Conductive heat dissipation buffer gasket for computer mainboard

Abstract

The utility model discloses a conductive heat dissipation buffer gasket for a computer mainboard. The conductive heat dissipation buffer gasket comprises a silica gel protective film and a gasket main body assembly, the silica gel protective film is attached to the middle of the gasket body assembly. The gasket main body assembly comprises a silica gel block, a double-sided adhesive layer, a single-sided copper foil adhesive tape assembly and a single-sided mylar adhesive tape assembly; the silica gel block is attached to the silica gel protective film, the size of the silica gel block is smaller than that of the single-face copper foil adhesive tape assembly, and the silica gel block is located in the middle of the single-face copper foil adhesive tape assembly; the single-sided mylar adhesive tape assembly is arranged between the single-sided copper foil adhesive tape assemblies; a foam block is attached to the position, not provided with the silica gel block, of the single-face copper foil adhesive tape assembly. The buffer protection device has excellent conductive, heat dissipation, buffer and shielding functions, and can realize different buffer protection effects.

Description

Technical Field

[0001] This utility model relates to the technical field of buffer pad products, and in particular to a conductive heat dissipation buffer pad for computer motherboards. Background Technology

[0002] With the continuous development of technology, modern society has increasingly higher requirements for computer performance. As one of the most important components of a computer, the motherboard houses the main circuitry of the computer. To a certain extent, the quality of the motherboard determines the overall performance, lifespan, and functional expansion capabilities of a computer.

[0003] With the increasing number and variety of electronic components inside computers, the internal structure of computers is becoming more complex. Computers generate a large amount of heat after prolonged use. To dissipate this heat effectively, the industry primarily uses heat sinks to conduct heat to the motherboard. However, this method is inefficient and its functionality is relatively limited, leaving considerable room for improvement. Furthermore, to ensure the circuit stability of the motherboard, a material with stable conductivity is needed. Additionally, in special circumstances, such as environments with strong electromagnetic interference, materials with electromagnetic shielding capabilities are required on the motherboard. Moreover, computers may be subjected to vibrations during transport or use, which can damage the motherboard. Furthermore, the different cushioning protection requirements for components on the motherboard necessitate targeted cushioning protection designs. Therefore, pads with cushioning, shock absorption, conductivity, and heat dissipation functions are essential. Existing electronic device pads cannot simultaneously meet these optimal cushioning, shock absorption, conductivity, and heat dissipation functions. Utility Model Content

[0004] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a conductive heat dissipation buffer pad for computer motherboards, which has superior conductivity, heat dissipation, buffering and shielding functions, and can achieve different buffering protection effects.

[0005] To achieve the above-mentioned technical objectives and effects, this utility model is implemented through the following technical solution:

[0006] A conductive heat dissipation buffer pad for a computer motherboard includes a silicone protective film and a pad body assembly. The silicone protective film is attached to the middle of the pad body assembly. The pad body assembly includes a silicone block, a double-sided adhesive layer, a single-sided copper foil tape assembly, and a single-sided Mylar tape assembly. The silicone block is attached to the silicone protective film, and the size of the silicone block is smaller than the size of the single-sided copper foil tape assembly, and the silicone block is located in the middle of the single-sided copper foil tape assembly. The single-sided Mylar tape assembly is disposed between the single-sided copper foil tape assemblies. Foam blocks are attached to the positions of the single-sided copper foil tape assemblies where there are no silicone blocks.

[0007] Furthermore, the silicone protective film extends laterally outward relative to the gasket body assembly.

[0008] Furthermore, an auxiliary release film is provided on the outermost side of the gasket body assembly away from the silicone protective film.

[0009] Furthermore, the thickness of the silicone protective film is 50±2μm, and the viscosity is 150-450g / 25mm.

[0010] Furthermore, the thickness of the silicone block is 0.542±0.05mm, and the hardness is 70±5°.

[0011] Furthermore, the double-sided adhesive layer includes an acrylic adhesive side and a silicone side, with a thickness of 0.1 mm, and the silicone side of the double-sided adhesive layer is bonded to the silicone block.

[0012] Furthermore, the single-sided copper foil tape assembly includes a first single-sided copper foil tape, a second single-sided copper foil tape, and a third single-sided copper foil tape; the single-sided Mylar tape assembly includes a first single-sided Mylar tape and a second single-sided Mylar tape; the first single-sided copper foil tape, the first single-sided Mylar tape, the second single-sided Mylar tape, the second single-sided copper foil tape, and the third single-sided copper foil tape are sequentially bonded from top to bottom.

