Slicing device for semiconductor production

Abstract

The utility model relates to the technical field of slicing devices, and discloses a slicing device for semiconductor production, which comprises a processing table for semiconductor production, an inclined plate is fixed on the side surface of the processing table, a through groove is formed in the surface of the side plate, an adjusting assembly is arranged in the through groove, and a rack is arranged on the surface of the adjusting assembly. The conveying mechanism comprises a rack, a conveying roller, a chain plate and a first bevel gear, the conveying roller is rotationally connected to the surface of the rack, the chain plate is arranged on the surface of the conveying roller, the first bevel gear is fixed to the end of the conveying roller, an output device is arranged on the surface of the first bevel gear, and a driving structure is arranged on the surface of the machining table. And when the device is used, the moving distance of the end of the raw material can be controlled by means of the conveying mechanism, so that trimming operation of different sizes is achieved, and the problem that the application range of an existing device is greatly limited due to the fact that only fixed trimming size can be achieved is solved.

Description

Technical Field

[0001] This utility model relates to the field of slicing device technology, specifically a slicing device for semiconductor production. Background Technology

[0002] Semiconductors are an extremely important component in the electrical field. During semiconductor processing, a variety of raw materials are required. Some of these materials are too large, so edge-cutting devices are used to cut them.

[0003] Chinese patent CN220113710U discloses a semiconductor slicing device. This device uses a positioning plate to limit the top of a semiconductor object. When the pusher is activated, the push rod provides a thrust to the semiconductor object. After the cutting disc passes through the slot, it slices the semiconductor object. The sliced ​​semiconductor object falls through the slot to the bottom of the processing table. A storage box can be placed below the slot to store the sliced ​​semiconductor object. The rollers reduce the friction between the semiconductor object and the positioning plate, making the semiconductor object move more smoothly during the slicing process. This improves the automation level of semiconductor slicing, saves labor, and thus improves the processing efficiency of the slicing device.

[0004] However, in actual use, the existing device is limited in the distance of material displacement due to the obstruction of the stop. Therefore, it can only perform fixed-size slicing during edge cutting. However, manufacturers often face processing requirements of different sizes. Therefore, the existing device greatly limits its scope of application. To address this, a slicing device for semiconductor production is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a slicing device for semiconductor production, in order to solve the problem mentioned in the background art that, in actual use, the existing device is limited in the distance of material displacement due to the obstruction of the stop block. Therefore, during the edge cutting operation, it can only perform slicing of a fixed size. However, manufacturers often face processing requirements of different sizes. Therefore, the existing device greatly limits its scope of application.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a slicing apparatus for semiconductor production, comprising a processing table for semiconductor production, an inclined plate fixed to the side of the processing table, a side plate fixed to the top surface of the processing table, a through groove on the surface of the side plate, an adjustment component disposed inside the through groove, a conveying mechanism disposed on the surface of the adjustment component, the conveying mechanism comprising a frame, a conveying roller, a chain plate and a first bevel gear, the frame disposed on the surface of the adjustment component, the conveying roller rotatably connected to the surface of the frame, the chain plate disposed on the surface of the conveying roller, the first bevel gear fixed to the end of the conveying roller, an output device disposed on the surface of the first bevel gear, a slicing device disposed on the surface of the processing table, a driving structure disposed on the surface of the processing table, and a limit component disposed on the surface of the driving structure.

[0007] Preferably, the aforementioned adjustment assembly includes a bidirectional lead screw and a sliding plate. The bidirectional lead screw is bearing-connected to the inside of the through groove, and the sliding plate is threaded onto the surface of the bidirectional lead screw. The side of the sliding plate slides against the inner wall of the through groove, and the frame and the sliding plate are fixed to each other.

[0008] Preferably, the output device includes a second bevel gear, a rotating shaft, a rectangular rod, and a motor. The second bevel gear is meshed with the surface of the first bevel gear. The rotating shaft is fixed to the surface of the second bevel gear and is rotatably connected to the frame. The rectangular rod is engaged and slidably inside the rotating shaft. The motor is fixed to the end of the rectangular rod. The motor and the processing table are connected to each other by a support rod. The second bevel gear is symmetrically distributed about the transverse central axis of the through slot.

