Heat dissipation assembly, domain controller and movable platform

Abstract

The utility model provides a heat dissipation assembly, a domain controller and a movable platform, the heat dissipation assembly comprises a shell, a first pipeline, a second pipeline, at least one heat dissipation fin, a plurality of heat dissipation columns and a plurality of first wall surface convex hulls, a heat dissipation cavity is formed in the shell, the heat dissipation cavity comprises a first heat dissipation area, a second heat dissipation area and a third heat dissipation area which are communicated, the first heat dissipation area and the third heat dissipation area correspond to the second heating device, and the second heat dissipation area corresponds to the first heating device; the first pipeline is communicated with the first heat dissipation area; the second pipeline is communicated with the third heat dissipation area; the heat dissipation fins are arranged in the first heat dissipation area or the third heat dissipation area; or the heat dissipation fins are arranged on the side, close to the first heat dissipation area or the third heat dissipation area, of the second heat dissipation area; the plurality of heat dissipation columns are uniformly arranged in the second heat dissipation area; and the plurality of first wall surface convex hulls are uniformly arranged on the side wall of the second heat dissipation area. The turbulent flow capacity of the cooling liquid in the heat dissipation cavity can be improved, and therefore the heat dissipation capacity of the heat dissipation assembly is improved.

Description

Technical Field

[0001] This application relates to domain controller heat dissipation technology, and more particularly to a heat dissipation component, a domain controller, and a mobile platform. Background Technology

[0002] A domain controller is a critical network server used to manage and control computers, users, and resources within a domain. For example, in the automotive field, a domain controller manages and controls various vehicle functions, including but not limited to powertrain, chassis control, autonomous driving, and smart cockpit information processing. Domain controllers integrate multiple heat-generating components, such as chips; therefore, they are equipped with corresponding heat dissipation components that contact these components to dissipate heat as quickly as possible, ensuring the domain controller maintains optimal operating conditions.

[0003] In related technical solutions, the heat dissipation component installed within the domain controller includes a housing, within which a heat dissipation cavity is formed. The surface of the housing has a first pipe and a second pipe communicating with the heat dissipation cavity. Coolant enters the heat dissipation cavity through the first pipe, and after heat exchange, flows out of the heat dissipation cavity through the second pipe. To improve the heat dissipation performance of the heat dissipation component, multiple heat dissipation fins can be installed within the heat dissipation cavity. These fins create multiple flow channels within the heat dissipation cavity, thereby enhancing the heat dissipation performance of the heat dissipation component.

[0004] However, the solution using related technologies has a poor coolant flow rate distribution within the heat dissipation components, resulting in poor heat dissipation in the areas corresponding to the main heat-generating components in the domain controller. Utility Model Content

[0005] In order to overcome the above-mentioned defects in related technologies, the purpose of this application is to provide a heat dissipation component, a domain controller and a mobile platform. This application is beneficial to improving the heat dissipation speed of the main heat-generating components in the domain controller, thereby improving the heat dissipation performance of the heat dissipation component.

[0006] On one hand, this application provides a heat dissipation assembly for dissipating heat from heat-generating devices in electronic devices, wherein the heat-generating devices include a plurality of first heat-generating devices and a plurality of second heat-generating devices, and the heat generated by the first heat-generating devices is greater than the heat generated by the second heat-generating devices; comprising:

[0007] The outer casing has a heat dissipation cavity formed inside it. The heat dissipation cavity includes a first heat dissipation area, a second heat dissipation area, and a third heat dissipation area that are connected to each other. The first heat dissipation area and the third heat dissipation area correspond to the second heat-generating device, and the second heat dissipation area corresponds to the first heat-generating device.

[0008] A first conduit, the first conduit being connected to the first heat dissipation area;

[0009] A second pipe, which connects to the third heat dissipation area;

[0010] At least one heat dissipation fin is disposed within the first heat dissipation area or the third heat dissipation area; or, the heat dissipation fin is disposed on the side of the second heat dissipation area close to the first heat dissipation area or the third heat dissipation area.

