Gas nozzle and coating equipment

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a gas nozzle and coating equipment. Wherein the gas nozzle is provided with a plurality of gas channels, and the first gas channel is used for circulating processing gas; the second gas channel is used for circulating oxidant; the third gas channel is used for circulating inert gas; the gas nozzle is further provided with a first flow dividing channel and a second flow dividing channel, the first flow dividing channel is provided with a first gas inlet section and at least two first gas outlet sections, the at least two first gas outlet sections are communicated with the gas inlet ends of the at least two second gas channels respectively, and the second flow dividing channel is provided with a second gas inlet section and a plurality of second gas outlet sections. The second gas outlet sections correspond to the third gas channels one to one, and the multiple second gas outlet sections communicate with the gas inlet ends of the multiple third gas channels correspondingly. The number of gas pipelines communicated with the gas supply source is reduced, the gas path structure is simplified, gas conveying loss is reduced, accurate conveying of an oxidizing agent and processing gas is guaranteed, and it is guaranteed that the thickness of a film is uniform.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a gas nozzle and coating equipment. Background Technology

[0002] In semiconductor manufacturing, wafer coating is a crucial step. To ensure the quality and uniformity of the coating, coating equipment typically requires the use of various gases, such as inert gases and reactive gases, which are precisely delivered to the wafer surface through specific nozzles.

[0003] Traditional gas nozzles, in order to supply multiple gases, often have multiple independent gas channels. Each gas channel is equipped with a separate gas pipe connected to the gas source, forming a complex gas piping layout. While this design can meet the needs of delivering multiple gases to a certain extent, it also brings significant problems. On the one hand, multiple gas pipes greatly increase the complexity of the gas path system. This not only increases the manufacturing and maintenance costs of the equipment, but also may lead to gas leaks due to connection and sealing problems, thereby affecting the coating quality and equipment stability. On the other hand, multiple gas pipes also increase gas delivery losses.

[0004] Therefore, there is an urgent need for a gas nozzle and coating equipment to solve the aforementioned problems. Utility Model Content

[0005] Based on the above, the purpose of this utility model is to provide a gas nozzle and coating equipment, which realizes that the gas supply source can supply gas through at least two second gas channels through a first gas inlet section, and the gas supply source can supply gas through multiple third gas channels through a second gas inlet section. This reduces the number of gas pipelines connected to the gas supply source, simplifies the gas path structure, reduces gas transportation losses, ensures accurate transportation of oxidant and processing gas, and guarantees uniform film thickness.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] On one hand, a gas nozzle is provided, the gas nozzle being provided with multiple gas channels, the multiple gas channels including a first gas channel, at least two second gas channels, and multiple third gas channels.

[0008] The first gas channel is used for the flow of processing gas;

[0009] The second gas channel is used for the flow of oxidant, and at least two second gas channels are located on both sides of the first gas channel along the first direction;

[0010] The third gas channel is used for the flow of inert gas. The third gas channel is provided between the second gas channel and the first gas channel, as well as on the side of the second gas channel away from the first gas channel.

[0011] The gas nozzle is further provided with a first diversion channel and a second diversion channel. The first diversion channel is provided with a first inlet section and at least two first outlet sections. The first outlet sections correspond one-to-one with the second gas channels, and the at least two first outlet sections are respectively connected to the inlet ends of at least two second gas channels.

[0012] The second diversion channel is provided with a second air inlet section and multiple second air outlet sections. The second air outlet sections correspond one-to-one with the third gas channel, and the multiple second air outlet sections are respectively connected to the air inlet ends of the multiple third gas channels.

[0013] As a preferred technical solution for a gas nozzle, there are four second gas outlet sections and four third gas channels. The second diversion channel also includes a first transition channel and a second transition channel. The second gas inlet section is disposed on the first transition channel, and the four second gas outlet sections are disposed on the second transition channel. The first transition channel is connected to the second transition channel through two conveying sections.

[0014] As a preferred technical solution for a gas nozzle, the gas channel has a buffer zone at the inlet end and a spray zone at the outlet end. Both the buffer zone and the spray zone are sheet-like, and the buffer zone and the spray zone are connected by multiple air holes.

