Aging test fixture and aging test equipment

Abstract

The utility model provides an aging test fixture and aging test equipment, and relates to the technical field of chip testing. The aging test clamp comprises a lower clamp assembly, an upper clamp assembly and a pressure adjusting device, the pressure adjusting device comprises a plurality of adjustable pressure heads used for abutting against the tested chip, the adjustable pressure heads are arranged in one-to-one correspondence with the mounting grooves, and the adjustable pressure heads are arranged to be capable of moving up and down relative to the mounting grooves. When the upper clamp assembly is matched with the lower clamp assembly, the adjustable pressure head of the pressure adjusting device enables the tested chip to be tightly attached to the groove bottom of the mounting groove, and the test probe can be in contact with the corresponding tested chip. According to the technical scheme, pressure can be applied to the tested chip by additionally arranging the pressure adjusting device, so that the tested chip is in full contact with the lower bottom plate, the heat consumption of the tested chip can be completely transmitted out through the lower bottom plate, and the situations that the junction temperature of the tested chip is unstable and the uniformity of repeated testing is poor are avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip test technical field, in particular to a kind of aging test fixture and aging test equipment. BACKGROUND

[0002] COS / COC chip aging test is to make the working performance of COS / COC chip in a stable state, and COS / COC chip needs to be pre-operated at high temperature and large current to promote its aging to the relatively stable region in performance curve.

[0003] The current COS / COC chip aging test method is to fix COS / COC chip on fishbone clamp using bent elastic sheet, place fishbone clamp on heat sink for temperature control, use probe to contact PAD on COS / COC chip and PAD on clamp PCB to transfer current voltage or signal, so as to realize COS / COC chip aging test.

[0004] In the current COS / COC chip test scheme, when large current / high power consumption test is performed, the heat consumption of COS / COC chip itself cannot be completely transmitted through the contact between COS / COC chip and bottom plate, and COS / COC chip junction temperature exceeds preset value during aging test, and COS / COC chip junction temperature is unstable, and repeated test uniformity is poor, and even part of COS / COC chip will be damaged due to high temperature. UTILITY MODEL CONTENTS

[0005] An object of the utility model is to provide an aging test fixture to solve the technical problem of unstable measured chip junction temperature and poor repeated test uniformity in the prior art.

[0006] Another object of the utility model is to avoid deformation of lower bottom plate.

[0007] Another object of the utility model is to provide an aging test equipment with the above-mentioned aging test fixture.

[0008] In particular, the utility model further provides an aging test fixture, which comprises:

[0009] The lower clamp assembly comprises a lower bottom plate and a plurality of abutting elastic sheets; the lower bottom plate is provided with a plurality of mounting grooves for placing measured chips; the abutting elastic sheets are provided one by one corresponding to the mounting grooves, and are elastically deformed under external pressure, so as to push the measured chips to abut against the side wall of the mounting groove.

[0010] The upper clamp assembly comprises a plurality of test probes for contacting the measured chips.

[0011] A pressure adjusting device is connected with the upper clamp assembly, and comprises a plurality of adjustable pressure heads for abutting against the measured chips, the adjustable pressure heads being arranged one-to-one with the mounting grooves; the adjustable pressure heads are arranged to be able to move up and down relative to the mounting grooves.

[0012] In the cooperating state of the upper clamp assembly and the lower clamp assembly, the adjustable pressure heads of the pressure adjusting device can make the measured chips tightly adhere to the groove bottoms of the mounting grooves, and the test probes can contact the corresponding measured chips.

[0013] Optionally, the pressure adjusting device further comprises a plurality of lower pressing members and a plurality of elastic members; the plurality of adjustable pressure heads, the plurality of lower pressing members and the plurality of elastic members are one-to-one matched.

[0014] Each of the elastic members is arranged vertically, and one end of each of the elastic members is connected with the lower pressing member, and the other end of each of the elastic members is connected with the adjustable pressure head; the lower pressing member is connected with the upper clamp assembly.