[0011] Multiple heat dissipation columns are evenly arranged within the second heat dissipation zone;

[0012] Multiple first wall protrusions are evenly distributed on the sidewall of the second heat dissipation area.

[0013] In one possible implementation, the inner diameter of the first heat dissipation area gradually increases in the direction away from the first pipe. The first heat dissipation area is provided with a plurality of heat dissipation fins, which are arranged along the extending direction of the first heat dissipation area, and a gap is formed between adjacent heat dissipation fins; and / or,

[0014] In the direction away from the second pipe, the inner diameter of the third heat dissipation area gradually increases. The third heat dissipation area is provided with a plurality of heat dissipation fins, which are arranged along the extension direction of the third heat dissipation area, and a gap is formed between two adjacent heat dissipation fins.

[0015] In one possible implementation, the inner diameter of the first heat dissipation area is equal everywhere in the direction away from the first pipe, and the heat dissipation fins are disposed on the side of the second heat dissipation area close to the first heat dissipation area.

[0016] In one possible implementation, the heat dissipation fins are arc-shaped, with the first end of the heat dissipation fins close to the first heat dissipation area and the second end of the heat dissipation fins close to the heat dissipation column.

[0017] In one possible implementation, the inner wall of the first heat dissipation area is further provided with a plurality of second wall protrusions, which are disposed on the side of the first heat dissipation area close to the second heat dissipation area.

[0018] In one possible implementation, the housing includes a base and an end cap, the heat dissipation cavity is formed within the base, and the end cap is disposed on the base to seal the heat dissipation cavity;

[0019] The heat dissipation fins, the heat dissipation pillars, and the first wall protrusion are integrally formed with the base. In one possible implementation, the height of the heat dissipation pillars is 6.824mm-10.824mm, and the gap between the heat dissipation pillars and the end cap is greater than or equal to 0.3mm.

[0020] The height of the first wall protrusion is 6.824mm-10.824mm, and the gap between the first wall protrusion and the end cap is greater than or equal to 0.3mm.

[0021] In one possible implementation, the heat dissipation column is cylindrical, and the diameter of the heat dissipation column is 2.2mm-3.8mm;

[0022] The first wall protrusion is semi-cylindrical, and the diameter of the first wall protrusion is 2.2mm-3.8mm;

[0023] The distance between the axis of the heat dissipation column and the axis of the adjacent heat dissipation column is 5mm-10mm; the distance between the axis of the heat dissipation column and the axis of the adjacent first wall protrusion is 5mm-10mm; the distance between the axis of the first wall protrusion and the axis of the adjacent first wall protrusion is 5mm-10mm.

[0024] On the other hand, this application provides a domain controller including the heat dissipation components described above.

[0025] In another aspect, this application provides a mobile platform, including the domain controller described above.

[0026] This application provides a heat dissipation component, a domain controller, and a mobile platform. The heat dissipation component is used to dissipate heat from heat-generating devices in electronic devices. The heat-generating devices include multiple first heat-generating devices and multiple second heat-generating devices, with the heat generated by the first heat-generating devices being greater than that of the second heat-generating devices. The heat dissipation component includes a housing, a first pipe, a second pipe, at least one heat dissipation fin, multiple heat dissipation pillars, and multiple first wall protrusions. A heat dissipation cavity is formed within the housing, comprising a first heat dissipation area, a second heat dissipation area, and a third heat dissipation area that are interconnected. The first and third heat dissipation areas correspond to the second heat-generating devices, and the second heat dissipation area corresponds to the first heat-generating device. The first pipe connects to the first heat dissipation area; the second pipe connects to the third heat dissipation area; the heat dissipation fins are disposed within the first or third heat dissipation area; or, the heat dissipation fins are disposed on the side of the second heat dissipation area near the first or third heat dissipation area; the multiple heat dissipation pillars are uniformly disposed within the second heat dissipation area; and the multiple first wall protrusions are uniformly disposed on the sidewalls of the second heat dissipation area. This application improves the heat dissipation capacity by setting heat dissipation fins, heat dissipation pillars, and a first wall protrusion in the heat dissipation cavity, and by placing the heat dissipation pillars and the first wall protrusion in the second heat dissipation area corresponding to the first heat-generating device. This improves the flow rate of the coolant in the second heat dissipation area, reduces the flow rate of the coolant near the wall, increases the flow rate of the coolant in the middle of the second heat dissipation area, and enhances the turbulence capability. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a top view of a heat dissipation component in the related art;