[0015] As a preferred technical solution for a gas nozzle, the volume of the buffer zone is larger than the volume of the spray zone.

[0016] As a preferred technical solution for a gas nozzle, the spray zone includes a uniform gas channel and a spray channel. The uniform gas channel is provided with a first air resistance part extending along a second direction at one end near the spray channel. The first direction is perpendicular to the second direction. The uniform gas channel is connected to the spray channel through the first air resistance part. The first air resistance part has a circular cross-section along the direction perpendicular to the second direction.

[0017] As a preferred technical solution for a gas nozzle, a second air resistance section is provided at one end of the gas distribution channel near the air hole, and a plurality of air holes are connected to the second air resistance section. The second air resistance section has a circular cross-section perpendicular to the second direction.

[0018] As a preferred technical solution for a gas nozzle, the corner of the buffer zone away from the gas orifice is provided with a rounded corner.

[0019] As a preferred technical solution for a gas nozzle, the gas nozzle is provided with a cooling channel for the flow of a cooling medium.

[0020] As a preferred technical solution for a gas nozzle, a thermocouple is installed inside the gas nozzle.

[0021] On the other hand, a coating apparatus is provided, including a conveying device, a support plate, and a gas nozzle as described in any of the above embodiments. The support plate is used to carry a wafer, and the conveying device is driven to be connected to the support plate. The conveying device is used to drive the support plate to reciprocate below the gas nozzle.

[0022] The beneficial effects of this utility model are as follows:

[0023] This invention provides a gas nozzle and coating equipment. A third gas channel is provided between the second gas channel and the first gas channel, as well as on the side of the second gas channel away from the first gas channel. On the one hand, the inert gas ejected through the third gas channel effectively isolates the oxidant ejected from the first gas channel and the processing gas ejected from the second gas channel, preventing the processing gas and oxidant from merging at the surface of the gas nozzle and preventing them from reacting and forming a deposition layer on the surface of the gas nozzle, thus affecting the coating efficiency and uniformity. On the other hand, the merging point of the processing gas and oxidant is located on the wafer surface, which can reduce the generation of powder between the wafer and the gas nozzle, improve process stability, and reduce maintenance costs.

[0024] Furthermore, the first diversion channel is equipped with a first inlet section and at least two first outlet sections. Each first outlet section corresponds one-to-one with a second gas channel, and each of the at least two first outlet sections is connected to the inlet end of at least two second gas channels. The oxidant enters from a single first inlet section, then undergoes a 1-to-2 equal diversion, ultimately being evenly distributed into the second gas channels. The second diversion channel is equipped with a second inlet section and multiple second outlet sections. Each second outlet section corresponds one-to-one with a third gas channel, and each of the multiple second outlet sections is connected to the inlet end of multiple third gas channels. Inert gas enters from a single second inlet section, then undergoes a 1-to-4 equal diversion, ultimately being evenly distributed into the third gas channels. This invention enables the gas supply source to supply gas to at least two second gas channels through a single first inlet section, and to supply gas to multiple third gas channels through a single second inlet section. This reduces the number of gas pipelines connected to the gas supply source, simplifies the gas path structure, reduces gas transport losses, ensures precise delivery of the oxidant and processing gas, and guarantees uniform film thickness. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0026] Figure 1 This is a top view of the gas nozzle provided in a specific embodiment of this utility model;

[0027] Figure 2 This is a schematic diagram of the gas channel inside the gas nozzle provided in a specific embodiment of the present invention;

[0028] Figure 3 This is a side view of the gas passage inside the gas nozzle provided in a specific embodiment of this utility model;

[0029] Figure 4 This is a front view of the gas nozzle provided in a specific embodiment of this utility model;

[0030] Figure 5 This is a side view of the gas nozzle provided in a specific embodiment of this utility model.

