Projection device

By incorporating a casing, projector body, first heat sink, and second heat sink into the projection device, the problem of poor heat dissipation performance of laser projection devices is solved, achieving more efficient heat dissipation and extending the service life of the device.

CN224035749UActive Publication Date: 2026-03-24QINGDAO HISENSE LASER DISPLAY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

The overall heat dissipation performance of existing laser projection equipment is poor, resulting in low reliability.

Method used

The design incorporates a casing, a projection device body, a first heat sink, and a second heat sink. The heat from the light valve is conducted to the air outlet of the casing through the first heat sink, and the heat from the laser is conducted to the air outlet of the casing through the second heat sink. Combined with the cooling fan and the layout of multiple air outlets, the heat dissipation efficiency is improved.

Benefits of technology

It effectively improves the heat dissipation efficiency of projection equipment and extends its service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses projection equipment, and belongs to the technical field of photoelectricity. The projection equipment comprises a shell, a projection equipment body, a first radiator and a second radiator. The first radiator is connected with the side, deviating from the light outlet opening of the shell, of the projection equipment body in the first direction, and at least part of the second radiator is located on the side, deviating from the projection equipment body, of the first radiator in the first direction; and the light outlet opening and the plurality of air outlets of the shell are distributed on the two opposite sides of the shell in the first direction, so that the first radiator and the second radiator are closer to the plurality of air outlets of the shell. Therefore, the heat conducted to the first radiator by the light valve and the heat conducted to the second radiator by the laser can be conducted to the outside of the accommodating cavity through the plurality of air outlets to a greater extent, so that the influence of the heat on the projection equipment body can be avoided, the radiating efficiency of the projection equipment is improved, and the service life of the projection equipment is prolonged.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of optoelectronic technology, in particular to a projection device. BACKGROUND

[0002] Laser light source has the advantages of good monochromaticity, high brightness, long service life, etc., and is a relatively ideal light source. With the improvement of the power of laser devices, the requirements of industrial applications are met, and lasers are gradually used as light sources for illumination. The projection device using laser as light source has the advantages of larger projection image size and better display effect, and has been more and more widely used.

[0003] The laser projection device generally can include a laser light source, an optical engine and a projection lens. The laser light beam emitted by the laser light source can provide an illumination light beam for the laser projection device. The optical engine is used to generate an image light beam according to the illumination light beam provided by the laser light source, and guide the image light beam to the projection lens. The projection lens is used to image the image light beam after receiving the image light beam, and project it onto a projection screen to display a picture on the projection screen.

[0004] However, in order to pursue the miniaturization design of the laser projection device, the internal structure of the laser projection device is arranged more closely, which leads to poor overall heat dissipation performance and low reliability of the laser projection device. Invention content

[0005] The embodiment of the present application provides a projection device. The problem of poor overall heat dissipation performance of the projection device in the prior art can be solved, and the technical scheme is as follows:

[0006] On the one hand, a projection device is provided, comprising: a shell, a projection device body, a first heat sink and a second heat sink;

[0007] The shell has a containing cavity, and a light outlet opening and a plurality of air outlets in communication with the containing cavity; the light outlet opening and the plurality of air outlets are distributed on the two sides of the shell oppositely arranged in the first direction;

[0008] The projection device body is installed in the containing cavity, the light outlet side of the projection device body faces the light outlet opening, and the projection device body has a laser and a light valve;

[0009] The first heat sink is connected to the side of the projection device body away from the light outlet opening in the first direction, and the first heat sink is attached to the back surface of the light valve;

[0010] At least part of the second heat sink is located on the side of the first heat sink away from the projection device body in the first direction, and the second heat sink is attached to the back surface of the laser.

[0011] Optionally, the first heat sink comprises a first heat sink body and a first heat transfer part connected together; the first heat transfer part is attached to the back surface of the light valve; the first heat sink body is located on the side of the first heat transfer part away from the light valve, and the first heat sink body is connected to the side of the projection device body away from the light exit opening in the first direction.

[0012] Optionally, the second heat sink comprises a second heat sink body, a second heat transfer part and a heat pipe;

[0013] The second heat transfer part is attached to the back surface of the laser; the heat pipe has an evaporation section for heat absorption and a condensation section for heat release at two ends respectively; the evaporation section is in thermal conduction with the second heat transfer part, and the condensation section is in thermal conduction with the second heat sink body;

[0014] The second heat sink body is located on the side of the first heat sink body away from the projection device body in the first direction.

[0015] Optionally, the heat pipe further comprises a connecting section between the evaporation section and the condensation section; one face of the evaporation section in contact with the second heat transfer part is a plane, the thickness of the evaporation section in the direction perpendicular to the plane is smaller than the pipe diameter of the connecting section, and the width of the evaporation section is greater than the pipe diameter of the connecting section.

[0016] Optionally, the shell further has a plurality of air inlets in communication with the accommodation cavity, the plurality of air inlets are distributed on at least one side of the shell in a second direction; the second direction intersects the first direction;

[0017] The projection device further comprises at least one heat dissipation fan, the at least one heat dissipation fan is distributed between the first heat sink body and the second heat sink body in the first direction;

[0018] In the first direction, the distance between the first heat sink body and the heat dissipation fan is greater than or equal to one half of the thickness of the heat dissipation fan.