[0015] Optionally, the upper clamp assembly comprises:

[0016] a PCB board;

[0017] a probe board located on one side of the PCB board and having a plurality of probe groups, each of the probe groups comprising at least one test probe, one end of each of the test probes being in contact with the measured chip, and the other end of each of the test probes being in contact with the PCB board;

[0018] an upper clamp plate located on the side of the PCB board away from the probe board and connected with the PCB board.

[0019] Optionally, the pressure adjusting device further comprises a guide block mounted on the upper clamp assembly, the guide block being provided with at least one guide structure, and the adjustable pressure head being capable of being arranged in the corresponding guide structure to guide the movement of the adjustable pressure head.

[0020] Optionally, the lower bottom plate is provided with a plurality of first mounting holes, and the lower clamp assembly further comprises:

[0021] an elastic sheet plate provided with a plurality of second mounting holes, the plurality of second mounting holes being uniformly arranged at positions close to the opposite sides of the elastic sheet plate, each of the first mounting holes being connected with one of the second mounting holes in a corresponding manner, and the elastic sheet plate having a plurality of outwardly extending abutting elastic sheets, the plurality of abutting elastic sheets being arranged to be elastically deformed when the elastic sheet plate is mounted on the lower bottom plate.

[0022] Optionally, the plurality of abutting spring sheets are divided into two groups of spring sheet groups, each of the groups of spring sheet groups comprising a plurality of the abutting spring sheets arranged at intervals along the extension length direction of the spring sheet plate, and the spring sheet plate is arranged with one of the groups of spring sheet groups on each of the opposite sides.

[0023] Optionally, the plurality of second mounting holes are divided into at least two groups of second mounting hole groups, and the at least two groups of second mounting hole groups are arranged at positions close to the two groups of spring sheet groups, each of the groups of second mounting hole groups comprising a plurality of the second mounting holes arranged at intervals along the length direction of the spring sheet plate.

[0024] Optionally, the lower clamp assembly further comprises:

[0025] A lower clamp plate is installed on the top of the spring sheet plate for applying pressure to the spring sheet plate.

[0026] Optionally, the upper clamp assembly further comprises:

[0027] A temperature measuring component is installed on the upper clamp assembly, and a temperature measuring head of the temperature measuring component is arranged to penetrate the lower clamp plate and the spring sheet plate when the upper clamp assembly is installed on the lower clamp assembly to contact the lower bottom plate, so as to measure the temperature of the lower bottom plate.

[0028] In particular, the utility model also provides an aging test equipment, including the above-mentioned aging test fixture.

[0029] The aging test fixture in the utility model comprises a lower clamp assembly, an upper clamp assembly and a pressure adjusting device, the pressure adjusting device comprises a plurality of adjustable pressure heads for abutting with the measured chips, the adjustable pressure heads are arranged in one-to-one correspondence with the mounting grooves, the adjustable pressure heads are arranged to be capable of moving up and down relative to the mounting grooves, and in the cooperation state of the upper clamp assembly and the lower clamp assembly, the adjustable pressure heads of the pressure adjusting device can make the measured chips tightly adhere to the groove bottom of the mounting groove, and the test probe can contact the corresponding measured chip. The above technical scheme aging test equipment can simultaneously test a plurality of measured chips, improves the test efficiency, simultaneously, through the newly added pressure adjusting device, pressure can be applied to each measured chip, so that the measured chip is fully contacted with the lower bottom plate, the heat consumption of the measured chip can be completely transmitted through the lower bottom plate, and the situation that the junction temperature of the measured chip is unstable and the repeated test uniformity is poor is avoided.

[0030] Further, the plurality of first mounting holes are arranged on the lower base plate, the lower clamp assembly further comprises a plurality of second mounting holes arranged on the elastic sheet plate, and the first mounting holes and the second mounting holes are one-to-one corresponding and connected.