[0009] Preferably, the slicing device described above includes a support frame, an electric push rod, a motor, and a cutting disc. The support frame is fixed to the surface of the processing table, the electric push rod is fixed to the surface of the support frame, the motor is fixed to the output shaft of the electric push rod, and the cutting disc is fixed to the output shaft of the motor.

[0010] Preferably, the drive structure described above includes a fixed block, a bidirectional screw, and a limiting rod. The fixed block is fixed to the bottom of the processing table, the bidirectional screw is connected to the fixed block by a bearing, and the limiting rod is fixed to the surface of the fixed block.

[0011] Preferably, the aforementioned limiting component includes a movable plate and balls. The movable plate is threaded onto the surface of the bidirectional screw, and the movable plate is slidably nested on the surface of the limiting rod. The balls are evenly distributed on the surface of the movable plate.

[0012] Preferably, the ends of the aforementioned bidirectional screw and bidirectional lead screw are both fixed with a turntable, the internal threads of the turntable are threaded through a bolt, and the surfaces of the side plate and the limiting rod are provided with several threaded holes that are compatible with the bolts.

[0013] Compared with the prior art, the present invention, by adopting the above technical solution, has the following technical effects:

[0014] 1. This utility model, through the cooperation of the processing table, inclined plate, side plate, through groove, adjustment component and conveying mechanism, enables the device to control the distance of the material end movement by means of the conveying mechanism during use, thereby realizing edge cutting operations of different sizes, thus solving the problem that the existing device can only perform fixed edge cutting sizes, which greatly limits the scope of application of the device.

[0015] 2. This utility model, through the cooperation of the output device, slicing equipment, driving structure and limiting component, enables the device to limit raw materials of different sizes with the help of the limiting component, thereby ensuring the accuracy of the raw material conveying process. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a first-view structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the second-view structure of the present invention;

[0019] Figure 3 This is a schematic diagram of the third-view structure of this utility model;

[0020] Figure 4 For the present utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0021] Figure 5 This is a three-dimensional structural diagram of the limiting component of this utility model.

[0022] Explanation of reference numerals in the attached drawings: 1. Processing table; 2. Inclined plate; 3. Side plate; 4. Through groove; 5. Adjustment component; 501. Bidirectional lead screw; 502. Slide plate; 6. Conveying mechanism; 601. Frame; 602. Conveying roller; 603. Chain plate; 604. First bevel gear; 7. Output device; 701. Second bevel gear; 702. Rotating shaft; 703. Rectangular rod; 704. Electric motor; 8. Slicing equipment; 801. Support frame; 802. Electric push rod; 803. Motor; 804. Slicing disc; 9. Drive structure; 901. Fixed block; 902. Bidirectional screw; 903. Limiting rod; 10. Limiting component; 1001. Movable plate; 1002. Ball bearing. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0025] Example

[0026] In the Chinese patent with authorization announcement number CN220113710U, in actual use, the existing device restricts the distance of material displacement due to the obstruction of the stop block. Therefore, during the edge cutting operation, it can only perform fixed-size cutting. However, manufacturers often face processing needs of different sizes. Therefore, the existing device greatly limits its scope of application.

