Intelligent screen mainboard heat dissipation structure

Abstract

The utility model discloses an intelligent screen mainboard heat dissipation structure which specifically comprises a heat dissipation plate, a heat dissipation frame and a heat dissipation fan which are connected in sequence, and a water cooling pipe is installed on the heat dissipation frame. The intelligent screen mainboard is subjected to air draft and heat dissipation through the heat dissipation fan, so that heat generated by the intelligent screen mainboard is dissipated through the ventilation holes, the heat dissipation air duct and the water cooling pipe, and the heat dissipation effect is improved. Therefore, the heat dissipation structure of the intelligent screen main board solves the technical problem that the heat dissipation effect of the intelligent screen main board is poor.

Description

Technical Field

[0001] This utility model relates to the field of motherboard heat dissipation technology, and in particular to a heat dissipation structure for a smart screen motherboard. Background Technology

[0002] With the continuous development of technology, smart screens are being used more and more widely. A smart screen is a multi-functional integrated screen that can display various information and provide intelligent control.

[0003] In existing technologies, smart screens include a casing, a motherboard, and a display screen. The motherboard houses numerous electronic components, and after prolonged operation, it generates a significant amount of heat. However, due to the traditional structure of smart screens, heat dissipation relies solely on the casing and ventilation holes, resulting in poor heat dissipation performance. This affects the lifespan of the components on the motherboard, consequently impacting the normal operation of the smart screen. Utility Model Content

[0004] The purpose of this utility model is to provide a heat dissipation structure for a smart screen motherboard, which solves the technical problem of poor heat dissipation performance of the smart screen motherboard.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A heat dissipation structure for a smart screen motherboard includes: a heat sink plate, a heat sink frame, and a heat dissipation fan connected in sequence. The heat sink plate is provided with ventilation holes, the heat sink frame is provided with heat dissipation air ducts corresponding to the ventilation holes, and water cooling pipes are installed on the heat sink frame.

[0007] The heat sink is connected to the smart screen motherboard, and the cooling fan is used to exhaust air from the smart screen motherboard to dissipate heat, so that the heat generated by the smart screen motherboard is dissipated through the ventilation holes, the cooling air ducts, and the water cooling pipes.

[0008] Optionally, at least one heat dissipation copper pillar is installed on the heat sink.

[0009] Optionally, the heat sink includes a first plate and a second plate connected vertically, the first plate having a plurality of first mounting holes and the second plate having a plurality of second mounting holes.

[0010] Optionally, the first plate is provided with four positioning slots, and the heat sink is positioned and inserted into the positioning slots.

[0011] Optionally, the heat dissipation frame includes two horizontal heat dissipation plates arranged opposite each other, and a plurality of vertical heat dissipation plates are connected between the two horizontal heat dissipation plates, the horizontal heat dissipation plates and the vertical heat dissipation plates forming the heat dissipation air duct.

[0012] Optionally, the heat dissipation vertical plate is provided with a wave-shaped heat dissipation contact surface.

[0013] Optionally, the water-cooling pipe includes a pipe body arranged in a serpentine shape, the pipe body passing back and forth through the heat dissipation air duct;

[0014] Wherein, one end of the pipe body is the water inlet end, and the other end of the pipe body is the water outlet end, and the water inlet end and the water outlet end are both located on the same side of the heat sink frame.

[0015] Optionally, both the heat sink and the heat sink bracket are made of aluminum alloy.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] This utility model provides a heat dissipation structure for a smart screen motherboard, specifically comprising: a heat sink, a heat sink frame, and a cooling fan connected in sequence, with water-cooling pipes installed on the heat sink frame. The cooling fan draws air from the smart screen motherboard to dissipate heat, allowing the heat generated by the motherboard to be dissipated through ventilation holes, heat dissipation channels, and water-cooling pipes, thus improving the heat dissipation effect. Therefore, the heat dissipation structure for a smart screen motherboard provided by this utility model solves the technical problem of poor heat dissipation performance of smart screen motherboards. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0020] Figure 1 This is a three-dimensional structural diagram of a heat dissipation structure for a smart screen motherboard disclosed in an embodiment of the present utility model;