[0031] The above and other objects, advantages and features of the present application will become more apparent by describing in detail our preferred embodiments thereof with reference to the attached drawings in which: BRIEF DESCRIPTION OF DRAWINGS

[0032] In the following detailed description of embodiments of the application, reference will be made to the accompanying drawings, of which:

[0033] Figure 1 Fig. 1 is a schematic structural diagram of an aging test fixture according to an embodiment of the present application;

[0034] Figure 2 Fig. 3 is a schematic structural diagram of a pressure regulating device and a measured chip according to an embodiment of the present application;

[0035] Figure 3 Fig. 4 is a schematic structural diagram of an upper clamp assembly of an aging test fixture according to an embodiment of the present application;

[0036] Figure 4 Fig. 5 is a schematic structural diagram of a pressure regulating device according to an embodiment of the present application;

[0037] Figure 5 Fig. 6 is a schematic structural diagram of an upper clamp plate according to an embodiment of the present application;

[0038] Figure 6 Fig. 7 is a schematic structural diagram of an elastic sheet plate and a lower base plate according to an embodiment of the present application;

[0039] Figure 7 Fig. 8 is a schematic structural diagram of an elastic sheet plate and an upper clamp plate according to an embodiment of the present application;

[0040] Figure 8is a schematic structural view of a lower base plate according to an embodiment of the present utility model.

[0041] Figure 9 is a schematic sectional view of an aging test fixture according to an embodiment of the present utility model.

[0042] Reference signs:

[0043] 100-aging test fixture, 200-chip under test, 10-lower fixture assembly, 20-upper fixture assembly, 11-lower clamp plate, 12-lower base plate, 121-mounting groove, 122-first mounting hole, 13-spring plate, 131-spring, 132-second mounting hole, 21-probe plate, 211-test probe, 22-PCB plate, 23-upper clamp plate, 24-pressure adjusting device, 241-adjustable pressure head, 242-elastic member, 243-pressing member, 244-pressing plate, 25-guiding block, 26-temperature measuring component, 27-screw, 28-positioning pin, 29-limiting block, 291-limiting structure. DETAILED DESCRIPTION

[0044] The embodiments of the present utility model are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present utility model, and cannot be understood as a limitation of the present utility model.

[0045] In the description of the present utility model, it is understood that the terms "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present utility model.

[0046] In the description of the present utility model, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features covered thereby, unless otherwise specifically described, it indicates that other features are not excluded and can further include other features.

[0047] Unless otherwise explicitly specified and limited, the terms "connected", "mounted", and the like should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication of two elements or interaction relationship between two elements, unless otherwise explicitly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0048] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of the embodiments have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0049] Figure 1 is a schematic structural view of an aging test fixture 100 according to an embodiment of the present application, Figure 2 is a schematic structural view of a pressure regulating device 24 in contact with a measured chip 200 according to an embodiment of the present application, Figure 3 is a schematic structural view of an upper clamp assembly 20 of an aging test fixture 100 according to an embodiment of the present application, Figure 4 is a schematic structural view of a pressure regulating device 24 according to an embodiment of the present application.

[0050] As shown in Figures 1 to 4 In a preferred embodiment, the aging test fixture 100 includes a lower clamp assembly 10, an upper clamp assembly 20, and a pressure regulating device 24. The lower clamp assembly 10 includes a lower base plate 12 and a plurality of elastic contact springs 131. The lower base plate 12 is provided with a plurality of mounting grooves 121 for placing the measured chip 200. The elastic contact springs 131 are provided one-to-one corresponding to the mounting grooves 121 and are arranged to elastically deform under the action of external pressure, thereby being able to push the measured chip 200 to tightly contact the side wall of the mounting groove 121. The upper clamp assembly 20 includes a plurality of test probes 211 for contacting the measured chip 200. The pressure regulating device 24 is connected with the upper clamp assembly 20, and the pressure regulating device 24 includes a plurality of adjustable pressure heads 241 for abutting against the measured chip 200. The adjustable pressure heads 241 are provided one-to-one corresponding to the mounting grooves 121. The adjustable pressure heads 241 are arranged to be able to move up and down relative to the mounting grooves 121. In the cooperating state of the upper clamp assembly 20 and the lower clamp assembly 10, the adjustable pressure heads 241 of the pressure regulating device 24 can make the measured chip 200 tightly contact the groove bottom of the mounting groove 121, and the test probes 211 can contact the corresponding measured chip 200.