[0013] Furthermore, the first single-sided copper foil tape has the following properties: tack: ≥4.5 N / cm, surface resistance: <0.7 Ω / sq, and vertical resistance: <0.1 Ω / in. 2 The thickness of the first single-sided copper foil tape is 0.045 mm; the thickness of the second single-sided copper foil tape is 45±4 μm, the adhesion is ≥1000 g / in, the impedance is <0.03 ohms, and the shielding efficiency is 40-70 dB; the thickness of the third single-sided copper foil tape is 45±4 μm, the adhesion is ≥1000 g / in, the impedance is <0.03 ohms, and the shielding efficiency is 40-70 dB.

[0014] Furthermore, the first single-sided Mylar tape has an adhesive strength of ≥1224g / in and a thickness of 0.05mm; the second single-sided Mylar tape has a thickness of 0.02-0.025mm and an adhesive strength of ≥1000g / 25mm.

[0015] Furthermore, the foam block has a thickness of 1.57 mm and is attached to a single-sided copper foil tape assembly using double-sided adhesive.

[0016] The beneficial effects of this utility model are:

[0017] The single-sided copper foil tape assembly of this invention has good conductivity, shielding effect and heat dissipation function. The use of multiple layers of single-sided copper foil tape can better enhance the heat dissipation effect and strengthen the heat dissipation efficiency. The single-sided Mylar tape assembly can achieve better insulation function.

[0018] This utility model includes a silicone block and a foam block; the silicone block is located in the middle of the single-sided copper foil tape assembly, and its hardness is higher than that of the foam block. It disperses impact through high resilience and provides buffer protection for the main structure of the components on the motherboard; the foam block is softer and absorbs impact energy through its foaming structure to achieve ultra-soft buffering, which can buffer and protect the pins of the components on the motherboard, and can better protect the small structure of the components. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the conductive heat dissipation buffer pad of this utility model.

[0020] Figure 2 This is a plan view of the conductive heat dissipation buffer pad of this utility model.

[0021] Figure 3 This is an exploded view of the conductive heat dissipation buffer pad of this utility model. Detailed Implementation

[0022] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0023] like Figures 1 to 3 As shown, a conductive heat dissipation buffer pad for a computer motherboard includes a silicone protective film 1 and a pad body assembly. The silicone protective film 1 is attached to the middle of the pad body assembly. The pad body assembly includes a silicone block 2, a double-sided adhesive layer 3, a single-sided copper foil tape assembly, and a single-sided Mylar tape assembly. The silicone block 2 is attached to the silicone protective film 1, and the size of the silicone block 2 is smaller than the size of the single-sided copper foil tape assembly, and the silicone block 2 is located in the middle of the single-sided copper foil tape assembly. The single-sided Mylar tape assembly is disposed between the single-sided copper foil tape assemblies. A foam block 10 is attached to the position of the single-sided copper foil tape assembly where there is no silicone block.

[0024] The silicone protective film 1 extends laterally outward relative to the main gasket assembly. The silicone protective film 1 is made of PET (polyester film) as the substrate and coated with silicone on one side. The adhesive side of the silicone protective film 1 is attached to the silicone block 2. The thickness of the silicone protective film 1 is 50±2μm, and the adhesion is 150-450g / 25mm. Its adhesion is stable and will not damage the surface of the silicone block when the silicone protective film is removed after attachment.

[0025] Silicone block 2 has a thickness of 0.542±0.05mm and a hardness of 70±5°, which can play a strong buffering role and effectively protect the components.

[0026] The double-sided adhesive layer 3 consists of an acrylic adhesive side and a silicone side, with a thickness of 0.1mm. The silicone side of the double-sided adhesive layer 3 is directly bonded to the silicone block 2 without the need for a pretreatment agent, making the process convenient. The shape of the double-sided adhesive layer 3 is consistent with the shape of the silicone block 2.

[0027] Specifically, the single-sided copper foil tape assembly includes a first single-sided copper foil tape 4, a second single-sided copper foil tape 7, and a third single-sided copper foil tape 8; the single-sided Mylar tape assembly includes a first single-sided Mylar tape 5 and a second single-sided Mylar tape 6; the first single-sided copper foil tape 4, the first single-sided Mylar tape 5, the second single-sided Mylar tape 6, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 are sequentially bonded from top to bottom.

