Heat exchange device, heat management system, vehicle-mounted refrigerator and vehicle

Abstract

The utility model relates to the technical field of vehicle-mounted refrigerators, and provides a heat exchange device, a heat management system, a vehicle-mounted refrigerator and a vehicle, and the heat exchange device comprises a cold storage part, a semiconductor chilling plate and cooling fins. The cold accumulation piece is provided with a refrigerant pipe, and the refrigerant pipe communicates with a refrigerating circuit of the heat management system. The two end faces of the semiconductor chilling plate in the thickness direction of the semiconductor chilling plate are a chilling face and a heat dissipation face respectively, and the heat dissipation face is connected with the cold accumulation piece. And the radiating fins are arranged on the cold accumulation piece and are in contact connection with the refrigeration surface. According to the heat exchange device, the heat management system, the vehicle-mounted refrigerator and the vehicle, the occupied space and cost of the heat exchange device can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicle-mounted refrigerators, and in particular to a heat exchange device, a thermal management system, a vehicle-mounted refrigerator and a vehicle. BACKGROUND

[0002] The vehicle-mounted refrigerator exchanges heat for the items located in the vehicle-mounted refrigerator through the heat exchange device inside the vehicle-mounted refrigerator to achieve refrigeration. In the related art, the cold storage part of the heat exchange device exchanges heat through cooperation with the fins, and the heat dissipation effect is poor. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the embodiments of the present application aim to provide a heat exchange device, a thermal management system, a vehicle-mounted refrigerator and a vehicle, which can improve the heat exchange effect of the heat exchange device.

[0004] To achieve the above-mentioned purpose, the technical scheme of the embodiments of the present application is as follows:

[0005] The embodiments of the present application disclose a heat exchange device applied to a vehicle-mounted refrigerator, which comprises:

[0006] A cold storage part, which is provided with a refrigerant pipe in communication with a refrigeration circuit of a thermal management system;

[0007] A semiconductor refrigeration sheet, which has a refrigeration surface and a heat dissipation surface at two ends along the thickness direction, and the heat dissipation surface is connected to the cold storage part;

[0008] A heat dissipation fin, which is arranged on the cold storage part and connected to the refrigeration surface.

[0009] In an embodiment, the heat exchange device comprises a deformation buffer, which is arranged between the heat dissipation surface and the cold storage part along the thickness direction.

[0010] In an embodiment, a heat-conducting gel is arranged between the deformation buffer and the heat dissipation surface, and / or a heat-conducting gel is arranged between the refrigeration surface and the heat dissipation fin.

[0011] In an embodiment, the deformation buffer is an aluminum sheet.

[0012] In an embodiment, the number of the semiconductor refrigeration sheets and the deformation buffers is multiple, the semiconductor refrigeration sheets are arranged at intervals along a first direction, each deformation buffer is arranged corresponding to one semiconductor refrigeration sheet, and the first direction intersects with the thickness direction.

[0013] In an embodiment, the heat exchange device comprises a first buffer member, the first buffer member is arranged at an end surface of the heat dissipation fin close to the cold storage member along the thickness direction, the first buffer member is formed with a mounting groove penetrating through both ends thereof along the thickness direction, and the semiconductor refrigeration piece is arranged in the mounting groove.

[0014] In an embodiment, the heat exchange device comprises a second buffer member, the second buffer member is formed with a protection groove, and the heat dissipation fin is arranged in the protection groove away from the first buffer member along the thickness direction.

[0015] In an embodiment, the first buffer member and / or the second buffer member is made of foam.

[0016] In an embodiment, the heat dissipation fin and the cold storage member are detachably connected.

[0017] In an embodiment, the heat exchange device comprises a fastener, one of the heat dissipation fin and the cold storage member is formed with a mounting hole, the other of the heat dissipation fin and the cold storage member is formed with a stud, and the fastener is arranged in the stud through the mounting hole.

[0018] In an embodiment, the heat exchange device comprises a housing, the housing is formed with a receiving groove and a mounting opening, an air inlet and an air outlet in communication with the receiving groove, the semiconductor refrigeration piece and the heat dissipation fin are arranged in the receiving groove, and the cold storage member is arranged on the mounting opening.

[0019] In an embodiment, the heat exchange device comprises an auxiliary fin, the auxiliary fin is arranged on the cold storage member, the auxiliary fin is arranged corresponding to the air inlet, and the heat dissipation fin is arranged corresponding to the air outlet.

