbing plate 5 and a silicon wafer grabbing plate 6. The driving end of the silicon wafer lifting module 3 is connected with a silicon wafer magazine 7. The driving end of the paper separator lifting module 4 is connected with a paper separator magazine 8. The middle part of the silicon wafer conveying track 1 is provided with a silicon wafer clamping plate motor 9. The driving end of the silicon wafer clamping plate motor 9 is connected with a clamping plate synchronous wheel 10. The clamping plate synchronous wheel 10 is drivingly connected with a clamping plate synchronous belt 11. The clamping plate synchronous belt 11 is provided with clamping plate arms 12. The two clamping plate arms 12 are respectively arranged on the two sides of the silicon wafer conveying track 1. The rear end of the silicon wafer conveying track 1 is provided with a pick-and-place detection light source 13. The rear end of the silicon wafer conveying track 1 is provided with a pick-and-place detection camera 14. The half wafer cutting mechanism comprises a wafer cutting support 25, a mechanical hand 26 and a half wafer output module 27. The wafer cutting support 25 is provided with a lifting motor 28 and a lifting frame 29. The lifting motor 28 moves forward and backward along the wafer cutting support 25. The driving end of the lifting motor 28 is connected with a cam 30. The cam 30 is arranged in the middle part of the lifting frame 29. The middle part of the wafer cutting support 25 is provided with a wafer cutting laser head 31 and a wafer cutting detection camera 32. The half wafer output module 27 comprises a half wafer horizontal movement module 33, a half wafer vertical movement module 34 and a half wafer suction rod 35. The half wafer vertical movement module 34 is arranged on the driving end of the half wafer horizontal movement module 33. The half wafer suction rod 35 is arranged on the driving end of the half wafer vertical movement module 34. The half wafer suction rod 35 is fixedly provided with a half wafer suction nozzle 36.

[0036] In the silicon wafer magazine 7, the silicon wafers 47 are stacked in an interval mode between the paper separators, so as to effectively prevent the silicon wafers 47 from being damaged. The horizontal movement pick-and-place module 2 synchronously controls the paper separator grabbing plate 5 and the silicon wafer grabbing plate 6 to move leftward and rightward. The silicon wafers 47 grabbed by the silicon wafer grabbing plate 6 are placed on the silicon wafer conveying track 1. At this time, the paper separator grabbing plate 5 also moves to the silicon wafer magazine 7 to grab the paper separators. When the paper separator grabbing plate 5 places the paper separators on the paper separator magazine 8, the silicon wafer grabbing plate 6 also returns to the silicon wafer magazine 7 to grab the silicon wafers 47. The above-mentioned operations are repeatedly performed to process the silicon wafers 47 in an interval mode.

[0037] The silicon wafers 47 on the silicon wafer conveying track 1 move backward. The silicon wafer clamping plate motor 9 controls the clamping plate synchronous wheel 10 to rotate, so as to drive the clamping plate arms 12 to move toward the middle part of the silicon wafer conveying track 1. The silicon wafers 47 which are inclined and deviated are adjusted. When the pick-and-place detection light source 13 is above the silicon wafers 47, the pick-and-place detection camera 14 can detect the broken pieces and the position of the silicon wafers 47.

[0038] According to the shooting of the taking and placing detection camera 14, the manipulator 26 grabs the qualified whole silicon wafer 47 to the wafering support 25, which is supported by the lifting frame 29. When the whole silicon wafer 47 approaches the wafering laser head 31 during the forward and backward movement of the lifting frame 29 along the wafering support 25, the lifting motor 28 controls the rotation of the cam 30, so that the lifting frame 29 is temporarily lifted up, and the whole silicon wafer 47 on the lifting frame 29 is closer to the wafering laser head 31, so that the whole silicon wafer 47 is completely and accurately divided from the middle. After the cutting is completed, the wafering detection camera 32 detects, and then the half wafer horizontal movement module 33 and the half wafer vertical movement module 34 on the half wafer output module 27 control the half wafer suction rod 35 to adsorb and move the double half wafers to the rear.

[0039] The four sides of the separator grabbing plate 5 are provided with separator suction nozzles 15, and the four sides of the silicon wafer grabbing plate 6 are provided with back-blowing nozzles 16. When grabbing the silicon wafer 47 and the separator, the suction nozzles are used for suction. The back-blowing nozzles 16 blow the separator downward to prevent the stacking of multiple silicon wafers.