[0021] Figure 2 This is an exploded view of a heat dissipation structure for a smart screen motherboard disclosed in an embodiment of the present invention;

[0022] Figure 3 This is a partial top view of a heat dissipation structure for a smart screen motherboard disclosed in an embodiment of the present utility model;

[0023] Figure 4 for Figure 3 A schematic diagram of the AA cross-sectional structure;

[0024] Figure 5 This is a schematic diagram of the connection structure between the heat sink and the heat sink copper pillar in a heat dissipation structure of a smart screen motherboard disclosed in an embodiment of this utility model.

[0025] Illustration:

[0026] 10. Heat sink plate; 11. First plate; 111. First mounting hole; 112. Ventilation hole; 113. Positioning groove; 12. Second plate; 121. Second mounting hole; 20. Heat sink bracket; 21. Horizontal heat sink plate; 22. Vertical heat sink plate; 221. Heat dissipation contact surface; 30. Heat dissipation fan; 40. Water cooling pipe; 41. Pipe body; 42. Water inlet end; 43. Water outlet end; 50. Copper heat dissipation column. Detailed Implementation

[0027] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0028] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0029] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0030] This utility model embodiment provides a heat dissipation structure for a smart screen motherboard, such as... Figure 1-5As shown, it includes: a heat sink 10, a heat sink bracket 20, and a cooling fan 30 connected in sequence. The heat sink 10 is provided with ventilation holes 112, and the heat sink bracket 20 is provided with heat dissipation air ducts corresponding to the ventilation holes 112. A water cooling pipe 40 is installed on the heat sink bracket 20. In this embodiment, the use of the water cooling pipe 40 provides a stable coolant circulation. Even under long-term high-load operation, the motherboard can maintain a low-temperature operating state and avoid a decrease in heat dissipation performance.

[0031] The heat sink 10 is connected to the smart screen motherboard, and the cooling fan 30 is used to exhaust air from the motherboard for heat dissipation, allowing the heat generated by the motherboard to be dissipated through the ventilation holes 112, the cooling air duct, and the water-cooling pipe 40. In this embodiment, the multi-stage heat dissipation design of the ventilation holes 112, the cooling air duct, and the water-cooling pipe 40 can quickly conduct and dissipate the heat generated by the motherboard, significantly improving heat exchange efficiency compared to traditional passive cooling. The efficient heat dissipation structure effectively reduces the operating temperature of the smart screen motherboard, preventing performance degradation or damage to electronic components due to overheating, thereby extending the lifespan of the motherboard and the entire device. This solution organically combines the heat sink 10, the heat sink bracket 20, the water-cooling pipe 40, and the cooling fan 30 to form a compact heat dissipation system. Its modular design is suitable for various specifications of smart screen motherboards, exhibiting strong compatibility.

[0032] It should be noted that the heat dissipation structure for a smart screen motherboard provided by this utility model specifically includes: a heat sink 10, a heat sink bracket 20, and a cooling fan 30 connected in sequence, with a water-cooling pipe 40 installed on the heat sink bracket 20. The cooling fan 30 draws air from the smart screen motherboard to dissipate heat, allowing the heat generated by the motherboard to be dissipated through the ventilation holes 112, the heat dissipation duct, and the water-cooling pipe 40, thus improving the heat dissipation effect. Therefore, the heat dissipation structure for a smart screen motherboard provided by this utility model solves the technical problem of poor heat dissipation performance of smart screen motherboards.

[0033] like Figure 1-5 As shown, at least one heat dissipation copper pillar 50 is installed on the heat sink 10. In this embodiment, four heat dissipation copper pillars 50 are installed on the heat sink 10, and the heat dissipation copper pillars 50 directly contact the high-temperature area of ​​the smart screen motherboard. The heat generated by the motherboard is first conducted to the heat sink 10 through the heat dissipation copper pillars 50, utilizing the excellent thermal conductivity of the copper pillars to achieve rapid heat transfer. This design can effectively avoid local overheating and improve heat dissipation efficiency.