[0020] In another aspect, the embodiments of the present application disclose a heat management system comprising the heat exchange device in any of the above embodiments.

[0021] In still another aspect, the embodiments of the present application disclose a vehicle-mounted refrigerator comprising the heat management system in the above embodiments.

[0022] In yet another aspect, the embodiments of the present application disclose a vehicle comprising the vehicle-mounted refrigerator in the above embodiments.

[0023] The embodiment of the present application discloses a heat exchange device, a thermal management system, a vehicle-mounted refrigerator and a vehicle. The heat exchange device uses the refrigerant of the refrigeration circuit of the thermal management system, so that an independent compressor is not needed. Therefore, the occupied space and manufacturing cost of the heat exchange device can be reduced. The semiconductor refrigerating sheet and the heat dissipation fin are arranged, and the heat dissipation surface of the semiconductor refrigerating sheet is connected with the cold storage part, and the refrigeration surface is connected with the heat dissipation fin. In this way, the cold energy of the cold storage part can be conducted to the semiconductor refrigerating sheet, and then the heat exchange is performed between the heat dissipation fin and the air flow to be exchanged. On the one hand, based on the characteristics of the semiconductor refrigerating sheet, the refrigeration surface of the semiconductor refrigerating sheet can obtain a lower temperature than the cold storage part, so that the heat exchange rate and the heat exchange effect are improved. On the other hand, the heat dissipation fin is arranged on the refrigeration surface, so that the heat exchange area between the heat dissipation fin and the air flow to be exchanged is increased, and the heat exchange effect is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 An explosion schematic diagram of a vehicle-mounted refrigerator provided by the embodiment of the present application is provided.

[0025] Figure 2 A system principle diagram of a thermal management system provided by another embodiment of the present application is provided.

[0026] Figure 3 A partial explosion schematic diagram of a heat exchange device provided by still another embodiment of the present application is provided.

[0027] BRIEF DESCRIPTION OF DRAWINGS

[0028] 1000, vehicle-mounted refrigerator; 100, thermal management system; 10, heat exchange device; 1, cold storage part; 1a, refrigerant pipe; 1a1, refrigerant outlet pipe; 1a2, refrigerant inlet pipe; 11, cold storage shell; 11a, wiring hole; 12, evaporator; 13, metal plate; 13a, stud; 14, shell; 14a, mounting port; 14b, air inlet; 14c, air outlet; 14d, accommodating groove; 2, semiconductor refrigerating sheet; 3, heat dissipation fin; 3a, mounting lug; 3b, mounting hole; 4, fan; 5, auxiliary fin; 7, deformation buffer; 8, first buffer; 8a, mounting groove; 9, second buffer; 9a, protection groove; 91, transition part; 92, connecting part; 101, fastener; 20, compressor; 30, refrigeration circuit; 40, air conditioner evaporator; 50, air conditioner expansion valve; 60, refrigerator expansion valve; 70, pressure regulating valve; 80, condenser; 200, shell; 200a, air inlet; 200b, air outlet; 300, storage shell; 400, first heat preservation shell; 500, second heat preservation shell; 501, heat preservation inner shell; 502, heat preservation outer shell. DETAILED DESCRIPTION

[0029] It should be noted that the embodiments and technical features in the present application can be combined with each other without conflict, and the detailed description in the specific implementation should be understood as the explanation and illustration of the purpose of the present application, and should not be regarded as improper limitation of the present application.

[0030] The present application will be further described in detail below in combination with the drawings and specific embodiments. The "first", "second" and the like in the embodiments of the present application are only for the purpose of description, and should not be understood as indicating or implying relative importance or implicitly including at least one feature. In the description of the embodiments of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0031] In order to better understand the heat exchange device 10 provided by the present application, the heat management system 100 is first described.

[0032] The heat management system 100 provided by the present application comprises the heat exchange device 10 in any one of the following embodiments.