[0051] The embodiment can apply pressure to each chip 200 to be tested by adding the pressure adjusting device 24, so that the chip 200 to be tested is in full contact with the lower base plate 12, and the heat consumption of the chip 200 to be tested can be completely transmitted through the lower base plate 12, thereby avoiding the instability of the junction temperature of the chip 200 to be tested and the poor repeatability of the test.

[0052] In some embodiments, one mounting groove 121 corresponds to one group of test probe groups, and each group of test probe groups includes at least one test probe 211.

[0053] Referring to Figure 4 In some embodiments, the pressure adjusting device 24 further includes a plurality of pressing members 243 and a plurality of elastic members 242, and the plurality of adjustable pressure heads 241, the plurality of pressing members 243, and the plurality of elastic members 242 are one-to-one corresponding and matched. Each elastic member 242 is arranged in a vertical direction, and one end of the elastic member 242 is connected with the pressing member 243, and the other end of the elastic member 242 is connected with the adjustable pressure head 241, and the pressing member 243 is connected with the upper clamp assembly 20. It can be understood that the adjustable pressure head 241, the elastic member 242, and the pressing member 243 of the pressure adjusting device 24 are connected in sequence from bottom to top. In this embodiment, the elastic member 242 is a spring. In other embodiments, the elastic member 242 can also be other components having the same elastic properties as the spring.

[0054] In some embodiments, the upper clamp assembly 20 includes a PCB board 22, a probe board 21, and an upper clamp plate 23. The probe board 21 is located on one side of the PCB board 22 and has a plurality of probe groups, each of which includes at least one test probe 211. One end of each test probe 211 is in contact with the chip 200 to be tested, and the other end of each test probe 211 is in contact with the PCB board 22. The upper clamp plate 23 is located on the side of the PCB board 22 away from the probe board 21 and is connected with the PCB board 22. When the upper clamp assembly 20 is installed on the lower clamp assembly 10, the test probes 211 of the probe groups on the probe board 21 abut against the corresponding chips 200 to be tested, thereby transmitting the signals of the chips 200 to be tested to the PCB board 22. Here, each probe group corresponds to one chip 200 to be tested. The upper clamp assembly 20 is connected with the lower clamp assembly 10 by screws 27. In addition, the upper clamp assembly 20 is also provided with at least one positioning pin 28, and the lower clamp assembly 10 is provided with a positioning hole matched with the positioning pin 28. During the cooperation of the upper clamp assembly 20 and the lower clamp assembly 10, the positioning pin 28 is first matched with the positioning hole on the lower clamp assembly 10, which can ensure the accuracy of the connection position of the upper clamp assembly 20 and the lower clamp assembly 10, and then the upper clamp assembly 20 and the lower clamp assembly 10 are connected by the screws 27, which can improve the efficiency of the assembly of the clamp assembly 20 and the lower clamp assembly 10.

[0055] In some embodiments, part of the pressure adjusting device 24 is arranged in the upper clamp plate 23. When the upper clamp assembly 20 is installed on the lower clamp assembly 10, the elasticity of the elastic member 242 of the pressure adjusting device 24 is first adjusted to a preset pressure value by using a tool, and then the pressing member 243 of the pressure adjusting device 24 is locked on the upper clamp plate 23 by torsion. The pressure value of a single elastic member 242 can be adjusted by the screw 27, and the adjustment of the force value of 0-50N can be realized. The performance of the junction temperature uniformity of the measured chip 200 under different force values can be observed by experimental observation, so as to complete the setting of the optimal force value. In this embodiment, the pressure value can be adjusted by setting the elastic member 242, and the flatness of the measured chip 200 in contact with the bottom wall of the mounting groove 121 can also be adjusted, so that the measured chip 200 is in full contact with the lower bottom plate 12.

