Memory and electronic equipment

Abstract

The utility model relates to a memory and electronic equipment, and the memory comprises a card body, the shape size of which is the shape size of an SD card; the card body comprises a first edge and a second edge, and the first edge and the second edge are opposite edges; the interface pin is arranged in an interface area, close to the first edge, of the card body; the interface pin comprises a first grounding pin; a storage unit; a control unit; the storage unit and the control unit are arranged in the card body; the control unit is respectively connected with the storage unit and the interface pin; the at least one second grounding pin is arranged in a grounding area, close to the second edge, on the card body; and the second grounding pin is connected with a grounding layer arranged in the card body. Through the memory structure of the scheme, radio frequency radiation interference generated by the memory body can be reduced.

Description

Technical Field

[0001] This application relates to the field of data storage technology, and more particularly to a memory and electronic device. Background Technology

[0002] With the rapid development of portable electronic devices, Secure Digital Memory Cards (SD cards) have undergone multiple generations of technological evolution. In the current technology, the standard SD card (32mm×24mm×2.1mm in size) adopts a 9-pin design, its successor MiniSD card (20mm×21.5mm×1.4mm) expands to 11 pins, while the current mainstream Micro SD card (11mm×15mm×1.4mm) is simplified to an 8-pin structure.

[0003] As storage capacity grows exponentially (from GB to TB), the data transfer speed of memory cards has increased accordingly. According to the SD Association specifications, the current transfer speed class has evolved from the basic Class 2 (2MB / s) to the UHS-III (300MB / s) standard.

[0004] However, during the implementation process, the applicant discovered that the memory cards had at least one problem: excessive radio frequency radiation interference, especially for memory cards with higher speed transmission modes. Utility Model Content

[0005] Based on this, the purpose of this application is to at least solve one of the above-mentioned technical defects, especially the technical defect of excessive radio frequency radiation interference in the prior art. This application provides a memory and an electronic device.

[0006] In a first aspect, this application provides a memory comprising:

[0007] The card body has the same shape and dimensions as an SD card; the card body includes a first edge and a second edge, which are opposite edges.

[0008] Interface pins are located on the interface area near the first edge of the card body; the interface pins include a first ground pin;

[0009] Storage unit;

[0010] Control unit; both the storage unit and the control unit are housed within the card body; the control unit is connected to the storage unit and interface pins respectively;

[0011] At least one second grounding pin is disposed on the card body in the grounding area near the second edge;

[0012] The second grounding pin connects to the grounding layer located inside the card body.

[0013] In one embodiment, the card body further includes a third edge and a fourth edge, the third edge and the fourth edge being opposite edges, and both the third edge and the fourth edge being adjacent edges to the second edge;

[0014] At least one second grounding pin is located near the second edge and is positioned centrally between the third and fourth edges.

[0015] In one embodiment, the second grounding pin, which is positioned at the center between the third and fourth edges, has its length direction aligned with the length direction of the second edge.

[0016] In one embodiment, the card body further includes a third edge and a fourth edge, the third edge and the fourth edge being opposite edges, and both the third edge and the fourth edge being adjacent edges to the second edge;

[0017] At least one second ground pin is positioned near the vertex corner between the second and third edges.

[0018] In one embodiment, at least one second ground pin is positioned near the vertex corner between the second edge and the fourth edge.

[0019] In one embodiment, the long side of the second ground pin, located near the vertex corner between the second and fourth edges, is parallel to the long side of the fourth edge.

[0020] In one embodiment, the long side of the second grounding pin, located near the vertex corner between the second and third edges, is parallel to the third edge.

[0021] In one embodiment, the second grounding pin is connected to the grounding layer disposed in the card body through the first grounding pin.

[0022] Secondly, this application provides an electronic device comprising:

[0023] The PCB board has slots for removably placing memory such as the memory described above.

[0024] The first connecting piece is set on the PCB board at the position corresponding to the interface pins and is used to electrically connect the interface pins.

[0025] The second connecting piece is set on the PCB board at the position corresponding to the placement of the second grounding pin, and is used to electrically connect to the second grounding pin; the second connecting piece connects to the grounding layer set in the PCB board.