[0029] Figure 2 for Figure 1 Simulation diagram of the flow performance of the heat dissipation component shown;

[0030] Figure 3 This is a top view of another heat dissipation component in the related technology;

[0031] Figure 4 for Figure 3 Simulation diagram of the flow performance of the heat dissipation component shown;

[0032] Figure 5 A top view of a heat dissipation assembly provided in an embodiment of this application;

[0033] Figure 6 for Figure 5 Simulation diagram of the flow performance of the heat dissipation component shown;

[0034] Figure 7 for Figure 5 Axonometric view of the heat dissipation assembly shown;

[0035] Figure 8 A top view of a heat dissipation assembly provided in another embodiment of this application;

[0036] Figure 9 for Figure 8 Simulation diagram of the flow performance of the heat dissipation component shown;

[0037] Figure 10 for Figure 8 Axonometric view of the heat dissipation assembly shown;

[0038] Figure 11 for Figure 8 A magnified view of a portion of the heat dissipation component shown.

[0039] Figure label:

[0040] 100 - Outer shell; 101 - Base; 110 - First heat dissipation zone; 120 - Second heat dissipation zone; 130 - Third heat dissipation zone;

[0041] 200 - First Pipeline;

[0042] 300 - Second pipe;

[0043] 400-Heat dissipation fins;

[0044] 500-heat sink column;

[0045] 600 - First wall convex hull;

[0046] 700-Second wall convex hull. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0048] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0049] As described in the background section, in related technologies, the heat dissipation component installed within a domain controller includes a housing with a heat dissipation cavity formed inside. The surface of the housing has a first pipe and a second pipe communicating with the heat dissipation cavity. Coolant enters the heat dissipation cavity through the first pipe, exchanges heat, and then flows out of the heat dissipation cavity through the second pipe. To improve the heat dissipation performance of the heat dissipation component, multiple heat dissipation fins can be installed within the heat dissipation cavity, creating multiple flow channels, thereby improving the heat dissipation performance. However, in the related technologies, the coolant flow rate distribution within the heat dissipation component is poor, resulting in poor heat dissipation in areas corresponding to the main heat-generating components in the domain controller.

[0050] Figure 1 A top view of a heat dissipation component in the related art is shown, mainly illustrating the internal structure of the heat dissipation cavity. For example... Figure 1 As shown, in a heat dissipation assembly of the related technology, a plurality of heat dissipation fins 400 are provided in the heat dissipation cavity within the housing 100. The heat dissipation fins 400 are curved and adapted to the contour of the side wall of the heat dissipation cavity. The heat dissipation fins 400 can transfer heat from the domain controller to the heat dissipation cavity and can also guide the flow of coolant within the heat dissipation cavity. The multiple heat dissipation fins 400 divide the interior of the heat dissipation cavity into multiple heat dissipation channels, allowing the coolant to be evenly distributed into each heat dissipation channel, thereby dissipating heat from the heat-generating components of the domain controller. In areas of the domain controller with high heat generation, the density of the heat dissipation fins 400 can be increased to improve heat dissipation performance.

[0051] Figure 2 It shows Figure 1 The simulation diagram of the heat dissipation component's flow performance is shown, where lighter colors represent higher coolant flow rates. Figure 2 As shown, in Figure 1 In the heat dissipation assembly shown, the coolant flow velocity is highest near the inlet and outlet. In the middle of the assembly, the coolant flow velocity at the edges is greater than that in the center. Since the main heat-generating components of the domain controller correspond to the middle region of the heat dissipation assembly, therefore... Figure 1 The coolant flow rate distribution within the heat dissipation component shown is poor, resulting in poor heat dissipation in the areas corresponding to the main heat-generating components in the domain controller.