[0019] Optionally, the projection device further comprises a main support installed in the accommodation space, the projection device body is fixed on the main support, and the main support has a plurality of ventilation openings.

[0020] Optionally, the main support comprises a connecting plate body, and a first plate body and a second plate body fixedly connected to two sides of the connecting plate body in a second direction; the second direction intersects the first direction;

[0021] The connecting plate body, the first plate body and the second plate body are used to enclose a first bearing space, and the projector body is connected with the connecting plate body in the first bearing space; in the second direction, the first plate body is closer to the shell relative to the second plate body, and the plurality of ventilation openings are distributed on at least the first plate body.

[0022] Optionally, the main support further comprises a third plate body and a fourth plate body; in the second direction, the third plate body and the fourth plate body are fixedly connected with a side of the second plate body away from the first plate body; in the first direction, the third plate body is fixedly connected with a side of the second plate body close to the plurality of air outlets; in a third direction, the fourth plate body is fixedly connected with a side of the second plate body away from the connecting plate body; the third direction intersects with the first direction and intersects with the second direction.

[0023] The second plate body, the third plate body and the fourth plate body are used to enclose a second bearing space; the projector further comprises a functional component located in the second bearing space.

[0024] The plurality of ventilation openings comprise a plurality of first ventilation openings distributed on the first plate body, a plurality of second ventilation openings distributed on the third plate body, and a plurality of third ventilation openings distributed on the fourth plate body.

[0025] Optionally, the projector further comprises a heat dissipation plate body and a main plate; the heat dissipation plate body is connected with a side of the main support away from the projector body in the third direction, and the main plate is connected with a side of the heat dissipation plate body away from the main support.

[0026] Optionally, the projector further comprises a drive plate; the drive plate is distributed between the heat dissipation plate body and the fourth plate body in the third direction, the drive plate is connected with a side of the heat dissipation plate body away from the main plate, and the drive plate is electrically connected with the main plate.

[0027] The technical scheme provided by the embodiments of the present application has at least the following beneficial effects:

[0028] The heat generated by the light valve in the projection device body can be conducted to the first heat sink, and the heat generated by the laser can be conducted to the second heat sink. Since the first heat sink is connected to the side of the projection device body away from the light exit opening of the shell in the first direction, at least part of the second heat sink is located on the side of the first heat sink away from the projection device body in the first direction, and the light exit opening and the plurality of air outlets of the shell are distributed on the two opposite sides of the shell in the first direction, the first heat sink and the second heat sink are both closer to the plurality of air outlets of the shell. In this way, the heat conducted by the light valve to the first heat sink and the heat conducted by the laser to the second heat sink can be conducted to the outside of the accommodation cavity to a greater extent through the plurality of air outlets, so that the influence of the heat on the projection device body can be avoided, the heat dissipation efficiency of the projection device is improved, and the service life of the projection device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0030] Figure 1 is a structural schematic diagram of a projection device provided by an embodiment of the present application;

[0031] Figure 2 is a structural schematic diagram of another projection device provided by an embodiment of the present application;

[0032] Figure 3 is a structural schematic diagram of a projection device provided by an embodiment of the present application without showing the shell;

[0033] Figure 4 is a structural schematic diagram of a projection device provided by an embodiment of the present application without showing the shell, the first heat sink and the second heat sink;

[0034] Figure 5 is a structural schematic diagram of another projection device provided by an embodiment of the present application without showing the shell;

[0035] Figure 6 is a structural schematic diagram of a light valve provided by an embodiment of the present application;

[0036] Figure 7 is a structural schematic diagram of a first heat sink provided by an embodiment of the present application;

[0037] Figure 8 is a structural schematic diagram of another first heat sink provided by an embodiment of the present application;

[0038] Figure 9is a structural schematic diagram of a laser improved by an embodiment of the present application;

[0039] Figure 10 is a structural schematic diagram of a second heat sink provided by an embodiment of the present application;

[0040] Figure 11 is a structural schematic diagram of a second heat sink provided by an embodiment of the present application;

[0041] Figure 12 is a top view of a projection device body provided by an embodiment of the present application;

[0042] Figure 13 is a structural schematic diagram of a main support provided by an embodiment of the present application;

[0043] Figure 14 is a structural schematic diagram of another main support provided by an embodiment of the present application;

[0044] Figure 15 is a structural schematic diagram of a heat dissipation plate body, a main plate and a main support provided by an embodiment of the present application;

[0045] Figure 16 is a structural schematic diagram of another projection device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0046] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0047] An embodiment of the present application provides a projection device, please refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 is a structural schematic diagram of a projection device provided by an embodiment of the present application, Figure 2 is a structural schematic diagram of another projection device provided by an embodiment of the present application, Figure 3 is a structural schematic diagram of a projection device without a shell provided by an embodiment of the present application, the projection device can include: a shell 100, a projection device body 200, a first heat sink 300 and a second heat sink 400.

[0048] The shell 100 in the projection device has a containing cavity K, and a light outlet opening O1 and a plurality of air outlets O2 in communication with the containing cavity K. The light outlet opening O1 and the plurality of air outlets O2 of the shell 100 can be distributed on two sides of the shell 100 arranged oppositely in the first direction X.

