Circuit board heat dissipation structure and heat pump water heater

Abstract

The utility model relates to a circuit board heat dissipation structure and a heat pump water heater, the circuit board heat dissipation structure comprises a heat exchanger, the heat exchanger comprises a shell, a containing cavity is formed in the shell, and the containing cavity is used for containing water to be subjected to heat exchange; the heat conduction structure is installed on the shell, and one part of the heat conduction structure is configured to make contact with water in the containing cavity; the circuit board assembly is installed on the heat conduction structure, and the heat conduction structure makes contact with the circuit board assembly and is used for conducting cooling and heat dissipation on the circuit board assembly. By means of the arrangement, heat of the circuit board assembly can be conducted to water in the heat exchanger through the heat conduction structure, and therefore cooling and heat dissipation of the circuit board assembly are achieved. The heat dissipation mode is not affected by the environment temperature, and the good heat dissipation effect can still be achieved even under the condition that the environment temperature is high. Therefore, the damage risk of the heating element in the circuit board assembly can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat pump, in particular to a circuit board heat dissipation structure and a heat pump water heater. BACKGROUND

[0002] In the heat pump water heater, the circuit board assembly is an essential device for controlling the start-stop and working mode of the heat pump water heater. The circuit board assembly includes a circuit board and a plurality of heat generating elements located thereon. When the circuit board assembly is working, these heat generating elements will generate a large amount of heat, which will cause the heat generating elements to be damaged due to high temperature if not dissipated in time.

[0003] A heat dissipation means in the related art is to install heat dissipation fins on the fan cavity side of the circuit board assembly, aiming to conduct heat out. However, in the case of high ambient temperature, the heat dissipation fins have poor heat conduction effect, and the heat generating elements of the circuit board assembly still face a high risk of damage. CONTENT OF THE INVENTION

[0004] The present application provides a circuit board heat dissipation structure and a heat pump water heater, aiming to improve the heat dissipation effect of the circuit board assembly and reduce the damage risk of the heat generating elements in the circuit board assembly.

[0005] The first aspect of the present application provides a circuit board heat dissipation structure, which comprises: a heat exchanger, the heat exchanger comprising a shell, an accommodating cavity being formed in the interior of the shell, the accommodating cavity being used for accommodating water to be heat exchanged; a heat conduction structure, the heat conduction structure being installed on the shell, a part of the heat conduction structure being configured to be in contact with the water in the accommodating cavity; and a circuit board assembly, the circuit board assembly being installed on the heat conduction structure, the heat conduction structure being in contact with the circuit board assembly, for cooling and heat dissipation of the circuit board assembly.

[0006] The circuit board heat dissipation structure in the present application is provided with a heat conduction structure, the heat conduction structure being installed on the shell of the heat exchanger, a part of the heat conduction structure being in contact with the water in the accommodating cavity of the shell, and the circuit board assembly being installed on the heat conduction structure, the heat conduction structure also being in contact with the circuit board assembly. In this way, the heat of the circuit board assembly can be conducted to the water in the heat exchanger through the heat conduction structure, so as to achieve cooling and heat dissipation of the circuit board assembly. It can be understood that as long as the temperature of the water in the heat exchanger is lower than the temperature of the circuit board assembly, the process of conducting the heat of the circuit board assembly to the water can be realized, and therefore, this heat dissipation method is not affected by the ambient temperature, and even in the case of high ambient temperature, it can still have good heat dissipation effect. Thus, the damage risk of the heat generating elements in the circuit board assembly can be reduced.

[0007] In addition, while the water in the heat exchanger is used to cool the circuit board assembly, the heat of the circuit board assembly also has a certain heating effect on the water, which is also conducive to improving the heating effect of the heat pump water heater.

[0008] In some embodiments, the heat-conducting structure is provided with a heat-conducting surface outside the accommodating cavity; the circuit board assembly comprises a circuit board and a heating element arranged on the circuit board, the circuit board is fixedly connected with the heat-conducting structure, and the heating element is in contact with the heat-conducting surface.

