LED lamp support with extension structure

By combining a multi-level heat dissipation structure with fractal fins and gradient heat dissipation fins and composite phase change materials, the problem of low heat dissipation efficiency of LED lamp brackets is solved, achieving efficient thermal management and improved light output performance.

CN224050326UActive Publication Date: 2026-03-27SUIZHOU XUDONGSHENG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-08
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

The heat sink design of existing LED lamp holders lacks a reasonable airflow channel, resulting in low heat exchange efficiency, heat accumulation in the lamp cup area, and affecting the lamp's lifespan and light output performance.

Method used

A multi-level heat dissipation structure with fractal fins and gradient heat dissipation fins is adopted, and composite phase change material is filled at the bottom of the lamp cup. The graphene-enhanced phase change material is encapsulated through vacuum infusion process to form a three-dimensional heat conduction network.

Benefits of technology

It significantly improves heat dissipation efficiency, enhances temperature distribution uniformity, and extends the lifespan and light output performance of LED lamps.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of lighting devices, in particular to an LED lamp support with an extension structure, which comprises a support mechanism and is used for mounting an LED chip, the support mechanism comprises a main body assembly and a plurality of LED lamp supports, the main body assembly comprises an anode rod and a cathode rod which are arranged in parallel, and the upper end of the anode rod and the upper end of the cathode rod are respectively provided with an anode lead frame and a cathode lead frame; a lamp cup is arranged at the upper end of the cathode lead frame; the heat dissipation assembly comprises extension plates arranged on the outer sides of the anode lead frame and the anode rod and on the inner sides and the outer sides of the cathode lead frame and the cathode rod, and a plurality of heat dissipation fins distributed at equal intervals are arranged on the outer walls of the extension plates; the heat dissipation assembly further comprises a plurality of fractal fins which are distributed on the surfaces of the outer walls of the two ends of the heat dissipation fins at equal intervals. A multi-stage heat dissipation structure of the fractal fins and the gradient heat dissipation fins is adopted, so that the heat dissipation efficiency is remarkably improved; and the graphene reinforced phase change material is packaged in a copper-plated cavity through a vacuum infusion process, so that efficient transient thermal management is realized.
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Description

TECHNICAL FIELD

[0001] The utility model relates to lighting device technical field, concretely is a LED lamp support with extension structure. BACKGROUND

[0002] With the development of society, the lighting energy consumption problem in daily life is increasingly prominent, therefore, the LED lamps and lanterns with obvious energy-saving advantage are more and more favored by people. LED support lamp is widely used, and it can be widely used in various electronic, information products and outdoor signboards, traffic signal lamps and the like;

[0003] According to the check of the public number: CN206379381U, the LED lamp support is disclosed, and the LED lamp support is disclosed in this technology, which is composed of a positive electrode lead, a negative electrode lead and an LED lamp cup. The LED lamp cup is fixedly installed on the inner side of the top end of the negative electrode lead, and the positive electrode lead is connected with the LED lamp cup through a wire. Its characterized in that: the negative electrode lead is provided with heat dissipation fins on the inner side and the outer side, the top end of the positive electrode lead is provided with heat dissipation fins, the heat dissipation fins are symmetrically located on the two sides of the negative electrode lead at the bottom of the LED lamp cup, and are integrated with the LED lamp cup and the negative electrode lead, the heat dissipation fins are located on the outer side of the positive electrode lead, and are integrated with the positive electrode lead, and the bottom of the heat dissipation fins and the heat dissipation fins are on the same horizontal plane. Technical scheme, has "increases the heat dissipation area of LED support, thereby prolongs the service life of LED lamp support" and the like technical effect;

[0004] The heat dissipation fins in the above scheme adopt simple flat plate design, lack reasonable air flow channel, air flow is blocked, and heat exchange efficiency is low. Moreover, the heat dissipation demand of the lamp cup bottom is not considered at all, the heat generated by the light emitting crystal during work cannot be effectively conducted, and obvious heat accumulation is formed in the lamp cup area. This design defect makes the encapsulation material in the lamp cup area accelerate aging due to continuous high temperature in the long-term working process of the lamp, obvious yellowing phenomenon appears, and the light output performance is significantly reduced, which directly affects the service life and lighting quality of the LED lamp. UTILITY MODEL CONTENTS

[0005] In view of the defects of the prior art, the utility model provides a LED lamp support with extension structure, adopts a multi-stage heat dissipation structure of fractal fin and gradient heat dissipation fin, and the heat dissipation efficiency is significantly improved. The graphene reinforced phase change material is encapsulated in the copper-plated cavity through a vacuum pouring process, and high-efficiency transient thermal management is realized.