[0031] The markings in the image are as follows:

[0032] 100. Gas nozzle;

[0033] 1. First gas channel; 2. Second gas channel; 3. Third gas channel; 4. First diversion channel; 41. First inlet section; 42. First outlet section; 5. Second diversion channel; 51. First transition channel; 52. Second transition channel; 53. Second inlet section; 54. Conveying section; 55. Second outlet section; 6. Buffer zone; 7. Spray zone; 71. Gas equalization channel; 711. First air resistance section; 712. Second air resistance section; 72. Spray channel; 8. Cooling channel; 9. Thermocouple; 10. Air vent. Detailed Implementation

[0034] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0035] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0038] like Figure 1 and Figure 2 As shown, this embodiment provides a coating equipment, which includes a conveying device, a carrier plate, and a gas nozzle 100. The carrier plate is used to carry the wafer, and the conveying device is driven and connected to the carrier plate. The conveying device is used to drive the carrier plate to reciprocate below the gas nozzle 100. When the wafer passes below the gas nozzle 100, the processing gas and oxidant sprayed from the gas nozzle 100 converge on the wafer surface to achieve coating on the wafer.

[0039] Specifically, the gas nozzle 100 is provided with multiple gas channels, including a first gas channel 1, at least two second gas channels 2, and multiple third gas channels 3. The first gas channel 1 is used for the flow of processing gas; the second gas channels 2 are used for the flow of oxidant, and at least two second gas channels 2 are located on both sides of the first gas channel 1 along a first direction; the third gas channels 3 are used for the flow of inert gas, and third gas channels 3 are provided between the second gas channels 2 and the first gas channel 1, as well as on the side of the second gas channel 2 away from the first gas channel 1. The nozzle 100 is also provided with a first diversion channel 4 and a second diversion channel 5. The first diversion channel 4 is provided with a first air inlet section 41 and at least two first air outlet sections 42. The first air outlet sections 42 correspond one-to-one with the second gas channels 2. The at least two first air outlet sections 42 are respectively connected to the air inlet ends of at least two second gas channels 2. The second diversion channel 5 is provided with a second air inlet section 53 and multiple second air outlet sections 55. The second air outlet sections 55 correspond one-to-one with the third gas channels 3. The multiple second air outlet sections 55 are respectively connected to the air inlet ends of multiple third gas channels 3.

[0040] A third gas channel 3 is provided between the second gas channel 2 and the first gas channel 1, as well as on the side of the second gas channel 2 facing away from the first gas channel 1. On one hand, the inert gas ejected through the third gas channel 3 effectively isolates the oxidant ejected from the first gas channel 1 and the processing gas ejected from the second gas channel 2, preventing the processing gas and oxidant from merging at the surface of the gas nozzle 100 and thus preventing them from reacting to form a deposition layer on the surface of the gas nozzle 100, affecting coating efficiency and uniformity. On the other hand, the merging point of the processing gas and oxidant is located on the wafer surface, which reduces powder generation between the wafer and the gas nozzle 100, improves process stability, and reduces maintenance costs. In this embodiment, the processing gas can also be a metal precursor. The independent gas channel design of the first gas channel 1, the second gas channel 2, and the third gas channel 3 ensures that different processing gases and oxidants do not react inside the gas nozzle 100, reducing particulate contamination. This optimized gas distribution structure of the gas nozzle 100 is suitable for large-size substrates of 12 inches and above, and can also be extended to roll-to-roll deposition equipment.

[0041] Furthermore, the first diversion channel 4 is provided with a first inlet section 41 and at least two first outlet sections 42. The first outlet sections 42 correspond one-to-one with the second gas channels 2. The at least two first outlet sections 42 are respectively connected to the inlet ends of at least two second gas channels 2. The oxidant enters from a single first inlet section 41, and then undergoes a 1-to-2 equal diversion, finally being evenly distributed into the second gas channels 2, ensuring that the flow rate change of the gas at the outlet of all second gas channels 2 is less than 3%, thus ensuring film uniformity. The second diversion channel 5 is provided with a second inlet section 53 and multiple second outlet sections 55. The second outlet sections 55 correspond one-to-one with the third gas channels 3. The multiple second outlet sections 55 are respectively connected to the inlet ends of multiple third gas channels 3. The inert gas enters from a single second inlet section 53, and then undergoes a 1-to-4 equal diversion, finally being evenly distributed into the third gas channels 3, ensuring that the flow rate change of the gas at the outlet of all third gas channels 3 is less than 3%, thus ensuring film uniformity. This embodiment enables the gas supply source to supply gas to at least two second gas channels 2 through a first gas inlet section 41, and to supply gas to multiple third gas channels 3 through a second gas inlet section 53. This reduces the number of gas pipelines connected to the gas supply source, simplifies the gas path structure, reduces gas delivery losses, ensures accurate delivery of oxidant and processing gas, and guarantees uniform film thickness.