[0033] For example, please refer to Figure 2 The heat management system 100 can further comprise a compressor 20, a condenser 80, a refrigeration circuit 30, an air conditioner evaporator 40 and an air conditioner expansion valve 50. The compressor 20, the condenser 80, the air conditioner evaporator 40 and the air conditioner expansion valve 50 can be arranged on the refrigeration circuit 30. The compressor 20 can compress the gaseous refrigerant into high-temperature and high-pressure gaseous refrigerant and flow to the condenser 80 through the refrigeration circuit 30. In the condenser 80, the high-temperature and high-pressure gaseous refrigerant is liquefied into high-temperature and high-pressure liquid refrigerant, and then flows to the air conditioner expansion valve 50. The air conditioner expansion valve 50 can throttle the liquid refrigerant into low-temperature and low-pressure gaseous-liquid mixed state refrigerant, and finally flows to the air conditioner evaporator 40. The air conditioner evaporator 40 can vaporize the low-temperature and low-pressure mixed state refrigerant into low-temperature and low-pressure gaseous refrigerant by absorbing the temperature in the vehicle, so as to realize the refrigeration in the vehicle. The low-temperature and low-pressure gaseous refrigerant can flow back to the compressor 20 through the refrigeration circuit 30 for compression, and the cycle is repeated.

[0034] The heat exchange device 10 provided by the present application comprises the heat exchange device 10 in any one of the following embodiments. Figures 1 to 3 The heat exchange device 10 comprises a cold storage member 1, a semiconductor refrigeration sheet 2 and a heat dissipation fin 3. The cold storage member 1 is provided with a refrigerant pipe 1a, and the refrigerant pipe 1a is in communication with the refrigeration circuit 30 of the heat management system 100. The semiconductor refrigeration sheet 2 has a refrigeration surface and a heat dissipation surface respectively on the two end surfaces along the thickness direction thereof, and the heat dissipation surface is connected with the cold storage member 1. The heat dissipation fin 3 is arranged on the cold storage member 1 and connected with the refrigeration surface.

[0035] The heat exchange device 10 provided by the application, by connecting the refrigerant pipe 1a of the cold storage element 1 with the refrigeration circuit 30 of the thermal management system 100, so that the refrigerant can enter the cold storage element 1 through the refrigerant pipe 1a to carry out refrigeration, cold storage and cold release, that is, the heat exchange device 10 provided by the application utilizes the refrigerant of the refrigeration circuit 30 of the thermal management system 100, so that it is not necessary to set an independent compressor 20, so that the occupied space and manufacturing cost of the heat exchange device 10 can be reduced.

[0036] By setting the semiconductor refrigeration sheet 2 and the heat dissipation fin 3, and connecting the heat dissipation surface of the semiconductor refrigeration sheet 2 with the cold storage element 1, and connecting the refrigeration surface with the heat dissipation fin 3, so that the cold energy of the cold storage element 1 can be conducted to the semiconductor refrigeration sheet 2, and then exchanged with the air flow to be exchanged through the heat dissipation fin 3, on the one hand, based on the characteristics of the semiconductor refrigeration sheet 2, the refrigeration surface of the semiconductor refrigeration sheet 2 can obtain a lower temperature than the cold storage element 1, so as to improve the heat exchange rate and heat exchange effect; on the other hand, by setting the heat dissipation fin 3 on the refrigeration surface, the heat exchange area between the heat dissipation fin 3 and the air flow to be exchanged can be increased, so as to further improve the heat exchange effect.

[0037] The thermal management system 100 provided by the application also has the characteristics of small occupied space, good heat dissipation effect and low manufacturing cost based on the advantages of the heat exchange device 10.

[0038] Exemplarily, in an embodiment, Figure 3 R1 can be the thickness direction, R2 can be the length direction, and R3 can be the width direction.

[0039] Exemplarily, in an embodiment, please refer to Figure 1 and Figure 2 The refrigerant pipe 1a includes a refrigerant inlet pipe 1a2 and a refrigerant outlet pipe 1a1, the refrigerant inlet pipe 1a2 can be connected to the pipeline of the refrigeration circuit 30 between the condenser 80 and the air conditioner evaporator 40, and the refrigerant outlet pipe 1a1 is arranged on the pipeline of the refrigeration circuit 30 between the compressor 20 and the air conditioner evaporator 40, that is, the heat exchange device 10 is connected in parallel to the refrigeration circuit 30 of the thermal management system 100.