[0026] Core functional components located on the PCB board.

[0027] In one embodiment, the second connecting piece is positioned near the edge of the card slot side of the PCB board.

[0028] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:

[0029] The memory and electronic device provided in this application, by setting the memory to the shape and size of an SD card, can meet the settings of existing electronic devices using SD cards without making too many modifications to existing electronic devices, thus saving costs. Through the structural settings of interface pins, storage units, and control units, it can realize the functions of existing memory without modifying the data storage structure of traditional memory. Furthermore, by setting at least one second grounding pin on the grounding area on the card body away from the first edge and close to the second edge, this application can connect to the grounding layer originally set in the card body through the second grounding pin, thereby grounding the memory body through the second grounding pin and reducing the radio frequency radiation interference generated by the memory body. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 1 ;

[0032] Figure 2 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 2 ;

[0033] Figure 3 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 3 ;

[0034] Figure 4 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 4 ;

[0035] Figure 5 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 5 ;

[0036] Figure 6 Schematic diagram of the structure of the electronic device provided in the embodiments of this application Figure 1 ;

[0037] Figure 7 Schematic diagram of the structure of the electronic device provided in the embodiments of this application Figure 2 .

[0038] Figure label:

[0039] 10: Card body; 20: Interface pin; 30: Storage unit; 40: Control unit; 50: Second ground pin; 60: Ground layer; 70: PCB board; 80: First connecting piece; 90: Second connecting piece. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] With the rapid development of portable electronic devices, SD cards have undergone multiple generations of technological evolution. In the current technology, the standard SD card (32mm×24mm×2.1mm) adopts a 9-pin design, its successor, the MiniSD card (20mm×21.5mm×1.4mm), expands to 11 pins, while the current mainstream Micro SD card (11mm×15mm×1.4mm) is simplified to an 8-pin structure.

[0042] In recent years, as storage capacity has grown exponentially (from GB to TB), the data transfer speed of memory cards has also increased accordingly. The current transfer speed level has evolved from the basic Class 2 (2MB / s) to the UHS-III (300MB / s) standard.

[0043] It is worth noting that, according to the applicant's research, the radio frequency (RF) radiation interference generated by the memory card itself can exceed 20 dB in UHS high-speed transmission mode. Experimental testing revealed that this interference primarily originates from the harmonic radiation of the clock signal at pin 5 (CLK), with its harmonic components radiating through the card and affecting the RF signal. As an example, the SD card desense (RF sensitivity degradation) of traditional memory is shown in Table 1 below. The table shows that traditional memory used in various electronic devices exhibits relatively high RF radiation values, while the standard generally requires SD card desense to be <5 dB. Table 1 demonstrates that traditional memory used in electronic devices generally fails to meet this standard.

[0044] Table 1. Radio Frequency Related Data for Traditional Memory

[0045]

[0046] 11a and 11g are both Wi-Fi protocol standards; 6M is the data transfer rate, measured in Mbps; and Channel refers to the data transfer channel.

[0047] Existing solutions to radiated interference often employ signal attenuation methods, such as reducing the CLK signal to mitigate interference. However, these methods have an inherent drawback: the quality of the baseband signal is affected.

[0048] This application provides a memory and electronic device that requires minimal modification to existing electronic devices and no alteration to the data storage structure of traditional memory. It enables grounding of the memory itself by connecting a second grounding pin to the existing grounding layer within the card, thereby reducing radio frequency radiation interference generated by the memory itself. Thus, this application is applicable to memory devices of common SD card form factors, ensuring that normal signals of the memory are not affected, while effectively solving the problem of radiation interference generated by the memory itself.

[0049] In one exemplary embodiment, Figure 1 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 1 ,like Figure 1 As shown, a memory is provided, which includes: a card body 10, an interface pin 20, a storage unit 30, a control unit 40, and at least one second ground pin 50.

[0050] Specifically, the shape and size of the card body 10 are the same as those of an SD card; the card body 10 includes a first edge and a second edge, which are opposite edges.

