Heating and power generation dual-mode semiconductor chip heating system of hybrid electric vehicle
By combining TEC semiconductor cooling chips and TEG thermoelectric generators in the heating system of hybrid vehicles, the problem of insufficient range caused by a single heating method is solved, enabling power generation during heating and increasing range.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-23
- Publication Date
- 2026-03-31
AI Technical Summary
The heating methods of existing hybrid vehicle heating systems are limited, resulting in insufficient driving range and increasing drivers' range anxiety.
It adopts a hybrid setup of TEC semiconductor cooling chip and TEG thermoelectric generator, using the heat generated during engine or motor drive to generate electricity while providing warm air, thereby increasing the driving range through thermoelectric power generation.
It generates electricity while providing heating, increasing the car's driving range. In particular, when heating is not needed, it uses the engine's hot water to generate electricity through temperature difference, increasing energy storage.
Smart Images

Figure CN224060811U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an automotive heating system, specifically to a hybrid vehicle heating and power generation dual-mode semiconductor chip heating system. Background Technology
[0002] Existing automotive heating systems can be divided into waste heat heating systems suitable for engine-powered vehicles and PTC heating systems suitable for electric vehicles. Hybrid vehicle heating systems primarily utilize engine waste heat, with PTC heating as a supplement. Existing patent applications CN202311045957.3 and CN202222310386.9 demonstrate that semiconductor heating can replace PTC heating, a method applicable to the heating systems of both electric and hybrid vehicles.
[0003] However, all of the aforementioned existing technologies rely on a single heating method, which results in insufficient driving range for the vehicle and significantly increases the driver's range anxiety. Utility Model Content
[0004] The technical problem to be solved by this utility model is: how to increase the driving range of a car, and to provide a hybrid car heating and power generation dual-mode semiconductor chip heating system.
[0005] To solve the above problems, this utility model is achieved through the following technical solution:
[0006] A hybrid vehicle heating and power generation dual-mode semiconductor chip heating system includes an inlet tank and an outlet tank, which are connected by several sets of water channels.
[0007] The water channel is provided with heat dissipation metal plates on both sides, or a dual-mode channel for heating and power generation is provided on both sides of the water channel, wherein the dual-mode channel for heating and power generation is provided with a water channel and a heat dissipation metal plate on both sides.
[0008] The dual-mode heating and power generation channel is provided with a mixed arrangement of TEC semiconductor cooling chip and TEG thermoelectric generator. The mixed arrangement means that: the dual-mode heating and power generation channel is provided with at least one TEG thermoelectric generator, or the dual-mode heating and power generation channel is provided with at least one TEC semiconductor cooling chip, or the dual-mode heating and power generation channel is provided with at least one TEC semiconductor cooling chip and at least one TEG thermoelectric generator.
[0009] The number of TEG thermoelectric generators is calculated using the following formula:
[0010]
[0011] Where, N TEGThe number of TEG thermoelectric generators must meet the requirements under two conditions: K=0 and K=1. K=0 represents the engine operating condition, and K=1 represents the electric motor operating condition. TEC η represents the TEC output power; β represents the TEC's coefficient of performance (COP); T1 represents the inlet water temperature; T2 represents the outlet water temperature; P F The required thermal power for the cab is related to the air intake speed, ambient temperature, and the set air intake temperature of the cab; α represents the performance parameters of the TEG thermoelectric generator, which are determined by the electromotive force and internal resistance of the TEG thermoelectric generator; ΔT represents the temperature difference between the hot and cold sides of the thermoelectric generator.
[0012] When both the heating and power generation dual-mode channel are equipped with TEC semiconductor cooling chips and TEG thermoelectric generators, the TEC semiconductor cooling chips and TEG thermoelectric generators are arranged alternately.
[0013] Compared with existing technologies, this invention has the following advantages: When a hybrid vehicle requires heating, it can generate electricity while providing heating via the electric motor or engine, thus increasing the vehicle's range. When heating is not needed, the hot water generated during engine operation can also be used for thermoelectric power generation, but air needs to be supplied to cool the fins and the heated air needs to be exhausted outside the vehicle to maintain the temperature difference between the two sides of the TEG thermoelectric generator for thermoelectric power generation, thereby increasing the vehicle's range. Attached Figure Description
[0014] Figure 1 This is the first structural diagram of the present utility model;
[0015] Figure 2 This is a second structural diagram of the present invention. Detailed Implementation
[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0017] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0018] like Figure 1 , Figure 2 As shown, a hybrid vehicle heating and power generation dual-mode semiconductor chip heating system includes an inlet tank 5 and an outlet tank 6, which are connected by several sets of water channels 1.
[0019] The water channel 1 is provided with heat dissipation metal plates 3 on both sides, or the water channel 1 is provided with a dual-mode channel for heating and power generation on both sides, and the dual-mode channel for heating and power generation is provided with water channel 1 and heat dissipation metal plates 3 on both sides respectively.