[0040] Exemplarily, in an embodiment, please refer to Figure 2The heat management system 100 comprises a refrigerator expansion valve 60, which can be arranged on the refrigerant inlet pipe 1a2. The refrigerator expansion valve 60 can throttle the liquid refrigerant into low-pressure and low-temperature gas-liquid mixed state refrigerant. The cold storage element 1 can vaporize the mixed state refrigerant into low-pressure and low-temperature gaseous refrigerant, which finally enters the compressor 20 through the refrigerant outlet pipe 1a1. In this way, the cold storage element 1 can realize heat exchange with the heat exchange flow through the refrigerator expansion valve 60, so that the temperature of the refrigeration circuit 30 of the heat management system 100 and the temperature of the vehicle refrigerator 1000 can be independently adjusted. On the one hand, the problem that the displacement of the compressor 20 is large and the refrigeration load of the heat exchange device 10 is small, which cannot realize performance matching, can be effectively solved. On the other hand, the frequent start of the compressor 20 can be reduced, and the service life of the compressor 20 can be improved. On the other hand, the problem of power consumption of non-refrigeration demand when the vehicle refrigerator 1000 is started and the vehicle DCDC circuit is started can be effectively solved, and the endurance of the vehicle can be improved.

[0041] For example, in an embodiment, referring to Figure 2 The refrigeration circuit 30 is provided with a pressure regulating valve 70 on the pipeline between the air conditioner evaporator 40 and the compressor 20, which is used for regulating the low pressure of the refrigeration circuit 30.

[0042] For example, in an embodiment, referring to Figures 1 to 3 The cold storage element 1 comprises a cold storage shell 11, a phase change material, an evaporator 12 and a metal plate 13. The cold storage shell 11 is formed with a cold storage pool, a through port and a wiring hole 11a in communication with the cold storage pool. The phase change material is filled in the cold storage pool. The evaporator 12 is arranged in the cold storage pool. The evaporator 12 is provided with a refrigerant pipe 1a, which passes out of the cold storage pool through the wiring hole 11a and communicates with the refrigeration circuit 30 of the heat management system 100. The metal plate 13 is arranged on the through port, and the heat dissipation surface is connected with the end surface of the metal plate 13 away from the cold storage shell 11 in the thickness direction.

[0043] Exemplarily, the phase change material can be water. The through hole and the wiring hole can be respectively located at two opposite ends of the cold storage shell 11 along the thickness direction, one end of the refrigerant inlet pipe 1a2 and one end of the refrigerant outlet pipe 1a1 can pass through the wiring hole 11a to communicate with the refrigeration circuit 30 of the thermal management system 100, and the other end of the refrigerant inlet pipe 1a2 and the other end of the refrigerant outlet pipe 1a1 can respectively communicate with the inlet and outlet of the evaporator 12, so that the low-pressure low-temperature gas-liquid mixed state refrigerant in the refrigeration circuit 30 of the thermal management system 100 can enter the evaporator 12 through the refrigerant inlet pipe 1a2, the evaporator 12 can absorb the temperature of the cold storage pool to vaporize the mixed state refrigerant into low-pressure low-temperature gaseous refrigerant, thereby realizing refrigeration, and the gaseous refrigerant can flow back to the refrigeration circuit 30 of the thermal management system 100 through the refrigerant outlet pipe 1a1, and finally flow back to the compressor 20, and circulate back and forth, while the phase change material in the cold storage pool can store a certain amount of cold energy, which can be conducted to the heat dissipation surface through the metal plate 13 to exchange heat with the airflow in the containing cavity.

[0044] Here, by setting the evaporator 12, the phase change material, the metal plate 13 and the cold storage shell 11, the evaporator 12 can perform refrigeration, the cold storage shell 11 can insulate the cold storage pool to some extent to reduce the loss of cold energy, and the phase change material can store a certain amount of cold energy for subsequent cold release, and the metal plate 13 can conduct cold energy, so that the use of cold storage technology can meet the needs of high-power cold storage and low-power cold release of the compressor 20.

[0045] In an embodiment, referring to Figure 1 , the heat exchange device 10 includes a shell 14, the shell 14 is formed with a containing groove 14d and a mounting hole 14a, an air inlet 14b and an air outlet 14c communicating with the containing groove 14d, the semiconductor refrigeration piece 2 and the heat dissipation fin 3 are arranged in the containing groove 14d, and the cold storage piece 1 is covered on the mounting hole 14a.

[0046] Exemplarily, the air inlet 14b and the air outlet 14c can be arranged at two sides of the shell 14 along the width direction of the heat dissipation fin 3, the opening direction of the air inlet 14b and the air outlet 14c can be perpendicular to the opening direction of the mounting hole 14a, the air inlet 14b and the air outlet 14c both communicate with the containing groove 14d, and the metal plate 13 can be covered on the mounting hole 14a to facilitate heat exchange with the airflow in the containing groove 14d.