[0042] In this embodiment, there are four second gas outlet sections 55 and four third gas channels 3. The second diversion channel 5 also includes a first transition channel 51 and a second transition channel 52. The second inlet section 53 is disposed on the first transition channel 51, and the four second gas outlet sections 55 are disposed on the second transition channel 52. The first transition channel 51 is connected to the second transition channel 52 through two conveying sections 54. The inert gas is diverted by 1 part to 2 parts through the first transition channel 51, and then by 2 parts to 4 parts through the second transition channel 52, resulting in an overall diversion of 1 part to 4 parts. The two diversions through the first transition channel 51 and the second transition channel 52 improve the uniformity of the inert gas flow to the four third gas channels 3, ensuring that the inert gas can diffuse fully and avoiding local over-concentration or over-leanization. In this embodiment, the two conveying sections 54 are located at both ends of the first transition channel 51, and the two conveying sections 54 and the first transition channel 51 are M-shaped as a whole.

[0043] In this embodiment, as Figure 2 and Figure 3As shown, a buffer zone 6 is provided at the inlet end of the gas channel, and a spray zone 7 is provided at the outlet end of the gas channel. Both the buffer zone 6 and the spray zone 7 are plate-shaped and connected by multiple air holes 10. The gas passes through the buffer zone 6, the multiple air holes 10, and the spray zone 7 in sequence. When the gas passes through the buffer zone 6, it can be evenly distributed throughout the entire buffer zone 6. The size and spacing of the air holes 10 are designed according to the gas flow velocity before entering the air holes 10 in the buffer zone 6 to achieve a further uniform gas distribution effect. Finally, the gas is ejected from the outlet of the spray zone 7.

[0044] Preferably, the corner of the buffer zone 6 away from the vent 10 is rounded. After the gas enters the gas channel, it preferentially enters the buffer zone 6. The rounded corner can guide the gas and make the gas evenly distributed throughout the buffer zone 6.

[0045] Preferably, the volume of the buffer zone 6 is larger than the volume of the spray zone 7 to avoid gas pressure loss and improve the deposition rate.

[0046] Preferably, the spray zone 7 includes a uniform gas distribution channel 71 and a spray channel 72. The uniform gas distribution channel 71 has a first air resistance section 711 extending along a second direction near one end of the spray channel 72. The first direction is perpendicular to the second direction. The uniform gas distribution channel 71 is connected to the spray channel 72 through the first air resistance section 711. The first air resistance section 711 has a circular cross-section perpendicular to the second direction. In this embodiment, the first direction is X, and the second direction is Y. More preferably, the uniform gas distribution channel 71 has a second air resistance section 712 near one end of the air holes 10. Multiple air holes 10 are connected to the second air resistance section 712. The second air resistance section 712 has a circular cross-section perpendicular to the second direction. By setting the first air resistance section 711 and the second air resistance section 712 to form a double air resistance, the consistency of the gas flow velocity in the lateral direction can be further ensured, improving the film formation uniformity. Here, lateral refers to the second direction.

[0047] Preferably, such as Figure 4 and Figure 5 As shown, a cooling channel 8 is provided inside the gas nozzle 100, and the cooling channel 8 is used for the flow of a cooling medium. The cooling medium can be cooling water. The inlet and outlet of the cooling channel 8 are located on one side of the gas nozzle 100 along the second direction. The cooling medium can reduce the nozzle temperature to near room temperature during the deposition process, preventing the gas nozzle 100 from overheating and causing blockage of the gas outlet, thus enhancing the durability of the system.