[0006] To achieve the above object, the utility model realizes the following technical scheme: a LED lamp support with extension structure, which comprises a support mechanism and is used for LED chip installation, and the support mechanism comprises:

[0007] The main body assembly comprises an anode rod and a cathode rod arranged in parallel with each other, and an anode lead frame and a cathode lead frame are arranged at the upper ends of the anode rod and the cathode rod respectively, and a lamp cup is arranged at the upper end of the cathode lead frame;

[0008] The heat dissipation assembly comprises an extension plate arranged outside the anode lead frame and the anode rod and arranged outside and inside the cathode lead frame and the cathode rod, and a plurality of heat dissipation fins are arranged at the outer wall of the extension plate.

[0009] Preferably, the heat dissipation assembly further comprises a plurality of fractal fins arranged at the outer wall surfaces of both ends of the heat dissipation fins at equal intervals, and the cross section of the fractal fin is triangular.

[0010] Preferably, one end of the heat dissipation fin close to the extension plate is thickened, and the thickness is 2mm, and the other end away from the extension plate is thinned, and the thickness is 1mm.

[0011] Preferably, the main body assembly further comprises a composite phase change material filled in the bottom of the lamp cup.

[0012] Preferably, the material of the composite phase change material is paraffin and graphene nanosheet.

[0013] Preferably, the main body assembly further comprises a bridge rod arranged between the anode rod and the cathode rod, and a feeding plate arranged between the lower ends of the anode rod and the cathode rod, and a positioning hole is arranged in the feeding plate. Beneficial effects

[0014] The utility model provides a LED lamp support with extension structure, which has the following beneficial effects compared with the prior art:

[0015] 1. The triangular cross section structure of the fractal fin realizes exponential growth of the heat dissipation area in a limited space through its self-similar geometric characteristics, and the layout mode of equal intervals ensures that the airflow passes through uniformly, and the sharp edges can effectively destroy the thermal boundary layer and produce micro-turbulence effect. The synergistic effect of the fractal fin and the heat dissipation fin forms a multi-stage heat dissipation system, greatly improves the heat dissipation efficiency per unit volume, and this design is particularly suitable for high-density LED array applications with limited space; the heat dissipation fin with gradually changing thickness is designed, the near end is thicker to ensure that the heat source has enough heat capacity, and the far end is thinner to promote rapid heat dissipation, and this gradient design makes the temperature distribution more uniform, effectively improving the heat dissipation effect.

[0016] 2, composite phase change material is filled to the bottom of the lamp cup special cavity by vacuum infusion process, the inner wall of the cavity is plated with 0.1mm thick copper layer to enhance heat conduction, the phase change material changes in the 55-60℃ interval, can quickly absorb the instantaneous heat of LED start-up; and, the cavity adopts double-layer sealing design, the inner layer is polyimide film, and the outer layer is silica gel sealing ring, ensures that there is no leakage in long-term use; graphene nanosheet is subjected to surface modification treatment, and three-step dispersion process is adopted to ensure uniform distribution in paraffin matrix. The composite material heat conduction network presents a three-dimensional structure, and the thermal conductivity is significantly improved. The microencapsulation treatment adopts sol-gel method to form a dense silica coating layer with a thickness of 50-100nm, which ensures heat conduction without affecting the phase change characteristics. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a three-dimensional structure schematic view when the utility model is connected to each other;

[0018] Figure 2 It is a structure schematic view of the utility model;

[0019] Figure 3 It is a structure schematic view of the utility model Figure 2 It is a structure schematic view of the utility model;

[0020] Figure 4 It is a structure schematic view of the utility model Figure 2 It is a structure schematic view of the utility model.