[0009] In some embodiments, the circuit board heat dissipation structure further comprises a heat-conducting medium, which is in contact with the heating element and the heat-conducting surface.

[0010] In some embodiments, the heat-conducting structure comprises a main plate body and a mounting portion connected with the main plate body, the mounting portion is connected with the shell and in contact with the water in the accommodating cavity; the mounting portion is located on one side of the main plate body, the circuit board assembly is located on the other side of the main plate body, and the circuit board assembly is connected with the main plate body.

[0011] In some embodiments, the shell is provided with an opening, the mounting portion is arranged at the opening, and the mounting portion is sealingly connected with the shell; the shell and the mounting portion jointly define the accommodating cavity.

[0012] In some embodiments, the mounting portion is provided with heat exchange fins, and the heat exchange fins are located in the accommodating cavity.

[0013] In some embodiments, the mounting portion is a metal piece, the main plate body is a metal plate, and the mounting portion and the main plate body are an integral structure.

[0014] In some embodiments, the mounting portion is a metal piece, the main plate body is a uniform temperature plate, and the uniform temperature plate comprises a metal shell and a working fluid located inside the metal shell.

[0015] In some embodiments, the heat-conducting structure comprises a main plate body, the main plate body is arranged in the shell, a part of the main plate body is located in the accommodating cavity and in contact with the water in the accommodating cavity, and the other part of the main plate body is located outside the accommodating cavity; the circuit board assembly is connected with the part of the main plate body located outside the accommodating cavity.

[0016] In some embodiments, the main plate body is a metal plate.

[0017] In some embodiments, the main plate body is a uniform temperature plate, and the uniform temperature plate comprises a metal shell and a working fluid located inside the metal shell.

[0018] The embodiment of the second aspect of the application provides a heat pump water heater, which comprises a box body, a compressor and the circuit board heat dissipation structure in any of the above embodiments, the heat exchanger is connected with the compressor, and the heat exchanger, the compressor and the circuit board assembly are located in the box body.

[0019] In the heat pump water heater provided by the embodiment of the application, the circuit board heat dissipation structure is provided with a heat conduction structure, the heat conduction structure is mounted on the shell of the heat exchanger, a part of the heat conduction structure is in contact with water in the accommodating cavity of the shell, the circuit board assembly is mounted on the heat conduction structure, and the heat conduction structure is also in contact with the circuit board assembly. In this way, the heat of the circuit board assembly can be conducted to the water in the heat exchanger through the heat conduction structure, so that the cooling and heat dissipation of the circuit board assembly are realized. It can be understood that as long as the temperature of the water in the heat exchanger is lower than the temperature of the circuit board assembly, the process of conducting the heat of the circuit board assembly to the water can be realized, and therefore, the heat dissipation mode is not affected by the ambient temperature, and even in the case that the ambient temperature is high, the heat dissipation effect is still good. Therefore, the damage risk of the heating element in the circuit board assembly can be reduced. In addition, while the water in the heat exchanger is used to cool and dissipate heat of the circuit board assembly, the heat of the circuit board assembly also has a certain heating effect on the water, so that the heating effect of the heat pump water heater is also improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0021] Figure 1 A perspective structural schematic view of the circuit board heat dissipation structure provided by an embodiment of the application is shown in the figure.

[0022] Figure 2 A front view schematic view of the circuit board heat dissipation structure provided by an embodiment of the application is shown in the figure.

[0023] Figure 3 A side view schematic view of the circuit board heat dissipation structure provided by an embodiment of the application is shown in the figure.

[0024] Figure 4 A top view schematic view of the circuit board heat dissipation structure provided by an embodiment of the application is shown in the figure.

[0025] Figure 5 A perspective structural schematic view of the circuit board heat dissipation structure provided by another embodiment of the application is shown in the figure.

[0026] Figure 6 A front view schematic diagram of a circuit board heat dissipation structure according to another embodiment of the present application is provided.

[0027] Figure 7 A side view schematic diagram of a circuit board heat dissipation structure according to another embodiment of the present application is provided.

