Injection mold for producing computer accessories

Abstract

The utility model relates to an injection mold for producing computer accessories, which comprises a mold bottom plate, a rack is arranged on the top surface of the mold bottom plate, a reciprocating pushing mechanism is arranged on the rack, one end of the reciprocating pushing mechanism is connected with the rack, the other end of the reciprocating pushing mechanism extends downwards to be connected with a male mold, and a female mold is further arranged on the top surface of the mold bottom plate. A cooling runner is formed in the female mold and surrounds the outer edges of the multiple mold cavities, and one side of the female mold is connected with a cooling assembly communicating with the cooling runner; and the demolding assembly is mounted on the top surface of the mold bottom plate and is used for ejecting out the mold in the mold cavity. According to the technical scheme, the cooling liquid is injected into the cooling runner and is made to flow, heat of the mold in the mold cavity can be absorbed, the cooling efficiency of the mold can be conveniently improved, the production efficiency is improved, meanwhile, the cooled mold can be ejected out through the demolding assembly, the automatic demolding effect is achieved, and the production efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of vertical injection mold technology, specifically to an injection mold used for producing computer accessories. Background Technology

[0002] Injection molds are currently one of the most commonly used pieces of equipment in the processing of computer plastic parts. After molding, the injection mold needs to be demolded. To better ensure product quality, demolding is a very important step. There are generally three demolding methods: forced demolding, manual demolding, and motorized demolding.

[0003] Manual demolding is suitable for injection molds with simple structures and high precision. However, because the injection-molded plastic parts are tightly attached to the inner wall of the mold plate, manual demolding is inconvenient, resulting in low efficiency and high labor intensity.

[0004] To address the aforementioned technical problems, Chinese Patent 202222503915.7 discloses a computer plastic injection mold with an automatic demolding function. The mold includes an upper template, with abutment blocks fixedly connected to its left and right sides. A fixing frame, shaped like a U, is installed directly below the abutment blocks. A support frame is slidably connected to the outer surface of the fixing frame, and a processing table is fixedly connected to the bottom of the support frame. Through the coordinated operation of a cylinder, upper template, abutment blocks, fixing frame, spring, vertical rod, and base plate, the cylinder pulls the upper template upwards, disengaging it from the top of the lower template. Simultaneously, the upper template causes the abutment blocks to release their pressure on the fixing frame. The compression spring, through its reverse action, pushes the fixing frame, causing the vertical rod to move upwards. The upward movement of the vertical rod pushes the base plate upwards, which in turn pushes the plastic out of the lower template, thus achieving automatic demolding and increasing production efficiency.

[0005] However, there is a limiting factor in the above-described technical implementation: the plastic mold must be allowed to cool down on its own, which takes a long time and slows down the production speed of the plastic mold, thus reducing its production efficiency. Utility Model Content

[0006] In view of this, the purpose of this utility model is to provide an injection mold for producing computer accessories, so as to solve the problems mentioned in the background art.

[0007] This utility model is achieved through the following technical solution:

[0008] An injection mold for producing computer accessories includes a mold base plate, a frame is provided on the top surface of the mold base plate, a reciprocating pushing mechanism is provided on the frame, one end of the reciprocating pushing mechanism is connected to the frame, and the other end extends downward to connect to a male mold. A female mold is also provided on the top surface of the mold base plate, and a number of mold cavities are opened on the top surface of the female mold, and a number of connecting holes are opened in each of the mold cavities.

[0009] The mother mold has cooling channels inside, which surround the outer edges of multiple mold cavities. A cooling component connected to the cooling channels is located on one side of the mother mold.

[0010] It also includes a demolding assembly, which is installed on the top surface of the mold base plate and is used to eject the mold from the mold cavity.

[0011] Furthermore, the cooling assembly includes a water tank and a water pump. The water tank is mounted on the top surface of the mold base plate, and the water pump is mounted on one side of the mother mold. The inlet of the water pump is connected to an inlet pipe, which is connected to the inside of the water tank. The outlet of the water pump is connected to an outlet pipe, which is connected to the inlet of the cooling channel. The cooling channel also has an outlet, and a connecting pipe is connected to the outlet. One end of the connecting pipe is connected to the outlet, and the other end is connected to the top surface of the water tank.