[0021] In the figure: 1, support mechanism; 11, main body assembly; 111, anode rod; 112, cathode rod; 113, anode wire holder; 114, cathode wire holder; 115, lamp cup; 116, composite phase change material; 117, bridging rod; 118, feeding plate; 119, positioning hole; 12, heat dissipation assembly; 121, extension plate; 122, heat dissipation fin; 123, fractal fin. DETAILED DESCRIPTION

[0022] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0023] Please refer to Figure 1 - Figure 4 The utility model provides a kind of technical scheme: a LED lamp support with extension structure, including support mechanism 1 and being used for LED chip installation, support mechanism 1 includes:

[0024] The main body assembly 11 comprises an anode rod 111 and a cathode rod 112 arranged in parallel with each other, and an anode lead frame 113 and a cathode lead frame 114 are arranged at the upper ends of the anode rod 111 and the cathode rod 112 respectively, and a lamp cup 115 is arranged at the upper end of the cathode lead frame 114;

[0025] The heat dissipation assembly 12 comprises an extension plate 121 arranged on the outer side of the anode lead frame 113 and the anode rod 111 and on the inner and outer sides of the cathode lead frame 114 and the cathode rod 112, and a plurality of heat dissipation fins 122 are arranged at equal intervals on the outer wall of the extension plate 121.

[0026] In the embodiment, the multidirectional arrangement of the extension plate 121 on the inner and outer sides of the lead frame and the rod body forms a three-dimensional heat dissipation network, which, in cooperation with the heat dissipation fins 122 arranged at equal intervals, significantly increases the heat dissipation surface area and enables the heat to be quickly dissipated through conduction and convection.

[0027] Specifically, the heat dissipation assembly 12 further comprises a plurality of fractal fins 123 arranged at equal intervals on the outer wall surfaces of both ends of the heat dissipation fins 122, and the cross section of the fractal fin 123 is triangular.

[0028] In the embodiment, the triangular cross section of the fractal fin 123 realizes exponential growth of the heat dissipation area in a limited space through its self-similarity geometric characteristics, and the equal-interval arrangement ensures that the airflow passes through uniformly, and the sharp edges can effectively destroy the thermal boundary layer and generate micro-turbulence effects. The synergistic effect of the fractal fin and the heat dissipation fin 122 forms a multi-stage heat dissipation system, which greatly improves the heat dissipation efficiency per unit volume, and this design is particularly suitable for high-density LED array applications with limited space.

[0029] Specifically, the heat dissipation fin 122 is thickened at one end close to the extension plate 121 with a thickness of 2 mm, and is thinned at the other end away from the extension plate 121 with a thickness of 1 mm.

[0030] In the embodiment, the heat dissipation fin with a gradually changing thickness is designed, the thicker near end ensures sufficient heat capacity at the heat source, and the thinner far end promotes rapid heat dissipation, and this gradient design makes the temperature distribution more uniform, effectively improving the heat dissipation effect.

[0031] Specifically, the main body assembly 11 further comprises a composite phase change material 116 filled in the bottom of the lamp cup 115.

[0032] In the embodiment, the composite phase change material 116 is filled into the specially designed cavity at the bottom of the lamp cup 115 by a vacuum pouring process, the inner wall of the cavity is plated with a 0.1 mm thick copper layer to enhance heat conduction, the phase change material undergoes phase change in the temperature range of 55-60℃, and can quickly absorb the instantaneous heat during LED startup; and the cavity adopts a double-layer sealing design, the inner layer is a polyimide film, and the outer layer is a silicone sealing ring, which ensures that there is no leakage during long-term use.

[0033] Specifically, the material of the composite phase change material 116 is paraffin plus graphene nanosheet.

[0034] In this embodiment, the graphene nanosheet is subjected to surface modification treatment, and a three-step dispersion process is adopted to ensure uniform distribution in the paraffin matrix.

[0035] Specifically, the main body assembly 11 further comprises a bridging rod 117 arranged between the anode rod 111 and the cathode rod 112, and a feeding plate 118 arranged between the lower ends of the anode rod 111 and the cathode rod 112, and the feeding plate 118 is internally provided with a positioning hole 119.

[0036] In this embodiment, the bridging rod 117 is made of copper-aluminum composite material, with a copper core in the middle to enhance conductivity and an aluminum layer on the outside to reduce weight.

