Evaporation device and evaporation array

Abstract

The utility model discloses an evaporation device and an evaporation array. The evaporation device comprises a melting area, a diversion trench and an evaporation area, the melting area is connected with the evaporation area through a diversion trench; the melting area is used for placing a metal aluminum wire to be molten, the flow guide groove is used for guiding metal aluminum liquid formed by melting the metal aluminum wire in the melting area to the evaporation area, and the evaporation area is used for evaporation coating; the evaporation area is of a fan-shaped structure, the fan-shaped structure is provided with a narrow end and a wide end, and the narrow end is provided with a first connector; a second connecting port is formed in one side of the melting area; and the first connecting port and the second connecting port are respectively connected with two ends of the diversion trench. Through the arrangement of the structure, the evaporation stability can be improved, the evaporation film forming quality is improved, and the space layout of an evaporation array is optimized.

Description

Technical Field

[0001] This utility model relates to the field of vapor deposition technology, specifically to a vapor deposition apparatus and vapor deposition array. Background Technology

[0002] With the increasing application of functional current collectors in battery current collectors, improving the vapor deposition efficiency of multilayer functional aluminum foil has become one of the key research topics in the industry. Multilayer functional aluminum foil is manufactured by depositing an aluminum layer onto the surface of a polymer substrate via vapor deposition. Vapor deposition involves continuously feeding aluminum wire into a high-temperature evaporating dish to melt and form aluminum vapor, which is then deposited onto the polymer substrate.

[0003] The existing vapor deposition machines have the following problems with the evaporation vessels: (1) the evaporation vessel is prone to splashing aluminum; (2) the aluminum liquid on the surface of the evaporation vessel cannot be spread; (3) the amount of aluminum vapor generated by the evaporation vessel is unstable; (4) when the aluminum wire touches the vessel during evaporation, it is easy to cause shaking, and the aluminum liquid at the tip is easy to splash; (5) the contact point between the evaporation vessel and the aluminum wire is prone to impact corrosion and cracking. Utility Model Content

[0004] The purpose of this invention is to address the above-mentioned problems by providing a vapor deposition apparatus and a vapor deposition array.

[0005] To achieve the above objectives, the technical solution provided by this utility model is as follows:

[0006] A vapor deposition apparatus includes a melting zone, a guide channel, and an evaporation zone; the melting zone is connected to the evaporation zone via the guide channel; the melting zone is used to place a metal aluminum wire to be melted, the guide channel is used to guide the molten metal aluminum formed by the metal aluminum wire in the melting zone to the evaporation zone, and the evaporation zone is used for vapor deposition.

[0007] The evaporation zone has a fan-shaped structure with a narrow end and a wide end. The narrow end has a first connection port. The melting zone has a second connection port on one side. The first connection port and the second connection port are respectively connected to the two ends of the guide groove.

[0008] To optimize the above technical solution, the specific measures also include:

[0009] The melting zone is higher than the evaporation zone, and the surface of the guide channel is inclined from the melting zone to the evaporation zone.

[0010] Furthermore, the inner surface of the evaporation zone is provided with evaporation grid grooves.

[0011] A wire feeding device is provided in conjunction with the melting zone, and the wire feeding point of the wire feeding device is located in the middle of the melting zone.

[0012] The heating devices for the melting zone and the evaporation zone are set independently: a first heating device is provided at the bottom of the melting zone, and a second heating device is provided at the bottom of the evaporation zone.

[0013] Furthermore, the wire feeding device is located on the side of the melting zone away from the guide channel and the evaporation zone.

[0014] Furthermore, the melting zone, the guide channel, and the evaporation zone are an integral structure.

[0015] This invention also provides a vapor deposition array, comprising several of the above-mentioned vapor deposition devices.

[0016] Each vapor deposition unit is arranged in opposite directions to adjacent vapor deposition units; in any two adjacent vapor deposition units, the narrow end of one fan-shaped structure is located next to the wide end of the other fan-shaped structure.

[0017] It also includes several wire feeding devices; the vapor deposition devices arranged in opposite directions form two groups of vapor deposition devices with different orientations. Each group of vapor deposition devices corresponds to a group of wire feeding devices arranged in the same row, forming a group of wire feeding devices; each vapor deposition device corresponds one-to-one with each wire feeding device.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] The vapor deposition apparatus of this invention includes a melting zone, a guide channel, and an evaporation zone. The evaporation zone has a fan-shaped structure. The structure of this invention can improve the stability of vapor deposition and the quality of the vapor-deposited film. This invention also optimizes the spatial layout of the vapor deposition array through the above structural design, which is beneficial to improving the vapor deposition quality and work efficiency. Attached Figure Description

[0020] Figure 1 : A schematic diagram of the vapor deposition apparatus of this utility model.