[0012] Furthermore, the demolding assembly includes a fixed plate, an ejector base plate, and a buffer assembly located between the fixed plate and the ejector base plate. The ejector base plate is provided with several sets of ejector bodies, each set of ejector bodies corresponding to a connection hole in a number of mold cavities. When the buffer assembly is in a freely extended state, the upper end of the ejector body extends out of the connection hole and is located in the mold cavity.

[0013] Furthermore, a connecting groove is provided on the top surface of the fixing plate, the connecting groove extends along the length of the fixing plate, and an installation rod is provided in the connecting groove. The two ends of the installation rod are fixedly connected to the opposite sides of the connecting groove, and the buffer assembly is installed at both ends of the installation rod.

[0014] Furthermore, the buffer assembly includes a force-bearing plate, two connecting rods, two movable sleeves, and two first buffer springs. The two movable sleeves and the first buffer springs are respectively sleeved on both ends of the connecting rods. The two ends of the first buffer springs are respectively connected to one end of the movable sleeve and the side wall of the connecting groove. One end of each of the two connecting rods is hinged to both ends of the force-bearing plate through a hinge seat, and the other end of the connecting rod is hinged to the movable sleeve through a hinge seat.

[0015] Furthermore, the hinged seat includes a connecting seat, an ear plate, and a pin. The connecting seat is fixedly connected to the end of the force-bearing plate or the movable sleeve, the ear plate is fixedly connected to the end of the second rod, the ear plate is embedded in the connecting seat, and the pin passes through and rotates to engage with it.

[0016] Furthermore, a second buffer spring is connected between the force-bearing plate and the mounting rod. The second buffer spring is fitted with a folded corrugated tube, and the two ends of the second buffer spring and the folded corrugated tube are respectively connected to one side of the force-bearing plate and the mounting rod.

[0017] Furthermore, the female mold has a positioning hole that extends longitudinally through the female mold. The bottom surface of the male mold is connected to a fixing rod corresponding to the positioning hole. The top surface of the ejector pin base plate is connected to a limit post. One end of the limit post is connected to the top surface of the ejector pin base plate, and the other end extends upward and slides into the positioning hole.

[0018] This injection mold for producing computer accessories absorbs heat from the mold cavity by injecting coolant into the cooling channels and allowing the coolant to flow, thus improving the mold's cooling efficiency and production efficiency. Furthermore, the cooled mold can be ejected via a demolding assembly, achieving automatic demolding and further enhancing production efficiency.

[0019] Other advantages, objectives, and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination and study, or may be learned from practice of this invention. The objectives and other advantages of this invention can be realized and obtained through the following description. Attached Figure Description

[0020] Figure 1 This is a perspective view (first-person view) of the present invention.

[0021] Figure 2 This is a perspective view (second view) of the present invention.

[0022] Figure 3 This is a schematic diagram of the exploded structure of this utility model;

[0023] Figure 4 This is a top sectional view of the mother mold of this utility model;

[0024] Figure 5 This is a schematic diagram of the buffer component structure of this utility model;

[0025] Figure 6 For the present utility model Figure 5 A magnified view of part A in the image;

[0026] Figure 7 For the present utility model Figure 5 A magnified view of part B in the image.

[0027] In the diagram: 1. Mold base plate; 2. Frame; 3. Reciprocating push mechanism; 4. Male mold; 5. Guide pillar; 6. Injection port; 7. Mold core; 8. Fixing rod; 9. Female mold; 10. Guide hole; 11. Mold cavity; 12. Connecting hole; 13. Positioning hole; 14. Mold foot; 15. Fixing plate; 16. Connecting groove;

[0028] 17. Buffer assembly; 1701. Force plate; 1702. Connecting rod; 1703. Movable sleeve; 1704. First buffer spring;

[0029] 18. Hinge base; 1801. Connecting base; 1802. Ear plate; 1803. Pin;