[0051] Here, "card body 10" refers to a physical entity of a removable or embedded storage device. The first edge refers to the boundary or outline of the physical form of the card body 10, such as the physical boundary corresponding to one short side of the card body 10. The second edge refers to a specific boundary or outline that is distinct from the first edge, such as the physical boundary corresponding to another short side of the card body 10. The first edge and the second edge are opposite edges, meaning two edges that are parallel and opposite to each other. For example, in a rectangular card body 10, if the first edge is a short side with gold fingers, then the second edge is a short side without gold fingers on the other side.

[0052] The shape and size of the card body 10 can be that of an SD card. For example, the memory can be an improvement based on an existing SD card so that there is no need to modify the physical components of the existing electronic device, such as the card slot and card tray, thus ensuring low cost.

[0053] The storage protocol of the memory can be the existing SD standard protocol, UHS-III protocol, or the existing eMMC protocol used in SD card form factors. This application does not involve any improvement to the protocol.

[0054] Specifically, the interface pin 20 is located on the interface area of ​​the card body 10 near the first edge; the interface pin 20 includes a first ground pin.

[0055] In this context, interface pin 20 may refer to the gold fingers of the memory. Interface area may refer to the area used to set the gold fingers. First ground pin may refer to the gold fingers of the memory's existing interface pin 20 used for grounding. As an example, this application uses the edge where the interface area is set as the first edge. Interface pin 20 may include 4 data pins, power pins, clock pins, a first ground pin, control pins, etc., at least 8 pins.

[0056] The storage unit 30 can refer to an existing storage unit 30, such as the storage unit 30 of an existing SD card. This application does not require any improvement to the storage unit 30.

[0057] Specifically, the control unit 40: both the storage unit 30 and the control unit 40 are located inside the card body 10; the control unit 40 is connected to the storage unit 30 and the interface pin 20 respectively.

[0058] This application does not require any improvement to the control unit 40 and its program.

[0059] Specifically, at least one second grounding pin 50 is disposed on the card body 10 in the grounding area near the second edge.

[0060] The second grounding pin 50 can refer to the gold finger added by this application based on the existing memory. The newly added gold finger can eliminate the radiation interference of the memory body by setting it in the grounding area near the second edge.

[0061] The second grounding pin 50 is connected to the grounding layer 60 provided inside the card body 10 to achieve grounding and eliminate radiation interference from the memory body.

[0062] As an example, Figure 1 The grounding layer 60 only shows a portion of the grounding layer area. In actual applications, the entire SD card, except for the signal area, can be a grounding layer.

[0063] For example, the memory includes: a card body 10, interface pins 20, a storage unit 30, a control unit 40, and at least one second ground pin 50. The card body 10, interface pins 20, storage unit 30, and control unit 40 are all based on existing memory configurations. By adding at least one second ground pin 50 to the area opposite the conventional gold finger area, the problem of radio frequency radiation interference can be solved.

[0064] Optionally, the card body 10 can be configured according to the physical specifications of a standard SD card, with a shape and size fully compatible with existing devices. The memory can include a pair of parallel and opposite short sides, namely, a first edge and a second edge. The first edge is the traditional gold finger interface side, and the second edge is the side with a newly added grounding area. The interface layout: The first edge can have the original interface area, including gold fingers conforming to SD standard protocols, such as data, power, and the original first ground pin. The second edge can have a newly added grounding area, and can have at least one second ground pin 50, which can be connected to the original memory grounding structure through the internal grounding layer 60.

[0065] A second grounding pin 50 can be added to the unused second edge area of ​​a traditional SD card, directly connecting to the grounding layer 60 built into the card body 10. The storage unit 30, control unit 40, and communication protocol can follow the existing standard architecture, such as NAND flash memory, thus retaining the original interface functions. The radiation interference problem can be solved by simply adding a grounding pin design (physical structure adjustment).

[0066] In this embodiment, by setting the memory to the shape and size of an SD card, and the structural configuration of interface pin 20, storage unit 30, and control unit 40, the functions of existing memory can be realized without modifying the data storage structure of traditional memory. A grounding pin is added to the second edge of the standard memory, and the grounding network is extended through the internal grounding layer 60. The radiated interference is reduced (especially for high-speed protocols such as UHS-III) with a simple physical structure improvement. Thus, this embodiment can reduce the radio frequency radiated interference generated during high-speed data transmission by the combined action of the newly added second grounding pin 50 and the grounding layer 60. Furthermore, it is fully compatible with the card slot specifications of existing devices and can be used directly without adjusting the device structure.

