Circuit board positioning structure for pasting piece

By setting a magnetic adsorption part of permanent magnet material and a ferromagnetic metal area of ​​circuit board assembly in the positioning groove area of ​​the carrier plate, the problem of circuit board dislocation due to vibration during movement is solved, and higher positioning stability and patch quality are achieved.

CN224069032UActive Publication Date: 2026-03-31HUIZHOU BAOMING SEIKO CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-14
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Traditional positioning fixtures are prone to causing circuit boards to come off track or become misaligned due to vibration or collision during movement, affecting the accuracy of surface mount technology and even causing the circuit boards to be scrapped.

Method used

A magnetic adsorption part made of permanent magnet material is set in the positioning groove area of ​​the carrier plate, and a ferromagnetic metal area is set on the circuit board assembly. The circuit board is fixed by magnetic attraction. Combined with the precise matching design of the positioning groove and the circuit board assembly, the positioning stability is enhanced.

Benefits of technology

It effectively reduces the risk of displacement caused by transportation vibration, improves the stability and reliability of circuit boards during movement, and enhances the quality of chip mounting.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a circuit board positioning structure used for pasting parts, comprising a bearing plate, the middle of which is recessed to form a positioning groove used for accommodating a circuit board assembly, and the bearing plate is provided with a magnetic adsorption part made of a permanent magnet material in an area corresponding to the positioning groove; the circuit board assembly is provided with at least one ferromagnetic metal area; when the circuit board assembly is placed in the positioning groove, the magnetic adsorption part enables the circuit board assembly to be fixed in the positioning groove through magnetic attraction. According to the utility model, the stability of the circuit board in the chip mounting process can be ensured, and the chip mounting quality is improved.
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Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and more specifically, to a circuit board positioning structure for mounting components. Background Technology

[0002] In the production process of printed circuit boards (PCBs), surface mount technology (SMT) is required on the PCB surface. Precise positioning and stable fixation of the PCB are crucial to ensuring SMT quality. Traditional positioning fixtures use simple positioning slots to position the PCB. However, during the movement of the fixture, vibration or collision can easily cause the PCB to fall off and become misaligned, affecting the accuracy of SMT and even leading to the scrapping of the PCB. Utility Model Content

[0003] The purpose of this invention is to provide a circuit board positioning structure for surface mount technology (SMT) that can ensure the stability of the circuit board during the SMT process and improve the SMT quality.

[0004] A circuit board positioning structure for mounting components includes: a carrier plate with a recessed portion forming a positioning groove for accommodating a circuit board assembly; the carrier plate having a magnetic adsorption portion made of permanent magnet material in a region corresponding to the positioning groove; and a circuit board assembly having at least one ferromagnetic metal region; when the circuit board assembly is placed in the positioning groove, the magnetic adsorption portion fixes the circuit board assembly in the positioning groove by magnetic attraction.

[0005] In the above technical solution, the positioning groove can limit the circuit board assembly. By setting a magnetic adsorption part in the area corresponding to the positioning groove on the carrier plate, and setting a corresponding ferromagnetic metal area on the circuit board assembly, the circuit board assembly is fixed by magnetic attraction. The uniform magnetic force distribution enhances the positioning stability, effectively reduces the displacement risk caused by transportation vibration, increases the stability and reliability of the circuit board during movement, and thus improves the quality of patch mounting.

[0006] Furthermore, the circuit board assembly has process edges on both sides, and the ferromagnetic metal region is located on the process edges.

[0007] In the above technical solution, the ferromagnetic metal region is integrated into the process edge of the circuit board assembly, making full use of the standardized structural features of the circuit board, so that the magnetic attraction is concentrated in the non-functional area, which not only avoids interference between the magnetic attraction area and the circuit components, but also preserves the complete circuit board structure by removing the process edge after the surface mount is completed.

[0008] Furthermore, the ferromagnetic metal region is formed as a metal layer covering at least one side of the process edge surface.

[0009] In the above technical solution, a structural design with a metal layer covering the process edge is adopted. This increases the ferromagnetic contact area and strengthens the magnetic adsorption force. At the same time, the metal layer can be formed by existing electroplating or printing methods, which simplifies the processing flow and ensures adsorption stability and compatibility with production processes.

[0010] Furthermore, the positioning groove is provided with at least one window area, which extends through the positioning groove from the height direction of the support plate.