[0030] 19. Folded bellows; 20. Second buffer spring; 21. Cooling channel;

[0031] 22. Cooling components; 2201. Water tank; 2202. Water pump; 2203. Inlet pipe; 2204. Outlet pipe; 2205. Connecting pipe;

[0032] 23. Demolding assembly; 2301. Ejector pin base plate; 2302. Ejector pin body; 24. Mounting rod; 25. Limiting post. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In the above description of this utility model, it should be noted that the terms "one side," "the other side," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] Furthermore, terms such as "identical" do not imply that components must be absolutely identical; minor differences are permissible. The term "perpendicular" simply means that the positional relationship between components is more perpendicular than "parallel," not that the structure must be perfectly perpendicular; a slight tilt is acceptable.

[0038] Please see Figure 1-7 This utility model provides a technical solution: an injection mold for producing computer accessories, including a mold base plate 1, a frame 2 is provided on the top surface of the mold base plate 1, a reciprocating pushing mechanism 3 is provided on the frame 2, one end of the reciprocating pushing mechanism 3 is connected to the frame 2, and the other end extends downward to connect to a male mold 4. A female mold 9 is also provided on the top surface of the mold base plate 1, and a plurality of mold cavities 11 are opened on the top surface of the female mold 9, and a plurality of connecting holes 12 are opened in each of the plurality of mold cavities 11.

[0039] The mother mold 9 has a cooling channel 21 inside, which surrounds the outer edge of multiple mold cavities 11. One side of the mother mold 9 is connected to a cooling component 22 that communicates with the cooling channel 21.

[0040] It also includes a demolding assembly 23, which is installed on the top surface of the mold base plate 1 and is used to eject the mold inside the mold cavity 11.

[0041] In this design, the bottom surface of the male mold 4 is connected to multiple guide pillars 5, the top surface of the female mold 9 is provided with multiple guide holes 10 corresponding to the guide pillars 5, and the bottom surface of the male mold 4 is provided with multiple mold cores 7 corresponding to the mold cavities 11. The reciprocating pushing mechanism 3 outputs in the direction of the female mold 9. When the reciprocating pushing mechanism 3 reciprocates, it drives the male mold 4, mold cores 7 and guide pillars 5 to reciprocate synchronously. The reciprocating pushing mechanism 3 can be a cylinder or a hydraulic cylinder. When the reciprocating telescopic mechanism is in the retracted state, the bottom end of the guide pillars 5 is still in the guide hole 10. The male mold 4 is provided with an injection port 6, which is not aligned with the horizontal plate of the frame 2. The male mold 4 is provided with a connecting channel, which is connected to multiple mold cores 7. The bottom of each mold core 7 is provided with a flow port corresponding to multiple mold cavities (the connecting channel is a commonly used technical means in the field of injection molds, so it is not shown in the attached drawings of this application). The bottom surface of the female mold 9 is also provided with mold feet 14, and the demolding component 23 is located below the female mold 9.

[0042] In use, the operator first activates the reciprocating pushing mechanism 3, which drives the male mold 4 downward until the bottom surface of the male mold 4 contacts the top surface of the female mold 9. While the male mold 4 moves downward, the guide rod slides down along the guide hole 10 until the mold core 7 enters the mold cavity 11, forming the space required to make the mold shape. Then, the operator injects the mold material into the mold cavity 11 through the injection port 6, so that the mold is formed and cooled. Then, the coolant is injected into the cooling channel 21, where it flows and absorbs the heat generated by the mold in the mold cavity 11. After the mold is formed and cooled, the operator controls the reciprocating pushing mechanism 3 to contract, so that the male mold 4 and the mold core 7 are separated from the female mold 9 and the mold cavity 11. At the same time, the demolding component 23 ejects the mold from the mold cavity 11 for easy collection by the operator.

[0043] By injecting coolant into the cooling channel 21 and allowing the coolant to flow, the heat of the mold in the mold cavity 11 can be absorbed, which facilitates the improvement of the mold's cooling efficiency and production efficiency. At the same time, the cooled mold can be ejected through the demolding component 23 to achieve the effect of automatic demolding, which further improves the production efficiency.