[0049] Here, the shell 100 can have a first shell plate 101 and a second shell plate 102 oppositely arranged for enclosing the accommodating cavity K and in the first direction X. The first shell plate 101 can have a light exit opening O1, and the second shell plate 102 can have a plurality of air outlets O2.

[0050] As shown in Figure 4 , Figure 4 is a structural schematic diagram of a projection device without a shell, a first heat sink and a second heat sink provided by an embodiment of the present application. A projection device body 200 in the projection device can be installed in the accommodating cavity K of the shell 100, and a light exit side of the projection device body 200 can face the light exit opening O1 of the shell 100. The projection device body 200 can include a laser 201 and a light valve 202.

[0051] Here, the projection device body 200 can further include a projection lens 203. The laser 201 in the projection device body 200 is used to emit a laser beam, and the laser beam emitted by the laser 201 can provide an illumination beam for the projector. The light valve 202 in the projection device body 200 is used to generate an image beam according to the illumination beam provided by the laser 201, and guide the image beam to the projection lens 203. The projection lens 203 is used to image the image beam after receiving the image beam, and project it onto a projection screen to display a picture on the projection screen. It should be noted that the projection lens 203 in the projection device body 200 can face the light exit opening O1 of the shell 100. In this way, the light valve 202 and the projection lens 203 in the projection device body 200 can be arranged in the first direction X.

[0052] The first heat sink 300 in the projection device can be connected to a side of the projection device body 200 away from the light exit opening O1 in the first direction X, and the first heat sink 300 can be attached to the back of the light valve 202. Here, the front of the light valve 200 can face the light exit opening O1 in the first direction X.

[0053] In the working process of the projection device, the heat generated by the light valve 202 can be conducted to the first heat sink 300 through the back of the light valve 202. Since the first heat sink 300 is connected to the side of the projection device body 200 away from the light exit hole O1 of the shell 100 in the first direction X, and since the light exit hole O1 and the plurality of air outlets O2 of the shell 100 are arranged to be distributed on the two sides of the shell 100 oppositely arranged in the first direction X, the first heat sink 300 is close to the plurality of air outlets O2 of the shell 100 in the first direction X. The heat conducted to the first heat sink 300 by the light valve 202 can be quickly conducted to the outside of the accommodating cavity K of the shell 100 through the plurality of air outlets O2.

[0054] At least part of the second heat sink 400 in the projection device can be located on the side of the first heat sink 200 away from the projection device body 200 in the first direction X, and the second heat sink 400 can be attached to the back of the laser 201.

[0055] In this way, during the operation of the projection device, the heat generated by the laser 201 can be conducted to the second heat sink 400. Since at least part of the second heat sink 400 is located on the side of the first heat sink 300 away from the projection device body 200 in the first direction X, the second heat sink 400 is closer to the plurality of air outlets O2 of the shell 100 relative to the first heat sink 300 in the first direction X, so that the heat conducted by the laser 201 to the second heat sink 300 can be more quickly conducted to the outside of the accommodating cavity K of the shell 100 through the plurality of air outlets O2.

[0056] In this application, the heat generated by the light valve 202 in the projection device body 200 can be conducted to the first heat sink 300, and the heat generated by the laser 201 can be conducted to the second heat sink 400. Since the first heat sink 300 is connected to the side of the projection device body 200 away from the light outlet opening O1 of the shell 100 in the first direction X, at least part of the second heat sink 400 is located on the side of the first heat sink 300 away from the projection device body 200 in the first direction X, and the light outlet opening O1 and the plurality of air outlets O2 of the shell 100 are distributed on the two sides of the shell 100 arranged in the first direction X, therefore the first heat sink 300 and the second heat sink 400 are both closer to the plurality of air outlets O2 of the shell 100. In this way, the heat conducted by the light valve 202 to the first heat sink 300, and the heat conducted by the laser 201 to the second heat sink 400 can be more greatly conducted to the outside of the accommodating cavity K through the plurality of air outlets O2, so that the influence of the heat on the projection device body 200 can be avoided, the heat dissipation efficiency of the projection device is improved, and the service life of the projection device is improved.

[0057] In summary, the embodiment of the present application provides a projection device, comprising: a shell, a projection device body, a first heat sink and a second heat sink. The heat generated by the light valve in the projection device body can be conducted to the first heat sink, and the heat generated by the laser can be conducted to the second heat sink. Since the first heat sink is connected to the side of the projection device body away from the light outlet opening of the shell in the first direction, at least part of the second heat sink is located on the side of the first heat sink away from the projection device body in the first direction, and the light outlet opening and the plurality of air outlets of the shell are distributed on the two sides of the shell arranged oppositely, therefore, the first heat sink and the second heat sink are both closer to the plurality of air outlets of the shell. In this way, the heat conducted by the light valve to the first heat sink and the heat conducted by the laser to the second heat sink can be conducted to the outside of the accommodation cavity to a greater extent through the plurality of air outlets, so that the influence of the heat on the projection device body can be avoided, the heat dissipation efficiency of the projection device is improved, and the service life of the projection device is improved.