[0020] The dual-mode heating and power generation channel incorporates a TEC thermoelectric cooler 4 and a TEG thermoelectric generator 2. This "mixed configuration" means that the dual-mode heating and power generation channel contains at least one TEG thermoelectric generator 2, or at least one TEC thermoelectric cooler 4, or at least one TEC thermoelectric cooler 4 and at least one TEG thermoelectric generator 2. It should be noted that both the TEC thermoelectric cooler 4 and the TEG thermoelectric generator 2 are connected to an automotive controller.
[0021] When both the heating and power generation dual-mode channels are equipped with TEC semiconductor cooling chips 4 and TEG thermoelectric generators 2, they can be staggered or arranged in other ways. The number and arrangement of the two functional semiconductor chips, TEC semiconductor cooling chips 4 and TEG thermoelectric generators 2, are determined based on the inlet water temperature, ambient temperature, flow rate, and temperature uniformity of the heater core. The number of TEG thermoelectric generators 2 can be calculated using the following formula:
[0022]
[0023] Where, N TEG The number of TEG thermoelectric generators 2 must meet the requirements under two conditions: K=0 and K=1. K=0 represents the engine operating condition, and K=1 represents the electric motor operating condition; P TEC η represents the TEC output power; β represents the TEC's coefficient of performance (COP); T1 represents the inlet water temperature; T2 represents the outlet water temperature; P F The required thermal power for the cab is related to the air intake speed, ambient temperature, and the set air intake temperature for the cab; α represents the performance parameters of the TEG thermoelectric generator, which are determined by the electromotive force and internal resistance of the TEG thermoelectric generator; ΔT represents the temperature difference between the hot and cold sides of the thermoelectric generator.
[0024] Figure 1The first structural diagram of this patent application shows that the heating system has ten water channels 1, and the inner sides of the top and bottom water channels 1 are respectively provided with heating and power generation dual-mode channels; inside the heating system, there are two water channels 1 with heating and power generation dual-mode channels on both sides, and the remaining water channels 1 are respectively provided with heat dissipation metal plates 3 on both sides.
[0025] Furthermore, the top and bottom heating and power generation dual-mode channels are equipped with four TEG thermoelectric generators 2.
[0026] The heating and power generation dual-mode channels inside the heating system are mixed with TEC semiconductor cooling chip 4 and TEG thermoelectric generator 2, and the TEC semiconductor cooling chip 4 and TEG thermoelectric generator 2 are arranged alternately.
[0027] exist Figure 1 In the illustrated embodiment, when the car engine is running and the heating system is activated, the TEC thermoelectric cooler 4 is not working. Engine coolant enters the inlet tank 5 and flows into the outlet tank 6 through the water channel 1. The water channel 1 transfers heat to the heat dissipation metal plate 3 via heat conduction, and then the heat from the heat dissipation metal plate 3 is blown into the passenger compartment by airflow. Hot water entering the inlet tank 5 and flowing into the water channel 1 provides heat to the hot side of the TEG thermoelectric generator 2. The heat dissipation metal plate 3 cools the cold side of the TEG thermoelectric generator 2 through air cooling, maintaining the temperature difference between the two sides of the TEG thermoelectric generator 2 to generate electricity, thereby increasing the car's driving range. When the car motor is running and the heating system is activated, ambient water enters the inlet tank 5 and flows into the outlet tank 6 through the water channel 1. At this time, the TEC thermoelectric cooler 4 is activated. The heat generated by the hot side of the TEC thermoelectric cooler 4 heats the heat dissipation metal plate 3. The airflow and the heat dissipation metal plate 3 exchange heat through convection, thus blowing the hot air into the passenger compartment. At the same time, the cooling energy generated by the cold side of the TEC thermoelectric cooler 4 is carried away through the water channel 1. When the heating system is activated, the TEC thermoelectric cooler 4 heats the heat dissipation metal plate 3 and can transfer heat to the hot side of the TEG thermoelectric generator 2. The ambient water dissipates heat to the cold side of the TEG thermoelectric generator 2, maintaining the temperature difference between the two sides of the TEG thermoelectric generator 2 to generate electricity, thereby increasing the vehicle's driving range.
[0028] Figure 2 exist Figure 1 The arrangement of the two functional semiconductor chips, TEC semiconductor cooling chip 4 and TEG thermoelectric generator 2, was optimized based on the inlet water temperature, ambient temperature, flow rate, and temperature uniformity of the heater core. Figure 2 In this design, the heat dissipation metal plate 3, water channel 1, TEC semiconductor cooling chip 4, and TEG thermoelectric generator 2 are arranged in an optimized manner. Compared to Figure 1 , Figure 2The dual-mode system of heating and power generation is more suitable for cold environments.
[0029] exist Figure 2 The heating system has six dual-mode channels for heating and power generation. Each dual-mode channel is equipped with a TEC semiconductor cooling chip 4 and a TEG thermoelectric generator 2, which are arranged alternately.