[0044] In this embodiment: the cooling assembly 22 includes a water tank 2201 and a water pump 2202. The water tank 2201 is mounted on the top surface of the mold base plate 1. The water pump 2202 is mounted on one side of the mother mold 9. The inlet of the water pump 2202 is connected to the inlet pipe 2203, which is connected to the inside of the water tank 2201. The outlet of the water pump 2202 is connected to the outlet pipe 2204, which is connected to the inlet of the cooling channel 21. The cooling channel 21 is also provided with an outlet. A connecting pipe 2205 is connected to the outlet. One end of the connecting pipe 2205 is connected to the outlet, and the other end is connected to the top surface of the water tank 2201.

[0045] In this design, the water tank 2201 is equipped with an inlet and an outlet, and both the inlet and outlet are equipped with solenoid valves. When the coolant in the water tank 2201 is insufficient, new coolant can be injected through the inlet. When the coolant needs to be replaced, it can be discharged through the outlet and new coolant can be injected through the inlet.

[0046] When it is necessary to cool the mold in the mold cavity 11, the water pump 2202 can be started. The water pump 2202 draws out the coolant in the water tank 2201 through the water inlet pipe 2203 and injects the drawn coolant into the cooling channel 21 through the water outlet pipe 2204. The coolant flows in the cooling channel 21 and absorbs the heat generated in the mold cavity 11. At the same time, the coolant flows back into the water tank 2201 through the connecting pipe 2205 connected to the outlet, realizing the circulation of the coolant and dissipating the absorbed heat.

[0047] The model of water pump 2202 is TOPSFLO.

[0048] In this embodiment, the demolding assembly 23 includes a fixed plate 15, an ejector pin base plate 2301, and a buffer assembly 17 located between the fixed plate 15 and the ejector pin base plate 2301. The ejector pin base plate 2301 is provided with a plurality of ejector pin bodies 2302, and the plurality of ejector pin bodies 2302 correspond to the connection holes 12 in a plurality of mold cavities 11 respectively. When the buffer assembly 17 is in a free extended state, the upper end of the ejector pin body 2302 extends out of the connection hole 12 and is located in the mold cavity 11.

[0049] The operator first activates the reciprocating push mechanism 3, which drives the male mold 4 downward until the bottom surface of the male mold 4 contacts the top surface of the female mold 9. At this point, pressure is applied to the ejector body 2302, causing the buffer component 17 to change from a freely extended state to a contracted state. This causes the upper end of the ejector body 2302 to slide downward along the connecting hole 12 until the upper end of the ejector body 2302 is flush with the top surface of the connecting hole 12. When the mold is formed, the reciprocating push mechanism 3 moves upward, and the pressure applied to the ejector body 2302 gradually decreases until it disappears. At the same time, the buffer component 17 changes from a telescopic state to a freely extended state, and the upper end of the ejector body 2302 slides upward along the connecting hole 12, ejecting the mold formed in the mold cavity 11.

[0050] In this embodiment: a connecting groove 16 is provided on the top surface of the fixing plate 15. The connecting groove 16 extends along the length of the fixing plate 15. An installation rod 24 is provided in the connecting groove 16. The two ends of the installation rod 24 are fixedly connected to the opposite sides of the connecting groove 16. The buffer assembly 17 is installed at both ends of the installation rod 24.

[0051] When the pressure on the buffer assembly 17 increases or decreases, the buffer assembly 17 can slide along the mounting rod 24, which can reduce the vibration generated when the ejector body 2302 slides up or down along the connecting hole 12.

[0052] In this embodiment, the buffer assembly 17 includes a force-bearing plate 1701, two connecting rods 1702, two movable sleeves 1703, and two first buffer springs 1704. The two movable sleeves 1703 and the first buffer springs 1704 are respectively sleeved on both ends of the connecting rods 1702. The two ends of the first buffer springs 1704 are respectively connected to one end of the movable sleeve 1703 and the side wall of the connecting groove 16. One end of each of the two connecting rods 1702 is hinged to both ends of the force-bearing plate 1701 through a hinge seat 18, and the other end of the connecting rod 1702 is hinged to the movable sleeve 1703 through a hinge seat 18.