[0058] Optionally, please refer to Figure 5 , Figure 6 , Figure 7 and Figure 8 , Figure 5 is another structural schematic view of the shell provided by the embodiment of the present application, Figure 6 is a structural schematic view of a light valve provided by the embodiment of the present application, Figure 7 is a structural schematic view of a first heat sink provided by the embodiment of the present application, Figure 8 is a structural schematic view of another first heat sink provided by the embodiment of the present application. The first heat sink 300 can comprise a first heat sink body 301 and a first heat transfer part 302 connected. The first heat transfer part 302 in the first heat sink 300 can be attached to the back of the light valve 202, and the first heat sink body 301 in the first heat sink 300 can be located on the side of the first heat transfer part 302 away from the light valve 202. And the first heat sink body 301 in the first heat sink 300 can be connected to the side of the projection device 200 away from the light outlet opening O1 in the first direction X.

[0059] In this way, during the working process of the projection device, the heat generated by the light valve 2020 can be conducted to the first heat transfer part 302 through the back of the light valve 202, and then conducted to the first heat sink body 301 through the first heat transfer part 302. Since the first heat sink body 301 is located on the side of the first heat transfer part 302 away from the light valve 202, the first heat sink body 301 is closer to the plurality of air outlets O2 of the shell 100. In this way, the heat conducted by the light valve 200 to the first heat sink body 301 through the first heat transfer part 302 can be conducted to the outside of the accommodation cavity K through the plurality of air outlets O2.

[0060] It should be noted that the size of the first heat transfer part 302 in the first heat sink 300 can be matched with the size of the light valve 200, so that the back surface of the light valve 202 can be attached to the first heat transfer part 302. The size of the first heat sink body 301 in the first heat sink 300 can be matched with the size of the one surface of the projection device body 200 facing the plurality of air outlets O2, so that the first heat sink body 301 can be connected to the one surface of the projection device body 200 facing the plurality of air outlets O2. In this way, the size of the first heat sink body 301 can be larger than the size of the first heat transfer part 302, so that the heat dissipation area of the first heat sink body 301 is larger, and the heat dissipation efficiency of the first heat sink body 301 is higher.

[0061] It should be noted that, as shown in Figure 8 , the first heat sink body 301 can include a connecting plate body 3011 and a plurality of first heat dissipation fins 3012. The side of the first heat transfer part 302 away from the light valve 202 can be fixedly connected to the connecting plate body 3011, and the plurality of first heat dissipation fins 3012 can be fixedly connected to the side of the connecting plate body 3011 away from the first heat transfer part 302. The plurality of heat dissipation fins 3012 can be arrayed on the connecting plate body 3011. In this way, the heat conducted by the light valve 202 to the first heat transfer part 302 can be conducted to the plurality of first heat dissipation fins 3012 through the connecting plate body 3011, and then dissipated through the plurality of first heat dissipation fins 3012. In this way, the heat dissipation efficiency of the first heat sink body 301 can be further improved through the plurality of first heat dissipation fins 3012.

[0062] It should also be noted that, as shown in Figure 7 and Figure 8 , the first heat sink body 301 can have a plurality of first through holes V1. The projection device can further include a plurality of first screws 1101 corresponding to the plurality of first through holes V1. After the plurality of first screws 1101 pass through the corresponding first through holes V1, the plurality of first screws 1101 can be fixedly connected to the side of the projection device body 200 away from the light outlet O1. In this way, the first heat sink body 301 can be fixed to the side of the projection device body 200 away from the light outlet O1 through the plurality of first through holes V1 and the plurality of first screws 1101.

[0063] Optionally, please refer to Figure 5 , Figure 9 and Figure 10 , Figure 9 is a structure diagram of a laser device improved by the embodiments of the present application, Figure 10 is a structure diagram of a second heat sink provided by the embodiments of the present application,

[0064] The second heat sink 400 can include a first heat sink body 401, a second heat transfer portion 402, and a heat pipe 403. The second heat transfer portion 402 can be attached to the back surface of the laser 201. The heat pipe 403 can have an evaporation section 4031 at one end for absorbing heat and a condensation section 4032 at the other end for releasing heat. The heat pipe 403 can be in thermal conduction with the second heat transfer portion 402, and the condensation section 4032 of the heat pipe 403 can be in thermal conduction with the second heat sink body 401. The second heat sink body 401 can be located on the side of the first heat sink body 301 away from the projector body 200 in the first direction X.

[0065] In this way, during the operation of the projector, the heat generated by the laser 201 can be conducted to the second heat transfer portion 402. The evaporation section 4031 of the heat pipe 403 can absorb the heat of the second heat transfer portion 402 and then conduct the heat to the condensation section 4032 of the heat pipe 403 through the heat pipe 403. The condensation section 4032 of the heat pipe 403 can then release the heat to the second heat sink body 401. The heat can then be dissipated to the outside of the housing 100 through the plurality of air outlets O2 through the second heat sink body 401.

[0066] It should be noted that the heat pipe 403 can include a heat pipe body and a circulating medium inside the heat pipe body. The heat pipe 403 can conduct heat through the evaporation and condensation of the circulating medium inside the heat pipe body. For example, in the evaporation section 4031 of the heat pipe 403, the circulating medium can evaporate from a liquid state to a gaseous state and absorb heat during the evaporation process to achieve the heat absorption function of the evaporation section 4031. In the condensation section 4032 of the heat pipe 403, the circulating medium can condense from a gaseous state to a liquid state and release heat during the condensation process, thereby achieving the heat release function of the condensation section 4032. In this way, through the continuous heat absorption of the evaporation section 4031 and the continuous heat release of the condensation section 4032, the heat conducted by the laser 201 to the second heat transfer portion 402 can be effectively conducted to the second heat sink body 401. For example, the circulating medium of the heat pipe 403 can be a phase change material.