[0027] Please see Figure 1-5This utility model provides a technical solution: a slicing device for semiconductor production, including a processing table 1 for semiconductor production, an inclined plate 2 fixed to the side of the processing table 1, a side plate 3 fixed to the top surface of the processing table 1, a through groove 4 opened on the surface of the side plate 3, an adjustment component 5 disposed inside the through groove 4, and a conveying mechanism 6 disposed on the surface of the adjustment component 5. To achieve the conveying of raw materials, the conveying mechanism 6 includes a frame 601, a conveying roller 602, a chain plate 603, and a first bevel gear 604. The frame 601 is disposed on the surface of the adjustment component 5, and a scale plate is disposed on the surface of the frame 601. The end of the frame 601 is located directly above the inclined plate 2. The conveying roller 602 is rotatably connected to the surface of the frame 601. The chain plate 603 is disposed on the surface of the conveying roller 602. The first bevel gear 604 is fixed to the end of the conveying roller 602, and an output device 7 is disposed on the surface of the first bevel gear 604. A slicing device 8 is disposed on the surface of the processing table 1, and a driving structure 9 is disposed on the surface of the processing table 1. A limiting device 7 is disposed on the surface of the driving structure 9. The positioning component 10, in order to meet the fixing requirements of materials of different thicknesses, is equipped with an adjustment assembly 5. The adjustment assembly 5 includes a bidirectional lead screw 501 and a sliding plate 502. The bidirectional lead screw 501 is bearing-connected to the inside of the through groove 4. The sliding plate 502 is threaded onto the surface of the bidirectional lead screw 501. The side of the sliding plate 502 slides against the inner wall of the through groove 4. The frame 601 and the sliding plate 502 are fixed to each other. In order to provide a power source for the conveying operation, an output device 7 is provided. The output device 7 includes a second bevel gear 701. The machine consists of a rotating shaft 702, a rectangular rod 703, and a motor 704. The second bevel gear 701 is meshed with the surface of the first bevel gear 604. The rotating shaft 702 is fixed to the surface of the second bevel gear 701 and is rotatably connected to the frame 601. The rectangular rod 703 is engaged and slidably inside the rotating shaft 702. The motor 704 is fixed to the end of the rectangular rod 703 and is connected to the processing table 1 through a support rod. The second bevel gear 701 is symmetrically distributed about the transverse central axis of the through slot 4.

[0028] For slicing the raw materials, a slicing device 8 is provided. The slicing device 8 includes a support frame 801, an electric push rod 802, a motor 803, and a cutting disc 804. The support frame 801 is fixed to the surface of the processing table 1, the electric push rod 802 is fixed to the surface of the support frame 801, the motor 803 is fixed to the output shaft of the electric push rod 802, and the cutting disc 804 is fixed to the output shaft of the motor 803. To facilitate the operation of the limiting component 10, a drive structure 9 is provided. The drive structure 9 includes a fixing block 901, a bidirectional screw 902, and a limiting rod 903. The fixing block 901 is fixed to the bottom of the processing table 1, the bidirectional screw 902 is connected to the fixing block 901 by a bearing, and the limiting rod 903 is fixed to the bottom of the processing table 1. To limit the movement of the raw material and ensure stable and precise conveying, a limiting component 10 is provided on the surface of the fixed block 901. The limiting component 10 includes a movable plate 1001 and ball bearings 1002. The movable plate 1001 is threaded onto the surface of the bidirectional screw 902. The movable plate 1001 is slidably nested on the surface of the limiting rod 903. The ball bearings 1002 are evenly distributed on the surface of the movable plate 1001. To increase the stability of the bidirectional screw 902 and the bidirectional lead screw 501 after rotation, a turntable is fixed to the end of both the bidirectional screw 902 and the bidirectional lead screw 501. Bolts are threaded through the internal threads of the turntable. Several threaded holes adapted to the bolts are opened on the surfaces of the side plate 3 and the limiting rod 903.

[0029] The model number of the 704 electric motor is AB060-90-S2-P2.

[0030] In terms of working principle or structural principle, during actual use, the operator can place the raw material to be trimmed on the surface of the lower chain plate 603. Then, the turntable at the end of the bidirectional lead screw 501 drives the bidirectional lead screw 501 to rotate. Because the bidirectional lead screw 501 and the slide plate 502 are threadedly connected, when the bidirectional lead screw 501 rotates, it will cause the slide plate 502 and its surface frame 601 to move closer together, thereby causing the chain plate 603 to limit the raw material. Next, the operator can rotate the turntable at the end of the bidirectional screw 902 to drive the bidirectional screw 902 to rotate. During the rotation of the bidirectional screw 902, the threads on its surface will cause the movable plates 1001 to move closer together, thereby centering and correcting the raw material. Subsequently, the operator can start the motor 704, which drives the rectangular rod 703 and the rotating shaft 702 to rotate. Since the rotating shaft 702 and the conveying roller 602 are connected by the first bevel gear 604 and the second bevel gear 701, when the rotating shaft 702 rotates, it will drive the conveying roller 602 to rotate, thereby driving the chain plate 603 and the raw material to move. The operator can know the displacement distance through the scale plate. After the distance meets the requirements, the operator can turn off the motor 704, start the electric push rod 802 and the motor 803, and make the cutting disc 804 move closer to the raw material to realize the cutting operation. The cut raw material will leave the device along the inclined plate 2. The operator can collect the material by placing a collection container at the end of the inclined plate 2 in advance.

