Camera module thermal expansion colloid packaging structure

Abstract

The utility model discloses a camera module thermal expansion colloid packaging structure, which comprises a mainboard, a chip, a frame, a fixing groove and glass, the chip is arranged at the top of the mainboard, the frame is arranged at the top of the mainboard, the fixing groove is arranged at the top of the frame, the glass is bonded at the bottom of the inner wall of the fixing groove, and the chip is arranged at the top of the mainboard. And a packaging mechanism is arranged at the bottom of the frame. According to the utility model, the packaging mechanism is arranged, the thermal expansion colloid is injected into the packaging mechanism by using the glue injection equipment to fix the frame, and the thermal expansion colloid is a material with special performance, can generate obvious volume expansion or shrinkage when the temperature changes, and can generate volume expansion when being heated; and the expansion degree has certain correlation with the temperature change.

Description

Technical Field

[0001] This utility model relates to the field of camera module technology, specifically to a thermal expansion colloid encapsulation structure for camera modules. Background Technology

[0002] As an image input device, cameras are widely used in terminal products such as camera shooting, mobile phone video, and security monitoring. They have now become an indispensable item in people's lives. The quality of a camera is closely related to its camera module. With the continuous advancement of technology, the manufacturing process of camera modules is also constantly improving.

[0003] Existing packaging structures involve applying a fixing adhesive to the surface of the motherboard and then placing the frame on the adhesive. When the frame is compressed, the adhesive spreads outwards, causing the frame to tilt and become unable to remain horizontal. Utility Model Content

[0004] To address the problems mentioned in the background art, the purpose of this utility model is to provide a thermal expansion colloid encapsulation structure for camera modules. This structure has the advantage of limiting the position of the thermal expansion colloid, and solves the problem that existing encapsulation structures use adhesive to fix the motherboard surface and then place the frame on the colloid. When the frame is squeezed, the colloid spreads to the surrounding area, causing the frame to tilt and fail to remain horizontal.

[0005] To achieve the above objectives, this utility model provides the following technical solution: including a motherboard, a chip, a frame, a fixing groove, and glass. The chip is mounted on the top of the motherboard, the frame is located on the top of the motherboard, the fixing groove is opened on the top of the frame, the glass is bonded to the bottom of the inner wall of the fixing groove, and an encapsulation mechanism is provided at the bottom of the frame.

[0006] As a preferred embodiment of the present invention, the packaging mechanism includes a groove, which is formed at the bottom of the frame. A storage groove is formed on the outer side of the bottom of the frame, a glue injection groove is formed on the left side of the storage groove, and a vent is formed at the top of the glue injection groove.

[0007] As a preferred embodiment of this invention, a sponge frame is installed on the top of the motherboard, and the sponge frame is located on the outside of the chip.

[0008] As a preferred embodiment of this invention, a sealing gasket is installed on the top of the frame, a metal cover is installed on the outer side of the frame, and a lens tube is installed on the inner wall of the metal cover.

[0009] As a preferred embodiment of this utility model, mounting grooves are provided on both sides of the frame, and a spring is installed on one side of the inner wall of the mounting groove.

[0010] As a preferred embodiment of this invention, a protrusion is mounted on the other end of the spring.

[0011] As a preferred embodiment of this invention, the metal cover has fixing holes on both sides.

[0012] As a preferred embodiment of this invention, sealing grooves are provided at the top and bottom of the frame surface, and sealing rings are installed on the inner walls of the sealing grooves.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model, by setting up a packaging mechanism, uses a dispensing device to inject a thermally expanding colloid into the packaging mechanism to fix the frame. The thermally expanding colloid is a material with special properties that undergoes significant volume expansion or contraction when the temperature changes. It expands when heated, and the degree of expansion is correlated with the temperature change. It has good flexibility and elasticity, which allows it to adapt to different shapes and spatial changes during expansion and contraction without easily breaking or losing its packaging and protective functions. It has excellent sealing performance and can effectively prevent external dust, moisture, gases and other substances from entering the packaged space, while also preventing internal substances from leaking out, providing a stable environment for the internal objects. Under certain temperature and environmental conditions, the thermally expanding colloid has good chemical stability and is not prone to chemical reactions with surrounding substances, thus ensuring its long-term performance stability. This solves the problem of existing packaging structures that use fixing glue applied to the surface of the motherboard and then place the frame on the colloid. When the frame is squeezed, the colloid will spread to the surroundings, causing the frame to tilt and unable to maintain a horizontal position. This invention has the advantage of limiting the position of the thermally expanding colloid.

[0015] 2. This utility model, by setting up a packaging mechanism, provides space for the installation of the sponge frame through the groove. Before fixing the frame, a clamp is needed to pre-fix the frame. The storage groove can store the thermal expansion colloid. The glue injection groove can be filled with thermal expansion colloid by the glue injection equipment after the frame is placed on the motherboard. Then, the excess air inside is discharged through the vent hole to avoid uneven distribution of thermal expansion colloid and affect the sealing performance.

