Silicon wafer clamping and conveying mechanism

Abstract

The utility model belongs to the technical field of silicon wafer conveying, and particularly relates to a silicon wafer clamping and conveying mechanism which comprises a first servo motor, a width adjusting assembly and two side edge guiding assemblies, and the two side edge guiding assemblies are arranged in parallel in the X-axis direction, are consistent in structure and are used for clamping a silicon wafer and conveying the silicon wafer in the X-axis direction. The width adjusting assembly is connected with the two side edge guiding assemblies, and the first servo motor is used for driving the width adjusting assembly so as to adjust the distance between the two side edge guiding assemblies in the Y-axis direction. According to the utility model, the width adjusting assembly is arranged to adjust the distance between the two side edge guiding assemblies in the Y-axis direction, so that the effect of clamping the silicon wafer is achieved, the side edge guiding assemblies are matched to achieve the effect of conveying the silicon wafer, the clamping and conveying mechanism is reliable in control and simple in mechanical structure, the silicon wafer cannot be inclined in the conveying process, and the wafer separation success rate is high.

Description

Technical Field

[0001] This utility model relates to a wide range of technical fields, and in particular to a silicon wafer clamping and conveying mechanism. Background Technology

[0002] In the vertical slitting equipment, the material tray places the entire group of silicon wafers in a water tank for slitting. During the slitting process, the belt conveyor mechanism below the silicon wafers needs to drive the wafers forward smoothly and slowly to ensure the continuous supply of silicon wafers and the slitting process. During the conveying process, due to uncontrollable factors, the silicon wafers may tilt and squeeze each other, affecting the slitting success rate and causing silicon wafer breakage and microcracks. Therefore, a clamping mechanism is needed to clamp the silicon wafers on both sides to fix them in place and facilitate the overall movement of the silicon wafers.

[0003] Currently, traditional clamping mechanisms use a large number of clamping blocks. Under the action of spring tension, the clamping blocks make soft contact with the silicon wafer through flexible components mounted on the clamping blocks, thus achieving the silicon wafer clamping function. The advantage of this structure is that it involves fewer electrical components and relies entirely on mechanical structures to automatically release the silicon wafer for dicing. However, the disadvantages are also quite obvious. Due to the large number of clamping blocks, the installation is difficult, the mechanical maintenance cost is high and uncontrollable, and the spring force may fail or weaken over a long period of time, affecting the clamping effect of the clamping blocks. Utility Model Content

[0004] The technical problem to be solved by this utility model is: In order to solve the technical problems existing in the prior art, this utility model provides a silicon wafer clamping and conveying mechanism to clamp and support the silicon wafer to prevent it from deviating during the conveying process, thereby improving the production efficiency of silicon wafers.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a silicon wafer clamping and conveying mechanism, which includes: two side guide components, the two side guide components are arranged in parallel along the X-axis direction and have the same structure, for clamping silicon wafers and conveying silicon wafers along the X-axis direction;

[0006] First servo motor;

[0007] A width adjustment component is provided, which is connected to the two side guide components. The first servo motor is used to drive the width adjustment component to adjust the spacing between the two side guide components in the Y-axis direction.

[0008] The specific technical effect is as follows: by setting the width adjustment component to adjust the distance between the two side guide components in the Y-axis direction, the silicon wafer can be clamped. In addition, the side guide components can be used to transport the silicon wafer. This solves the problems of existing technology, which requires multiple clamping blocks, resulting in difficult installation, high and uncontrollable mechanical maintenance costs, and failure or weakening of spring force over long periods, affecting the clamping effect of the clamping blocks.

[0009] Furthermore, the width adjustment component includes:

[0010] Synchronous belt;

[0011] The first drive wheel is connected to the output end of the first servo motor;

[0012] The first driven pulley is driven by the first driving pulley through the synchronous belt, and the axes of the first driven pulley and the first driving pulley are arranged along the x-direction;

[0013] Two redirection mounting structures are constructed identically. One redirection mounting structure is installed at the upper end of the timing belt and connected to one of the side guide components. The other redirection mounting structure is installed at the lower end of the timing belt and connected to another of the side guide components.

[0014] Furthermore, the width adjustment component also includes:

[0015] y-axis beam;

[0016] An active end support is provided on one end of the y-axis beam and is used to support the first servo motor and the first active wheel.

[0017] A passive end support is provided at the other end of the y-axis beam and is used to support the first driven wheel.