[0037] The working principle and use process of the utility model are as follows: first, the extension plate 121 is arranged in multiple directions inside and outside the wire holder and the rod body to form a three-dimensional heat dissipation network, which is matched with the equidistantly distributed heat dissipation fins 122 to significantly increase the heat dissipation surface area, so that heat is quickly dissipated through conduction and convection; the triangular cross-section structure of the fractal fin 123 realizes exponential growth of the heat dissipation area in a limited space through its self-similarity geometric characteristics; the equidistant distribution ensures that the airflow passes through uniformly, and the sharp edges can effectively destroy the thermal boundary layer to produce a micro-turbulence effect. The synergistic effect of the fractal fin and the heat dissipation fin 122 forms a multi-stage heat dissipation system, which greatly improves the heat dissipation efficiency per unit volume. This design is particularly suitable for high-density LED array applications with limited space; the heat dissipation fin design with gradually increasing thickness ensures sufficient heat capacity at the heat source with a thicker end, and a thinner end promotes rapid heat dissipation. This gradient design makes the temperature distribution more uniform, effectively improving the heat dissipation effect.

[0038] The composite phase change material 116 is filled into the specially designed cavity at the bottom of the lamp cup 115 by vacuum infusion process, the inner wall of the cavity is plated with a 0.1mm thick copper layer to enhance heat conduction, the phase change material undergoes phase change in the range of 55-60℃, and can quickly absorb the instantaneous heat during LED startup; in addition, the cavity adopts a double-layer sealing design, the inner layer is a polyimide film, and the outer layer is a silicone sealing ring, which ensures no leakage during long-term use; the graphene nanosheet is subjected to surface modification treatment, and a three-step dispersion process is adopted to ensure uniform distribution in the paraffin matrix. The heat conduction network of the composite material presents a three-dimensional structure, and the thermal conductivity is significantly improved. The microencapsulation treatment adopts a sol-gel method to form a dense silica coating layer with a thickness of 50-100nm, which ensures heat conduction without affecting the phase change characteristics.

[0039] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0040] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. An LED light holder having an extended structure, characterized by: The application relates to a bracket mechanism (1) for LED chip mounting, which comprises the following steps: A main body assembly (11) comprises an anode rod (111) and a cathode rod (112) arranged in parallel, an anode lead frame (113) and a cathode lead frame (114) are arranged at the upper ends of the anode rod (111) and the cathode rod (112) respectively, and a lamp cup (115) is arranged at the upper end of the cathode lead frame (114); A heat dissipation assembly (12) comprises an extension plate (121) arranged on the outer side of the anode lead frame (113) and the anode rod (111) and on the inner and outer sides of the cathode lead frame (114) and the cathode rod (112), and a plurality of heat dissipation fins (122) are arranged on the outer wall of the extension plate (121) at equal intervals.

2. The LED lamp holder with extended structure according to claim 1, characterized in that: The heat dissipation assembly (12) further comprises a plurality of fractal fins (123) arranged at equal intervals on the outer wall surfaces of both ends of the heat dissipation fins (122), and the cross section of the fractal fins (123) is triangular.

3. The LED lamp holder with extended structure according to claim 1, characterized in that: The heat dissipation fins (122) are thickened at one end close to the extension plate (121) and have a thickness of 2mm, and are thinned at the other end away from the extension plate (121) and have a thickness of 1mm.

4. The LED lamp holder with extended structure according to claim 1, characterized in that: The main body assembly (11) further comprises a composite phase change material (116) filled in the bottom of the lamp cup (115).

5. The LED lamp holder with extended structure according to claim 4, characterized in that: The material of the composite phase change material (116) is paraffin and graphene nanosheet.

6. The LED lamp holder with extended structure according to claim 1, wherein: The main body assembly (11) further comprises a bridging rod (117) arranged between the anode rod (111) and the cathode rod (112), a feeding plate (118) arranged between the lower ends of the anode rod (111) and the cathode rod (112), and a positioning hole (119) formed in the feeding plate (118).

Citation Information

Patent Citations

  • LED (light emitting diode) lamp bracket

    CN206379381U