[0021] Figure 2 : A schematic diagram of the vapor deposition array of this utility model.

[0022] In the diagram: 1-Melting zone, 2-Guide groove, 3-Evaporation zone, 4-Narrow end, 5-Wide end, 6-First connection port, 7-Second connection port, 8-Evaporation grid groove, 9-Wire feeding device, 10-First vapor deposition device orientation group, 11-Second vapor deposition device orientation group, 12-First wire feeding device group, 13-Second wire feeding device group; 14-Aluminum wire, 15-Molten aluminum, 16-Aluminum vapor. Detailed Implementation

[0023] The present invention will be further described in detail below through embodiments, but it should not be construed as the scope of the present invention being limited to the following embodiments. All technologies implemented based on the present invention fall within the scope of the present invention.

[0024] In the description of this utility model, it should also be noted that:

[0025] The orientations or positional relationships described herein are based on the relationships shown in the accompanying drawings and are only for the purpose of facilitating the description of this utility model and simplifying the description. They are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0026] Furthermore, terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] This utility model provides a vapor deposition apparatus, such as Figure 1 As shown, it includes a melting zone 1, a guide channel 2, and an evaporation zone 3; the melting zone 1 is connected to the evaporation zone 3 through the guide channel 2; the melting zone 1 is used to place the aluminum wire 14 to be melted, the guide channel 2 is used to guide the molten aluminum 15 formed by the aluminum wire 14 in the melting zone 1 to the evaporation zone 3, and the evaporation zone 3 is used for evaporation coating; the polymer substrate to be evaporated and coated is placed above the evaporation zone 3.

[0028] The evaporation zone 3 has a fan-shaped structure with a narrow end 4 and a wide end 5. The narrow end 4 has a first connection port 6, which is connected to one end of the guide channel 2. The wide end 5 is away from the guide channel 2. The melting zone 1 has a second connection port 7 on one side, which is connected to the other end of the guide channel 2.

[0029] The transition from the narrow end 4 to the wide end 5 of the fan-shaped structure guides the molten aluminum liquid to extend naturally along the fan-shaped surface, avoiding aluminum liquid accumulation at the outlet of the guide channel 2 and making the aluminum liquid distribution in the evaporation zone 3 more uniform. The fan-shaped surface increases the contact area between the molten aluminum liquid 15 and the heating device, which can avoid splashing caused by local overheating, while ensuring a gentler evaporation temperature gradient and reducing film defects caused by uneven temperature. The wide end 5 of the fan shape allows the vapor to diffuse at a larger angle, making the aluminum vapor 16 form a more diffused diffusion field in the vacuum chamber, which can reduce the central aggregation effect of the vapor flow, improve the uniformity of the coating coverage on the substrate surface, and reduce the difference in coating thickness between the edge and center areas of the polymer substrate.

[0030] In some embodiments, the melting zone 1 is higher than the evaporation zone 3, and the surface of the guide channel 2 is inclined from the melting zone 1 to the evaporation zone 3.

[0031] In some embodiments, the inner surface of the evaporation zone 3 is provided with evaporation grid grooves 8. The grid structure guides the aluminum vapor to form a more uniform diffusion path through physical segmentation, reducing the problem of uneven film thickness caused by the difference in flow velocity between the edge and center of the fan-shaped area, reducing the turbulence effect of the aluminum vapor flow, and preventing droplet splashing or incompletely evaporated aluminum dross splashing and damaging the surface of the polymer substrate.

[0032] In some embodiments, a wire feeding device 9 is provided in conjunction with the melting zone 1, and the wire feeding point of the wire feeding device 9 is located in the middle of the melting zone 1.

[0033] By setting up an independent evaporation zone 3, this utility model can also prevent the aluminum wire 14 from directly contacting the evaporation zone 3, thereby reducing the corrosion of the evaporation zone 3; the wire feeding does not contact the evaporation zone 3, which can eliminate the adverse effects of wire feeding vibration on the evaporation zone 3.

[0034] The heating devices for the melting zone 1 and the evaporation zone 3 are set independently: a first heating device is located at the bottom of the melting zone 1, and a second heating device is located at the bottom of the evaporation zone 3. The melting zone 1 needs to heat the solid aluminum wire 14 to its melting point, while the evaporation zone 3 requires a higher temperature to completely vaporize the aluminum liquid. The independent heating devices can precisely set the temperature according to the needs of different stages, avoiding overheating that could cause the aluminum liquid to boil or splatter or insufficient evaporation. A detachable heating base plate is preferably used for the heating device.