[0052] Figure 3 A top view of another heat dissipation component in the related art is shown, mainly illustrating the internal structure of the heat dissipation cavity. For example... Figure 3 As shown, in another heat dissipation component of the related technology, a plurality of heat dissipation fins 400 are provided in the heat dissipation cavity inside the housing 100. The heat dissipation fins 400 are curved and adapted to the contour of the side wall of the heat dissipation cavity. Furthermore, since the heat-generating devices of the domain controller are mainly concentrated in the upper right of the heat dissipation component, the heat dissipation component adopts an asymmetrical structure. The upper right area of ​​the heat dissipation component has a large area, and the density of heat dissipation fins 400 in this area is also large, thereby improving heat dissipation performance.

[0053] Figure 4 It shows Figure 3 The simulation diagram of the heat dissipation component's flow performance is shown, where lighter colors represent higher coolant flow rates. Figure 4 As shown, in Figure 3 In the heat dissipation assembly shown, the coolant flow velocity is highest in the area near the inlet and outlet. In the upper right area of ​​the heat dissipation assembly, the coolant flow velocity at the edge is greater than that in the middle. Therefore, the coolant flow velocity distribution in the heat dissipation assembly is poor, and the heat dissipation effect is poor in the area corresponding to the main heat-generating devices in the domain controller.

[0054] In view of this, the embodiments of this application aim to provide a heat dissipation component, a domain controller, and a movable platform. By providing heat dissipation fins, heat dissipation pillars, and a first wall protrusion in the heat dissipation cavity, and by positioning the heat dissipation pillars and the first wall protrusion in a second heat dissipation area corresponding to the first heat-generating device, the flow rate of the coolant in the second heat dissipation area is improved, the flow rate of the coolant near the wall is reduced, the flow rate of the coolant in the middle position of the second heat dissipation area is increased, and the turbulence capability is enhanced, thereby improving the heat dissipation capability.

[0055] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can gain a more detailed understanding of the contents of this application.

[0056] Please refer to Figures 5-11This embodiment provides a heat dissipation component for cooling heat-generating devices in electronic devices, such as domain controllers. The heat-generating devices may be chips, and include multiple first heat-generating devices and multiple second heat-generating devices, wherein the heat generated by the first heat-generating devices is greater than the heat generated by the second heat-generating devices.

[0057] The heat dissipation assembly includes a housing 100, within which a heat dissipation cavity is formed. The shape of the heat dissipation cavity is adapted to the distribution shape of heat-generating components within the electronic device to cover most or even all of the heat-generating components. The heat dissipation cavity includes a first heat dissipation area 110, a second heat dissipation area 120, and a third heat dissipation area 130 that are interconnected. The first heat dissipation area 110 and the third heat dissipation area 130 correspond to a second heat-generating component, and the second heat dissipation area 120 corresponds to the first heat-generating component. The second heat dissipation area 120 is the main heat dissipation area of ​​the heat dissipation assembly.

[0058] The first pipe 200 is connected to the first heat dissipation area 110. The first pipe 200 can be, for example, a coolant inlet pipe, so that coolant is injected into the heat dissipation cavity through the first pipe 200.

[0059] The second pipe 300 connects to the third heat dissipation zone 130. The second pipe 300 can be, for example, a coolant outlet pipe, through which the coolant after heat exchange in the heat dissipation cavity is discharged.

[0060] At least one heat dissipation fin 400 is disposed within the first heat dissipation zone 110 or the third heat dissipation zone 130 to guide the coolant entering or exiting the heat dissipation cavity. Alternatively, the heat dissipation fin 400 is disposed on the side of the second heat dissipation zone 120 close to the first heat dissipation zone 110 or the third heat dissipation zone 130 to guide the coolant from the first heat dissipation zone 110 into the second heat dissipation zone 120, or to guide the coolant from the second heat dissipation zone 120 into the third heat dissipation zone 130.