[0028] Figure 8 A top view schematic diagram of a circuit board heat dissipation structure according to another embodiment of the present application is provided.

[0029] Figure 9 A structural schematic diagram of a heat pump water heater according to an embodiment of the present application is provided.

[0030] Legend of reference signs:

[0031] 10, circuit board heat dissipation structure;

[0032] 100, heat exchanger; 110, shell; 111, water inlet; 112, water outlet; 113, refrigerant inlet; 114, refrigerant outlet;

[0033] 200, heat conduction structure; 201, heat conduction surface; 210, main plate body; 220, mounting portion; 230, connecting column; 240, screw;

[0034] 300, circuit board assembly; 310, circuit board; 320, heat generating element;

[0035] 20, heat pump water heater;

[0036] 21, box body;

[0037] 22, compressor;

[0038] 23, fan assembly. DETAILED DESCRIPTION

[0039] The principles and features of the present application are described below in conjunction with the accompanying drawings, and the examples are only used to explain the present application and not to limit the scope of the present application.

[0040] In a heat pump water heater, a circuit board assembly is an essential device for controlling the start-stop and working mode of the heat pump water heater. The circuit board assembly includes a circuit board and a plurality of heat generating elements located thereon. When the circuit board assembly is working, these heat generating elements will generate a large amount of heat, which will cause the heat generating elements to be damaged due to high temperature if not dissipated in time.

[0041] A heat dissipation means in the related art is to install a heat sink on the fan cavity side of the circuit board assembly, aiming to conduct heat out. However, in the case of high ambient temperature, the heat dissipation effect of the heat sink is poor, and the heat generating elements of the circuit board assembly still face a high risk of damage.

[0042] Embodiments of the first aspect of the present application provide a circuit board heat dissipation structure, Figure 1 A perspective view of the circuit board heat dissipation structure provided by an embodiment of the present application is shown in Figure 2 A front view of the circuit board heat dissipation structure provided by an embodiment of the present application is shown in Figure 3 A side view of the circuit board heat dissipation structure provided by an embodiment of the present application is shown in Figure 4 A top view of the circuit board heat dissipation structure provided by an embodiment of the present application is shown in Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown in the circuit board heat dissipation structure 10 includes a heat exchanger 100, a heat conduction structure 200 and a circuit board assembly 300. Specifically, the heat exchanger 100 includes a housing 110, the inside of the housing 110 forms an accommodation cavity, the accommodation cavity is used to accommodate water to be heat exchanged. The heat conduction structure 200 is installed on the housing 110, part of the heat conduction structure 200 is configured to be in contact with the water in the accommodation cavity, the circuit board assembly 300 is installed on the heat conduction structure 200, the heat conduction structure 200 is in contact with the circuit board assembly 300, and is used to cool and dissipate heat for the circuit board assembly 300.

[0043] Specifically, the heat exchanger 100 is a heat exchanger in a heat pump water heater 20. Generally, the heat pump water heater includes a compressor 22, a first heat exchanger, a throttling device and a second heat exchanger, which are connected in sequence to form a refrigerant circulation loop. In the process of refrigerant circulation, the refrigerant releases heat when passing through the first heat exchanger, and absorbs heat from the air when passing through the second heat exchanger. The first heat exchanger is the heat exchanger 100 in the circuit board heat dissipation structure 10. The heat exchanger 100 further includes a refrigerant pipe inside the housing 110, the accommodation cavity is used to accommodate water, and the refrigerant pipe is used for the refrigerant to pass through. The refrigerant releases heat during the process of passing through the refrigerant pipe, and the heat is transferred to the water in the accommodation cavity, thereby heating the water. It can be understood that the heat exchanger 100 has a water inlet 111, a water outlet 112, a refrigerant inlet 113 and a refrigerant outlet 114, wherein the water inlet 111 and the water outlet 112 are both in communication with the accommodation cavity, the water inlet 111 is used to make the water to be heated enter the accommodation cavity, and the water outlet 112 is used to make the heated water output from the accommodation cavity. The refrigerant inlet 113 and the refrigerant outlet 114 are both in communication with the refrigerant pipe, and are respectively used for the refrigerant to enter and leave the refrigerant pipe. Exemplarily, the heat exchanger 100 is a titanium tube heat exchanger 100, that is, the refrigerant pipe adopts a titanium tube, and the titanium tube heat exchanger 100 has the advantages of small volume and strong heat exchange capacity.