[0067] It should also be noted that the second heat transfer portion 402 can be a copper plate structure made of copper. One side of the copper plate structure can be attached to the back surface of the laser 201, and the other side can be in thermal conduction with the evaporation section 4031 of the heat pipe 403. Here, copper is a material with good thermal conductivity, and the second heat transfer portion 402 made of copper also has good thermal conductivity. The size of the second heat transfer portion 402, which is a copper plate, can match the size of the back surface of the laser 201, so that the second heat transfer portion 402, which is a copper plate, can avoid the phenomenon of instantaneous overheating and long-term heat accumulation.

[0068] It should be noted that the evaporation section 4031 of the heat pipe 403 needs to be in contact with the second heat transfer part 402 to realize heat conduction between the evaporation section 4031 and the second heat transfer part 402. The condensation section 4032 of the heat pipe 403 needs to be in contact with the second heat dissipation main body 401 to realize heat conduction between the condensation section 4032 and the second heat dissipation main body 401.

[0069] Optionally, please refer to Figure 11 , Figure 11 is another structure diagram of a second heat dissipation device provided by the embodiment of the present application. The heat pipe 403 can further include a connecting section 4033 between the evaporation section 4031 and the condensation section 4032. The side of the evaporation section 4031 in contact with the second heat transfer part 402 can be a plane P, the thickness of the evaporation section 4031 in the direction perpendicular to the plane P can be less than the pipe diameter of the connecting section, and the width of the evaporation section 4031 can be greater than the pipe diameter of the connecting section 4033. That is, the evaporation section 4031 can be a structure flattened in the direction perpendicular to the plane P for the part of the heat pipe 403 located in the evaporation section 4031.

[0070] In this way, the width of the evaporation section 4031 is large, which can increase the contact area of the evaporation section 4031 with the second heat transfer part 402, and thus the heat absorption efficiency of the evaporation section 4031 on the second heat transfer part 402 can be improved, and thus the heat dissipation efficiency of the second heat dissipation device 400 can be improved.

[0071] It should be noted that when the evaporation section 4031 is flattened in the direction perpendicular to the plane P to increase the contact area of the evaporation section 4031 and the second heat transfer part 402, the evaporation section 4031 cannot be flattened too much, that is, the evaporation section 4031 still needs to have a certain height in the direction perpendicular to the plane P to ensure that the circulating medium inside the heat pipe 403 can still circulate normally to realize the evaporation heat absorption of the evaporation section 4031 and the condensation heat release of the condensation section 4032 of the heat pipe 403, so as to ensure the heat transfer efficiency of the heat pipe 403. For example, the pipe diameter of the connecting section 4033 in the heat pipe 403 can be 8 mm, and the height of the flattened evaporation section 4031 in the direction perpendicular to the plane P can be 5 mm.

[0072] Optionally, please refer to Figure 1 , Figure 2 , Figure 5 and Figure 12 , Figure 12 is a top view of a projection device body provided by the embodiment of the present application. The shell 100 can further have a plurality of air inlets O3 in communication with the accommodation cavity K, and the plurality of air inlets O3 can be distributed on at least one side of the shell 100 in the second direction Y. The first direction X can intersect the second direction Y.

[0073] The embodiments of the present application are illustratively described by taking the example that a plurality of air inlets O3 are distributed on both sides of the shell 100 in the second direction Y. Here, the plurality of air inlets O3 can include a plurality of first air inlets O31 and a plurality of second air inlets O32, and the plurality of first air inlets O31 and the plurality of second air inlets O32 can be distributed on both sides of the shell 100 in the second direction Y. Here, the shell 100 can have a third shell plate 103 and a fourth shell plate 104 for enclosing the accommodating cavity K and oppositely arranged in the second direction Y. The third shell plate 103 can have a plurality of first air inlets O31, and the fourth shell plate 104 can have a plurality of second air inlets O32.

[0074] The projection device can further include at least one heat dissipation fan 500. The at least one heat dissipation fan 500 in the projection device can be distributed between the first heat dissipation body 301 and the second heat dissipation body 401 in the first direction X.

[0075] Here, one side of the fan 500 facing the first heat dissipation body 301 can be used for air suction, and one side of the fan 500 facing the second heat dissipation body 401 can be used for air blowing. In this way, during the operation of the projection device, after the fan 500 starts to work, the air can enter the inside of the accommodating cavity K from the air inlet O3, and after flowing through the first heat dissipation body 301, it can be blown to the second heat dissipation body 401 under the action of the fan 500, and then it can flow out to the outside of the accommodating cavity K through the plurality of air outlets O2.

[0076] In this way, in the flow path of the air, under the air suction action of the fan 500, the flowing air can conduct the heat of the first heat dissipation body 301 to the second heat dissipation body 401 to achieve the cooling of the first heat dissipation body 301. Under the air blowing action of the fan 500, the flowing air can conduct the heat of the second heat dissipation body 402 to the outside of the accommodating cavity K through the plurality of air outlets O2 to achieve the heat dissipation of the second heat dissipation body 401.