[0030] Figure 2 The embodiment increases the number of TEC semiconductor cooling chips 4 and optimizes the distribution of water channels 1 and heat dissipation metal plates 3, thereby enabling the heating system to respond faster in cold environments. The cross-arrangement of TEC semiconductor cooling chips 4 and TEG thermoelectric generators 2 can also increase the uniformity of air supply temperature.
[0031] When the hybrid vehicle's engine is running, engine coolant flows into the water tank and is heated by heat transfer between the water channel 1 and the heat dissipation metal plate 3, as well as by heat transfer between the air and the heat dissipation metal plate 3, thus heating the air supply and delivering it into the passenger compartment. Simultaneously, the hot water heats the hot side of the TEG thermoelectric generator 2, while the air supply cools the cold side, maintaining the temperature difference between the two sides of the TEG thermoelectric generator 2 for power generation. When the hybrid vehicle's electric motor is running, ambient temperature water flows into the water channel and heats the heat dissipation metal plate 3 via the TEC semiconductor cooling chip 4. Heat transfer is then completed through heat convection between the air supply and the heat dissipation metal plate 3, heating the air supply and delivering it into the passenger compartment. Room temperature water cools the cold side of the TEG thermoelectric generator 2, while the hot side of the TEG thermoelectric generator 2 is heated by the hot side of the TEC semiconductor cooling chip 4, thus maintaining the temperature difference between the two sides of the TEG thermoelectric generator 2 for power generation.
[0032] The beneficial effects of this invention are that when a hybrid vehicle needs heating, it can generate electricity while providing heating during motor or engine operation, thereby increasing the vehicle's range. When heating is not needed, the hot water generated during engine operation can also be used for thermoelectric power generation, but air needs to be supplied to cool the fins and the heated air needs to be exhausted outside the vehicle to maintain the temperature difference between the two sides of the TEG thermoelectric generator 2 for thermoelectric power generation, thereby increasing the vehicle's range.
[0033] The above description is only a preferred embodiment of the present utility model. It should be noted that those skilled in the art can make several changes and improvements without departing from the overall concept of the present utility model, and these should also be considered within the protection scope of the present utility model.
Claims
1. A hybrid vehicle heating and power generation dual-mode semiconductor chip heating system, characterized by: It comprises a water inlet box (5) and a water outlet box (6), and the water inlet box (5) and the water outlet box (6) are connected through a plurality of groups of water channels (1); The water channel (1) is provided with a heat dissipation metal sheet (3) on both sides, or a heating and power generation dual-mode channel is arranged on both sides of the water channel (1), and both sides of the heating and power generation dual-mode channel are respectively the water channel (1) and the heat dissipation metal sheet (3).
2. The hybrid vehicle heating and power generation dual-mode semiconductor chip air heating system according to claim 1, characterized in that: In the heating and power generation dual-mode channel, a TEC semiconductor refrigeration sheet (4) and a TEG thermoelectric generator sheet (2) are mixedly arranged, and the mixed arrangement means that at least one TEG thermoelectric generator sheet (2) is arranged in the heating and power generation dual-mode channel, or at least one TEC semiconductor refrigeration sheet (4) is arranged in the heating and power generation dual-mode channel, or at least one TEC semiconductor refrigeration sheet (4) and at least one TEG thermoelectric generator sheet (2) are arranged in the heating and power generation dual-mode channel.
3. The hybrid vehicle heating and power generation dual-mode semiconductor chip air heating system according to claim 1, characterized in that: The number of TEG thermoelectric generator sheets (2) is calculated according to the following formula: Wherein, N TEG is the number of TEG thermoelectric generator pieces (2), which needs to meet the requirements of K=0 and K=1, wherein K=0 represents the engine working condition, and K=1 represents the motor working condition; P TEC represents the TEC output power; η represents the refrigeration performance coefficient of the TEC; β represents the water property parameter; T1 represents the inlet water temperature; T2 represents the outlet water temperature; P F represents the heat power required by the cab, which is related to the inlet air speed, the environment temperature and the cab set inlet air temperature; α represents the performance parameter of the TEG thermoelectric generator piece, which is determined by the electromotive force and internal resistance of the TEG thermoelectric generator piece (2); ΔT represents the temperature difference between the hot surface and the cold surface of the thermoelectric generator piece.
4. The hybrid vehicle heating and power generation dual-mode semiconductor chip air heating system of claim 1, wherein: When the TEC semiconductor refrigeration sheet (4) and the TEG thermoelectric generator sheet (2) are arranged in the heating and power generation dual-mode channel, the TEC semiconductor refrigeration sheet (4) and the TEG thermoelectric generator sheet (2) are arranged alternately.
Citation Information
Patent Citations
New energy automobile heating system based on semiconductor refrigeration
CN117067863A
Warm air radiator and automobile air conditioner heating system based on same
CN218430774U