[0053] In its natural state, the first buffer spring 1704 is naturally unfolded, and the force plate 1701 and the two connecting rods 1702 form a bent rod. When the bottom surface of the male mold 4 abuts against the top surface of the female mold 9, pressure is applied to the ejector body 2302. The ejector body 2302 will transmit the force received to the force plate 1701. The force plate 1701 moves towards the mounting rod 24. As the moving distance increases, the tilt angle of the two connecting rods 1702 gradually increases. The ends of the two connecting rods 1702 connected to the movable sleeve 1703 move away from each other. The movable sleeve 1703 moves synchronously. In this state, the movement of the movable sleeve 1703 compresses the first buffer spring 1704, causing the first buffer spring 1704 to deform and contract, thereby causing the ejector body 2302 to slide down along the connecting hole 12 until the upper end of the ejector body 2302 is flush with the connecting hole 12.

[0054] In this embodiment, the hinge seat 18 includes a connecting seat 1801, an ear plate 1802, and a pin 1803. The connecting seat 1801 is fixedly connected to the end of the force plate 1701 or the movable sleeve 1703. The ear plate 1802 is fixedly connected to the end of the second rod. The ear plate 1802 is embedded in the connecting seat 1801, and the pin 1803 passes through and rotates in engagement with it.

[0055] Connecting seats 1801 are provided at both ends of the connecting rod 1702 and on the side of the movable sleeve 1703. The ear plates 1802 on both ends of the two connecting rods 1702 are respectively embedded into the connecting seats 1801 on both ends of the force plate 1701 and the two movable sleeves 1703, while the pins 1803 pass through to make them rotate and engage.

[0056] In this embodiment: a second buffer spring 20 is connected between the force plate 1701 and the mounting rod 24. The second buffer sleeve is provided with a folded corrugated tube 19. The two ends of the second buffer spring 20 and the folded corrugated tube 19 are respectively connected to one side of the force plate 1701 and the mounting rod 24.

[0057] During the process of the ejector body 2302 being subjected to force, the second buffer spring 20 and the folded bellows 19 contract to apply buffer to the force plate 1701 and prevent the force plate 1701 from shifting on the mounting rod 24.

[0058] In this embodiment: a positioning hole 13 is provided on the female mold 9, the positioning hole 13 extends longitudinally through the female mold 9, a fixing rod 8 corresponding to the positioning hole 13 is connected to the bottom surface of the male mold 4, a limiting post 25 is connected to the top surface of the ejector base plate 2301, one end of the limiting post 25 is connected to the top surface of the ejector base plate 2301, and the other end extends upward and slides in the positioning hole 13.

[0059] When the reciprocating push mechanism 3 drives the male mold 4 to move downward, before the bottom surface of the male mold 4 contacts the top surface of the female mold 9, the fixing rod 8 on the bottom surface of the male mold 4 enters the positioning hole 13 on the female mold 9 and slides downward along the positioning hole 13 until the bottom end of the fixing rod 8 contacts the top end of the limiting post 25 and applies pressure to the limiting post 25. At the same time, the limiting post 25 transmits the pressure it receives to the ejector base plate 2301. The ejector base plate 2301 moves downward and transmits the force it receives to the buffer assembly 17 for buffering.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A kind of injection mould for producing computer accessories, including mould base plate (1), the top surface of mould base plate (1) is provided with rack (2), reciprocating push mechanism (3) is provided on the rack (2), one end of reciprocating push mechanism (3) is connected with rack (2), the other end is extended downward and is connected with male mould (4), the top surface of mould base plate (1) is also provided with female mould (9), it is characterized by: The female mold (9) top surface is provided with several mold cavities (11), several mold cavities (11) are provided with a plurality of connecting holes (12); The female mold (9) is provided with a cooling flow channel (21), the cooling flow channel (21) surrounds the outer edge of the plurality of mold cavities (11), and one side of the female mold (9) is connected with a cooling assembly (22) communicated with the cooling flow channel (21); It also includes a demolding assembly (23), which is installed on the top surface of the mold bottom plate (1) and is used to eject the mold in the mold cavity (11).

