Multilayer circuit board with mechanical blind holes

Abstract

The utility model discloses a multilayer circuit board with mechanical blind holes, which comprises a multilayer circuit board body, the interior of the multilayer circuit board body sequentially comprises a top layer circuit board, a middle layer circuit board and a bottom layer circuit board from top to bottom, the bottom of the top layer circuit board is adhered to the top of the middle layer circuit board through adhesive, and the bottom of the bottom layer circuit board is adhered to the bottom of the bottom layer circuit board through adhesive. And the bottom of the middle-layer circuit board is adhered to the top of the bottom-layer circuit board through an adhesive. According to the multi-layer circuit board with the mechanical blind holes, the protection main layer comprising the first protection auxiliary layer, the second protection auxiliary layer and the third protection auxiliary layer is designed, multi-layer protection of the multi-layer circuit board body is achieved, and each protection auxiliary layer is specially designed for specific environmental threats; and the wear-resistant and scratch-resistant layer in the first protective auxiliary layer is made of a silicon carbide material, so that the wear-resistant and scratch-resistant layer is high in hardness and good in wear resistance.

Description

TECHNICAL FIELD

[0001] The utility model relates to multilayer circuit board technical field, concretely is a kind of multilayer circuit board with mechanical blind hole. BACKGROUND

[0002] In the field of electronic engineering, as the core component of electronic equipment, the performance and reliability of multilayer circuit board directly affect the stable operation of the entire system. With the rapid development of modern electronic technology, multilayer circuit board not only needs to meet the increasingly complex design requirements in function, but also needs to maintain its structural integrity and electrical performance in extreme environments.

[0003] Traditional multilayer circuit board outer protective layer often only uses single material, such as simple plastic coating or metal wrapping. Although this design can provide basic physical protection and certain electromagnetic shielding effect to a certain extent, it is difficult to meet the protection requirements in complex and variable use environments, such as high temperature, high humidity, strong ultraviolet radiation, chemical corrosion and mechanical impact. For example, plastic coating may be prone to wear and tear and aging, and metal wrapping may increase weight and affect electromagnetic compatibility. SUMMARY

[0004] The utility model aims at providing a kind of multilayer circuit board with mechanical blind hole, to solve the problem that traditional multilayer circuit board outer protective layer often only uses single material, such as simple plastic coating or metal wrapping, in the above background technology. Although this design can provide basic physical protection and certain electromagnetic shielding effect to a certain extent, it is difficult to meet the protection requirements in complex and variable use environments, such as high temperature, high humidity, strong ultraviolet radiation, chemical corrosion and mechanical impact. For example, plastic coating may be prone to wear and tear and aging, and metal wrapping may increase weight and affect electromagnetic compatibility.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a multilayer circuit board with mechanical blind vias, comprising a multilayer circuit board body, wherein the interior of the multilayer circuit board body comprises, from top to bottom, a top circuit board, a middle circuit board, and a bottom circuit board. The bottom of the top circuit board is bonded to the top of the middle circuit board with adhesive, and the bottom of the middle circuit board is bonded to the top of the bottom circuit board with adhesive. The middle circuit board has a plurality of buried via bodies inside. Blind via bodies are provided on the top and bottom sides of the top and bottom circuit boards corresponding to the buried via bodies. A protective main layer is fixedly connected to the outside of the multilayer circuit board body. The protective main layer includes a protective sub-layer one, a protective sub-layer two, and a protective sub-layer three. The protective sub-layer one is located outside the protective sub-layer two, and the protective sub-layer two is located outside the protective sub-layer three. The protective sub-layer one includes a wear-resistant and scratch-resistant layer and a UV-resistant layer. The protective sub-layer two includes a corrosion-resistant layer and an electromagnetic shielding layer. The protective sub-layer three includes a buffer shock-absorbing layer and a thermal insulation layer.