[0061] Multiple heat sinks, 500mm each, evenly spaced (e.g.) Figure 5 The heat dissipation columns 500 are arranged in a uniformly staggered pattern within the second heat dissipation zone 120. This means that multiple heat dissipation columns 500 are positioned on the bottom wall of the second heat dissipation zone 120. By setting multiple heat dissipation columns 500, the flow state of the coolant within the second heat dissipation zone 120 can be altered. Compared to the heat dissipation fin scheme in related technologies, this can transform the turbulent coolant within the second heat dissipation zone 120 into turbulent flow, thereby improving heat exchange capacity.

[0062] Multiple first wall protrusions 600 are evenly distributed on the sidewall of the second heat dissipation zone 120. By providing multiple first wall protrusions 600, the flow state of the coolant near the sidewall of the second heat dissipation zone 120 can be changed, the wall flow velocity can be reduced, the turbulence can be enhanced, and the heat dissipation performance can be improved.

[0063] As described above, this embodiment improves the coolant flow rate in the second heat dissipation zone 120 by providing heat dissipation fins 400, heat dissipation pillars 500, and a first wall protrusion 600 inside the heat dissipation cavity, and by positioning the heat dissipation pillars 500 and the first wall protrusion 600 within the second heat dissipation zone 120 corresponding to the first heat-generating device. This reduces the coolant flow rate near the wall and increases the coolant flow rate in the middle of the second heat dissipation zone 120, thereby enhancing turbulence and improving heat dissipation capacity.

[0064] Please continue to refer to Figure 5 and Figure 7 In one possible implementation, the heat dissipation component of this embodiment can be configured as a symmetrical structure, that is, the entire heat dissipation component is symmetrically arranged with respect to the perpendicular bisector of the line connecting the first heat dissipation area 110 and the third heat dissipation area 130. In this case, the functions of the first pipe 200 and the second pipe 300 can be interchanged, that is, the first pipe 200 can be a coolant inlet pipe or a coolant outlet pipe; the second pipe 300 can correspondingly be a coolant outlet pipe or a coolant inlet pipe.

[0065] In the direction away from the first pipe 200, the inner diameter of the first heat dissipation area 110 gradually increases, with the inner diameter near the second heat dissipation area 120 being larger than that near the first pipe 200. The first heat dissipation area 110 is provided with multiple heat dissipation fins 400, which are arranged along the extending direction of the first heat dissipation area 110, and gaps are formed between adjacent heat dissipation fins 400. By providing multiple heat dissipation fins 400, coolant can be guided from the first pipe 200 into the second heat dissipation area 120, or from the second heat dissipation area 120 into the first pipe 200.

[0066] In the direction away from the second pipe 300, the inner diameter of the third heat dissipation zone 130 gradually increases, with the inner diameter near the second heat dissipation zone 120 being larger than that near the second pipe 300. The third heat dissipation zone 130 is provided with multiple heat dissipation fins 400, which are arranged along the extending direction of the third heat dissipation zone 130, and gaps are formed between adjacent heat dissipation fins 400. By providing multiple heat dissipation fins 400, coolant can be guided from the second pipe 300 into the second heat dissipation zone 120, or from the second heat dissipation zone 120 into the second pipe 300.

[0067] Within the second heat dissipation zone 120, multiple heat dissipation columns 500 are evenly distributed, all positioned on the bottom wall of the second heat dissipation zone 120. By providing multiple heat dissipation columns 500, the flow state of the coolant within the second heat dissipation zone 120 can be altered, transforming the turbulent coolant flow into a turbulent flow, thereby improving heat exchange capacity.

[0068] On the side wall of the second heat dissipation zone 120, a plurality of first wall protrusions 600 are evenly arranged. By setting a plurality of first wall protrusions 600, the flow state of coolant near the side wall of the second heat dissipation zone 120 can be changed, the wall flow velocity can be reduced, the turbulence can be enhanced, and the heat dissipation performance can be strengthened.

