Batch laminating and bonding device for chips and glass

Abstract

The utility model provides a batch bonding device for chips and glass, which comprises a base station, a seat body is arranged on the base station, a plurality of hot-pressing groups are arranged on the base station side by side, and the horizontal position of each hot-pressing group on the seat body is adjustable; the material placing table is located under the multiple hot pressing sets. The support is provided with a plurality of buffer material supply sets with adjustable horizontal positions, the buffer material supply sets are in one-to-one correspondence with the hot pressing sets, and the support is further provided with a traction set so as to pull out buffer materials on the buffer material supply sets from the positions between the hot pressing sets and the material placing table; and the arrangement heights of the buffer material supply group and the traction group are higher than the height of the working end of the hot-pressing group. According to the utility model, a plurality of hot-pressing groups are designed, so that the hot-pressing process of batch chips can be realized, and the horizontal positions of the hot-pressing groups can be correspondingly adjusted according to the positions of the chips sent out from the previous station, so that the hot-pressing work of each chip can be accurately realized, the production efficiency is improved, and the batch production requirement is met.

Description

Technical Field

[0001] This utility model relates to the field of chip bonding technology, specifically, it demonstrates a batch bonding device for chips and glass. Background Technology

[0002] A COG (Chip-on-Glass) bonding machine is an automated device that precisely bonds IC chips to LCD glass panels, primarily used in the assembly of display modules in electronic product manufacturing. It mainly uses a hot-pressing process with ACF (Anisotropic Conductive Fiber) adhesive to permanently connect the IC chip to the LCD glass panel, enabling circuit conduction and signal transmission. Specifically, it employs a PLC control system, servo-driven platform positioning, and a constant-temperature heating method with a stainless steel hot-pressing head to achieve constant-temperature bonding. However, existing automated bonding equipment still has some shortcomings: low hot-pressing efficiency, and only one chip can be hot-pressed at a time, which is not conducive to mass production needs. Utility Model Content

[0003] The purpose of this invention is to provide a batch bonding device for chips and glass, which has a simple and practical structure and can simultaneously perform hot pressing on a batch of chips.

[0004] The technical solution is as follows:

[0005] A batch bonding device for chips and glass includes a base, on which:

[0006] The base has several hot-pressing units arranged side by side, and the horizontal position of each hot-pressing unit on the base is adjustable;

[0007] The material placement platform is located directly below several hot press units;

[0008] The support frame has several adjustable cushioning material supply groups, each corresponding to a hot pressing group. The support frame also has a traction group to pull the cushioning material from the hot pressing group and the material placement table. The cushioning material supply group and the traction group are installed at a height higher than the working end of the hot pressing group.

[0009] Optionally, the hot pressing assembly includes a cylinder module, an intermediate main module, and a hot pressing head. The hot pressing head is located at the bottom of the intermediate main module, and the cylinder module is used to lift and lower the intermediate main module. The cylinder module is movably mounted on the base. The purpose of designing the position of the hot pressing assembly to be adjustable left and right is to accurately adjust the position of the corresponding hot pressing assembly according to the chip position, so as to precisely achieve the hot pressing action between the chip and the glass.

[0010] The base has a movable groove along its length. The stroke end of the cylinder module passes downward through the movable groove and connects to the intermediate main body module. The cylinder module and the intermediate main body module are movably mounted on the base via slider and slide rail assemblies. The cylinder module can be adjusted horizontally relative to the base, and the intermediate main body module can be adjusted vertically relative to the base.

[0011] The intermediate main module is also equipped with a photoelectric sensor, which is positioned towards the hot press head to detect whether there is cushioning material beneath the hot press head. The presence or absence of cushioning material beneath the hot press head is detected by the photoelectric sensor.

[0012] Furthermore, the photoelectric sensor is mounted on the intermediate main module via a mounting plate, and the other end of the mounting plate has an inclined section for mounting the photoelectric sensor. The inclined section is used to adjust the mounting angle of the photoelectric sensor so that the irradiation end of the photoelectric sensor can accurately face the lower part of the hot press head (the top surface of the material handling table).

[0013] Optionally, the bracket has several parallel mounting rods, and the cushioning material supply assembly includes a frame and a material roller rotatably mounted on the frame. One end of the frame has a slot at its bottom that can be movably placed on one of the mounting rods, and the other end of the frame has a fork at its front that can be movably engaged on another mounting rod. The fork faces the direction of the hot-pressing assembly. The design of the slot and fork allows the cushioning material supply assembly to be movably connected to the mounting rods, enabling flexible assembly and disassembly of the cushioning material supply assembly and easy adjustment of its position on the mounting rods.