[0016] 3. This utility model provides secondary protection for the chip by setting up a sponge frame, which is fixed to the motherboard by thermal expansion colloid. This prevents the thermal expansion colloid from overflowing and flowing around the chip when the frame is in place, thus blocking the thermal expansion colloid. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the main cross-sectional structure of this utility model;

[0019] Figure 3 This utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0020] In the diagram: 1. Mainboard; 2. Chip; 3. Frame; 4. Mounting groove; 5. Glass; 6. Packaging mechanism; 61. Groove; 62. Storage groove; 63. Glue injection groove; 64. Vent; 7. Sponge frame; 8. Sealing gasket; 9. Metal cover; 10. Lens barrel; 11. Mounting groove; 12. Spring; 13. Protrusion; 14. Mounting hole; 15. Sealing groove; 16. Sealing ring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1 to 3 As shown, the present invention includes a motherboard 1, a chip 2, a frame 3, a fixing groove 4, and a glass 5. The chip 2 is installed on the top of the motherboard 1, the frame 3 is set on the top of the motherboard 1, the fixing groove 4 is opened on the top of the frame 3, the glass 5 is bonded to the bottom of the inner wall of the fixing groove 4, and an encapsulation mechanism 6 is opened at the bottom of the frame 3.

[0023] refer to Figure 3 The encapsulation mechanism 6 includes a groove 61, which is located at the bottom of the frame 3. A storage groove 62 is provided on the outer side of the bottom of the frame 3. A glue injection groove 63 is provided on the left side of the storage groove 62. A vent hole 64 is provided on the top of the glue injection groove 63.

[0024] As a technical optimization of this utility model, by setting the encapsulation mechanism 6, the groove 61 can provide installation space for the sponge frame 7. Before fixing the frame 3, a clamp is needed to pre-fix the frame 3. The storage groove 62 can store the thermal expansion colloid. After the frame 3 is placed on the main board 1, the thermal expansion colloid can be injected into the injection groove 63 by the injection equipment. Then, the excess air inside is discharged through the vent hole 64 to avoid uneven distribution of the thermal expansion colloid and affect the sealing performance.

[0025] refer to Figure 3 A foam frame 7 is installed on the top of the motherboard 1, and the foam frame 7 is located on the outside of the chip 2.

[0026] As a technical optimization of this utility model, a sponge frame 7 is set up. The sponge frame 7 is fixed on the motherboard 1 by thermal expansion colloid. The sponge frame 7 provides secondary protection for the chip 2 and prevents the thermal expansion colloid from overflowing and flowing around the chip 2 when the frame 3 is in place. It can block the thermal expansion colloid.

[0027] refer to Figure 3 A sealing gasket 8 is installed on the top of the frame 3, a metal cover 9 is installed on the outside of the frame 3, and a lens tube 10 is installed on the inner wall of the metal cover 9.

[0028] As a technical optimization of this utility model, by setting a sealing gasket 8 and a metal cover 9, the sealing gasket 8 can seal the top of the inner wall of the metal cover 9, preventing dust from entering and maintaining the stability of the internal space. The metal cover 9 can protect the frame 3 and the chip 2. The lens barrel 10 contains a lens, which can enable the chip 2 to form a better image.

[0029] refer to Figure 3 The frame 3 has mounting slots 11 on both sides, and a spring 12 is installed on one side of the inner wall of the mounting slot 11.

[0030] As a technical optimization of this utility model, by setting the mounting groove 11 and the spring 12, the mounting groove 11 can limit the spring 12 and provide space for movement, and the spring 12 can push the protrusion 13 to move so that the protrusion 13 can be reset after being squeezed.

[0031] refer to Figure 3 A protrusion 13 is installed on the other end of the spring 12.

[0032] As a technical optimization of this utility model, by setting the protrusion 13, when installing the metal cover 9, the protrusion 13 is pressed to be housed in the mounting groove 11, and then the metal cover 9 is pressed down. After the metal cover 9 moves down a certain distance, the protrusion 13 is released so that the metal cover 9 blocks part of the protrusion 13, and then the metal cover 9 is pressed down again.

[0033] refer to Figure 3 Fixing holes 14 are provided on both sides of the metal cover 9.

[0034] As a technical optimization of this utility model, by setting a fixing hole 14, when the metal cover 9 is pressed, the protrusion 13 is inserted into the fixing hole 14 under the push of the spring 12 to fix the metal cover 9. Then, thermal expansion colloid is applied to the bottom of the metal cover 9 to seal the gap between the metal cover 9 and the main board 1.

[0035] refer to Figure 3 The top and bottom of the surface of the frame 3 are provided with sealing grooves 15, and sealing rings 16 are installed on the inner wall of the sealing grooves 15.

[0036] As a technical optimization of this utility model, by setting a sealing groove 15 and a sealing ring 16, the sealing groove 15 can seal the gap between the frame 3 and the metal cover 9 to prevent dust and air from entering.