[0018] Furthermore, the width adjustment component also includes:

[0019] A linear slide rail, which is disposed along the y-axis on the y-axis beam;

[0020] The redirection mounting structure includes a redirection mounting plate and a mounting stand. One end of the redirection mounting plate is connected to the timing belt, and the other end of the redirection mounting plate is connected to the mounting stand. The mounting stand is slidably mounted on the linear guide rail via a slider, and the mounting stand is connected to the side guide assembly.

[0021] Furthermore, a slotted photoelectric sensor is provided on the y-axis beam, and a photoelectric baffle that cooperates with the slotted photoelectric sensor is provided on the redirection mounting structure.

[0022] Furthermore, anti-collision mounting seats are respectively provided at both ends of the y-axis beam, and the anti-collision mounting seats are respectively located on the outside of the two redirection mounting structures, and limit anti-collision blocks are provided on the anti-collision mounting seats.

[0023] Furthermore, the number of the width adjustment components is two, and the two width adjustment components are located at both ends of the side guide component.

[0024] Furthermore, the side guide assembly includes:

[0025] Clamp the belt;

[0026] Square tube profile frame;

[0027] A motor mounting bracket is installed at one end of the square tube profile frame;

[0028] A second servo motor is mounted on the motor mounting bracket.

[0029] An adjusting plate is installed on the other end of the square tube profile frame and is used to tension the belt. The adjusting plate and the output end of the second servo motor are driven by the clamping belt.

[0030] Compared with the prior art, the beneficial effects of this utility model are:

[0031] This invention adjusts the spacing between two side guide components in the Y-axis direction by setting a width adjustment component, thereby clamping the silicon wafer. Combined with the side guide components, it conveys the silicon wafer. The clamping and conveying mechanism is reliable, has a simple mechanical structure, and the silicon wafer will not be skewed during the conveying process, resulting in a high wafer splitting success rate. Attached Figure Description

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0033] Figure 1 This is a schematic diagram of the structure of a silicon wafer clamping and conveying mechanism according to the present invention;

[0034] Figure 2 for Figure 1 The main view;

[0035] Figure 3 for Figure 1 Side view

[0036] Figure 4 for Figure 1 A magnified schematic diagram of the local structure at point A in the middle.

[0037] In the diagram: 1. First servo motor;

[0038] 2. Width adjustment assembly; 201. Synchronous belt; 202. First driving pulley; 203. First driven pulley; 204. Redirection mounting structure; 205. Y-axis crossbeam; 206. Driving end support; 207. Passive end support; 208. Linear slide rail; 209. Redirection mounting plate; 210. Mounting plate; 211. Slider; 212. Groove photoelectric sensor; 213. Photoelectric baffle; 214. Anti-collision mounting base; 215. Limiting anti-collision block;

[0039] 3. Side guide assembly; 301. Clamping belt; 302. Square tube profile frame; 303. Motor mounting base; 304. Second servo motor; 305. Adjustment plate. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0041] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0042] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0043] like Figures 1 to 4 The diagram shows the preferred embodiment of this utility model. This embodiment provides a silicon wafer clamping and conveying mechanism, comprising: a first servo motor 1, a width adjustment component 2, and two side guide components 3. The two side guide components 3 are arranged parallel to each other along the X-axis and have the same structure, and are used to clamp silicon wafers and convey silicon wafers along the X-axis. The width adjustment component 2 is connected to the two side guide components 3. The first servo motor 1 is used to drive the width adjustment component 2 to adjust the spacing between the two side guide components 3 in the Y-axis direction.

[0044] Therefore, by setting the width adjustment component 2 to adjust the distance between the two side guide components 3 in the Y-axis direction, the silicon wafer can be clamped. In addition, the side guide components 3 can be used to transport the silicon wafer. This solves the problems of existing technology, which requires multiple clamping blocks, resulting in difficult installation, high and uncontrollable mechanical maintenance costs, and failure or weakening of spring force over long periods, affecting the clamping effect of the clamping blocks.

[0045] In this embodiment, the width adjustment component 2 includes:

[0046] Synchronous belt 201;

[0047] The first drive wheel 202 is connected to the output end of the first servo motor 1;

[0048] The first driven wheel 203 and the first driving wheel 202 are driven by a synchronous belt 201, and the axes of the first driven wheel 203 and the first driving wheel 202 are arranged along the x-direction;

[0049] Two redirection mounting structures 204 are constructed identically. One redirection mounting structure 204 is installed at the upper end of the timing belt 201 and connected to one side guide component 3. The other redirection mounting structure 204 is installed at the lower end of the timing belt 201 and connected to the other side guide component 3.