[0077] Optionally, as shown in Figure 12 In the first direction X, the distance between the first heat dissipation body 301 and the heat dissipation fan 500 can be greater than or equal to one half of the thickness of the heat dissipation fan 500 in the first direction X. That is, in the first direction X, the distance between the first heat dissipation body 301 and the heat dissipation fan 500 can be far, so that the resistance of the air flowing between the first heat dissipation body 301 and the heat dissipation fan 500 can be reduced, the flow of the air can be improved, and the noise during the operation of the projection device can be reduced.

[0078] It should be noted that, in the case of ensuring the strength of the shell 100, the opening area and the opening rate of the third shell plate 103 and the fourth shell plate 104 provided with the plurality of air inlets O3 on the shell 100 need to be large, so as to reduce the wind resistance at the air inlets O3, so that the air amount entering the accommodating cavity K through the plurality of air inlets O3 is large, so as to improve the heat dissipation efficiency of the projection device. Here, the opening rate of the air inlets O3 of the shell 100 can be twenty percent. In the case of ensuring the strength of the shell 100, the opening area and the opening rate of the second shell plate 102 provided with the plurality of air outlets O2 on the shell 100 also need to be large, so as to reduce the wind resistance at the air outlets O2, and ensure that the air with heat can be smoothly discharged through the plurality of air outlets O2. Here, the opening area on the second shell plate 102 can be the same as the area of the fan, and the opening rate of the air outlets O2 of the shell 100 can be forty percent.

[0079] It should be noted that, when the air is blown out from the plurality of air outlets O3 of the shell 100, the air blown out from the plurality of air outlets O3 of the shell 100 can be blown out in a direction of 30° towards the bottom of the projection device, so that the air with heat is not blown out in a direction perpendicular to the plate surface of the second shell plate 102, so as to avoid the phenomenon that the air with heat is blown to the user, and at the same time, the noise when the air is blown out from the air outlets O3 can be reduced.

[0080] Optionally, please refer to Figure 4 and Figure 13 , Figure 13 is a structural schematic diagram of a main support provided by an embodiment of the present application. The projection device can further include a main support 600 installed in the accommodating space K of the shell 100. The projection device body 200 in the projection device can be fixed on the main support 600, and the main support 600 can have a plurality of ventilation openings B. By providing the plurality of ventilation openings B on the main support 600, the wind resistance of the air flowing in the accommodating cavity K of the shell 100 can be reduced, so as to increase the air amount flowing in the accommodating cavity K of the shell 100, and further improve the heat dissipation effect of the projection device.

[0081] As shown in Figure 4 and Figure 13 , the main support 600 can include a connecting plate body 601, and a first plate body 602 and a second plate body 603 fixedly connected with both sides of the connecting plate body 601 in the second direction Y. The connecting plate body 601, the first plate body 602 and the second plate body 603 can be used to enclose a first bearing space C1. The projection device body 200 in the projection device can be connected with the connecting plate body 601 in the first bearing space C1. Here, the projection device body 200 can be locked on the connecting plate body 601 through a screw.

[0082] In the second direction Y, the first plate body 602 can be closer to the shell 100 relative to the second plate body 603, and the plurality of ventilation openings B can be distributed on the first plate body 602. Here, the plurality of ventilation openings B distributed on the first plate body 602 can be first ventilation openings B1.

[0083] It should be noted that the third shell plate 103 and the fourth shell plate 104 in the shell 100 are oppositely arranged in the second direction Y, the third shell plate 103 is distributed with a plurality of first air inlets O31, and the fourth shell plate 104 is distributed with a plurality of second air inlets O32. Here, in the second direction Y, the first plate body 602 can be closer to the third shell plate 103 relative to the second plate body 603. In this way, the plurality of first air inlets O31 can be oppositely arranged with the plurality of first ventilation openings B1 in the second direction Y, and the air entering from the first air inlet O31 can be blown into the first bearing space C1 through the first ventilation opening B1 to cool the projector body 200 located in the first bearing space K1.

[0084] Optionally, please refer to Figure 13 and Figure 14 , Figure 14 is another structure diagram of a main support provided by the embodiment of the present application, and the main support 600 can further include a third plate body 604 and a fourth plate body 605. In the second direction Y, the third plate body 604 and the fourth plate body 605 are both fixedly connected to the side of the second plate body 603 away from the first plate body 602. In the first direction X, the third plate body 604 can be fixedly connected to the side of the second plate body 603 close to the plurality of air outlets O2. In the third direction Z, the fourth plate body 605 can be fixedly connected to the side of the second plate body 603 away from the connecting plate body 601. Here, the first direction X can intersect the second direction Y, and can intersect the third direction Z. For example, the first direction X, the second direction Y and the third direction Z can be perpendicular to each other.

[0085] The second plate body 603, the third plate body 604 and the fourth plate body 605 can be used to enclose the second bearing space C2. The projector can further include a functional component located in the second bearing space C2. It should be noted that the side of the third plate body 604 and the fourth plate body 605 away from the second plate body 203 in the second direction Y can be used to enclose an opening O5. The functional device can be put into the second bearing space C2 through the opening O5. For example, the functional component can be a sound box.

[0086] Among them, the plurality of ventilation openings B can include: a plurality of first ventilation openings B1 distributed on the first plate body 602, a plurality of second ventilation openings B2 distributed on the third plate body 604, and a plurality of third ventilation openings B3 distributed on the fourth plate body 605.