[0067] In one exemplary embodiment, Figure 2 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 2 ,like Figure 2 As shown, in Figure 1 Based on this, the structure of the memory is illustrated by example, wherein the card body 10 further includes a third edge and a fourth edge, the third edge and the fourth edge are opposite edges, and both the third edge and the fourth edge are adjacent edges to the second edge;

[0068] At least one second ground pin 50 is located near the second edge and is positioned centrally between the third and fourth edges.

[0069] The shape of the card body 10 can be rectangular. If the first edge and the second edge are two short edges, then the third edge and the fourth edge are two long edges that are parallel to each other and opposite to each other.

[0070] For example, at least one second ground pin 50 can be concentrated near the second edge and positioned in the central region between the third and fourth edges. For instance, a second ground pin 50 can be positioned symmetrically along the center of the second edge (the shorter side). By centrally positioning the ground pins while maintaining a standard memory size, more balanced RF radiation interference suppression can be achieved without adding external components or changing the internal circuit design. Thus, by balancing the ground coverage through a central placement, the uniformity of RF radiation suppression on both sides (the third and fourth edge regions) of the card body 10 can be improved.

[0071] In this embodiment, the centrally located second grounding pin 50 can simultaneously cover the adjacent areas of the third and fourth edges, reducing the difference in edge signal interference.

[0072] In one exemplary embodiment, such as Figure 2 As shown, the second grounding pin 50, which is positioned in the center between the third and fourth edges, has its length direction aligned with the length direction of the second edge.

[0073] For example, the second ground pin 50 is configured to extend along the length direction of the second edge (short side), that is, the long axis of the second ground pin 50 is aligned with the short side of the second edge. For example, if the second edge is the short side of the SD card, the second ground pin 50 is arranged laterally.

[0074] Optionally, the long side of the newly added grounding gold finger is parallel to the long axis of the second edge and is located in the central region between the third and fourth edges.

[0075] In this embodiment, the above-described structural layout can fit the existing ground layer 60 layout of the memory, enhance the connection efficiency with the internal ground layer 60, and form better radio frequency radiation suppression.

[0076] In one exemplary embodiment, Figure 3 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 3 ,like Figure 3 As shown, in Figure 1 Based on this, the structure of the memory is illustrated. The card body 10 also includes a third edge and a fourth edge, which are opposite edges and adjacent edges to the second edge.

[0077] At least one second ground pin 50 is positioned near the vertex corner between the second edge and the third edge.

[0078] The vertex angle can refer to the corner position of the card body 10, which is the vertex angle region at the intersection of the second edge (short edge) and the third edge (long edge).

[0079] For example, at least one second ground pin 50 is disposed in the vertex corner region at the junction of the second edge and the third edge. The second ground pin 50 is disposed based on the vertex corner layout, which can suppress signal interference at the junction of the second edge and the third edge and reduce radio frequency radiation.

[0080] In this embodiment, by setting at least one second grounding pin 50 close to the vertex corner between the second edge and the third edge, the coverage area of ​​the second grounding pin 50 can be increased, thereby improving the body grounding area and better reducing radio frequency radiation.

[0081] In one exemplary embodiment, Figure 4 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 4 ,like Figure 4 As shown, in Figure 1 Based on this, the structure of the memory is illustrated, wherein at least one second ground pin 50 is positioned near the vertex corner between the second edge and the fourth edge.

[0082] For example, at least one second ground pin 50 is disposed in the vertex corner region at the junction of the second edge and the fourth edge. The second ground pin 50 is disposed based on the vertex corner layout, which can simultaneously suppress signal interference at the junction of the second edge and the fourth edge and reduce radio frequency radiation.

[0083] Alternatively, the spatial coverage of the grounding network can be expanded by distributing the grounding pin locations (such as by setting multiple vertex corners).