[0014] One of the mounting rods may also be movably fitted with a limiting body, which is movably connected to the mounting rod via screws. A receiving slot is provided in the middle of the fork portion to allow the limiting body to engage. The position of the cushioning material supply group is adjusted accordingly based on the position of the hot-pressing group, and the limiting body precisely positions the cushioning material supply group.

[0015] Optionally, the support also includes a rotatable conveyor roller assembly positioned between the cushioning material supply assembly and the traction assembly. This designed conveyor roller assembly supports and guides the cushioning material on the supply assembly along a predetermined path toward the traction assembly, ensuring the stability and accuracy of the cushioning material flow.

[0016] The traction assembly includes a traction rod rotatably mounted on a support, several front pressure rollers that can contact the traction rod and are rotatably positioned, a traction motor for driving the traction rod to rotate, and a recycling plate. The support also has an adjustment groove along its length, and the front pressure rollers are movably positioned within the adjustment groove via adjustment blocks. Buffer material flowing from the conveyor roller assembly enters between the front pressure rollers and the traction rod, i.e., the buffer material is sandwiched between the front pressure rollers and the traction rod. The position of the front pressure rollers needs to be adjusted synchronously with the buffer material supply assembly. By driving the traction rod to rotate, the traction effect on the buffer material between the front pressure rollers and the traction rod is achieved. Waste buffer material is then recycled backward via the recycling plate.

[0017] Optionally, an antistatic module is also provided on the base, with the antistatic module facing the top surface of the material handling platform. The antistatic module is used to eliminate static electricity on the buffer material during hot pressing.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows: the design of multiple hot pressing groups can realize the hot pressing process of batch chips, and the horizontal position of the hot pressing group can be adjusted according to the position of the chip delivered from the previous station to ensure that the hot pressing work of each chip can be accurately realized, thereby improving production efficiency and meeting the needs of mass production. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a chip-glass batch bonding device according to an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of the hot pressing assembly according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the relevant design of the bracket in an embodiment of this utility model;

[0022] Figure 4 This is a schematic diagram of the cushioning material supply group according to an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the traction assembly according to an embodiment of the present invention;

[0024] The following are the relevant markings in the attached diagram: 1-Base, 2-Seat, 3-Hot pressing group, 4-Placing platform, 5-Bracket, 6-Buffer material feeding group, 7-Traction group, 8-Transfer roller group, 9-Eliminating static electricity module; 21-Moving groove, 31-Cylinder module, 32-Intermediate main body module, 33-Hot pressing head, 34-Photoelectric sensor, 35-Mounting sheet metal; 51-Mounting rod, 52-Adjusting groove, 53-Limiting body; 61-Frame, 62-Material roller, 611-Groove opening, 612-Fork opening, 613-Accommodation groove; 71-Traction rod, 72-Front pressure roller, 73-Traction motor, 74-Recovery plate, 75-Adjusting block. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] This utility model provides a batch bonding device for chips and glass, which solves the technical problems mentioned in the background art. Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, specifically, a base 1 is provided with a seat 2, a hot pressing assembly 3, a material placement table 4, and a support 5. To ensure the stability and accuracy of the base during production and to prevent deformation and wear, the base can be made of marble. Multiple hot pressing assemblies 3 are arranged vertically side-by-side, and the horizontal position of each assembly on the seat 2 is adjustable, meaning each assembly can work independently. The material placement table 4 is positioned along the length of the base 1 on its surface and directly below the working ends of the hot pressing assemblies 3. Since the hot pressing process generates a certain temperature, to ensure the stability and accuracy of the material placement table and to prevent overheating that could affect its top surface level, the table can be designed with three layers: a top layer for placement, a middle layer for ceramic heat dissipation, and a bottom layer for the base. This middle ceramic heat dissipation layer improves heat conduction, preventing heat from concentrating on the top surface of the table during operation.

[0027] The support 5 is equipped with several horizontally adjustable cushioning material supply groups 6. The number and position of the cushioning material supply groups 6 correspond one-to-one with the number and position of the hot pressing group 3. The support 5 is also equipped with a traction group 7 to pull the cushioning material on the cushioning material supply group 6 out from between the hot pressing group 3 and the material placement table 4. Similarly, the number and position of the traction group 7 correspond one-to-one with the number and position of the cushioning material supply group 6. The installation height of the cushioning material supply group 6 and the traction group 7 is higher than the height of the working end of the hot pressing group 3.