[0087] ​​​​​It should be noted that in the second direction Y, the first plate body 602 can be closer to the third housing plate 103 relative to the second plate body 603, and the opening O5 can be arranged opposite the fourth housing plate 104 in the second direction Y. The first housing plate 101 and the second housing plate 102 in the housing 100 are arranged opposite in the first direction X, and the first housing plate is distributed with the light outlet opening O1, and the second housing plate 102 is distributed with a plurality of air outlets O2. Here, the third plate body 604 can be fixedly connected to the side of the second plate body 603 close to the second housing plate 102 having a plurality of air outlets O2. In this way, the plurality of second ventilation holes B2 of the third plate body 604 can be arranged opposite the plurality of air outlets O2 of the second housing plate 102 in the first direction X.

[0088] In this way, the air entering the accommodation cavity K through the second air inlet O32 on the fourth housing plate 104 can be blown into the second bearing space C2 through the opening O5, and the air blown into the second bearing space C2 can be blown to the plurality of air outlets O2 through the plurality of second ventilation holes B2 to be blown out of the accommodation cavity K of the housing 200. In this way, the heat dissipation of the functional components located in the second bearing space C2 can be achieved.

[0089] Optionally, please refer to Figure 4 and Figure 15 , Figure 15 is a structure diagram of a heat dissipation plate body, a main plate and a main support provided by the embodiment of the application. The projection device can further include: a heat dissipation plate body 700 and a main plate 800, the heat dissipation plate body 700 can be connected to the side of the main support 600 away from the projection device body 200 in the first bearing space C1 in the third direction Z, and the main plate 800 can be connected to the side of the heat dissipation plate body 700 away from the main support 600.

[0090] Here, the main plate 800 can be configured with a plurality of chips, and the main plate 800 can be electrically connected to the projection device body 200. In the working process of the projection device, the heat generated by the chips can cause the main plate 800 to heat up. Here, the heat dissipation plate body 700 can be made of a metal material with good thermal conductivity, and the heat on the main plate 800 can be conducted to the heat dissipation plate body 700.

[0091] After the air is blown into the accommodation cavity K of the housing 100 from the air inlet O3, the air flowing in the accommodation cavity K can flow between the heat dissipation plate body 700 and the main support 600, so that the air flowing through the heat dissipation plate body 700 can take away the heat on the heat dissipation plate body 700 to dissipate the heat of the heat dissipation plate body 700, so that the heat dissipation of the main plate 800 can be achieved.

[0092] Optionally, as Figure 14 and Figure 15As shown, the projection device can further include a driving board 900. The driving board 900 can be distributed between the heat dissipation board body 700 and the fourth board body 605 of the main support 600 in the third direction Z, the driving board 900 can be connected to the side of the heat dissipation board body 700 away from the main board 800, and the driving board 900 can be electrically connected to the main board 800. Here, the driving board 900 and the main board 800 can be electrically connected to the projection device body 200.

[0093] It should be noted that the driving board 900 can also be configured with a plurality of chips. In the working process of the projection device, the chips will also generate heat to cause the driving board 900 to heat up. Since the driving board 900 is located between the heat dissipation board body 700 and the fourth board body 605, and the fourth board body 605 has a plurality of third ventilation openings B3, therefore, after the wind is blown from the air inlet O3 into the accommodating cavity K of the shell 100, the wind flowing between the heat dissipation board body 700 and the main support 600 can carry away the heat on the driving board 900, so as to achieve heat dissipation of the driving board 900.

[0094] In the present application, as shown in Figure 4 、 Figure 13 、 Figure 14 and Figure 15 , the main support 600 can further include a plurality of support columns 606, the plurality of support columns 606 can be connected to the connecting board body 601, and the extension direction of the plurality of support columns 606 can be parallel to the third direction Z. The end of the support column 606 away from the connecting board body 601 can have a first connecting portion 6061. The side of the heat dissipation iron plate 700 facing the main support 600 can have a plurality of second connecting portions 701, the plurality of second connecting portions 701 can correspond to the plurality of support columns 606 one by one, and the second connecting portion 701 can be fixedly connected with the first connecting portion 6061 of the corresponding support column 606. In this way, through the fixed connection of the plurality of second connecting portions 701 and the plurality of first connecting portions 6061, the fixation of the heat dissipation board body 700 on the main support 600 can be achieved.

[0095] It should be noted that, as shown in Figure 16 , Figure 16is a structure schematic diagram of still another projection device provided by an embodiment of the present application. The projection device can further include a holder 1200. The holder 1200 can include a support part 1201 and two connecting parts 1202. The support part 1201 can be arranged opposite to the support part 1201 in a third direction Z, and the two support parts 1202 can be fixedly connected to the support part 1201 in a second direction Y. One end of each connecting part 1201 can be fixedly connected to the support part 1201, and the other end can be fixedly connected to the shell 100. Here, the shell 100 includes a third shell plate 103 and a fourth shell plate 104 arranged opposite in the second direction Y, and one end of each connecting part 1202 away from the support part 1201 can be connected to the third shell plate 103 and the fourth shell plate 104, respectively. In this way, the holder 1200 can support the whole projection device. For example, the projection device can be placed on a desktop through the holder 1200.