[0044] The heat pump water heater 20 is an apparatus capable of providing hot water. Exemplarily, it can be applied to heating swimming pool water. For example, the water inlet 111 and the water outlet 112 of the heat exchanger 100 are connected to the swimming pool through pipelines, so that the swimming pool water can be introduced into the heat exchange apparatus to be heated.

[0045] The circuit board heat dissipation structure 10 in the embodiments of the present application is provided with the heat conduction structure 200, which is installed on the shell 110 of the heat exchanger 100. A part of the heat conduction structure 200 is in contact with the water in the accommodating cavity of the shell 110. The circuit board assembly 300 is installed on the heat conduction structure 200, and the heat conduction structure 200 is also in contact with the circuit board assembly 300. In this way, the heat of the circuit board assembly 300 can be conducted to the water in the heat exchanger 100 through the heat conduction structure 200, so as to achieve the cooling and heat dissipation of the circuit board assembly 300. It can be understood that as long as the temperature of the water in the heat exchanger 100 is lower than the temperature of the circuit board assembly 300, the process of conducting the heat of the circuit board assembly 300 to the water can be realized. Therefore, this heat dissipation mode is not affected by the ambient temperature, and even in the case of high ambient temperature, it still has good heat dissipation effect. In this way, the damage risk of the heating element 320 in the circuit board assembly 300 can be reduced.

[0046] In addition, while the water in the heat exchanger 100 is used to cool and dissipate heat of the circuit board assembly 300, the heat of the circuit board assembly 300 also has a certain heating effect on the water. In this way, it is also beneficial to improve the heating effect of the heat pump water heater 20.

[0047] In some embodiments, as shown in Figure 2 , Figure 3 and Figure 4 , the heat conduction structure 200 is formed with a heat conduction surface 201, which is located outside the accommodating cavity. The circuit board assembly 300 includes a circuit board 310 and a heating element 320 arranged on the circuit board 310. The circuit board 310 is fixedly connected with the heat conduction structure 200, and the heating element 320 is in contact with the heat conduction surface 201.

[0048] The heat of the circuit board assembly 300 mainly comes from the heating element 320 on the circuit board 310, such as a rectifier bridge stack, an intelligent power module, an inverter module, etc. Therefore, by fixedly connecting the circuit board 310 with the heat conduction structure 200 and making the heating element 320 in contact with the heat conduction surface 201, the heat generated by the heating element 320 can be more efficiently conducted to the water in the heat exchanger 100, so as to improve the heat dissipation effect.

[0049] Further, as shown in Figure 2 , Figure 3As shown, the circuit board 310 can be connected with the heat-conducting structure 200 through the screws 240, and the connection manner is simple and the cost is low. Specifically, the heat-conducting structure 200 is provided with the connecting columns 230, the connecting columns 230 are provided with threaded holes, and correspondingly, the circuit board 310 is provided with connecting holes, the screws 240 are fixedly installed in the threaded holes after passing through the connecting holes, so as to fix the circuit board 310 on the heat-conducting structure 200. In addition, by arranging the connecting columns 230, a certain distance can be kept between the circuit board 310 and the heat-conducting surface 201 of the heat-conducting structure 200, so that a certain installation space can be provided for the heating elements 320 on the circuit board 310, so that the heating elements 320 can be in contact with the heat-conducting surface 201.

[0050] Further, the number of the connecting columns 230 is multiple, the connecting columns 230 are arranged at intervals, the number of the screws 240 is the same as that of the connecting columns 230, and the screws 240 and the connecting columns 230 are in one-to-one correspondence. In addition, the screws 240 are distributed at the edge positions of the circuit board 310.