[0056] Figure 5 is a schematic structural view of the upper clamp plate 23 according to an embodiment of the present application. As shown in Figure 5 , specifically, the upper clamp plate 23 is provided with a limiting block 29 on both sides, and at least one limiting structure 291 is arranged on the limiting block 29. In the cooperating state of the pressure adjusting device 24 and the upper clamp plate 23, the pressing member 243 of the pressure adjusting device 24 can be accommodated in the limiting structure 291. The limiting structure 291 can be a limiting hole.

[0057] In some embodiments, the adjustable pressing head 241 includes two pressing plates 244 arranged at intervals, and the two pressing plates 244 respectively abut against the two sides close to the edges of the measured chip 200.

[0058] In this embodiment, the upper clamp assembly 20 transmits the force of the elastic member 242 to the measured chip 200 through the adjustable pressing head 241 of the pressure adjusting device 24, so that the measured chip 200 is in good contact with the lower bottom plate 12. At the same time, the preset pressure value of the elastic member 242 corresponding to each measured chip 200 is adjusted, which can guarantee the consistency of the contact of the measured chip 200 with the lower bottom plate 12.

[0059] In some embodiments, the pressure adjusting device 24 further includes a guide block 25, and the guide block 25 is installed on the opposite sides of the probe plate 21 of the upper clamp assembly 20. The guide block 25 is provided with at least one guide structure, and at least one adjustable pressing head 241 of the pressure adjusting device 24 is arranged in each guide structure to guide the movement path of the adjustable pressing head 241.

[0060] In this embodiment, the number of guide blocks 25 is two, two guide blocks 25 are arranged on both sides of two pairs of probe boards 21 respectively, and are arranged along the extension direction of the probe boards 21 respectively. The guide blocks 25 are connected with the probe boards 21 through bolts. The adjustable pressure heads 241 of the pressure adjusting devices 24 are all arranged in the guide structures of the guide blocks 25 to be limited and guided by the guide structures, and the two pressure plates 244 of the adjustable pressure heads 241 protrude below the guide blocks 25 to abut against the measured chips 200.

[0061] Figure 5 is a schematic structural view of the elastic sheet plate 13 and the lower base plate 12 according to an embodiment of the present utility model, Figure 6 is a schematic structural view of the elastic sheet plate 13 and the upper clamping plate 23 according to an embodiment of the present utility model, Figure 7 is a schematic structural view of the lower base plate 12 according to an embodiment of the present utility model. As shown in Figures 5 to 7 some embodiments, the lower base plate 12 is provided with a plurality of first mounting holes 122, the lower clamping fixture assembly further comprises an elastic sheet plate 13, the elastic sheet plate 13 is provided with a plurality of second mounting holes 132, the plurality of second mounting holes 132 are uniformly arranged at positions close to opposite sides of the elastic sheet plate 13, the first mounting holes 122 and the second mounting holes 132 are one-to-one correspondingly connected, the elastic sheet plate 13 has a plurality of elastic sheet pieces 131 extending outward, and the plurality of elastic sheet pieces 131 are arranged to be elastically deformed when the elastic sheet plate 13 is mounted on the lower base plate 12.

[0062] In this embodiment, the second mounting holes 132 are arranged at positions close to opposite sides of the elastic sheet plate 13, so that the lower base plate 12 can be uniformly pressed on both sides when the elastic sheet plate 13 is mounted on the lower base plate 12, and the torque exerted by the elastic sheet plate 13 on the lower base plate 12 can be reduced, thereby avoiding the risk of deformation of the lower base plate 12 under long-term use of pressure, and improving the overall strength of the aging test fixture. In an embodiment, the plurality of elastic sheet pieces 131 are divided into two groups of elastic sheet pieces, each group of elastic sheet pieces comprises a plurality of elastic sheet pieces 131 extending along the width direction of the elastic sheet plate 13, and the plurality of elastic sheet pieces 131 are arranged at intervals, and one group of elastic sheet pieces is arranged on each of the opposite sides of the elastic sheet plate 13. That is, the opposite sides of the elastic sheet plate 13 are arranged at intervals along the extension direction of the elastic sheet plate 13, and a plurality of elastic sheet pieces 131 are arranged on each of the opposite sides, see Figure 6 each elastic sheet piece 131 corresponds to one measured chip 200, see Figure 5 .