[0048] Preferably, a thermocouple 9 is installed inside the gas nozzle 100. The thermocouple 9 is used to monitor the temperature of the gas nozzle 100 in real time to ensure temperature stability. The supply of cooling medium is dynamically adjusted based on the temperature data measured by the thermocouple 9, improving the accuracy of temperature control and preventing abnormal temperature fluctuations in the gas nozzle 100, thus ensuring stability during the deposition process.

[0049] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A gas injection head, characterized by, The gas nozzle is provided with a plurality of gas channels, the plurality of gas channels comprises a first gas channel (1), at least two second gas channels (2) and a plurality of third gas channels (3), The first gas channel (1) is used for flowing processing gas; The second gas channel (2) is used for flowing oxidizing agent, and at least two second gas channels (2) are located on both sides of the first gas channel (1) in a first direction; The third gas channel (3) is used for flowing inert gas, and the third gas channel (3) is arranged between the second gas channel (2) and the first gas channel (1) and on a side of the second gas channel (2) away from the first gas channel (1); The gas nozzle is further provided with a first shunt channel (4) and a second shunt channel (5), the first shunt channel (4) is provided with a first gas inlet section (41) and at least two first gas outlet sections (42), the first gas outlet section (42) corresponds to the second gas channel (2) one by one, and at least two first gas outlet sections (42) respectively communicate with the gas inlet ends of at least two second gas channels (2); The second shunt channel (5) is provided with a second gas inlet section (53) and a plurality of second gas outlet sections (55), the second gas outlet section (55) corresponds to the third gas channel (3) one by one, and a plurality of second gas outlet sections (55) respectively communicate with the gas inlet ends of a plurality of third gas channels (3).

2. The gas injection nozzle of claim 1, wherein The second gas outlet section (55) and the third gas channel (3) are both four, the second shunt channel (5) further comprises a first transition channel (51) and a second transition channel (52), the second gas inlet section (53) is arranged on the first transition channel (51), four second gas outlet sections (55) are arranged on the second transition channel (52), and the first transition channel (51) is communicated with the second transition channel (52) through two conveying sections (54).

3. The gas injection nozzle of claim 1, wherein The gas inlet end of the gas channel is provided with a buffer zone (6), the gas outlet end of the gas channel is provided with a spraying zone (7), the buffer zone (6) and the spraying zone (7) are both in a sheet shape, and the buffer zone (6) and the spraying zone (7) are communicated through a plurality of gas holes (10).

4. The gas injection nozzle of claim 3, wherein The volume of the buffer zone (6) is greater than that of the spraying zone (7).

5. The gas injection nozzle of claim 3, wherein The spraying zone (7) comprises a uniform gas channel (71) and a spraying channel (72), the uniform gas channel (71) is provided with a first gas resistance part (711) extending in a second direction at one end close to the spraying channel (72), the first direction is perpendicular to the second direction, the uniform gas channel (71) is communicated with the spraying channel (72) through the first gas resistance part (711), and the first gas resistance part (711) is circular in cross section perpendicular to the second direction.

6. The gas injection nozzle of claim 5, wherein, The uniform gas channel (71) is provided with a second gas resistance part (712) at one end close to the gas hole (10), a plurality of gas holes (10) are communicated with the second gas resistance part (712), and the second gas resistance part (712) is circular in cross section perpendicular to the second direction.

7. The gas injection nozzle of claim 3, wherein The corner of the buffer zone (6) away from the air hole (10) is provided with a rounded corner.

8. The gas injection nozzle of claim 1, wherein, The gas nozzle is provided with a cooling channel (8) for flowing cooling medium.

9. The gas injection nozzle of claim 1, wherein, The gas nozzle is provided with a thermocouple (9).

10. A coating apparatus, characterized by, The gas nozzle is provided with a cooling channel (8) for flowing cooling medium. The gas nozzle is provided with a thermocouple (9).

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