[0051] The number of the connecting columns 230 is multiple, and the number of the screws 240 is also multiple, so that multiple connection points are formed between the circuit board 310 and the heat-conducting structure 200, thereby facilitating the improvement of the installation stability of the circuit board assembly 300. In addition, the screws 240 are distributed at the edge positions of the circuit board 310, so that the screws 240 and the connecting columns 230 can avoid the heating elements 320 on the circuit board 310, thereby avoiding the interference phenomenon between the connecting columns 230 and the heating elements 320.

[0052] In one of the embodiments, the circuit board heat-dissipating structure 10 further comprises a heat-conducting medium (not shown in the figure), which is in contact with the heating elements 320 and the heat-conducting surface 201.

[0053] For example, the heat-conducting medium can be heat-conducting silicone grease, heat-conducting silica gel, etc.

[0054] Since the heights of the heating elements 320 are difficult to be uniform, it is difficult to make all the heating elements 320 in contact with the heat-conducting surface 201. Based on the above situation, the circuit board heat-dissipating structure 10 further comprises a heat-conducting medium (not shown in the figure), which can fill the gap between the heating elements 320 and the heat-conducting surface 201, so as to have a better heat-conducting effect between the heating elements 320 and the heat-conducting structure 200.

[0055] In some embodiments, as Figures 1 to 4As shown, the heat conduction structure 200 comprises a main plate body 210 and a mounting portion 220 connected with the main plate body 210, the mounting portion 220 is connected with the shell 110 and contacts with the water in the accommodating cavity. The mounting portion 220 is located at one side of the main plate body 210, and the circuit board assembly 300 is located at the other side of the main plate body 210, and the circuit board assembly 300 is connected with the main plate body 210.

[0056] The mounting portion 220 is mainly used for connecting with the shell 110 of the heat exchanger 100, so as to realize the installation between the heat conduction structure 200 and the heat exchanger 100. In addition, a part of the surface of the mounting portion 220 faces the accommodating cavity, and the part of the surface can directly contact with the water in the accommodating cavity, so as to directly conduct heat to the water.

[0057] The mounting portion 220 is connected with the main plate body 210, so that the heat can be conducted between the main plate body 210 and the mounting portion 220. The main plate body 210 is a plate structure, so the surface of the side of the main plate body 210 away from the mounting portion 220 is the heat conduction surface 201, which makes the heat conduction structure 200 have a larger heat conduction surface 201, so that the heat generating elements 320 in the circuit board assembly 300 can all contact the heat conduction surface 201.

[0058] In one of the embodiments, the shell 110 is provided with an opening, and the mounting portion 220 is arranged at the opening, and the mounting portion 220 is sealingly connected with the shell 110, and the shell 110 and the mounting portion 220 jointly define the accommodating cavity.

[0059] In this embodiment, the mounting portion 220 and the shell 110 are sealingly connected, and the mounting portion 220 and the shell 110 jointly enclose the inner cavity of the heat exchanger 100, which is beneficial to increasing the contact area between the mounting portion 220 and the water, so as to improve the heat conduction efficiency, and also makes the mounting portion 220 not occupy the space in the shell 110, so as to ensure that the accommodating cavity has a relatively large volume, and further improve the heating effect of the heat pump water heater 20 during working.

[0060] Further, the mounting portion 220 is provided with heat exchange fins (not shown in the figure) located in the accommodating cavity. By arranging the heat exchange fins, the contact area between the mounting portion 220 and the water can be increased, so as to improve the heat conduction efficiency between the heat conduction structure 200 and the water.

[0061] In one of the embodiments, the mounting portion 220 is a metal piece, and the main plate body 210 is a metal plate, and the mounting portion 220 and the main plate body 210 are an integral structure.

[0062] For example, the mounting portion 220 is an aluminum piece, and the main plate body 210 is an aluminum plate, or the mounting portion 220 is a copper piece, and the main plate body 210 is a copper plate.

[0063] The metal has good thermal conductivity, the mounting portion 220 is a metal piece, and the main plate body 210 is a metal plate, so that the heat conduction structure 200 has good thermal conductivity. In addition, the mounting portion 220 and the main plate body 210 are integrated, that is, the mounting portion 220 and the main plate body 210 are integrated when they are formed, so that one assembly environment can be reduced during assembly, which is beneficial to improve production efficiency.