[0096] In summary, the embodiment of the present application provides a projection device, which includes a shell, a projection device body, a first heat sink, and a second heat sink. The heat generated by the light valve in the projection device body can be conducted to the first heat sink, and the heat generated by the laser can be conducted to the second heat sink. Since the first heat sink is connected to the side of the projection device body away from the light outlet opening of the shell in the first direction, at least part of the second heat sink is located on the side of the first heat sink away from the projection device body in the first direction, and the light outlet opening and the multiple air outlets of the shell are distributed on the two sides of the shell arranged opposite in the first direction, the first heat sink and the second heat sink are both closer to the multiple air outlets of the shell. In this way, the heat conducted by the light valve to the first heat sink and the heat conducted by the laser to the second heat sink can be conducted to the outside of the accommodation cavity to a greater extent through the multiple air outlets, so that the influence of the heat on the projection device body can be avoided, the heat dissipation efficiency of the projection device is improved, and the service life of the projection device is improved.

[0097] In the present application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. The term "multiple" refers to two or more, unless otherwise explicitly limited.

[0098] The above only describes optional embodiments of the present application and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A projection device, characterized in that, include: The outer casing, the projection device body, the first heat sink, and the second heat sink; The outer casing has a receiving cavity, a light-emitting opening communicating with the receiving cavity, and a plurality of air outlets; the light-emitting opening and the plurality of air outlets are distributed on opposite sides of the outer casing in a first direction; The projection device body is installed in the receiving cavity, the light-emitting side of the projection device body faces the light-emitting opening, and the projection device body has a laser and a light valve; The first heat sink is connected to the side of the projection device body opposite to the light outlet in the first direction, and the first heat sink is attached to the back of the light valve. At least a portion of the second heat sink is located on the side of the first heat sink away from the projection device body in the first direction, and the second heat sink is attached to the back of the laser.

2. The projection device according to claim 1, characterized in that, The first heat sink includes: a first heat dissipation body and a first heat transfer part connected together; the first heat transfer part is attached to the back of the light valve, the first heat dissipation body is located on the side of the first heat transfer part away from the light valve, and the first heat dissipation body is connected to the side of the projection device body away from the light emission opening in the first direction.

3. The projection device according to claim 2, characterized in that, The second radiator includes: a second heat dissipation body, a second heat transfer section, and a heat pipe; The second heat transfer section is attached to the back of the laser; the two ends of the heat pipe have an evaporation section for absorbing heat and a condensation section for releasing heat, the evaporation section is thermally connected to the second heat transfer section, and the condensation section is thermally connected to the second heat dissipation body. The second heat dissipation body is located on the side of the first heat dissipation body away from the projection device body in the first direction.

4. The projection device according to claim 3, characterized in that, The heat pipe further includes a connecting section located between the evaporation section and the condensation section; the side of the evaporation section that contacts the second heat transfer part is a plane, the thickness of the evaporation section in the direction perpendicular to the plane is less than the diameter of the connecting section, and the width of the evaporation section is greater than the diameter of the connecting section.

5. The projection device according to claim 3, characterized in that, The outer casing also has a plurality of air inlets communicating with the receiving cavity, the plurality of air inlets being distributed in a second direction on at least one side of the outer casing; the second direction intersects the first direction; The projection device further includes: at least one cooling fan, wherein the at least one cooling fan is distributed between the first heat dissipation body and the second heat dissipation body in the first direction; In the first direction, the distance between the first heat dissipation body and the heat dissipation fan is greater than or equal to half the thickness of the heat dissipation fan.

6. The projection device according to any one of claims 1 to 5, characterized in that, The projection device further includes a main support installed in the receiving cavity, the projection device body being fixed on the main support, and the main support having multiple ventilation openings.

7. The projection device according to claim 6, characterized in that, The main support includes: a connecting plate, and a first plate and a second plate that are fixedly connected to both sides of the connecting plate in a second direction; the second direction intersects with the first direction; The connecting plate, the first plate, and the second plate are used to form a first bearing space, and the projection device body is connected to the connecting plate within the first bearing space; in the second direction, the first plate is closer to the outer shell than the second plate, and the plurality of ventilation openings are distributed at least on the first plate.

8. The projection device according to claim 7, characterized in that, The main support further includes: a third plate and a fourth plate; in the second direction, both the third plate and the fourth plate are fixedly connected to the side of the second plate away from the first plate; in the first direction, the third plate is fixedly connected to the side of the second plate near the plurality of air outlets; in the third direction, the fourth plate is fixedly connected to the side of the second plate away from the connecting plate; the third direction intersects the first direction and the second direction. The second plate, the third plate, and the fourth plate are used to enclose a second bearing space; the projection device further includes: functional components located within the second bearing space; The plurality of ventilation openings include: a plurality of first ventilation openings distributed on the first plate, a plurality of second ventilation openings distributed on the third plate, and a plurality of third ventilation openings distributed on the fourth plate.

9. The projection device according to claim 8, characterized in that, The projection device further includes a heat sink and a motherboard. The heat sink is connected to the side of the main bracket opposite to the projection device body in the third direction. The motherboard is connected to the side of the heat sink opposite to the main bracket.

10. The projection device according to claim 9, characterized in that, The projection device further includes a driver board, which is distributed between the heat sink and the fourth board in the third direction. The driver board is connected to the side of the heat sink away from the motherboard and is electrically connected to the motherboard.