[0047] Here, the airflow to be heat exchanged can enter the containing groove 14d through the air inlet 14b to exchange heat with the heat dissipation fin 3, and then flow out from the air outlet 14c, and the shell 14 not only can insulate to some extent to reduce heat loss, but also can protect the semiconductor refrigeration piece 2 and the heat dissipation fin 3 located in the containing groove 14d from collision and scratching.

[0048] Exemplarily, in an embodiment, please refer to Figure 1 and Figure 2 The heat exchange device 10 comprises a fan 4, which can be arranged at the air outlet 14c to accelerate the driving of the air flow to be exchanged from the air inlet 14b to the air outlet 14c.

[0049] Exemplarily, in an embodiment, the fan 4 can be an axial fan. In this way, the high-flow output of the air flow can be improved, and the forced convection heat exchange and the refrigeration rate can be accelerated.

[0050] In an embodiment, please refer to Figure 3 The heat exchange device 10 comprises auxiliary fins 5 arranged on the cold storage member 1, and the auxiliary fins 5 are arranged corresponding to the air inlet 14b, and the heat dissipation fins 3 are arranged corresponding to the air outlet 14c.

[0051] Exemplarily, the auxiliary fins 5 can be fixedly arranged on the metal plate 13 by welding.

[0052] In this way, by arranging the auxiliary fins 5 corresponding to the air inlet 14b and arranging the heat dissipation fins 3 corresponding to the air outlet 14c, the air flow to be exchanged from the air inlet 14b first exchanges heat with the auxiliary fins 5, and then exchanges heat with the heat dissipation fins 3, and finally is discharged from the air outlet 14c, so as to prolong the flow path of the air flow to be exchanged and improve the heat exchange effect.

[0053] Exemplarily, in an embodiment, the heat exchange device 10 comprises a temperature sensor for monitoring the outlet air temperature of the air outlet 14c.

[0054] In the related art, the semiconductor refrigeration sheet is arranged with an upper cover and a lower cover, and the upper cover and the lower cover are made of ceramic material. When the temperature changes, the upper cover and the lower cover will deform to cause the semiconductor refrigeration sheet to break and fail.

[0055] In an embodiment, please refer to Figure 3 The heat exchange device 10 comprises a deformation buffer 7 arranged between the heat dissipation surface and the cold storage member 1 along the thickness direction.

[0056] It should be noted that the thermal expansion coefficient of the semiconductor refrigeration sheet 2 and the expansion coefficient of the cold storage member 1 have differences. When the temperature changes, the difference causes the volume changes of the semiconductor refrigeration sheet 2 and the cold storage member 1 to be inconsistent.

[0057] In this way, by arranging the deformation buffer 7 between the heat dissipation surface and the cold storage part 1, on the one hand, the semiconductor refrigeration sheet 2 is effectively clamped by the deformation buffer 7 and the heat dissipation fin 3, which can reduce the occurrence of fracture; on the other hand, when the temperature changes, the deformation buffer 7 can play a certain buffering effect, absorbing and dispersing the stress generated by thermal expansion and cold contraction, so as to effectively reduce the damage of the semiconductor refrigeration sheet 2 caused by the deformation of the cold storage part 1, and improve the service life of the semiconductor refrigeration sheet 2.

[0058] In an embodiment, the deformation buffer 7 is an aluminum sheet.

[0059] Here, the aluminum sheet is used as the deformation buffer 7, on the one hand, the aluminum sheet has high thermal conductivity and can quickly conduct heat; on the other hand, the aluminum sheet has a certain flexibility and elasticity, which can absorb and disperse the stress generated by the thermal expansion and cold contraction of the cold storage part 1 through its own deformation, so as to reduce the damage to the semiconductor refrigeration sheet 2.

[0060] In an embodiment, the heat-conducting gel is arranged between the deformation buffer 7 and the heat dissipation surface and / or the heat-conducting gel is arranged between the refrigeration surface and the heat dissipation fin 3.

[0061] For example, the heat-conducting gel can be arranged between the deformation buffer 7 and the heat dissipation surface; the heat-conducting gel can be arranged between the refrigeration surface and the heat dissipation fin 3; or the heat-conducting gel can be arranged between the deformation buffer 7 and the heat dissipation surface and between the refrigeration surface and the heat dissipation fin 3.