[0064] In another embodiment, the mounting portion 220 is a metal piece, and the main plate body 210 is a uniform temperature plate including a metal shell and a working fluid inside the metal shell.

[0065] The uniform temperature plate is also called a heat conduction plate or a super heat conduction plate. Generally, the uniform temperature plate adopts a metal shell and has high thermal conductivity. An airtight inner cavity is formed in the metal shell, and a wick is attached to the side wall of the inner cavity. The working principle of the uniform temperature plate is as follows: when heat is applied to the bottom of the uniform temperature plate, the working fluid evaporates with the increase of heat, the steam rises to the top of the inner cavity to condense, and the wick returns to the evaporation surface to form a cycle. The uniform temperature plate has small spreading thermal resistance and high uniform temperature characteristics, and is a high-efficiency heat conduction device.

[0066] In this embodiment, the mounting portion 220 is a metal piece, and the main plate body 210 is a uniform temperature plate. The high efficiency of the uniform temperature plate can make the heat conduction structure 200 have good thermal conductivity and high thermal efficiency.

[0067] Further, the shell 110 of the heat exchanger 100 can be a plastic shell 110, such as a PVC (polyvinyl chloride) shell 110. In the case where the mounting portion 220 is a metal piece, the mounting portion 220 and the shell 110 can be connected by a sealant, which realizes sealing while connecting.

[0068] Figure 5 A perspective view of a circuit board heat dissipation structure according to another embodiment of the present application is shown in FIG. 4A, Figure 6 A front view of a circuit board heat dissipation structure according to another embodiment of the present application is shown in FIG. 4B, Figure 7 A side view of a circuit board heat dissipation structure according to another embodiment of the present application is shown in FIG. 4C, Figure 8 A top view of a circuit board heat dissipation structure according to another embodiment of the present application is shown in FIG. 4D. As shown in Figure 5 、 Figure 6 、 Figure 7 and Figure 8 In some embodiments, the heat conduction structure 200 includes a main plate body 210, the main plate body 210 is arranged in the shell 110, a portion of the main plate body 210 is located in the containing cavity and contacts water in the containing cavity, and another portion of the main plate body 210 is located outside the containing cavity. The circuit board assembly 300 is connected to the portion of the main plate body 210 located outside the containing cavity.

[0069] In this embodiment, the heat-conducting structure 200 comprises a main plate body 210, which is arranged through the shell 110 of the heat exchanger 100, so that a part of the main plate body 210 is located in the containing cavity, and another part is located outside the containing cavity. The part of the main plate body 210 located in the containing cavity can be directly contacted with the water in the containing cavity, and the circuit board assembly 300 can be installed on the part of the main plate body 210 located outside the containing cavity. The heat generated by the circuit board assembly 300 during operation can be directly conducted to the water in the containing cavity through the main plate body 210, so as to cool and dissipate heat for the circuit board assembly 300.

[0070] It can be understood that after the circuit board assembly 300 is installed on the main plate body 210, the circuit board 310 in the circuit board assembly 300 and the main plate body 210 are in parallel or close to parallel with each other. Therefore, in this embodiment, since the main plate body 210 is arranged through the shell 110 of the heat exchanger 100, the plane where the circuit board 310 is located also passes through the shell 110 of the heat exchanger 100. In the foregoing embodiment in which the main plate body 210 is connected to the shell 110 through the mounting portion 220, the circuit board assembly 300 is arranged on the side of the main plate body 210 away from the mounting portion 220, in which case, the plane where the circuit board 310 is located does not pass through the shell 110 of the heat exchanger 100. Therefore, in the two embodiments, the installation positions of the circuit board assembly 300 relative to the heat exchanger 100 are different, and in actual application, a suitable arrangement can be selected according to the actual application environment, for example, a suitable scheme can be selected according to the internal layout of the actual heat pump water heater 20 product, so as to avoid interference between the circuit board assembly 300 and other structures.