[0037] The working principle and usage process of this utility model are as follows: During use, the encapsulation mechanism 6 injects thermally expanding colloid into it using a dispensing device to fix the frame 3. Thermally expanding colloid is a material with special properties; it undergoes significant volume expansion or contraction when the temperature changes. The groove 61 provides installation space for the sponge frame 7. Before fixing the frame 3, a clamp is used to pre-fix it. The storage tank 62 stores the thermally expanding colloid. The dispensing tank 63 injects the thermally expanding colloid into the dispensing device after the frame 3 is placed on the motherboard 1. Excess air is then expelled through the vent 64 to prevent uneven distribution of the thermally expanding colloid, which could affect the sealing performance. The sponge frame 7 is fixed to the motherboard 1 by the thermally expanding colloid, providing secondary protection for the chip 2 and preventing the thermally expanding colloid from overflowing and flowing around the chip 2 when the frame 3 is in place. The sealing gasket 8 can protect the top of the inner wall of the metal cover 9. Sealing prevents dust from entering and maintains the stability of the internal space. The metal cover 9 protects the frame 3 and the chip 2. The lens barrel 10 contains a lens, which allows the chip 2 to image better. The mounting groove 11 limits the spring 12 and provides space for movement. The spring 12 can push the protrusion 13 to move, so that the protrusion 13 can be reset after being squeezed. When installing the metal cover 9, press the protrusion 13 to make the protrusion 13 retract into the mounting groove 11, and then press the metal cover 9 down. After the metal cover 9 moves down a certain distance, release the protrusion 13 so that the metal cover 9 blocks part of the protrusion 13. Then continue to press the metal cover 9. When pressing the metal cover 9, the protrusion 13 is pushed into the fixing hole 14 by the spring 12 to fix the metal cover 9. Then apply thermal expansion glue to the bottom of the metal cover 9 to seal the gap between the metal cover 9 and the main board 1. The sealing groove 15 can seal the gap between the frame 3 and the metal cover 9 to prevent dust and air from entering.

[0038] In summary, this camera module's thermal expansion colloid encapsulation structure, through the encapsulation mechanism 6, uses an injection device to inject thermal expansion colloid into the encapsulation mechanism 6 to fix the frame 3. Thermal expansion colloid is a material with special properties; it undergoes significant volume expansion or contraction when the temperature changes. It expands when heated, and the degree of expansion is correlated with temperature changes. It possesses good flexibility and elasticity, allowing it to adapt to different shapes and spatial changes during expansion and contraction without easily breaking or losing its encapsulation and protective functions. It exhibits excellent sealing performance, effectively preventing external dust, moisture, gases, and other substances from entering the encapsulated space, while also preventing internal substances from leaking out, providing a stable environment for the internal components. Under certain temperature and environmental conditions, thermal expansion colloid has good chemical stability and is not prone to chemical reactions with surrounding substances, thus ensuring its long-term performance stability. This solves the problem of existing encapsulation structures that involve applying fixing adhesive to the motherboard surface and then placing the frame on the colloid, where the colloid spreads outwards when the frame is compressed, causing the frame to tilt and fail to maintain a horizontal position.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thermal expansion colloidal encapsulation structure for a camera module, comprising a motherboard (1), a chip (2), a frame (3), a fixing groove (4), and glass (5), characterized in that: The chip (2) is installed on the top of the mainboard (1), the frame (3) is arranged on the top of the mainboard (1), the fixed groove (4) is arranged on the top of the frame (3), the glass (5) is bonded to the bottom of the inner wall of the fixed groove (4), and the encapsulation mechanism (6) is arranged on the bottom of the frame (3). 2.The camera module thermal expansion gel package structure of claim 1, wherein: The encapsulation mechanism (6) comprises a groove (61), the groove (61) is arranged on the bottom of the frame (3), the outer side of the bottom of the frame (3) is provided with a storage groove (62), the left side of the storage groove (62) is provided with a glue injection groove (63), and the top of the glue injection groove (63) is provided with an exhaust hole (64).

3. The camera module thermal expansion gel package structure of claim 1, wherein: The top of the mainboard (1) is provided with a sponge frame (7), and the sponge frame (7) is located outside the chip (2).

4. The camera module thermal expansion gel package structure of claim 1, wherein: The top of the frame (3) is provided with a sealing gasket (8), the outer side of the frame (3) is provided with a metal cover (9), and the inner wall of the metal cover (9) is provided with a lens barrel (10).

5. The camera module thermal expansion gel package structure of claim 1, wherein: Both sides of the frame (3) are provided with mounting grooves (11), and one side of the inner wall of the mounting groove (11) is provided with a spring (12).

6. The camera module thermal expansion gel package structure of claim 5, wherein: The other end of the spring (12) is provided with a protruding block (13).

7. The camera module thermal expansion gel package structure of claim 4, wherein: Both sides of the metal cover (9) are provided with fixing holes (14). 8.The camera module thermal expansion gel package structure of claim 1, wherein: The top and bottom of the surface of the frame (3) are provided with sealing grooves (15), and the inner wall of the sealing groove (15) is provided with a sealing ring (16).

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