[0084] In this embodiment, by setting at least one second grounding pin 50 close to the vertex corner between the second edge and the fourth edge, the coverage area of ​​the second grounding pin 50 can be increased, thereby improving the body grounding area and better reducing radio frequency radiation.

[0085] In one exemplary embodiment, such as Figure 4 As shown, the long side of the second grounding pin 50, which is located near the vertex corner between the second edge and the fourth edge, is parallel to the long side of the fourth edge.

[0086] For example, the second grounding pin 50, located at the vertex corner region of the second edge and the fourth edge, has its long side direction parallel to the long side of the fourth edge.

[0087] Optionally, the long side of the second ground pin 50 is parallel to the long side of the fourth edge, which can specifically cover the body RF radiation suppression of the long side of the fourth edge, effectively suppressing RF radiation interference. The direction of the second ground pin 50 in the vertex corner area is consistent with the long side, which can adapt to the contour of the card body 10, avoid space waste, and provide better RF radiation suppression.

[0088] Indicatively, the second ground pin 50 can be made to fit as closely as possible to the contour of the vertex corner region.

[0089] In this embodiment, by extending the coverage of the ground layer 60 by the second ground pin 50 along the long side of the fourth edge, radio frequency radiation suppression can be better achieved, and it can be better adapted to the physical structure of the card body 10.

[0090] In one exemplary embodiment, such as Figure 3 As shown, the long side of the second grounding pin 50, which is located near the vertex corner between the second and third edges, is parallel to the third edge.

[0091] For example, the second grounding pin 50 located at the vertex corner region of the second edge and the third edge has its long side direction parallel to the long side of the third edge.

[0092] Optionally, the long side of the second ground pin 50 is parallel to the long side of the third edge, which can specifically cover the signal transmission path on the long side and effectively suppress radio frequency radiation interference. The direction of the second ground pin 50 in the vertex corner area is consistent with the long side, which can adapt to the contour of the card body 10, avoid space waste, and provide better radio frequency radiation suppression.

[0093] Indicatively, the second ground pin 50 can be made to fit as closely as possible to the contour of the vertex corner region.

[0094] In this embodiment, by extending the coverage of the ground layer 60 by the second ground pin 50 along the long side of the third edge, radio frequency radiation suppression can be better achieved, and it can be better adapted to the physical structure of the card body 10.

[0095] In one exemplary embodiment, Figure 5 A schematic diagram of the memory structure provided in the embodiments of this application. Figure 5 ,like Figure 5 As shown, in Figure 1 Based on this, the structure of the memory is illustrated schematically. At least one second ground pin 50 is provided at the vertex corner near the second edge and the third edge, and at the vertex corner near the second edge and the fourth edge. This allows for better coverage of the grounding area near the second edge, thereby better suppressing radio frequency radiation interference from the memory body.

[0096] In an exemplary embodiment, the second grounding pin 50 is connected to the grounding layer 60 disposed within the card body 10 via the first grounding pin.

[0097] For example, the second ground pin 50 can be indirectly connected to the ground layer 60 built into the card body 10 through the first ground pin. The grounding path of the first ground pin can be reused, reducing the need to open a separate internal connection channel for the second ground pin 50, reducing process complexity, and maintaining minimal changes to the internal wiring of the card body 10. This balances the consideration of suppressing body radiation interference and manufacturing cost, and achieves body radio frequency interference suppression simply by expanding the coverage of the original ground layer 60.

[0098] In this embodiment, the second grounding pin 50 is connected to the grounding layer 60 provided in the card body 10 through the first grounding pin. The shared grounding layer 60 can also reduce the potential difference problem that may be introduced by multiple grounding points and expand the radio frequency radiation suppression range of the grounding network on the edge of the card body 10 (especially the second edge and adjacent vertex corners).

[0099] In one exemplary embodiment, Figure 6 Schematic diagram of the structure of the electronic device provided in the embodiments of this application Figure 1 ,like Figure 6 As shown, the electronic device includes:

[0100] PCB board 70, PCB board 70 is provided with a slot for removably placing a memory such as the above-mentioned memory;

[0101] The first connecting piece 80 is set on the PCB board 70 at a position corresponding to the placement of the interface pin 20, and is used to electrically connect the interface pin 20.