[0071] Further, a sealing member is arranged between the main plate body 210 and the shell 110, for example, a sealing glue is arranged at the position where the main plate body 210 passes through the shell 110, so as to ensure that the main plate body 210 and the shell 110 are sealingly connected, thereby preventing the heat exchanger 100 from leaking water.

[0072] In one of the embodiments, the main plate body 210 is a metal plate, such as an aluminum plate or a copper plate. A part of the metal plate is located in the containing cavity and directly contacted with the water in the containing cavity, and the circuit board assembly 300 is installed on the part of the metal plate located outside the containing cavity. The good heat-conducting performance of the metal plate is utilized to conduct the heat of the circuit board assembly 300 to the water in the heat exchanger 100, so as to cool and dissipate heat for the circuit board assembly 300.

[0073] In another embodiment, the main plate body 210 is a uniform temperature plate, which includes a metal shell and a working fluid inside the metal shell. As known from the foregoing, the uniform temperature plate has a small thermal spreading resistance and a high uniform temperature characteristic, and is a high-efficiency heat conduction device. Therefore, the heat of the circuit board assembly 300 can also be conducted to the water in the heat exchanger 100 through the uniform temperature plate, so as to obtain better heat conduction efficiency.

[0074] Embodiments of the second aspect of the present application provide a heat pump water heater, Figure 9 A structural schematic diagram of a heat pump water heater provided by an embodiment of the present application is shown in FIG. 2. As shown in FIG. 2, the heat pump water heater 20 includes a box body 21, a compressor 22, and the circuit board heat dissipation structure 10 in any of the above embodiments, wherein the heat exchanger 100 is connected to the compressor 22, and the heat exchanger 100, the compressor 22, and the circuit board assembly 300 are all located in the box body 21. Figure 9

[0075] In the heat pump water heater 20 in the embodiments of the present application, the circuit board heat dissipation structure 10 is provided with the heat conduction structure 200, the heat conduction structure 200 is installed on the shell 110 of the heat exchanger 100, a part of the heat conduction structure 200 is in contact with the water in the accommodating cavity of the shell 110, the circuit board assembly 300 is installed on the heat conduction structure 200, and the heat conduction structure 200 is also in contact with the circuit board assembly 300. In this way, the heat of the circuit board assembly 300 can be conducted to the water in the heat exchanger 100 through the heat conduction structure 200, so as to achieve cooling and heat dissipation of the circuit board assembly 300. It can be understood that as long as the temperature of the water in the heat exchanger 100 is lower than the temperature of the circuit board assembly 300, the process of conducting the heat of the circuit board assembly 300 to the water can be realized, and therefore, this heat dissipation mode is not affected by the ambient temperature, and even in the case of a high ambient temperature, it still has a good heat dissipation effect. In this way, the damage risk of the heating element 320 in the circuit board assembly 300 can be reduced.

[0076] In addition, while the water in the heat exchanger 100 is used to cool and dissipate heat of the circuit board assembly 300, the heat of the circuit board assembly 300 also has a certain heating effect on the water, which is also conducive to improving the heating effect of the heat pump water heater 20.

[0077] In some embodiments, the heat pump water heater 20 further includes a fan assembly 23 and a second heat exchanger, both of which are arranged in the box body 21, and the box body 21 is provided with a ventilation opening, which communicates the internal space of the box body 21 with the external space.

[0078] ​The heat pump water heater 20 releases heat from the heat exchanger 100 to heat the water in the containing cavity when working. The second heat exchanger is used to absorb heat from the air. The fan assembly 23 is used to make the air outside enter the box 21, and make the air in the box 21 exhaust to the outside of the box 21, that is, to form an air circulation between the inside and outside of the box 21. The air entering the box 21 exchanges heat with the refrigerant passing through the second heat exchanger in the second heat exchanger, so that the refrigerant passing through the second heat exchanger can absorb heat from the air.