[0063] see Figure 5 and Figure 7In some embodiments, the plurality of second mounting holes 132 are divided into at least two groups of second mounting holes, which are arranged uniformly at positions close to the two groups of spring sheet groups, and each group of second mounting holes comprises a plurality of second mounting holes 132 arranged uniformly along the length direction of the spring sheet 13. In this embodiment, the number of groups of second mounting holes is two, and each group of second mounting holes corresponds to a group of spring sheet groups. Each second mounting hole 132 corresponds to a first mounting hole 122. That is, the layout of the first mounting holes 122 on the lower base plate 12 is the same as the layout of the second mounting holes 132 on the spring sheet 13. In other embodiments, the plurality of second mounting holes 132 can also be arranged uniformly on the spring sheet 13 according to other layout manners, which are determined according to design requirements.

[0064] In some embodiments, the lower clamp assembly 10 further comprises a lower clamp plate 11 installed on the top of the spring sheet 13 for applying pressure to the spring sheet 13, as shown in Figure 3 Here, the lower clamp plate 11 is connected to the spring sheet 13 by bolts.

[0065] Before the spring sheet 13 is installed on the lower base plate 12, the abutting spring 131 on the spring sheet 13 is in an initial bending state of arching upward. The measured chip 200 is first placed in the mounting groove 121 of the lower base plate 12, and then the spring sheet 13 is installed on the lower base plate 12, and then the lower clamp plate 11 is installed on the top of the spring sheet 13 to apply pressure to the spring sheet 13, so that the abutting spring 131 is elastically deformed, and at this time the abutting spring 131 is switched from the initial bending state to the deformed and stretched state, that is, the end of the abutting spring 131 abuts against one corner of the measured chip 200, and then the measured chip 200 can move in the mounting groove 121 under the pushing of the abutting spring 131, until the measured chip 200 abuts against the side wall of the mounting groove 121, thereby limiting the movement of the measured chip 200 and realizing the positioning of the measured chip 200. When the spring sheet 13 is installed on the lower base plate 12, the bolts pass through the spring sheet 13 from the bottom of the lower base plate 12 to connect with the spring sheet 13. Here, the measured chip 200 is a COS / COC chip. The lower clamp assembly 10 is placed on the heat sink, which is equivalent to that the lower base plate 12 is placed on the heat sink, and the heat sink exchanges heat with the measured chip 100 through the lower base plate 12.

[0066] Figure 8 is a schematic sectional view of the aging test fixture 100 according to an embodiment of the present application. As Figure 8As shown, in some embodiments, the lower clamp assembly 10 further comprises a temperature measuring component 26, which is installed on the upper clamp assembly 20, and the temperature measuring head of the temperature measuring component 26 is arranged to penetrate the lower clamp plate 14 and the spring plate 13 when the upper clamp assembly 20 is installed on the lower clamp assembly 10, so as to be in contact with the lower bottom plate 12, thereby measuring the temperature of the lower bottom plate 12.

[0067] This embodiment can effectively avoid the damage of the measured chip 200 caused by overheating by comparing the temperature of the temperature measuring head of the temperature measuring component 26 with the preset temperature value, while observing the contact between the bottom plate 12 and the heat sink synchronously.

[0068] This embodiment further provides an aging test device, which comprises the aging test clamp 100 described above. For the aging test clamp 100, details are not repeated here.

[0069] This embodiment can cleverly integrate the pressure on the measured chip 200 by arranging the pressure adjusting device 24 in the upper clamp assembly 20, so that the measured chip 200 is in good contact with the lower bottom plate 12. In addition, this embodiment strengthens the overall strength of the aging test clamp 100 by changing the overall structure of the aging test clamp 100, thereby ensuring the stability of the aging test clamp 100 under long-term use of large pressure.