[0062] In this way, by arranging the heat-conducting gel between the deformation buffer 7 and the heat dissipation surface and / or arranging the heat-conducting gel between the refrigeration surface and the heat dissipation fin 3, not only can the connection strength between the deformation buffer 7 and the heat dissipation surface and / or the connection strength between the refrigeration surface and the heat dissipation fin 3 be improved, but also the thermal resistance between the deformation buffer 7 and the heat dissipation surface and / or the thermal resistance between the refrigeration surface and the heat dissipation fin 3 can be reduced, and the heat conduction performance can be improved.

[0063] In an embodiment, please refer to Figure 3 , the number of semiconductor refrigeration sheets 2 and deformation buffers 7 is multiple, the multiple semiconductor refrigeration sheets 2 are arranged in the first direction, and each deformation buffer 7 is arranged corresponding to one semiconductor refrigeration sheet 2, wherein the first direction intersects the thickness direction.

[0064] For example, the first direction can be the length direction of the heat dissipation fin 3, and the number of semiconductor refrigeration sheets 2 and deformation buffers 7 can be two, the two semiconductor refrigeration sheets 2 are arranged in the first direction, the heat dissipation surface of each semiconductor refrigeration sheet 2 is connected with one deformation buffer 7, and the refrigeration surface of each semiconductor refrigeration sheet 2 is connected to the heat dissipation fin 3.

[0065] Here, by arranging the plurality of semiconductor refrigeration pieces 2 and the deformation buffer 7 along the first direction, the refrigeration effect of the heat exchange device 10 along the first direction can be enhanced, so as to improve the heat exchange effect with the airflow to be exchanged.

[0066] In an embodiment, referring to Figure 3 , the heat exchange device 10 comprises a first buffer 8, the first buffer 8 is arranged at the end surface of the heat dissipation fin 3 close to the cold storage piece 1 along the thickness direction, the first buffer 8 is formed with a mounting groove 8a penetrating through both ends thereof along the thickness direction, and the semiconductor refrigeration piece 2 is arranged in the mounting groove 8a.

[0067] For example, the first buffer 8 can be formed with two mounting grooves 8a arranged at intervals along the first direction, and two semiconductor refrigeration pieces 2 are arranged in one mounting groove 8a respectively.

[0068] In this way, by forming the first buffer 8 with the mounting groove 8a, on the one hand, the first buffer 8 can play a certain buffering role between the heat dissipation fin 3 and the cold storage piece 1, so as to reduce the collision and scratching between the two; on the other hand, the arrangement of the mounting groove 8a can effectively block the condensed water and reduce the failure of the semiconductor refrigeration piece 2, thereby improving the working stability of the semiconductor refrigeration piece 2.

[0069] In an embodiment, referring to Figure 3 , the heat exchange device 10 comprises a second buffer 9, the second buffer 9 is formed with a protection groove 9a, and the heat dissipation fin 3 is arranged in the protection groove 9a away from the first buffer 8 along the thickness direction.

[0070] For example, the second buffer 9 can comprise two connecting portions 92 and a transition portion 91, the transition portion 91 can extend along the first direction, one end of the two connecting portions 92 is arranged at the opposite ends of the transition portion 91 along the first direction, and the other end of the two connecting portions 92 extends along the thickness direction to define the protection groove 9a, and the protection groove 9a is substantially in the shape of “N”.

[0071] In this way, by arranging the second buffer 9 away from the first buffer 8 along the thickness direction of the heat dissipation fin 3, the heat dissipation fin 3 can be buffered and protected to a certain extent, and the arrangement of the protection groove 9a can reduce the air leakage.

[0072] In an embodiment, the material of the first buffer 8 and / or the material of the second buffer 9 is foam.

[0073] For example, the material of the first buffer 8 can be foam, or the material of the second buffer 9 can be foam, or the material of the first buffer 8 and the material of the second buffer 9 are both foam.

[0074] In this way, the first buffer 8 and / or the second buffer 9 is made of foam material, which not only improves the heat preservation effect, but also isolates the condensed water to some extent, reducing the possibility of the semiconductor refrigeration sheet 2 being invalidated by the condensed water.

[0075] In an embodiment, the heat dissipation fin 3 is detachably connected with the cold storage element 1.

[0076] Here, the detachable connection facilitates the replacement and maintenance of the heat dissipation fin 3 and the cold storage element 1.

[0077] In an embodiment, referring to Figure 3 , the heat exchange device 10 includes fasteners 101, one of the heat dissipation fin 3 and the cold storage element 1 is formed with mounting holes 3b, and the other of the heat dissipation fin 3 and the cold storage element 1 is formed with threaded studs 13a, and the fasteners 101 are arranged in the threaded studs 13a through the mounting holes 3b.