[0069] Figure 6 It shows Figure 5 The simulation diagram of the heat dissipation component's flow performance is shown, where lighter colors represent higher coolant flow rates. Figure 6 As shown, in Figure 5 In the heat dissipation assembly shown, the coolant flow velocity is highest near the inlet and outlet. Within the second heat dissipation zone 120, the coolant flow velocity in the middle is greater than that at the edges. This means that the flow rate, velocity, and turbulence performance in the middle are significantly improved, exceeding the turbulence performance of the flow channels at the edges. Conversely, the flow rate and velocity at the inner and outer edges are significantly reduced. This achieves highly efficient utilization of the coolant. The inventors found through simulation and actual measurement results that, compared to... Figure 1 Compared with the existing technology solutions shown, the solution in this embodiment can reduce the surface temperature of the main heat-generating components in the domain controller by about 5°C, and the heat dissipation effect is better.

[0070] Please continue to refer to Figure 8 and Figure 10 In another possible implementation, the heat dissipation component of this embodiment can be configured as an asymmetrical structure, with the second heat dissipation area 120 located near the upper right region of the heat dissipation component. In this case, the first pipe 200 is the inlet pipe for the coolant, and the second pipe 300 is the outlet pipe for the coolant.

[0071] In the direction away from the first pipe 200, the inner diameter of the first heat dissipation zone 110 is uniform throughout. Since the inner diameter of the first heat dissipation zone 110 is small, heat dissipation fins 400 are not required. Correspondingly, the inner diameter of the third heat dissipation zone 130 is also small, so heat dissipation fins 400 are also not required. The heat dissipation fins 400 are located on the side of the second heat dissipation zone 120 closest to the first heat dissipation zone 110, thereby better guiding the coolant from the first heat dissipation zone 110 into the second heat dissipation zone 120.

[0072] Within the second heat dissipation zone 120, multiple heat dissipation columns 500 are evenly distributed, all positioned on the bottom wall of the second heat dissipation zone 120. By providing multiple heat dissipation columns 500, the flow state of the coolant within the second heat dissipation zone 120 can be altered, transforming the turbulent coolant flow into a turbulent flow, thereby improving heat exchange capacity.

[0073] On the sidewall of the second heat dissipation zone 120, a plurality of first wall protrusions 600 are evenly arranged. By providing a plurality of first wall protrusions 600, the flow state of the coolant near the sidewall of the second heat dissipation zone 120 can be changed, reducing the wall flow velocity, enhancing turbulence, and improving heat dissipation performance. For example, combined with Figure 8 As shown, the first wall protrusion 600 is located on the side wall of the second heat dissipation area 120 in a region that does not correspond to the heat dissipation fins 400. Since the presence of the heat dissipation fins 400 already ensures good coolant flow in this region, the first wall protrusion 600 is unnecessary, thus reducing manufacturing difficulty. Furthermore, placing the first wall protrusion 600 near the center of the second heat dissipation area 120 improves the central heat dissipation capacity of the second heat dissipation area 120, thereby better dissipating heat from the heat-generating components of the electronic device.

[0074] Specifically, such as Figure 8 As shown, the heat dissipation fins 400 in this embodiment are arc-shaped and are disposed close to the sidewall of the second heat dissipation area 120, and the shape of the heat dissipation fins 400 is adapted to the shape of the sidewall of the second heat dissipation area 120. The first end of the heat dissipation fins 400 is close to the first heat dissipation area 110, and the second end of the heat dissipation fins 400 is close to the heat dissipation column 500.

[0075] In this embodiment, by setting heat dissipation fins 400 at the bend of the second heat dissipation zone 120, the backflow zone in this area can be avoided, and the coolant can be guided to the heat dissipation column 500 of the second heat dissipation zone 120, thereby improving the heat exchange capacity.

[0076] Furthermore, in this embodiment, the inner wall of the first heat dissipation area 110 is also provided with a plurality of second wall protrusions 700, which are disposed on the side of the first heat dissipation area 110 near the second heat dissipation area 120.

[0077] In this embodiment, by setting multiple second wall protrusions 700 on the side of the first heat dissipation area 110 near the second heat dissipation area 120, the coolant can be dispersed in advance, reducing potential energy.