[0050] Therefore, when the first servo motor 1 drives the synchronous belt 201 to rotate through the first drive wheel 202, the two redirection mounting structures 204 move closer to each other, thereby driving the two side guide components 3 to move closer to each other to clamp the silicon wafer.

[0051] In this embodiment, the width adjustment component 2 further includes:

[0052] y-axis crossbeam 205;

[0053] Active end support 206 is disposed on one end of the y-axis beam 205 and is used to support the first servo motor 1 and the first drive wheel 202;

[0054] Passive end support 207 is located at the other end of the y-axis beam 205 and is used to support the first driven wheel 203.

[0055] In this embodiment, the width adjustment component 2 further includes:

[0056] Linear slide rail 208 is set on the y-axis beam 205 along the y-axis;

[0057] The redirection mounting structure 204 includes a redirection mounting plate 209 and a mounting plate 210. One end of the redirection mounting plate 209 is connected to the timing belt 201, and the other end of the redirection mounting plate 209 is connected to the mounting plate 210. The mounting plate 210 is slidably mounted on the linear guide rail 208 via a slider 211, and the mounting plate 210 is connected to the side guide assembly 3.

[0058] In this embodiment, a slotted photoelectric sensor 212 is provided on the y-axis beam 205, and a photoelectric baffle 213 that cooperates with the slotted photoelectric sensor 212 is provided on the redirection mounting structure 204. This is used to determine whether the side guide assembly 3 has reached the predetermined clamping position.

[0059] In this embodiment, anti-collision mounting seats 214 are respectively provided at both ends of the y-axis beam 205. The anti-collision mounting seats 214 are located on the outer sides of the two redirection mounting structures 204, and limit anti-collision blocks 215 are provided on the anti-collision mounting seats 214. Thus, when the redirection mounting structures 204 move in opposite directions, the limit anti-collision blocks 215 can play a limiting anti-collision role on the outer side of the redirection mounting structures 204. Specifically, the limit anti-collision blocks 215 are made of polyurethane material.

[0060] In this embodiment, there are two width adjustment components 2, which are located at both ends of the side guide component 3.

[0061] In this embodiment, the side guide assembly 3 includes:

[0062] Clamp belt 301;

[0063] 302 square tube profile frame;

[0064] Motor mounting bracket 303 is mounted on one end of square tube profile frame 302;

[0065] The second servo motor 304 is mounted on the motor mounting base 303;

[0066] Adjustment plate 305 is installed on the other end of square tube profile frame 302 and is used to tension belt. Adjustment plate 305 and output end of second servo motor 304 achieve transmission through clamping belt 301.

[0067] In this embodiment, the clamping belt 301 is made of PU (polyurethane) material, which makes soft contact with the silicon wafer to avoid damaging the silicon wafer during clamping and transportation, and causing the silicon wafer to chip.

[0068] In this embodiment, two side guide components 3 are used to clamp the upper end of the silicon wafer. The side guide components 3 mainly play a clamping role to prevent the silicon wafer from tilting during the transportation process. A conveyor is provided at the lower end of the silicon wafer. The conveyor is used to transport the silicon wafer and bear the main weight of the silicon wafer. It should be noted that the second servo motor 304 and the conveyor need to keep their movements synchronized in electrical control so as to synchronously drive the silicon wafer 201 to transport it forward, so as to ensure the overall movement of the silicon wafer and ensure that the silicon wafer does not twist.

[0069] The main working principle of this utility model is as follows:

[0070] When the silicon wafer is located between the two side guide components 3, the first servo motor 1 starts. Through the transmission cooperation of the first driving wheel 202, the first driven wheel 203 and the synchronous belt 201, the two redirection mounting structures 204 move towards each other along the linear slide rail 208, thereby driving the two side guide components 3 to move towards each other to clamp the silicon wafer. When the photoelectric baffle 213 on the redirection mounting structure 204 blocks the slotted photoelectric 212, it means that the two side guide components 3 have reached the predetermined clamping position and the silicon wafer is clamped. When the two side guide components 3 clamp the silicon wafer, the clamping belt 301 is close to the side of the silicon wafer. At this time, the second servo motor 304 starts and drives the clamping belt 301 to start rotating. Under the action of static friction, the silicon wafer is driven forward by the clamping belt 301 (it should be noted that the second servo motor 304 keeps the movement synchronized with the conveyor). When the silicon wafer is transferred to the end of the clamping belt 301 and disengages from the clamping belt 301, it enters the subsequent slitting stage.