[0070] At this point, those skilled in the art should realize that although the multiple exemplary embodiments of the utility model have been shown and described in detail herein, many other variants or modifications conforming to the principles of the utility model can be directly determined or deduced according to the content disclosed by the utility model without departing from the spirit and scope of the utility model. Therefore, the scope of the utility model should be understood and recognized as covering all these other variants or modifications.

Claims

1. An aging test fixture, characterized in that, include: The lower clamp assembly includes a lower base plate and multiple clamping springs; the lower base plate is provided with multiple mounting slots for placing the chip under test; the clamping springs are arranged one-to-one with the mounting slots and are configured to undergo elastic deformation under external pressure, thereby pushing the chip under test against the side wall of the mounting slot. The upper clamping assembly includes multiple test probes for contacting the chip under test; A pressure regulating device is connected to the upper clamp assembly. The pressure regulating device includes a plurality of adjustable pressure heads for contacting the chip under test. Each adjustable pressure head is configured to correspond one-to-one with a mounting slot. The adjustable pressure head is configured to move up and down relative to the mounting slot. When the upper clamp assembly and the lower clamp assembly are engaged, the adjustable pressure head of the pressure regulating device can make the chip under test fit tightly against the bottom of the mounting slot, and the test probe can contact the corresponding chip under test.

2. The aging test fixture according to claim 1, characterized in that, The pressure regulating device further includes multiple pressing elements and multiple elastic elements; the multiple adjustable pressure heads, the multiple pressing elements, and the multiple elastic elements are matched one-to-one; Each of the elastic elements is arranged vertically, with one end connected to the lower pressure member and the other end connected to the adjustable pressure head. The lower pressure member is connected to the upper clamp assembly.

3. The aging test fixture according to claim 2, characterized in that, The upper clamp assembly includes: PCB board; A probe board is located on one side of the PCB board and has multiple probe groups. Each probe group includes at least one test probe. One end of each test probe is in contact with the chip under test, and the other end is in contact with the PCB board. The upper clamp is located on the side of the PCB board away from the probe board and is connected to the PCB board.

4. The aging test fixture according to claim 3, characterized in that, The pressure regulating device further includes a guide block, which is mounted on the upper clamp assembly. The guide block is provided with at least one guide structure, and the adjustable pressure head can pass through the corresponding guide structure to guide the movement of the adjustable pressure head.

5. The aging test fixture according to any one of claims 1-4, characterized in that, The lower base plate is provided with a plurality of first mounting holes, and the lower clamp assembly further includes: The spring plate has a plurality of second mounting holes, which are evenly arranged on opposite sides near the spring plate. Each first mounting hole is connected to a second mounting hole. The spring plate has a plurality of outwardly extending abutting springs, which are configured to elastically deform when the spring plate is installed on the lower base plate.

6. The aging test fixture according to claim 5, characterized in that, The plurality of abutting springs are divided into two groups of springs, each group of springs including a plurality of abutting springs spaced apart along the extension length of the spring plate, and a group of springs is arranged on each of the opposite sides of the spring plate.

7. The aging test fixture according to claim 6, characterized in that, The plurality of second mounting holes are divided into at least two groups of second mounting holes. The at least two groups of second mounting holes are evenly arranged near the two groups of spring plates. Each group of second mounting holes includes a plurality of second mounting holes that extend along the length of the spring plate and are arranged at intervals.

8. The aging test fixture according to claim 5, characterized in that, The lower clamp assembly further includes: The lower clamping plate is installed on top of the spring plate and is used to apply pressure to the spring plate.

9. The aging test fixture according to claim 8, characterized in that, The upper clamp assembly further includes: A temperature measuring component is mounted on the upper clamp assembly, and the temperature measuring head of the temperature measuring component is configured to penetrate the lower clamping plate and the spring plate when the upper clamp assembly is mounted on the lower clamp assembly, so as to contact the lower base plate and thereby measure the temperature of the lower base plate.

10. An aging test device, characterized in that, Includes the aging test fixture as described in any one of claims 1-9.

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