[0078] Figure 9 It shows Figure 8 The simulation diagram of the heat dissipation component's flow performance is shown, where lighter colors represent higher coolant flow rates. Figure 9 As shown, in Figure 8In the heat dissipation assembly shown, the coolant flow velocity is highest near the inlet and outlet. Within the second heat dissipation zone 120, the coolant flow velocity in the middle is greater than that at the edges, exhibiting a high-velocity, high-turbulence state. Correspondingly, the flow rate and velocity at the inner and outer edges are significantly reduced. This achieves efficient utilization of the coolant and improves heat exchange performance. The inventors found through simulation and actual measurement results that, compared to... Figure 4 Compared with the existing technology solutions shown, the solution in this embodiment can reduce the surface temperature of the main heat-generating components in the domain controller by more than 3°C, resulting in better heat dissipation.

[0079] Please continue to refer to Figure 7 and Figure 10 In this embodiment, the housing 100 includes a base 101 and an end cap (not shown in the figure). A heat dissipation cavity is formed inside the base 101, and the end cap is disposed on the base 101 to seal the heat dissipation cavity. For example, the end cap can be welded to the base 101 to form a single unit, thereby ensuring good sealing performance.

[0080] In this embodiment, the heat dissipation fins 400, heat dissipation pillars 500, first wall protrusions 600, and second wall protrusions 700 are all integrally formed with the base 101. For example, the heat dissipation fins 400, heat dissipation pillars 500, first wall protrusions 600, and second wall protrusions 700 can be integrally die-cast with the base 101, thereby improving production efficiency.

[0081] In this embodiment, the height of the heat dissipation column 500 is preferably 6.824mm-10.824mm, and the gap between the heat dissipation column 500 and the end cover is preferably greater than or equal to 0.3mm. The height of the first wall protrusion 600 is preferably 6.824mm-10.824mm, and the gap between the first wall protrusion 600 and the end cover is preferably greater than or equal to 0.3mm.

[0082] This embodiment takes into account existing die-casting processes and costs, and limits the height of the heat dissipation column 500 and the first wall protrusion 600 to the above range. This ensures that the coolant in the heat dissipation cavity can fully contact the heat dissipation column 500, thereby giving the heat dissipation component a better heat dissipation capacity.

[0083] Please continue to refer to Figure 11 In some embodiments of this application, the heat dissipation column 500 is cylindrical and the diameter of the heat dissipation column 500 is 2.2mm-3.8mm.

[0084] The first wall protrusion 600 is semi-cylindrical, and its diameter is 2.2mm-3.8mm.

[0085] The distance D1 between the axis of the heat dissipation column 500 and the axis of the adjacent heat dissipation column 500 is 5mm-10mm. The distance D2 between the axis of the heat dissipation column 500 and the axis of the adjacent first wall protrusion 600 is 5mm-10mm. The distance D3 between the axis of the first wall protrusion 600 and the axis of the adjacent first wall protrusion 600 is 5mm-10mm.

[0086] In this embodiment, taking into account existing die-casting processes and costs, the diameters and spacing of the heat dissipation column 500 and the first wall protrusion 600 are set within the above-mentioned range. This can enhance the turbulence of the coolant in the heat dissipation cavity, strengthen the heat exchange performance, and thus give the heat dissipation component better heat dissipation capabilities.

[0087] This embodiment also provides a domain controller, including the above-described heat dissipation component.

[0088] Specifically, the domain controller includes a housing, within which a circuit board, a chip, and the aforementioned heat dissipation assembly are stacked. The heat dissipation assembly can be integrally formed with the housing using processes such as die casting. The chip, the main heat-generating component within the domain controller, is mounted on the circuit board and abuts against the surface of the heat dissipation assembly via a thermally conductive adhesive layer. Because this embodiment employs the aforementioned heat dissipation assembly, the domain controller's heat dissipation capacity is improved, thereby maintaining optimal operating conditions.

[0089] This embodiment also provides a mobile platform, including the domain controller described above.

[0090] Specifically, the mobile platform in this embodiment can be, for example, a vehicle, a drone, or a robot. Because of the domain controller described above, the heat dissipation capacity of the mobile platform can be improved, allowing it to maintain optimal operating conditions.