[0040] The driving ends of the separator lifting cylinder 17 and the silicon wafer lifting cylinder 18 are respectively installed on both sides of the driving end of the horizontal movement taking and placing module 2. The driving end of the separator lifting cylinder 17 is connected with the separator grabbing plate 5, and the driving end of the silicon wafer lifting cylinder 18 is connected with the silicon wafer grabbing plate 6. In order to ensure that the current other structure is not affected when grabbing the separator and the silicon wafer 47 each time, the separator lifting cylinder 17 is used to control the separator grabbing plate 5 to place the separator to the separator box 8, and the silicon wafer lifting cylinder 18 is used to control the silicon wafer grabbing plate 6 to place the silicon wafer 47 to the silicon wafer conveying track 1.

[0041] The middle part of the silicon wafer conveying track 1 is provided with an anti-stacking inductor 19. The anti-stacking inductor 19 is used to detect whether the silicon wafer 47 is stacked or not, and also can check whether there is still separator attached, so as to ensure that the subsequent photographing function can be smoothly performed.

[0042] The clamping plate arm 12 is provided with clamping plate guide wheels 20 along the front and back directions. When the clamping plate arms 12 are close to each other, the clamping plate guide wheels 20 reduce the hard contact between the clamping plate arms 12 and the side edges of the silicon wafer 47, so as to protect the integrity of the silicon wafer 47.

[0043] The rear end of the silicon wafer conveying track 1 is provided with a taking and placing limiting arm 21, which moves along the front and back directions. The silicon wafer conveying track 1 is fixed with a taking and placing cylinder 22, and the driving end of the taking and placing cylinder 22 is connected with the lower end of the taking and placing limiting arm 21. Under the action of the taking and placing cylinder 22, the taking and placing limiting arm 21 retreats, and the position of the silicon wafer 47 is fixed at a position where the image can be photographed.

[0044] The track wheels 23 are rotationally connected on the silicon wafer conveying track 1, and the track belts 24 are drivingly connected between the track wheels 23. The track belts 24 are located on both sides of the silicon wafer conveying track 1. During the conveying of the silicon wafer conveying track 1, the rotating track wheels 23 control the movement of the track belts 24, and drive the silicon wafer 47 to move forward in parallel.

[0045] The movable end of the mechanical arm 26 is provided with an adsorption plate 37, which is used to grab the whole silicon wafer 47.

[0046] The scribing front and back module 38 is installed at the lower end of the scribing support 25, and the driving end of the scribing front and back module 38 is fixedly connected with the jacking motor 28. The middle part of the jacking frame 29 is provided with a cam movable hole, and the cam 30 is located in the cam movable hole. The scribing support 25 is provided with a movable slot 39 in the front and back direction. The upper end of the jacking frame 29 penetrates through the movable slot 39. The scribing front and back module 38 controls the jacking frame 29 to move forward and backward. When the jacking motor 28 controls the jacking frame 29 to rise through the cam 30, the upper end of the jacking frame 29 is higher than the movable slot 39 on the scribing support 25, and the jacking frame 29 can move along the movable slot 39 to drive the silicon wafer 47 to be subjected to laser cutting treatment.

[0047] The upper end of the jacking frame 29 is provided with a plurality of adsorption hole positions, which firmly adsorb and fix the silicon wafer 47 to prevent deviation and accurately perform laser cutting.

[0048] The scribing support 25 is provided with a transfer support 40 on one side. The transfer support 40 is provided with an adsorption cross rod 41. There is a gap between adjacent two adsorption cross rods 41. The half-piece output module 27 places the cut double half-pieces on the adsorption cross rod 41 for fixation. A subsequent stringer machine inserts a track into the gap between the adsorption cross rods 41, and then lifts the double half-pieces away.

[0049] The mechanical arm 26 is provided with a separator supplement box 42 and a defective placement box 43 on one side. When the front end detects whether the whole silicon wafer 47 meets the requirements, the defective silicon wafer 47 is placed in the defective placement box 43 in a spaced manner of one layer of separator and one layer of silicon wafer 47. The separator is taken out from the separator supplement box 42 and placed in the defective placement box 43 to separate and protect each layer of silicon wafer 47.

[0050] The scribing support 25 is provided with a horizontal sliding table 44. The horizontal sliding table 44 is connected with an L-shaped support 45. The L-shaped support 45 is provided with a vertical sliding table 46. The scribing laser head 31 and the scribing detection camera 32 are respectively installed on one vertical sliding table 46. The positions of the scribing laser head 31 and the scribing detection camera 32 are finely adjusted by using the horizontal sliding table 44 and the vertical sliding table 46, so as to adapt to the positions of the silicon wafer 47 to be scribed.

[0051] The modules involved in the present application are all linear modules.