[0078] For example, the heat dissipation fin 3 is formed with mounting ears 3a, the mounting ears 3a can be formed with mounting holes 3b, the metal plate 13 can be formed with threaded studs 13a, and the fasteners 101 can be bolts that are screwed with the threaded studs 13a through the mounting holes 3b.

[0079] Here, the fasteners 101 arranged in the threaded studs 13a through the mounting holes 3b not only improves the connection strength between the heat dissipation fin 3 and the cold storage element 1, effectively clamping the semiconductor refrigeration sheet 2 and reducing the possibility of falling, but also facilitates the disassembly and assembly by the fasteners 101 screwed with the threaded studs 13a through the mounting holes 3b.

[0080] For example, in an embodiment, referring to Figure 3 , the number of fasteners 101, mounting holes 3b and threaded studs 13a can be two, for example, the heat dissipation fin 3 is formed with mounting ears 3a at both ends along the first direction, each mounting ear 3a is formed with a mounting hole 3b, and two threaded studs 13a are arranged on the metal plate 13 along the first direction, and each fastener 101 is arranged in the corresponding threaded stud 13a through the corresponding mounting hole 3b, to further improve the connection strength between the cold storage element 1 and the heat dissipation fin 3.

[0081] In another aspect, the application provides a vehicle-mounted refrigerator 1000, which includes the heat management system 100 of any of the above embodiments.

[0082] For example, referring to Figure 1The vehicle-mounted refrigerator 1000 comprises a shell 200 and a storage shell 300. The shell 200 is formed with a storage cavity and a communication port communicating with the storage cavity. The storage shell 300 is movably arranged in the storage cavity to define a circulating air duct, an air inlet 200a and an air outlet 200b. The air inlet 200a and the air outlet 200b both communicate with the circulating air duct. The shell 14 of the heat exchange device 10 covers the communication port, so that the air inlet 14b communicates with the air outlet 200b and the air outlet 14c communicates with the air inlet 200a. Under the driving of the fan 4, the airflow after heat exchange with the heat dissipation fins 3 and the auxiliary fins 5 can enter the circulating air duct through the air outlet 14c and the air inlet 200a to heat exchange with the storage shell 300 and the articles in the storage shell 300. Then, the airflow can enter the containing groove 14d through the air outlet 200b and the air inlet 14b to heat exchange with the heat dissipation fins 3 and the auxiliary fins 5 again, and the circulation is repeated.

[0083] The vehicle-mounted refrigerator 1000 provided by the application has the advantages of the heat management system 100, and has the characteristics of low manufacturing cost and large effective storage space.

[0084] For example, in an embodiment, referring to Figure 1 The vehicle-mounted refrigerator 1000 comprises a first heat preservation shell 400 and a second heat preservation shell 500. The first heat preservation shell 400 is formed with an assembly port communicating with the internal space of the first heat preservation shell 400. The shell 200 is arranged in the first heat preservation shell 400. The second heat preservation shell 500 comprises a heat preservation inner shell 501 and a heat preservation outer shell 502. The heat exchange device 10 can be arranged in the heat preservation inner shell 501. The heat preservation inner shell 501 can be arranged in the heat preservation outer shell 502. The heat preservation outer shell 502 covers the assembly port.

[0085] Here, by arranging the first heat preservation shell 400 and the second heat preservation shell 500, on the one hand, the shell 200 and the heat exchange device 10 can be protected to some extent, and the damage caused by physical collision, scratching and the like of the shell 200 and the heat exchange device 10 in installation or transportation can be reduced, and the service life of the shell 200 and the heat exchange device 10 can be prolonged. On the other hand, the first heat preservation shell 400 and the second heat preservation shell 500 can reduce the heat exchange between the heat exchange device 10, the shell 200 and the outside, and reduce the large fluctuation of temperature.

[0086] In another aspect, the application provides a vehicle comprising the vehicle-mounted refrigerator 1000 in any of the above embodiments.

[0087] For example, the vehicle-mounted refrigerator 1000 can be arranged in the passenger compartment, the front trunk or the rear trunk of the vehicle.

[0088] The vehicle provided by the application has the advantages of the vehicle-mounted refrigerator 1000, and has the characteristics of large effective space, low part cost, reduced heat damage to the passenger compartment of the vehicle and NVH problem, and improved comfort.

[0089] For example, the vehicle can be a fuel vehicle, a hybrid vehicle, a range-extended vehicle, or an electric vehicle, etc.