[0028] In this embodiment, the hot pressing assembly 3 mainly includes a cylinder module 31, an intermediate main body module 32, and a hot pressing head 33. The hot pressing head 33 is located at the bottom of the intermediate main body module 32. The cylinder module 31 realizes the lifting and lowering action of the intermediate main body module 32, thereby realizing the contact or movement of the hot pressing head 33 with the top surface of the loading table 4, thus completing the hot pressing action on the chip and glass. The cylinder module 31 is movably mounted on the base 2. The purpose of designing the position of the hot pressing assembly to be adjustable left and right is to accurately adjust the position of the corresponding hot pressing assembly according to the position of the chip and glass delivered in the previous process, so as to accurately realize the hot pressing action on the chip and glass.

[0029] Specifically, a movable groove 21 extending along its length is provided on the base 2. The stroke end of the cylinder module 31 passes downward through the movable groove 21 and is connected to the intermediate main body module 32. The cylinder module 31 and the intermediate main body module 32 are movably mounted on the base 2 through slider and slide rail groups, respectively. Under the action of their respective slider and slide rail groups, the cylinder module 31 can achieve horizontal displacement adjustment relative to the base 2, and the intermediate main body module 32 can achieve vertical displacement adjustment relative to the base 2. The lateral movement of the cylinder module 31 can achieve horizontal position adjustment of the entire hot press group 3, while the lateral movement of the intermediate main body module 32 can achieve vertical position adjustment of the hot press head 33 on the hot press group 3.

[0030] Furthermore, a photoelectric sensor 34 is also provided on the intermediate main module 32. The photoelectric sensor 34 is positioned towards the hot pressing head 33 to detect whether there is a buffer material under the hot pressing head 33. In actual operation, a layer of buffer material is laid between the hot pressing head and the chip to avoid direct hard contact between the hot pressing head and the chip. In this way, the presence or absence of buffer material under the hot pressing head can be detected by the photoelectric sensor.

[0031] Specifically, the photoelectric sensor 34 is mounted on the intermediate main module 32 via a mounting plate 35, and the other end of the mounting plate 35 is provided with an inclined surface for mounting the photoelectric sensor 34. The inclined surface is used to adjust the mounting angle of the photoelectric sensor so that the irradiation end of the photoelectric sensor can accurately face the lower part of the hot press head (i.e., the top surface of the material handling table).

[0032] In this embodiment, the bracket 5 has several parallel mounting rods 51, which are also arranged along the length of the base 1. The cushioning material supply group 6 includes a frame 61 and a material roller 62 rotatably mounted on the frame 61. Cushioning material (usually Teflon) is wound on the material roller 62. One end of the frame 61 has a slot 611 that can be movably placed on one of the mounting rods 51, with the slot 611 facing downwards. The other end of the frame 61 has a fork 612 that can be movably engaged on another mounting rod 51, with the fork 612 facing forwards, i.e., the fork 612 is arranged towards the hot pressing group 3. In this way, the cushioning material supply group can achieve a movable connection with the two mounting rods through the design of its slot and fork, without the need for other structural components. This allows for flexible assembly and disassembly of the cushioning material supply group and easy adjustment of its position on the mounting rod.

[0033] To prevent the position of the cushioning material supply group from being arbitrarily changed, a limiting body 53 is movably provided on one of the mounting rods 51. The limiting body 53 is movably connected to the mounting rod 51 by screws, and the end of the screws can act on the outer surface of the mounting rod. That is, by turning the screws on the limiting body, the application and release of force can be controlled. The middle of the fork 612 is provided with a receiving slot 613 for the limiting body 53 to be inserted into. When it is necessary to adjust the position of the cushioning material supply group 6, the limiting body 53 is loosened by screws, and the limiting body 53 and the cushioning material supply group 6 are moved together until the cushioning material supply group 6 reaches the preset position. Then the limiting body 53 is tightened by screws. The position of the cushioning material supply group 6 is adjusted according to the position of the hot pressing group 3, and the limiting body 53 is used to accurately position the position of the cushioning material supply group 6.

[0034] In this embodiment, the support 5 also has a rotatable conveyor roller assembly 8, which is located between the cushioning material supply assembly 6 and the traction assembly 7. The designed conveyor roller assembly supports and guides the cushioning material on the cushioning material supply assembly to move along a predetermined path towards the traction assembly, ensuring the stability and accuracy of the cushioning material flow.