[0011] In the above technical solution, the through-hole design of the window area in the positioning groove can ensure that there is no gap for the protruding structure or existing components on the circuit board assembly, thus ensuring the stability of the circuit board placement.

[0012] Furthermore, the shape and dimensions of the positioning groove are matched with the shape and dimensions of the circuit board assembly.

[0013] In the above technical solution, the precise matching of the positioning groove with the shape and size of the circuit board assembly, combined with the magnetic attraction, achieves dual positioning, significantly improving the positioning accuracy and stability of the circuit board assembly.

[0014] Furthermore, the area of ​​the bearing plate corresponding to the outer periphery of the positioning groove is formed as a non-magnetic part made of non-permanent magnet material.

[0015] In the above technical solution, the non-permanent magnet material design of the non-magnetic part of the outer periphery of the carrier plate concentrates the magnetic force on the positioning groove area, avoiding the circuit board assembly from being attracted to other positions on the carrier plate when it is placed, making the operation more convenient.

[0016] Furthermore, the thickness of the bearing plate is 2.4mm-2.6mm.

[0017] Furthermore, the positioning groove is surrounded by several clearance grooves.

[0018] In the above technical solution, the clearance slot facilitates the placement and removal of circuit board components, making the operation more convenient.

[0019] Compared with the prior art, the beneficial effects of this utility model are: the positioning groove can limit the circuit board assembly; by setting a magnetic adsorption part in the area corresponding to the positioning groove on the bearing plate, and setting a corresponding ferromagnetic metal area on the circuit board assembly, the circuit board assembly is fixed by magnetic attraction; the positioning stability is enhanced by uniform magnetic force distribution, effectively reducing the displacement risk caused by transportation vibration, increasing the stability and reliability of the circuit board during movement, and thus improving the quality of patch mounting. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the support plate in an embodiment of the present utility model.

[0021] Figure 2 This is a schematic diagram of the circuit board assembly according to an embodiment of the present utility model.

[0022] Explanation of icon numbers:

[0023] 1. Support plate, 11. Positioning groove, 12. Magnetic adsorption part, 13. Window area, 14. Voiding groove, 2. Circuit board assembly, 21. Ferromagnetic metal area, 22. Process edge. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] like Figure 1 and Figure 2 As shown in a preferred embodiment, the circuit board positioning structure for mounting components of this invention mainly includes a carrier plate 1 and a circuit board assembly 2. The carrier plate 1 has a recessed center forming a positioning groove 11 for accommodating the circuit board assembly 2. A magnetic adsorption part 12 made of permanent magnet material is formed in the area corresponding to the positioning groove 11 on the carrier plate 1. The circuit board assembly 2 is provided with at least one ferromagnetic metal region 21. When the circuit board assembly 2 is placed in the positioning groove 11, the magnetic adsorption part 12 magnetically attracts and fixes the circuit board assembly 2 in the positioning groove 11.

[0027] For example, the carrier plate 1 is generally rectangular, with a downward recess near the center forming a positioning groove 11. In this embodiment, the shape and size of the positioning groove 11 match the shape and size of the circuit board assembly 2, enabling positioning of the circuit board assembly 2. A magnetic adsorption part 12, made of existing permanent magnet material, is formed on the carrier plate 1 in the area corresponding to the positioning groove 11. Specifically, the magnetic adsorption part 12 may be made of existing permanent magnet material in the area corresponding to the positioning groove 11 on the carrier plate 1, or permanent magnet material may be provided on the surface or inside the area corresponding to the positioning groove 11 on the carrier plate 1. A ferromagnetic metal region 21 is disposed on the circuit board assembly 2. It is understood that the ferromagnetic metal region 21 is made of existing ferromagnetic material, such as iron.

[0028] As can be seen from the above technical solution, the positioning groove 11 can limit the circuit board assembly 2. By setting the magnetic adsorption part 12 in the area corresponding to the positioning groove 11 on the bearing plate 1, and setting the corresponding ferromagnetic metal area 21 on the circuit board assembly 2, the circuit board assembly 2 can be fixed by magnetic attraction. The uniform magnetic force distribution enhances the positioning stability, effectively reduces the displacement risk caused by transportation vibration, increases the stability and reliability of the circuit board during movement, and thus improves the quality of patch mounting.