[0052] It should be noted that the above specific embodiments are only the preferred embodiments of the utility model and the applied technical principles, and any changes or replacements easily thought by any skilled in the art in the technical range disclosed by the utility model should be covered in the protection range of the utility model.

Claims

1. A half-wafer cutting machine for BC battery silicon wafers, characterized in that, It includes a pick-and-place assembly, a silicon wafer transport track, and a half-wafer cutting mechanism, wherein the silicon wafer transport track connects the pick-and-place assembly and the half-wafer cutting mechanism; The pick-and-place assembly includes a transverse pick-and-place module, a silicon wafer lifting module, and a paper separator lifting module. A paper separator gripping plate and a silicon wafer gripping plate are installed on the drive end of the transverse pick-and-place module. A silicon wafer cassette is connected to the drive end of the silicon wafer lifting module. A paper separator cassette is connected to the drive end of the paper separator lifting module. A silicon wafer clamping motor is installed below the middle of the silicon wafer conveying track. A clamping synchronous pulley is connected to the drive end of the silicon wafer clamping motor. A clamping synchronous belt is driven by the clamping synchronous pulley. A clamping arm is installed on the clamping synchronous belt. The two clamping arms are respectively located on both sides of the silicon wafer conveying track. A pick-up and place detection light source is installed below the rear end of the silicon wafer conveying track. A pick-up and place detection camera is installed above the rear end of the silicon wafer conveying track. The half-piece cutting mechanism includes a dicing bracket, a robotic arm, and a half-piece output module. The dicing bracket is equipped with a lifting motor and a lifting frame. The lifting motor moves back and forth along the dicing bracket. A cam is connected to the drive end of the lifting motor. The cam is located in the middle of the lifting frame. A dicing laser head and a dicing detection camera are arranged in the middle of the dicing bracket. The half-piece output module includes a half-piece horizontal movement module, a half-piece vertical movement module, and a half-piece suction rod. The half-piece vertical movement module is mounted on the drive end of the half-piece horizontal movement module. The half-piece suction rod is mounted on the drive end of the half-piece vertical movement module. A half-piece suction nozzle is fixed on the half-piece suction rod.

2. The half-wafer cutting machine for BC battery silicon wafers according to claim 1, characterized in that, The drive end of the transverse pick-and-place module is equipped with a paper-separating lifting cylinder and a silicon wafer lifting cylinder on both sides respectively. The drive end of the paper-separating lifting cylinder is connected to the paper-separating gripping plate, and the drive end of the silicon wafer lifting cylinder is connected to the silicon wafer gripping plate.

3. The half-wafer cutting machine for BC battery silicon wafers according to claim 1, characterized in that, The rear end of the silicon wafer transport track is provided with a wafer pick-up and placement limiting arm, which moves along the front-back direction.

4. A half-wafer cutting machine for BC battery silicon wafers according to claim 3, characterized in that, A wafer pick-and-place cylinder is fixed on the silicon wafer transport track, and the drive end of the wafer pick-and-place cylinder is connected to the lower end of the wafer pick-and-place limiting arm.

5. A half-wafer cutting machine for BC battery silicon wafers according to claim 1, characterized in that, The silicon wafer conveying track is rotatably connected to track wheels, and track belts are driven between the track wheels. The track belts are located on both sides of the silicon wafer conveying track.

6. A half-wafer cutting machine for BC battery silicon wafers according to claim 1, characterized in that, The lower end of the dicing bracket is equipped with a dicing front and rear module, the drive end of the dicing front and rear module is fixedly connected to the lifting motor, and a cam movable hole is provided in the middle of the lifting frame, with the cam located in the cam movable hole.

7. A half-wafer cutting machine for BC battery silicon wafers according to claim 1, characterized in that, The slitting bracket has a movable groove along the front-to-back direction, and the upper end of the lifting frame passes through the movable groove.

8. A half-wafer cutting machine for BC battery silicon wafers according to claim 1, characterized in that, A transfer bracket is provided on one side of the dicing bracket, and an adsorption crossbar is installed on the transfer bracket, with a gap between two adjacent adsorption crossbars.

9. A half-wafer cutting machine for BC battery silicon wafers according to claim 1, characterized in that, The robotic arm is equipped with a paper replenishment box and a defective placement box on one side.

10. A half-wafer cutting machine for BC battery silicon wafers according to claim 1, characterized in that, A horizontal slide is installed on the dicing bracket, an L-shaped support is connected to the horizontal slide, a vertical slide is installed on the L-shaped support, and the dicing laser head and the dicing detection camera are respectively installed on one of the vertical slides.