[0035] The wire feeding device 9 is located on the side of the melting zone 1 away from the guide channel 2 and the evaporation zone 3. The wire feeding device 9 being away from the evaporation zone 3 can reduce the direct heat radiation of the high temperature of the evaporation zone 3 to the aluminum wire 14, and prevent the aluminum wire 14 from softening or oxidizing prematurely due to local heating during the conveying process.

[0036] In some preferred embodiments, the melting zone 1, the guide channel 2, and the evaporation zone 3 are an integral structure that can be connected by an integral casting or welding process to achieve seamless connection of the melting, guiding, and evaporation processes.

[0037] When the vapor deposition apparatus is in use, the aluminum wire 14 is conveyed to the melting zone 1 by the wire feeding mechanism. The aluminum wire 14 is heated by the first heating device in the melting zone 1 and melted into liquid. The aluminum liquid flows into the guide channel 2 and then into the fan-shaped evaporation zone 3, where the final evaporation coating is carried out.

[0038] This invention also provides a vapor deposition array, such as Figure 2 As shown, the array includes several vapor deposition units, which are arranged in opposite directions to adjacent units. In any two adjacent vapor deposition units, the narrow end 4 of one fan-shaped structure is located next to the wide end 5 of the other fan-shaped structure. In this array layout, multiple evaporation sources operate simultaneously, expanding the coverage area of ​​the coating region. The superposition of the thermal fields of adjacent evaporation sources in the array can reduce edge effects.

[0039] It also includes several wire feeding devices 9; the vapor deposition devices arranged in opposite directions form two sets of vapor deposition devices with different orientations, such as Figure 2 The first vapor deposition unit orientation group 10 and the second vapor deposition unit orientation group 11 each correspond to a set of wire feeding devices 9 arranged in the same row, forming a wire feeding device group, which facilitates operation and maintenance. Figure 2 The first wire feeding device group 12 and the second wire feeding device group 13 are in the middle; each vapor deposition device corresponds to each wire feeding device 9.

[0040] This invention also optimizes the spatial layout of the vapor deposition array through the structural arrangement of the melting zone 1, the guide groove 2 and the evaporation zone 3, as well as the fan-shaped structure of the evaporation zone 3, which is beneficial to improving the vapor deposition quality and work efficiency.

[0041] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any simple modifications, equivalent substitutions, and improvements made by those skilled in the art to the above embodiments without departing from the scope of the present utility model's technical solution and based on the technical essence of the present utility model shall still fall within the protection scope of the present utility model's technical solution.

Claims

1. An evaporation device, characterized by: The device comprises a melting zone, a flow guide groove and an evaporation zone; the melting zone is connected with the evaporation zone through the flow guide groove; the melting zone is used for placing the aluminum wire to be melted; the flow guide groove is used for guiding the aluminum liquid melted from the aluminum wire in the melting zone to the evaporation zone; and the evaporation zone is used for evaporating and coating. The evaporation zone is in a fan shape, has a narrow end and a wide end, and the narrow end has a first connecting port; one side of the melting zone has a second connecting port; and the first connecting port and the second connecting port are respectively connected with two ends of the flow guide groove.

2. The evaporation apparatus according to claim 1, characterized by: The melting zone is higher than the evaporation zone, and the surface of the flow guide groove is inclined from the melting zone to the evaporation zone.

3. The evaporation apparatus according to claim 1, characterized by: The inner surface of the evaporation zone is provided with evaporation grid grooves.

4. The evaporation apparatus according to claim 1, wherein: The melting zone is provided with a wire feeding device, and the wire feeding point of the wire feeding device is located in the middle of the melting zone.

5. The evaporation apparatus according to claim 1, wherein: The heating devices of the melting zone and the evaporation zone are independently arranged; the bottom of the melting zone is provided with a first heating device, and the bottom of the evaporation zone is provided with a second heating device.

6. The evaporation apparatus according to claim 4, wherein: The wire feeding device is located on the side of the melting zone away from the flow guide groove and the evaporation zone.

7. The evaporation apparatus according to claim 1, wherein: The melting zone, the flow guide groove and the evaporation zone are in an integrated structure.

8. An evaporation array, characterized by: The device comprises a plurality of evaporation devices as claimed in any one of claims 1-7.

9. The array of claim 8, wherein: Each evaporation device is arranged in the opposite direction of the adjacent evaporation device; and the narrow end of one fan-shaped structure is located beside the wide end of the other fan-shaped structure.

10. The array of claim 8, wherein: The device further comprises a plurality of wire feeding devices; the oppositely arranged evaporation devices form two groups of evaporation devices in different directions, each group of evaporation devices corresponds to a group of wire feeding devices arranged in the same column, and forms a wire feeding device group. Each evaporation device and each wire feeding device are one-to-one corresponding.

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