[0031] In summary, this device has the advantages of wide applicability and ease of collection.

[0032] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this utility model can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this utility model. In particular, the features described in the various embodiments and / or claims of this utility model can be combined or combined in various ways without departing from the spirit and teachings of this utility model. All such combinations and / or combinations fall within the scope of this utility model.

Claims

1. A slicing apparatus for semiconductor production, comprising a processing table (1) for semiconductor production, characterized in that: An inclined plate (2) is fixed to the side of the processing table (1), and a side plate (3) is fixed to the top surface of the processing table (1). A through groove (4) is opened on the surface of the side plate (3), and an adjustment component (5) is arranged inside the through groove (4). A conveying mechanism (6) is arranged on the surface of the adjustment component (5). The conveying mechanism (6) includes a frame (601), a conveying roller (602), a chain plate (603), and a first bevel gear (604). The frame (601) is arranged on the surface of the adjustment component (5). On the surface of the machine frame (601), the conveying roller (602) is rotatably connected to the surface of the machine frame (601), the chain plate (603) is disposed on the surface of the conveying roller (602), the first bevel gear (604) is fixed to the end of the conveying roller (602), the surface of the first bevel gear (604) is provided with an output device (7), the surface of the processing table (1) is provided with a slicing device (8), the surface of the processing table (1) is provided with a driving structure (9), and the surface of the driving structure (9) is provided with a limit component (10).

2. The slicing apparatus for semiconductor production according to claim 1, characterized in that: The adjustment assembly (5) includes a bidirectional lead screw (501) and a sliding plate (502). The bidirectional lead screw (501) is connected to the inside of the through groove (4) by a bearing. The sliding plate (502) is threaded onto the surface of the bidirectional lead screw (501). The side of the sliding plate (502) slides against the inner wall of the through groove (4). The frame (601) and the sliding plate (502) are fixed to each other.

3. A slicing apparatus for semiconductor production according to claim 1, characterized in that: The output device (7) includes a second bevel gear (701), a rotating shaft (702), a rectangular rod (703), and a motor (704). The second bevel gear (701) is meshed with the surface of the first bevel gear (604). The rotating shaft (702) is fixed to the surface of the second bevel gear (701). The rotating shaft (702) is rotatably connected to the frame (601). The rectangular rod (703) is engaged and slidably inside the rotating shaft (702). The motor (704) is fixed to the end of the rectangular rod (703). The motor (704) is connected to the processing table (1) through a support rod. The second bevel gear (701) is symmetrically distributed about the transverse central axis of the through slot (4).

4. A slicing apparatus for semiconductor production according to claim 1, characterized in that: The slicing device (8) includes a support frame (801), an electric push rod (802), a motor (803), and a cutting disc (804). The support frame (801) is fixed to the surface of the processing table (1), the electric push rod (802) is fixed to the surface of the support frame (801), the motor (803) is fixed to the output shaft of the electric push rod (802), and the cutting disc (804) is fixed to the output shaft of the motor (803).

5. A slicing apparatus for semiconductor production according to claim 2, characterized in that: The drive structure (9) includes a fixed block (901), a bidirectional screw (902), and a limiting rod (903). The fixed block (901) is fixed to the bottom of the processing table (1), the bidirectional screw (902) is connected to the fixed block (901) by a bearing, and the limiting rod (903) is fixed to the surface of the fixed block (901).

6. A slicing apparatus for semiconductor production according to claim 1, characterized in that: The limiting component (10) includes a movable plate (1001) and balls (1002). The movable plate (1001) is threaded onto the surface of the bidirectional screw (902). The movable plate (1001) is slidably nested on the surface of the limiting rod (903). The balls (1002) are evenly distributed on the surface of the movable plate (1001).

7. A slicing apparatus for semiconductor production according to claim 5, characterized in that: Both the ends of the bidirectional screw (902) and the bidirectional lead screw (501) are fixed with a turntable, and the internal threads of the turntable are threaded through a bolt. The surfaces of the side plate (3) and the limiting rod (903) are provided with several threaded holes that are compatible with the bolts.

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