[0029] In this embodiment, the circuit board assembly 2 has process edges 22 on both sides, and the ferromagnetic metal region 21 is disposed on the process edge 22. For example, the circuit board assembly 2 is generally rectangular, and the process edges 22 are disposed on both sides of the length direction of the circuit board assembly 2. Integrating the ferromagnetic metal region 21 into the process edge 22 of the circuit board assembly 2 can make full use of the standardized structural features of the circuit board, so that the magnetic attraction is concentrated in the non-functional area, which not only avoids the interference between the magnetic attraction area and the circuit components, but also preserves the complete circuit board structure by removing the process edge 22 after the surface mount is completed.

[0030] In this embodiment, the ferromagnetic metal region 21 is formed as a metal layer covering at least one surface of the process edge 22. In practice, the metal layer can be formed on the process edge 22 using existing processes such as electroplating or printing, simplifying the processing flow. This structural design, using a metal layer covering the process edge 22, enhances magnetic adsorption by increasing the ferromagnetic contact area, ensuring adsorption stability and compatibility with the production process.

[0031] In this embodiment, the positioning groove 11 is provided with at least one window area 13, which extends through the positioning groove 11 from the height direction of the support plate 1. The through-hole design of the window area 13 in the positioning groove 11 can ensure that there is no gap for the protruding structure or existing components on the circuit board assembly 2, and ensure that the circuit board is placed stably.

[0032] The area around the outer periphery of the support plate 1 corresponding to the positioning groove 11 is formed as a non-magnetic part 15 made of non-permanent magnet material. The non-permanent magnet material design of the non-magnetic part 15 around the outer periphery of the support plate 1 concentrates the magnetic force on the area of ​​the positioning groove 11, preventing the circuit board assembly 2 from being attracted to other positions on the support plate 1 when it is placed, making the operation more convenient.

[0033] In this embodiment, the thickness of the support plate 1 is 2.4mm-2.6mm. The design of the support plate 1 within a specific thickness range ensures structural rigidity while maintaining the stability of the magnetic attraction force. This thickness balances the requirements of mechanical strength and magnetic attraction performance.

[0034] In this embodiment, the positioning groove 11 is provided with a plurality of clearance grooves 14 around its periphery. For example, the clearance grooves 14 are formed as arc-shaped grooves protruding from the edge of the positioning groove 11. The four corners of the positioning groove 11 are provided with clearance grooves 14 to ensure that the operator can place or remove the circuit board assembly 2 from the corners of the positioning groove 11. At the same time, clearance grooves 14 can be provided on the edges of the positioning groove 11 in both the length and width directions to facilitate the placement and removal of the circuit board assembly 2 and make the operation more convenient.

[0035] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board positioning structure for component mounting, characterized in that, The application relates to a circuit board assembly and a carrier plate for the circuit board assembly. The carrier plate comprises a carrier plate body with a positioning groove for accommodating the circuit board assembly, and a magnetic adsorption part made of a permanent magnetic material is formed on the carrier plate body in a region corresponding to the positioning groove. The circuit board assembly is provided with at least one ferromagnetic metal region. When the circuit board assembly is placed in the positioning groove, the magnetic adsorption part magnetically adsorbs the circuit board assembly to fix the circuit board assembly in the positioning groove.

2. The structure for positioning a circuit board for a patch member according to claim 1, wherein Two sides of the circuit board assembly are provided with process edges, and the ferromagnetic metal region is arranged on at least one side surface of the process edge.

3. The structure for positioning a circuit board for a patch member according to claim 2, wherein The ferromagnetic metal region is formed as a metal layer covering the at least one side surface of the process edge.

4. The structure for positioning a circuit board for a patch member according to claim 1, wherein At least one windowed region is arranged in the positioning groove, and the windowed region penetrates the positioning groove from the height direction of the carrier plate body.

5. The structure for positioning a circuit board for a patch member according to claim 1, wherein The shape and size of the positioning groove are matched with the shape and size of the circuit board assembly.

6. The structure for positioning a circuit board for a patch member according to claim 1, wherein A non-magnetic part made of a non-permanent magnetic material is formed on the carrier plate body in a region corresponding to the periphery of the positioning groove.

7. The structure for positioning a circuit board for a patch member according to claim 1, wherein The thickness of the carrier plate body is 2.4-2.6 mm.

8. The structure for positioning a circuit board for a patch member according to claim 1, wherein The periphery of the positioning groove is provided with a plurality of air-avoiding grooves.