[0034] like Figure 3 and Figure 4As shown, the heat sink 10 includes a first plate 11 and a second plate 12 connected vertically. The first plate 11 has a plurality of first mounting holes 111, and the second plate 12 has a plurality of second mounting holes 121. In this embodiment, the second plate 12 is connected to other heat dissipation components through the second mounting holes 121, so that heat is evenly distributed between the two plates and transferred to the subsequent heat dissipation air duct.

[0035] like Figure 3 and Figure 4 As shown, the first plate 11 has four positioning slots 113, and the heat sink 20 is positioned and inserted into the positioning slots 113. It should be noted that, since the first plate 11 is designed with four positioning slots 113, the heat sink 20 is fixed by being inserted into the positioning slots 113, forming a reliable overall structure.

[0036] like Figure 3 and Figure 4 As shown, the heat sink 20 includes two opposing horizontal heat sinks 21, with a plurality of vertical heat sinks 22 connected between the two horizontal heat sinks 21. The horizontal heat sinks 21 and the vertical heat sinks 22 enclose each other to form a heat dissipation duct. In this embodiment, the heat sink 20 includes a heat dissipation duct formed by the horizontal heat sinks 21 and the vertical heat sinks 22, and utilizes the exhaust action of the cooling fan 30 to achieve rapid heat dissipation.

[0037] like Figure 3 and Figure 4 As shown, the heat dissipation vertical plate 22 has a wavy heat dissipation contact surface 221. It should be noted that the wavy contact surface of the heat dissipation vertical plate 22 further increases the contact area between the air and the heat sink 20, improves the heat exchange area, and the combined effect of the heat dissipation air duct and the water cooling pipe 40 enhances the heat conduction capacity of the air and liquid, allowing the heat of the motherboard to be quickly dissipated to the external environment.

[0038] like Figure 3 and Figure 4 As shown, the water-cooling pipe 40 includes a pipe body 41 arranged in a serpentine shape, which passes back and forth through the heat dissipation air duct.

[0039] The water-cooling pipe 40 has a water inlet 42 at one end and a water outlet 43 at the other end, both located on the same side of the heat sink 20. This arrangement facilitates pipe routing and coolant circulation. The serpentine pipe body 41 is evenly distributed, effectively preventing localized overheating. The overall structure is compact and adaptable to different specifications of smart screen motherboards.

[0040] In this embodiment, the cooling fan 30 exhausts hot air from the cooling duct and continuously introduces cool air. Simultaneously, the water-cooling pipes 40 are arranged in a serpentine pattern within the cooling duct, increasing the contact area between the water-cooling pipes 40 and the hot air in the cooling duct, ensuring more efficient heat exchange. The coolant circulates within the pipes, carrying heat away from the cooling duct. This dual heat dissipation mechanism of hot air and water-cooling pipes 40 further enhances the heat dissipation capacity.

[0041] like Figure 1-5 As shown, both the heat sink 10 and the heat sink bracket 20 are made of aluminum alloy. In this embodiment, the high thermal conductivity and corrosion resistance of aluminum alloy enable the heat dissipation system to operate stably in various environments. The dual heat dissipation mechanism of the water cooling pipe 40 and the cooling fan 30 reduces the temperature of the smart screen motherboard, prevents component damage caused by overheating, and thus extends the service life of the device.

[0042] It should be noted that both the heat sink 10 and the heat sink bracket 20 are made of aluminum alloy. Aluminum alloy has excellent thermal conductivity and light weight, enabling it to quickly absorb and conduct heat while reducing the overall weight of the heat dissipation component. The use of aluminum alloy makes the process of heat transfer from the smart screen motherboard to the heat dissipation structure more efficient.