[0079] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0080] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0081] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0082] In the present application, unless specifically stated and limited otherwise, a first feature "on" or "under" a second feature can be directly in contact with the second feature, or indirectly in contact with the second feature through an intermediate medium. Also, a first feature "over", "above" and "on top of" a second feature can be directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature "under", "below" and "underneath" a second feature can be directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0083] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the present application. The illustrative appearance of the above terms in various places in the description are not necessarily referring to the same embodiment or example. Also, the particular features, structures, materials or characteristics can be combined in any suitable manner in one or more embodiments or examples. Moreover, the different embodiments or examples described in the specification can be combined and combined with each other in suitable manners, without mutual contradiction.

[0084] Although the embodiments of the present application have been shown and described above, it is to be understood that the above-described embodiments are exemplary, and cannot be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.

Claims

1. A circuit board heat dissipation structure, characterized by comprising: The heat exchanger comprises a shell, an accommodation cavity is formed in the interior of the shell, and the accommodation cavity is used for accommodating water to be heat exchanged. The heat conduction structure is installed on the shell, and a part of the heat conduction structure is configured to be in contact with the water in the accommodation cavity. The circuit board assembly is installed on the heat conduction structure, and the heat conduction structure is in contact with the circuit board assembly and used for cooling and dissipating heat for the circuit board assembly. The heat conduction structure comprises a main plate body and a mounting portion connected with the main plate body, the mounting portion is connected with the shell and in contact with the water in the accommodation cavity, the mounting portion is located on one side of the main plate body, the circuit board assembly is located on the other side of the main plate body, and the circuit board assembly is connected with the main plate body. Alternatively, the heat conduction structure comprises a main plate body, the main plate body is arranged in the shell, a part of the main plate body is located in the accommodation cavity and in contact with the water in the accommodation cavity, and the other part of the main plate body is located outside the accommodation cavity, and the circuit board assembly is connected with the part of the main plate body located outside the accommodation cavity. The heat conduction structure is formed with a heat conduction surface located outside the accommodation cavity. The circuit board assembly comprises a circuit board and a heating element arranged on the circuit board, the circuit board is fixedly connected with the heat conduction structure, and the heating element is in contact with the heat conduction surface.

2. The circuit board heat dissipating structure according to claim 1, wherein The circuit board heat dissipation structure further comprises a heat conduction medium in contact with the heating element and the heat conduction surface. In the case that the heat conduction structure comprises a main plate body and a mounting portion connected with the main plate body, the mounting portion is connected with the shell and in contact with the water in the accommodation cavity, the shell is provided with an opening, the mounting portion is arranged at the opening, and the mounting portion is sealingly connected with the shell; and the shell and the mounting portion jointly define the accommodation cavity.

3. The circuit board heat dissipating structure according to claim 2, wherein The mounting portion is provided with heat exchange fins located in the accommodation cavity.

4. The circuit board heat dissipating structure according to claim 1, wherein The mounting portion is a metal piece, the main plate body is a metal plate, and the mounting portion and the main plate body are in an integrated structure.

5. The circuit board heat dissipating structure according to claim 4, wherein The mounting portion is a metal piece, the main plate body is a uniform temperature plate, and the uniform temperature plate comprises a metal shell and working fluid located in the interior of the metal shell.

6. The circuit board heat dissipating structure according to claim 1 or 4 or 5, wherein In the case that the heat conduction structure comprises a main plate body arranged in the shell, the main plate body is a metal plate.

7. The circuit board heat dissipating structure according to claim 1 or 4 or 5, wherein In the case that the heat conduction structure comprises a main plate body arranged in the shell, the main plate body is a uniform temperature plate, and the uniform temperature plate comprises a metal shell and working fluid located in the interior of the metal shell.

8. The circuit board heat dissipating structure according to claim 1, wherein The box body; 9. The circuit board heat dissipating structure according to claim 1, wherein The compressor; 10. A heat pump water heater, characterized by, And The circuit board heat dissipation structure in any one of claims 1 to 9, the heat exchanger is connected with the compressor, and the heat exchanger, the compressor and the circuit board assembly are located in the box body. ​ ​ ​

Images