[0071] Compared with the prior art, the beneficial effects of this utility model are:

[0072] (1) This utility model adjusts the distance between the two side guide components 3 in the Y-axis direction by setting the width adjustment component 2, thereby clamping the silicon wafer. In addition, the side guide components 3 are used to transport the silicon wafer. The clamping and conveying mechanism is reliable, the mechanical structure is simple, the silicon wafer will not be skewed during the transport process, and the wafer splitting success rate is high.

[0073] (2) This utility model improves control accuracy and ensures the stability of silicon wafer transmission by using a first servo motor 1 and a second servo motor 304.

[0074] (3) By adopting a linear guide rail 208 for guidance, the side guide components 3 on both sides of the silicon wafer are made to run more smoothly.

[0075] The above description is based on the preferred embodiments of this utility model. Through the above description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined by the scope of the claims.

Claims

1. A silicon wafer chucking and conveying mechanism, characterized by, The utility model relates to a silicon wafer conveying device, including: Two side edge guide assemblies (3) are arranged in parallel along the X-axis direction and are consistent in structure, used for clamping and conveying silicon wafers along the X-axis direction; A first servo motor (1); A width adjusting assembly (2) is connected with the two side edge guide assemblies (3), and the first servo motor (1) is used to drive the width adjusting assembly (2) to adjust the distance between the two side edge guide assemblies (3) along the Y-axis direction; The width adjusting assembly (2) includes a y-axis cross beam (205) and two redirection mounting structures (204), one of which is connected with one of the side edge guide assemblies (3), and the other of which is connected with the other side edge guide assembly (3), the y-axis cross beam (205) is provided with a slot photoelectric (212), the redirection mounting structure (204) is provided with a photoelectric baffle (213) matched with the slot photoelectric (212), both ends of the y-axis cross beam (205) are respectively provided with anti-collision mounting seats (214), the anti-collision mounting seats (214) are respectively located outside the two redirection mounting structures (204), and the anti-collision mounting seats (214) are provided with limiting anti-collision blocks (215).

2. A silicon wafer chucking and conveying mechanism as claimed in claim 1, wherein, The width adjusting assembly (2) includes: A synchronous belt (201); A first driving wheel (202) connected with the output end of the first servo motor (1); A first driven wheel (203) driven by the synchronous belt (201) and arranged along the x-axis direction with the axis of the first driving wheel (202); Two redirection mounting structures (204) consistent in structure, one of which is installed at the upper end of the synchronous belt (201), and the other of which is installed at the lower end of the synchronous belt (201).

3. A silicon wafer chuck and transport mechanism as claimed in claim 2 wherein, The width adjusting assembly (2) further includes: An active end support seat (206) provided on one end of the y-axis cross beam (205) and used for supporting the first servo motor (1) and the first driving wheel (202); A passive end support seat (207) provided on the other end of the y-axis cross beam (205) and used for supporting the first driven wheel (203).

4. A silicon wafer chucking and conveying mechanism as claimed in claim 3, wherein, The width adjusting assembly (2) further includes: A linear slide rail (208) provided on the y-axis cross beam (205) along the y-axis direction. The repositioning mounting structure (204) comprises a repositioning mounting plate (209) and a mounting vertical plate (210), one end of the repositioning mounting plate (209) is connected with the synchronous belt (201), the other end of the repositioning mounting plate (209) is connected with the mounting vertical plate (210), the mounting vertical plate (210) is slidably arranged on the linear slide rail (208) through a sliding block (211), and the mounting vertical plate (210) is connected with the side edge guiding assembly (3).

5. A silicon wafer chuck and transport mechanism as claimed in claim 1 wherein, The number of the width adjusting assemblies (2) is two, and the two width adjusting assemblies (2) are located at two ends of the side edge guiding assembly (3).

6. A silicon wafer chuck and transport mechanism as claimed in claim 1 wherein, The side edge guiding assembly (3) comprises: a clamping belt (301); a square tube profile frame (302); a motor mounting seat (303) mounted on one end of the square tube profile frame (302); a second servo motor (304) mounted on the motor mounting seat (303); an adjusting plate (305) mounted on the other end of the square tube profile frame (302) and used for tensioning the belt, and the adjusting plate (305) is in transmission with an output end of the second servo motor (304) through the clamping belt (301).

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