[0090] For example, in an embodiment, when the vehicle refrigerator 1000 needs to be quickly cooled when starting, the front compartment compressor 20 can be started to store cold in the cold storage element 1, and the semiconductor refrigeration fin 2 and the fan 4 can be started at the same time. At this time, the surface temperature of the heat dissipation fin 3 on the semiconductor refrigeration fin 2 is rapidly reduced, and a large amount of cold can be provided to the storage shell 300 within a few seconds through the heat dissipation fin 3. Compared with the vehicle refrigerator without a semiconductor refrigeration fin in the prior art, the total refrigeration time of the vehicle refrigerator 1000 can be shortened by at least 3 minutes. The temperature in the storage shell 300 can be controlled by adjusting the electric power of the semiconductor refrigeration fin 2. Since the cooperation of the semiconductor refrigeration fin 2 and the cold storage element 1 can achieve the freezing function more quickly, the evaporating pressure of the front compartment compressor 20 does not need to reach 1.2 Bar (-18℃), which can cause the compressor 20 to have difficulty in suction and reduce the system COP.

[0091] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application is included in the protection scope of the present application.

Claims

1. A heat exchange device for use in a vehicle refrigerator, characterized in that, The heat exchange device includes: A cold storage device, wherein the cold storage device is provided with a refrigerant pipe, and the refrigerant pipe is connected to the refrigeration circuit of the thermal management system; A semiconductor refrigeration chip, wherein the two end faces of the semiconductor refrigeration chip along its thickness direction are a cooling surface and a heat dissipation surface, respectively, and the heat dissipation surface is connected to the cold storage element; Heat dissipation fins are disposed on the cold storage component and are in contact with and connected to the cooling surface.

2. The heat exchange device according to claim 1, characterized in that, The heat exchange device includes a deformation buffer, which is disposed between the heat dissipation surface and the cold storage component along the thickness direction.

3. The heat exchange device according to claim 2, characterized in that, A thermally conductive gel is provided between the deformation buffer and the heat dissipation surface, and / or a thermally conductive gel is provided between the cooling surface and the heat dissipation fins.

4. The heat exchange device according to claim 2, characterized in that, The deformation buffer is an aluminum sheet.

5. The heat exchange device according to claim 2, characterized in that, The number of semiconductor cooling chips and deformation buffers are both multiple, and the multiple semiconductor cooling chips are spaced apart along a first direction. Each deformation buffer is corresponding to one semiconductor cooling chip, wherein the first direction intersects the thickness direction.

6. The heat exchange device according to any one of claims 1-5, characterized in that, The heat exchange device includes a first buffer member, which is disposed on the end face of the heat dissipation fins near the cold storage member along the thickness direction. The first buffer member has a mounting groove extending through both ends along the thickness direction, and the semiconductor cooling chip is disposed in the mounting groove.

7. The heat exchange device according to claim 6, characterized in that, The heat exchange device includes a second buffer member, which has a protective groove. The heat dissipation fins are disposed in the protective groove on the side away from the first buffer member along the thickness direction.

8. The heat exchange device according to claim 7, characterized in that, The material of the first buffer and / or the material of the second buffer is foam.

9. The heat exchange device according to any one of claims 1-5, characterized in that, The heat dissipation fins are detachably connected to the cold storage component.

10. The heat exchange device according to claim 9, characterized in that, The heat exchange device includes a fastener, one of the heat dissipation fins and the cold storage element has a mounting hole, and the other of the heat dissipation fins and the cold storage element has a stud, and the fastener passes through the mounting hole and is disposed in the stud.

11. The heat exchange device according to any one of claims 1-5, characterized in that, The heat exchange device includes a housing, which has a receiving groove and an installation port, an air inlet and an air outlet communicating with the receiving groove. The semiconductor cooling chip and the heat dissipation fins are both disposed in the receiving groove, and the cold storage component is covered by the installation port.

12. The heat exchange device according to claim 11, characterized in that, The heat exchange device includes auxiliary fins, which are disposed on the cold storage element. The auxiliary fins are disposed corresponding to the air inlet, and the heat dissipation fins are disposed corresponding to the air outlet.

13. A thermal management system, characterized in that, Includes the heat exchange device according to any one of claims 1-12.

14. A vehicle-mounted refrigerator, characterized in that, Includes the thermal management system as described in claim 13.

15. A vehicle, characterized in that, Including the vehicle refrigerator as described in claim 14.

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