[0035] Based on the above scheme, the traction group 7 includes a traction rod 71 rotatably mounted on the bracket 5, several front pressure rollers 72 that can contact the traction rod 71 and are rotatably mounted, a traction motor 73 for driving the traction rod 71 to rotate, and a recycling plate 74. An adjustment groove 52 along its length is also provided on the bracket 5. The front pressure rollers 72 are movably mounted in the adjustment groove 52 by means of an adjustment block 75. That is, the adjustment block 75 is fixedly connected to the adjustment groove 52 on the bracket 5 by means of screws and nuts. When the position of the adjustment block 75 on the adjustment groove 52 is adjusted to the preset position, tightening the screws and nuts can fix the adjustment block 75. A driven gear is provided at one end of the traction rod 71, and a driving gear is provided at the output end of the traction motor 73. The driving gear and the driven gear are meshed and connected, and the rotation of the traction rod 71 is controlled by the traction motor 73. The buffer material flowing out from the conveyor roller group enters between the front pressure roller and the traction rod, that is, the buffer material is sandwiched between the front pressure roller and the traction rod. The position of the front pressure roller needs to be adjusted synchronously with the buffer material supply group. By driving the traction rod to rotate, the traction effect of the buffer material between the front pressure roller and the traction rod is achieved. The waste of the buffer material is recycled backward through the recycling plate.

[0036] In this embodiment, an antistatic module 9 is also provided on the base 1, and the antistatic module 9 is arranged facing the top surface of the material handling platform 4. The antistatic module can be, for example, a current ion bar module, to eliminate static electricity present on the buffer material during hot pressing.

[0037] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A chip-on-glass batch bonding apparatus comprising a base (1), characterized in that, The base station (1) is provided with: a seat body (2), a plurality of hot pressing groups (3) are arranged side by side on the seat body (2), and the horizontal positions of each hot pressing group (3) on the seat body (2) are adjustable; a material placing table (4) located directly below the plurality of hot pressing groups (3); a support (5) provided with a plurality of buffer material feeding groups (6) with adjustable horizontal positions, the buffer material feeding groups (6) correspond to the hot pressing groups (3) one by one, and the support (5) is further provided with a traction group (7) to pull the buffer material on the buffer material feeding group (6) out from between the hot pressing group (3) and the material placing table (4), wherein the layout height of the buffer material feeding group (6) and the traction group (7) is higher than the height of the working end of the hot pressing group (3).

2. The apparatus according to claim 1, wherein The hot pressing group (3) comprises a cylinder module (31), an intermediate body module (32), and a hot pressing head (33), the hot pressing head (33) is arranged at the bottom end of the intermediate body module (32), the intermediate body module (32) is lifted and lowered by the cylinder module (31), and the cylinder module (31) is movably arranged on the seat body (2).

3. The apparatus according to claim 2, wherein The seat body (2) is provided with a movable groove (21) along the length direction thereof, the stroke end of the cylinder module (31) is connected to the intermediate body module (32) after passing through the movable groove (21) downward, and the cylinder module (31) and the intermediate body module (32) are movably arranged on the seat body (2) through a sliding block and rail group respectively.

4. The apparatus according to claim 2, wherein The intermediate body module (32) is further provided with a photoelectric sensor (34), the photoelectric sensor (34) is arranged towards the direction of the hot pressing head (33) to detect whether there is buffer material below the hot pressing head (33).

5. The apparatus according to claim 4, wherein The photoelectric sensor (34) is arranged on the intermediate body module (32) through a mounting plate (35), and the other end of the mounting plate (35) is provided with a beveled portion for mounting the photoelectric sensor (34).

6. The apparatus according to claim 1, wherein The support (5) has a plurality of mounting rod bodies (51) arranged side by side, the buffer material feeding group (6) comprises a frame body (61) and a material roller (62) rotatably arranged in the frame body (61), one end of the frame body (61) is provided with a notch portion (611) movably arranged on one of the mounting rod bodies (51), the other end of the frame body (61) is provided with a forked portion (612) movably arranged on the other mounting rod body (51), and the forked portion (612) is arranged towards the direction of the hot pressing group (3).

7. The apparatus according to claim 6, wherein One of the mounting rod bodies (51) is further movably provided with a limiting body (53), the limiting body (53) is movably connected with the mounting rod body (51) through a screw, and the middle of the forked portion (612) is provided with a receiving notch (613) for clamping the limiting body (53).

8. The apparatus according to claim 1, wherein The support (5) further has a rotatable conveying roller group (8) between the buffer material feeding group (6) and the traction group (7).

9. The apparatus according to claim 8, wherein The traction group (7) comprises a traction rod body (71) rotatably arranged on the support (5), a plurality of front side pressing wheels (72) capable of contacting the traction rod body (71) and rotatably arranged, a traction motor (73) for driving the traction rod body (71) to rotate, and a recovery material plate (74), and the support (5) is further provided with an adjusting groove (52) along the length direction thereof, and the front side pressing wheel (72) is movably arranged in the adjusting groove (52) through an adjusting block (75).

10. The apparatus according to claim 1, wherein The base (1) is further provided with an electrostatic elimination module (9) arranged towards the top surface direction of the material placing table (4).

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