[0043] Working principle: The present invention provides a heat dissipation structure for a smart screen motherboard, specifically including: a heat sink 10, a heat sink bracket 20, and a cooling fan 30 connected in sequence, with a water cooling pipe 40 installed on the heat sink bracket 20. The cooling fan 30 draws air from the smart screen motherboard to dissipate heat, exhausting hot air from the heat dissipation duct and continuously introducing cool air.

[0044] Meanwhile, the water-cooling pipes 40 are arranged in a serpentine pattern within the heat dissipation duct, increasing the contact area between the water-cooling pipes 40 and the hot air in the duct, ensuring more efficient heat exchange. The coolant circulates within the pipes, carrying heat away from the heat dissipation duct. This dual heat dissipation mechanism of hot air and water-cooling pipes 40 enhances the heat dissipation effect. Therefore, the smart screen motherboard heat dissipation structure provided by this utility model, through the combination of serpentine water-cooling pipes, aluminum alloy heat sink and heat sink frame, and cooling fan, forms an efficient and stable heat dissipation solution, significantly improving the heat dissipation capacity of the smart screen motherboard and solving the technical problem of poor heat dissipation performance of the smart screen motherboard.

[0045] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. An intelligent screen mainboard heat dissipation structure, characterized in that, The application relates to a heat dissipation device for a smart screen mainboard. The heat dissipation device comprises a heat dissipation plate (10), a heat dissipation frame (20) and a heat dissipation fan (30) connected in sequence, the heat dissipation plate (10) is provided with ventilation holes (112), the heat dissipation frame (20) is provided with heat dissipation air ducts corresponding to the ventilation holes (112), and a water cooling pipe (40) is arranged on the heat dissipation frame (20). The heat dissipation plate (10) is connected with the smart screen mainboard, the heat dissipation fan (30) is used for air extraction and heat dissipation of the smart screen mainboard, and the heat generated by the smart screen mainboard is dissipated through the ventilation holes (112), the heat dissipation air ducts and the water cooling pipe (40).

2. The intelligent screen mainboard heat dissipation structure according to claim 1, characterized in that, At least one heat dissipation copper column (50) is arranged on the heat dissipation plate (10).

3. The intelligent screen mainboard heat dissipation structure according to claim 1 or 2, characterized in that, The heat dissipation plate (10) comprises a first plate (11) and a second plate (12) connected vertically, a plurality of first mounting holes (111) are arranged on the first plate (11), and a plurality of second mounting holes (121) are arranged on the second plate (12).

4. The intelligent screen mainboard heat dissipation structure according to claim 3, characterized in that, Four positioning grooves (113) are arranged on the first plate (11), and the heat dissipation frame (20) is positioned and inserted into the positioning grooves (113).

5. The intelligent screen mainboard heat dissipation structure according to claim 1 or 2, characterized in that, The heat dissipation frame (20) comprises two heat dissipation horizontal plates (21) arranged oppositely, a plurality of heat dissipation vertical plates (22) are connected between the two heat dissipation horizontal plates (21), and the heat dissipation horizontal plates (21) and the heat dissipation vertical plates (22) form the heat dissipation air ducts. 6.The intelligent screen mainboard heat dissipation structure according to claim 5, characterized in that, Wavy heat dissipation contact surfaces (221) are arranged on the heat dissipation vertical plates (22).

7. The intelligent screen mainboard heat dissipation structure according to claim 5, characterized in that, The water cooling pipe (40) comprises a pipe body (41) arranged in a snake shape, the pipe body (41) passes through the heat dissipation air ducts back and forth. One end of the pipe body (41) is a water inlet end (42), the other end of the pipe body (41) is a water outlet end (43), and the water inlet end (42) and the water outlet end (43) are located on the same side of the heat dissipation frame (20). 8.The intelligent screen mainboard heat dissipation structure according to claim 1 or 2, characterized in that, The heat dissipation plate (10) and the heat dissipation frame (20) are made of aluminum alloy.

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