[0102] The second connecting piece 90 is disposed on the PCB board 70 at a position corresponding to the placement of the second grounding pin 50, and is used to electrically connect to the second grounding pin 50; the second connecting piece 90 is connected to the grounding layer 60 disposed within the PCB board 70.

[0103] The core functional components are located on PCB board 70.

[0104] The first connecting piece 80 can refer to a connecting piece on the electronic device used to implement the original memory function. The second connecting piece 90 can refer to a connecting piece used to connect the newly added second ground pin 50. The core functional component can refer to the core functional electronic components that implement the original functions of the electronic device.

[0105] For example, a card slot (traditional shape and size) matching the size of the memory card body 10 can be provided to ensure that the standard SD card-type memory can be plugged in and adapted. A first connecting piece 80 is provided, corresponding to the original interface pin 20 of the memory (including data, power, and first ground pins, etc.), to realize the transmission of traditional function signals. A second connecting piece 90 is provided, specifically for the newly added second ground pin 50 of the memory, and is directly connected to the ground layer 60 of the PCB board 70. In this way, the second connecting piece 90 connects the second ground pin 50 of the memory to the main ground layer 60 of the electronic device, which can form a composite ground loop with the internal ground layer 60 of the memory.

[0106] Alternatively, the core functional components of the electronic device retain the original design, and the suppression of radio frequency radiation interference from the memory body is achieved only by adjusting the PCB connectors.

[0107] In this embodiment, on the electronic device side, the directional connection between the newly added second connecting piece 90 and the PCB ground layer 60, together with the improved design of the memory, forms a complete system-level solution. This enables bidirectional optimization of the memory and electronic device grounding system, improves overall electromagnetic communication compatibility, and achieves a closed-loop compatibility design, ensuring that the memory provided in this application can be directly applied to existing electronic devices. Thus, by connecting the memory's second ground pin 50 to the PCB ground layer 60 via the newly added second connecting piece 90, radio frequency radiation interference from the memory itself can be suppressed.

[0108] In one exemplary embodiment, such as Figure 6 As shown, the second connecting piece 90 is positioned near the edge of the PCB board 70 on the card insertion side.

[0109] The "card insertion edge" can refer to the edge on which the memory is inserted, that is, the edge on which the memory is inserted into the electronic device.

[0110] For example, the second connecting piece 90 is disposed near the card insertion side edge of the PCB board 70, that is, on one side edge region in the memory insertion direction, corresponding to the position of the second ground pin 50 on the second edge of the memory.

[0111] Optionally, the second connecting piece 90 is positioned on the side edge of the card insertion slot to ensure that the second grounding pin 50 and the second connecting piece 90 are automatically and accurately aligned during insertion and removal, avoiding poor contact. The layout of the second connecting piece 90 on the side edge of the card insertion slot allows for better compatibility with standard card slot structures, ensuring that the memory provided in this application can be inserted and removed normally.

[0112] In this embodiment, by setting the second connecting piece 90 on the side edge of the card insert, the additional grounding connection function can be realized in a limited space, forming a radio frequency interference suppression effect that is optimized in collaboration between the memory and the device.

[0113] In one exemplary embodiment, Figure 7 Schematic diagram of the structure of the electronic device provided in the embodiments of this application Figure 2 ,like Figure 7 As shown, the second connecting piece 90 is also provided when the memory is placed, and... Figure 1 The corresponding position of the second grounding pin 50 shown is located in the vertex corner area of ​​the base plate where the memory is placed.

[0114] Optionally, the second connecting piece 90 is also disposed in the bottom corner area of ​​the card slot of the PCB board 70, corresponding to the corner position where the second grounding pin 50 is located after the memory is inserted, the corner position where the second edge and the third edge meet, and the corner position where the second edge and the fourth edge meet.

[0115] In this embodiment, the spatial coupling design between the second connecting piece 90 at the vertex corner and the grounding area near the second edge of the memory effectively achieves precise correspondence between the gold finger and the connecting piece, thereby improving the interference suppression capability of the memory body's radio frequency radiation.