2. An injection mold for producing a computer accessory according to claim 1, wherein: The cooling assembly (22) includes a water tank (2201) and a water pump (2202), the water tank (2201) is installed on the top surface of the mold bottom plate (1), the water pump (2202) is installed on one side of the female mold (9), the inlet of the water pump (2202) is connected with a water inlet pipe (2203), the water inlet pipe (2203) is communicated with the inside of the water tank (2201), the outlet of the water pump (2202) is connected with a water outlet pipe (2204), the water outlet pipe (2204) is communicated with the water inlet of the cooling flow channel (21), the cooling flow channel (21) is also provided with a water outlet, the water outlet is connected with a connecting pipe (2205), one end of the connecting pipe (2205) is connected with the water outlet, and the other end is connected with the top surface of the water tank (2201).

3. An injection mold for producing a computer accessory according to claim 1, wherein: The demolding assembly (23) includes a fixed plate (15), a ejector pin bottom plate (2301) and a buffer assembly (17) arranged between the fixed plate (15) and the ejector pin bottom plate (2301), the ejector pin bottom plate (2301) is provided with a plurality of ejector pin bodies (2302), a plurality of ejector pin bodies (2302) correspond to a plurality of connecting holes (12) in the mold cavity (11) respectively, and the upper end of the ejector pin body (2302) is located in the connecting hole (12) in the mold cavity (11) when the buffer assembly (17) is in a free stretching state.

4. An injection mold for producing a computer accessory according to claim 3, wherein: The top surface of the fixed plate (15) is provided with a connecting groove (16), the connecting groove (16) extends along the length direction of the fixed plate (15), the connecting groove (16) is provided with a mounting rod (24), the two ends of the mounting rod (24) are fixedly connected with the opposite sides of the connecting groove (16), and the buffer assembly (17) is mounted on the two ends of the mounting rod (24).

5. An injection mold for producing a computer accessory according to claim 4, wherein: The buffer assembly (17) includes a stress plate (1701), two connecting rods (1702), two movable sleeves (1703) and two first buffer springs (1704), two movable sleeves (1703) and first buffer springs (1704) are sleeved on the two ends of the connecting rod (1702), the two ends of the first buffer spring (1704) are connected with one end of the movable sleeve (1703) and the side wall of the connecting groove (16), one end of the two connecting rods (1702) is hinged with the two ends of the stress plate (1701) through the hinge seat (18), and the other end of the connecting rod (1702) is hinged with the movable sleeve (1703) through the hinge seat (18).

6. An injection mold for producing a computer accessory according to claim 5, wherein: The hinged seat (18) comprises a connecting seat (1801), an ear plate (1802) and a bolt (1803), the connecting seat (1801) is fixedly connected to the end of the stress plate (1701) or the movable sleeve (1703), the ear plate (1802) is fixedly connected to the end of the second rod body, the ear plate (1802) is embedded in the connecting seat (1801), and the bolt (1803) penetrates and rotates.

7. An injection mold for producing a computer accessory according to claim 5, wherein: The stress plate (1701) is connected with the mounting rod (24) through a second buffer spring (20), the second buffer spring (20) is provided with a folding bellows (19), and the two ends of the second buffer spring (20) and the folding bellows (19) are connected with one side of the stress plate (1701) and the mounting rod (24) respectively.

8. An injection mold for producing a computer accessory according to any one of claims 1-7, characterized in that: The female mold (9) is provided with a positioning hole (13), the positioning hole (13) longitudinally penetrates the female mold (9), the male mold (4) is connected with a fixed rod (8) corresponding to the positioning hole (13), the ejector pin bottom plate (2301) is connected with a limiting column (25) on the top surface, one end of the limiting column (25) is connected with the top surface of the ejector pin bottom plate (2301), and the other end extends upward and is slidingly fitted in the positioning hole (13).

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