[0006] Compared with the prior art, the beneficial effects of this utility model are:

[0007] This multilayer circuit board with mechanical blind vias achieves multi-layer protection by designing a main protective layer comprising three protective sub-layers: Protective Sub-layer 1, Protective Sub-layer 2, and Protective Sub-layer 3. Each protective sub-layer is specifically designed to address particular environmental threats, enabling it to comprehensively withstand complex and changing operating environments such as high temperature, high humidity, strong ultraviolet radiation, chemical corrosion, and mechanical impact. The wear-resistant and scratch-resistant layer in Protective Sub-layer 1 uses silicon carbide, which has high hardness and good wear resistance, effectively resisting mechanical wear and scratches and extending the lifespan of the circuit board. The UV-resistant layer uses fluorocarbon resin, which has excellent UV aging resistance, preventing the circuit board from aging and deteriorating under prolonged exposure to strong light, maintaining its electrical performance and structural stability. Protective Sub-layer 2... The corrosion-resistant layer uses titanium alloy film material. Titanium alloy has excellent corrosion resistance and can maintain the integrity and electrical performance of the circuit board in a chemically corrosive environment. The electromagnetic shielding layer uses ferrite material, which has good electromagnetic shielding effect and can effectively prevent external electromagnetic interference from affecting the internal signals of the circuit board, thus improving the electromagnetic compatibility of the circuit board. The buffer and shock-absorbing layer in the third protective sublayer uses silicone material. Silicone has excellent elasticity and buffering performance, which can absorb and disperse mechanical shock energy and protect the circuit board from vibration and impact damage. The thermal insulation layer uses ceramic fiber material. Ceramic fiber has high thermal resistance and low thermal conductivity, which can effectively prevent heat transfer between the circuit board and the external environment, maintain the stable operating temperature of the circuit board, and improve the reliability and service life of the circuit board. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of this utility model;

[0009] Figure 2 It is the structure section view of the utility model multi-layer circuit board body;

[0010] Figure 3 It is the structure section view of the utility model protection main layer;

[0011] Figure 4 It is the structure section view of the utility model protection vice layer three;

[0012] Figure 5 It is the structure section view of the utility model protection vice layer one;

[0013] Figure 6 It is the structure section view of the utility model protection vice layer two.

[0014] In the drawing: 1, multi-layer circuit board body;2, top layer circuit board;3, middle layer circuit board;4, bottom layer circuit board;5, embedded hole body;6, blind hole body;7, side fixed frame;8, protection main layer;9, protection vice layer one;10, protection vice layer two;11, protection vice layer three;12, wear-resistant scratch-resistant layer;13, ultraviolet resistance layer;14, corrosion-resistant layer;15, electromagnetic shielding layer;16, buffer shock absorption layer;17, thermal insulation layer. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0016] Please refer to Figures 1-6The utility model provides a technical scheme: a kind of multilayer circuit board with mechanical blind hole, including multilayer circuit board body 1, the inside of multilayer circuit board body 1 from top to bottom includes top layer circuit board 2, middle layer circuit board 3 and bottom layer circuit board 4 in sequence, the bottom of top layer circuit board 2 is adhered with the top of middle layer circuit board 3 by adhesive, the bottom of middle layer circuit board 3 is adhered with the top of bottom layer circuit board 4 by adhesive, the inside of middle layer circuit board 3 is equipped with several embedded hole bodies 5, top layer circuit board 2 and bottom layer circuit board 4 corresponding embedded hole body 5's top and bottom are all set with blind hole body 6 in the side opposite to each other, the outside of multilayer circuit board body 1 is fixedly connected with protection main layer 8, protection main layer 8 includes protection secondary layer one 9, protection secondary layer two 10 and protection secondary layer three 11, protection secondary layer one 9 is located in the outside of protection secondary layer two 10, protection secondary layer two 10 is located in the outside of protection secondary layer three 11, protection secondary layer one 9 includes wear-resistant scratch-resistant layer 12 and ultraviolet resistance layer 13, protection secondary layer two 10 includes corrosion-resistant layer 14 and electromagnetic shielding layer 15, protection secondary layer three 11 includes buffer shock-absorbing layer 16 and thermal insulation layer 17.

[0017] The both sides of multilayer circuit board body 1 are fixedly connected with side fixed frame 7.

[0018] The material of wear-resistant scratch-resistant layer 12 is silicon carbide.

[0019] The material of ultraviolet resistance layer 13 is fluorocarbon resin.

[0020] The material of corrosion-resistant layer 14 is titanium alloy film.

[0021] The material of electromagnetic shielding layer 15 is ferrite.

[0022] The material of buffer shock-absorbing layer 16 is silica gel.

[0023] The material of thermal insulation layer 17 is ceramic fiber.