[0116] In some specific exemplary embodiments, as shown in Table 2, the research scheme for the SD card desense (RF sensitivity degradation) problem uses electronic device 1 in Table 1 as the applied electronic device for research, and obtains research data for multiple schemes, including the following schemes and measured RF data:

[0117] (1) Reduce the CLK drive current by software. Although reducing the clock signal (CLK) drive current can reduce the steepness of the signal edge (reduce high frequency noise), it may cause timing errors and other problems such as baseband test failure.

[0118] (2) Add CLK series matching through hardware. In this case, a resistor is connected in series on the CLK signal line. By impedance matching, signal reflection can be suppressed, which can effectively reduce radio frequency radiation. However, there is still a large amount of radio frequency radiation.

[0119] (3) Remove the metal plate of the card tray. The metal card tray may act as an antenna to amplify the electromagnetic interference radiated by the SD card, but its removal will lead to a decrease in structural strength or shielding performance, which is not allowed structurally.

[0120] (4) SD card body grounding: By adding a grounding pin (such as the second grounding pin set in this application) to the SD card body through the memory and electronic device provided in the embodiments of this application, the interference current in the card can be directly guided to the grounding layer of the electronic device, suppressing radiation interference from the source, and making the SD card desense smaller.

[0121] Table 2. Research data on memory radio frequency related improvements

[0122]

[0123] In this embodiment, by grounding the existing memory (e.g., SD card) itself, the problem of radio frequency radiation interference can be effectively solved, and radiation interference can be greatly reduced.

[0124] Those skilled in the art will understand that Figures 1 to 7 The structure shown is only a block diagram of a portion of the structure related to the present application. Specific memory and electronic devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0125] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, memory, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, memory, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, memory, article, or apparatus that includes said element.

[0126] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can be referred to each other.

[0127] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A memory, comprising: The memory comprises: a card body, the shape and size of which are the shape and size of an SD card; the card body comprises a first edge and a second edge, which are opposite edges; an interface pin, which is arranged on the card body in an interface region close to the first edge; the interface pin comprises a first ground pin; a storage unit; a control unit; the storage unit and the control unit are arranged in the card body; the control unit is connected with the storage unit and the interface pin respectively; at least one second ground pin, which is arranged on the card body in an interface region close to the second edge; the second ground pin is connected with a ground layer arranged in the card body.

2. The memory of claim 1, wherein, The card body further comprises a third edge and a fourth edge, which are opposite edges, and the third edge and the fourth edge are adjacent edges to the second edge; at least one second ground pin is arranged at a central position between the third edge and the fourth edge close to the second edge.

3. The memory of claim 2, wherein, The length direction of the second ground pin arranged at the central position between the third edge and the fourth edge is the length direction of the second edge.

4. The memory of claim 2 or 3, wherein, At least one second ground pin is arranged close to a vertex angle between the second edge and the third edge.

5. The memory of claim 4, wherein, At least one second ground pin is arranged close to a vertex angle between the second edge and the fourth edge.

6. The memory of claim 5, wherein, The long side of the second ground pin arranged close to a vertex angle between the second edge and the fourth edge is parallel to the long side of the fourth edge.

7. The memory of claim 4, wherein, The long side of the second ground pin arranged close to a vertex angle between the second edge and the third edge is parallel to the third edge.

8. The memory of claim 1, wherein, The second ground pin is connected with the ground layer arranged in the card body through the first ground pin.

9. An electronic device, comprising: The electronic device comprises: a PCB board, on which a card slot is arranged for detachably placing the memory according to any one of claims 1 to 8; a first connecting piece, which is arranged on the PCB board at a position corresponding to the position of the interface pin, and is used for electrically connecting the interface pin; a second connecting piece, which is arranged on the PCB board at a position corresponding to the position of the second ground pin, and is used for electrically connecting the second ground pin; the second connecting piece is connected with a ground layer arranged in the PCB board; a core functional component arranged on the PCB board.

10. The electronic device of claim 9, wherein, The second connecting piece is arranged close to the card insertion side edge of the PCB board.

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