[0091] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0092] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0093] It should be noted that in the description of this application, the terms "first" and "second" are used only for convenience in describing different components and should not be construed as indicating or implying a sequential relationship, relative importance, or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features.

[0094] The embodiments or implementation methods in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0095] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipating assembly for dissipating heat from a heat generating device of an electronic device, wherein, The heat generating device comprises a plurality of first heat generating devices and a plurality of second heat generating devices, the heat generating amount of the first heat generating device is greater than that of the second heat generating device; characterized in that comprising: The shell is formed with a heat dissipation cavity in the shell, the heat dissipation cavity comprises a first heat dissipation area, a second heat dissipation area and a third heat dissipation area which are connected, wherein the first heat dissipation area and the third heat dissipation area correspond to the second heat generating device, and the second heat dissipation area corresponds to the first heat generating device; The first pipeline communicates the first heat dissipation area; The second pipeline communicates the third heat dissipation area; At least one heat dissipation fin is arranged in the first heat dissipation area or the third heat dissipation area; or the heat dissipation fin is arranged on one side of the second heat dissipation area close to the first heat dissipation area or the third heat dissipation area; A plurality of heat dissipation columns are uniformly arranged in the second heat dissipation area; A plurality of first wall convexes are uniformly arranged on the side wall of the second heat dissipation area.

2. The heat dissipation assembly of claim 1, wherein, In the direction away from the first pipeline, the inner diameter of the first heat dissipation area gradually increases, a plurality of heat dissipation fins are arranged in the first heat dissipation area, a plurality of heat dissipation fins are arranged along the extension direction of the first heat dissipation area, and a gap is formed between adjacent two heat dissipation fins; and / or, In the direction away from the second pipeline, the inner diameter of the third heat dissipation area gradually increases, a plurality of heat dissipation fins are arranged in the third heat dissipation area, a plurality of heat dissipation fins are arranged along the extension direction of the third heat dissipation area, and a gap is formed between adjacent two heat dissipation fins.

3. The heat dissipation assembly of claim 1, wherein, In the direction away from the first pipeline, the inner diameter of the first heat dissipation area is equal everywhere, and the heat dissipation fin is arranged on one side of the second heat dissipation area close to the first heat dissipation area.

4. The heat dissipating assembly of claim 3, wherein, The heat dissipation fin is in the shape of a circular arc, the first end of the heat dissipation fin is close to the first heat dissipation area, and the second end of the heat dissipation fin is close to the heat dissipation column.

5. The heat dissipation assembly of claim 3, wherein, A plurality of second wall convexes are arranged on the inner wall of the first heat dissipation area, and the second wall convexes are arranged on one side of the first heat dissipation area close to the second heat dissipation area.

6. The heat dissipating assembly according to any one of claims 1-5, wherein, The shell comprises a base and an end cover, the heat dissipation cavity is formed in the base, and the end cover is arranged on the base to seal the heat dissipation cavity; The heat dissipation fin, the heat dissipation column and the first wall convex are integrated with the base.

7. The heat dissipating assembly of claim 6, wherein, The height of the heat dissipation column is 6.824mm-10.824mm, and the gap between the heat dissipation column and the end cover is greater than or equal to 0.3mm; The height of the first wall convex is 6.824mm-10.824mm, and the gap between the first wall convex and the end cover is greater than or equal to 0.3mm.

8. The heat dissipating assembly of claim 6, wherein, The heat dissipation column is in the shape of a cylinder, and the diameter of the heat dissipation column is 2.2mm-3.8mm; The first wall convex is in the shape of a semicylinder, and the diameter of the first wall convex is 2.2mm-3.8mm; The distance between the axis of the heat dissipation column and the axis of another adjacent heat dissipation column is 5mm-10mm; the distance between the axis of the heat dissipation column and the axis of an adjacent first wall convex is 5mm-10mm; the distance between the axis of the first wall convex and the axis of another adjacent first wall convex is 5mm-10mm.

9. A domain controller, characterized by The heat dissipation assembly as claimed in any one of claims 1-8.

10. A movable platform, characterized by The domain controller as claimed in claim 9.

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