[0024] In summary: the multilayer circuit board with mechanical blind holes, by designing the protection main layer 8 containing the protection auxiliary layer one 9, the protection auxiliary layer two 10 and the protection auxiliary layer three 11, the multilayer protection of the multilayer circuit board body 1 is realized, each layer of protection auxiliary layer is specially designed for specific environmental threats, so as to comprehensively cope with the complex and changeable use environment of high temperature, high humidity, strong ultraviolet radiation, chemical corrosion and mechanical impact, the wear-resistant and scratch-resistant layer 12 in the protection auxiliary layer one 9 adopts silicon carbide material, which has high hardness and good wear resistance, can effectively resist mechanical wear and scratch, prolong the service life of the circuit board, the ultraviolet resistance layer 13 adopts fluorocarbon resin material, which has excellent ultraviolet aging resistance, can prevent the circuit board from aging and metamorphosis under long-term exposure to strong light, and maintains its electrical performance and structural stability, the corrosion-resistant layer 14 in the protection auxiliary layer two 10 adopts titanium alloy film material, titanium alloy has excellent corrosion resistance, can maintain the integrity and electrical performance of the circuit board in the chemical corrosion environment, the electromagnetic shielding layer 15 adopts ferrite material, which has good electromagnetic shielding effect, can effectively prevent the influence of external electromagnetic interference on the internal signal of the circuit board, and improve the electromagnetic compatibility of the circuit board, the buffer and shock-absorbing layer 16 in the protection auxiliary layer three 11 adopts silica gel material, which has excellent elasticity and buffering performance, can absorb and disperse mechanical impact energy, protect the circuit board from damage caused by vibration and impact, the thermal insulation layer 17 adopts ceramic fiber material, which has high thermal resistance and low thermal conductivity, can effectively prevent heat transfer between the circuit board and the external environment, maintain the working temperature of the circuit board stable, and improve the reliability and service life of the circuit board.

[0025] It should be noted that in this paper, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0026] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A multilayer circuit board having a mechanical blind via, comprising a multilayer circuit board body (1), characterized by: The inside of the multilayer circuit board body (1) comprises a top layer circuit board (2), a middle layer circuit board (3) and a bottom layer circuit board (4) from top to bottom, the bottom of the top layer circuit board (2) is bonded with the top of the middle layer circuit board (3) through adhesive, the bottom of the middle layer circuit board (3) is bonded with the top of the bottom layer circuit board (4) through adhesive, a plurality of embedded hole bodies (5) are arranged in the middle layer circuit board (3), blind hole bodies (6) are arranged on the side of the top layer circuit board (2) and the bottom layer circuit board (4) corresponding to the top and bottom of the embedded hole body (5), the outside of the multilayer circuit board body (1) is fixedly connected with a protective main layer (8), the protective main layer (8) comprises a protective secondary layer one (9), a protective secondary layer two (10) and a protective secondary layer three (11), the protective secondary layer one (9) is located outside the protective secondary layer two (10), the protective secondary layer two (10) is located outside the protective secondary layer three (11), the protective secondary layer one (9) comprises a wear-resistant and scratch-resistant layer (12) and an ultraviolet-resistant layer (13), the protective secondary layer two (10) comprises a corrosion-resistant layer (14) and an electromagnetic shielding layer (15), the protective secondary layer three (11) comprises a buffer and shock absorption layer (16) and a thermal insulation layer (17).

2. The multilayer circuit board having a mechanical blind via according to claim 1, wherein: The both sides of the multilayer circuit board body (1) are fixedly connected with side fixed frames (7).

3. The multilayer circuit board having a mechanical blind via of claim 1, wherein: The material of the wear-resistant and scratch-resistant layer (12) is silicon carbide.

4. The multilayer circuit board having mechanical blind vias of claim 1, wherein: The material of the ultraviolet-resistant layer (13) is fluorocarbon resin.

5. The multilayer circuit board having a mechanical blind via of claim 1, wherein: The material of the corrosion-resistant layer (14) is titanium alloy film.

6. The multilayer circuit board having mechanical blind vias of claim 1, wherein: The material of the electromagnetic shielding layer (15) is ferrite.

7. The multilayer circuit board having a mechanical blind via of claim 1, wherein: The material of the buffer and shock absorption layer (16) is silica gel.

8. The multilayer circuit board having mechanical blind vias of claim 1, wherein: The material of the thermal insulation layer (17) is ceramic fiber.

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