[0028] The size of the first single-sided copper foil tape 4 is larger than that of the second single-sided copper foil tape 7 and the third single-sided copper foil tape 8. The silicone block 2 is directly attached to the middle of the first single-sided copper foil tape 4 via the double-sided adhesive layer 3. A step is provided on the lower side of the first single-sided copper foil tape 4. The first single-sided Mylar tape 5 and the second single-sided Mylar tape 6 are attached to the middle of the first single-sided copper foil tape 4 and are adapted to the step position. A portion of the second single-sided copper foil tape 7 and the second single-sided copper foil tape 8 are attached vertically below the second single-sided Mylar tape 6, while the other portion is directly attached to the first single-sided copper foil tape 4.

[0029] The first single-sided copper foil tape 4, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 are all copper foil tapes with an adhesive layer on one side; the first single-sided copper foil tape 4 has the following properties: tack: ≥4.5 N / cm, surface resistance: <0.7 Ω / sq, vertical resistance: <0.1 Ω / in 2 The first single-sided copper foil tape 7 has a thickness of 0.045 mm and the adhesive side faces down; the second single-sided copper foil tape 8 has a thickness of 45±4 μm, an adhesion of ≥1000 g / in, an impedance of <0.03 ohms, and a shielding efficiency of 40-70 dB, and the adhesive side faces down; the third single-sided copper foil tape 8 has a thickness of 45±4 μm, an adhesion of ≥1000 g / in, an impedance of <0.03 ohms, and a shielding efficiency of 40-70 dB, and the adhesive side faces down. In this embodiment, the second single-sided copper foil tape 7 and the third single-sided copper foil tape 8 have the same shape.

[0030] The first single-sided copper foil tape 4, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 all have conductivity in the XY and Z directions, shielding effect, and heat dissipation function. The three layers of materials—first single-sided copper foil tape 4, second single-sided copper foil tape 7, and third single-sided copper foil tape 8—are stacked together to better enhance the heat dissipation function.

[0031] The first single-sided Mylar tape 5 comprises a PET base film and a bio-based adhesive layer disposed on one side of the PET base film. The first single-sided Mylar tape 5 has an adhesive strength of ≥1224 g / in, a thickness of 0.05 mm, and the adhesive side faces down. The second single-sided Mylar tape 6 is an acrylic PET single-sided ultra-thin tape with a matte black coating. The tape surface has a uniform color, a matte effect, does not fade, has high light-blocking properties, maintains high adhesion, and leaves no residue. The second single-sided Mylar tape 6 has a thickness of 0.02-0.025 mm, an adhesive strength of ≥1000 g / 25 mm, and the adhesive side faces down. The first single-sided Mylar tape 5 and the second single-sided Mylar tape 6 provide insulation.

[0032] The foam block 10 has a thickness of 1.57 mm and is attached to the single-sided copper foil tape assembly using double-sided adhesive. Specifically, the foam block 10 is directly attached to the upper surface of the exposed portion of the first single-sided copper foil tape 4.

[0033] An auxiliary release film 9 is provided on the outermost side of the gasket body assembly, away from the silicone protective film. Specifically, the auxiliary release film 9 is attached to the uncovered adhesive surface of the first single-sided copper foil tape 4. This auxiliary release film 9 is made of a PET substrate and a silicone oil layer. The thickness of the auxiliary release film 9 is 0.075 mm, and the release force is 30 ± 8 g / in. The auxiliary release film 9 can protect the adhesive in the secondary bonding area from contamination, preventing any impact on adhesion.

[0034] The entire pad is set on a single sheet of release film. In use, take the outward-extending part of the silicone protective film 1 and remove the pad product from the single sheet of release film; attach the product to the corresponding position on the computer motherboard, then remove the silicone protective film 1, and then remove the auxiliary release film 9 for a second attachment.

[0035] Example

[0036] like Figures 1 to 3As shown, the conductive heat dissipation buffer pad for a computer motherboard in this embodiment includes a silicone protective film 1 and a pad body assembly; the silicone protective film 1 is attached to the middle of the pad body assembly; the pad body assembly includes a silicone block 2, a double-sided adhesive layer 3, a single-sided copper foil tape assembly, and a single-sided Mylar tape assembly; the silicone block 2 is attached to the silicone protective film 1, the size of the silicone block 2 is smaller than the size of the single-sided copper foil tape assembly, and the silicone block 2 is located in the middle of the single-sided copper foil tape assembly. In this embodiment, the single-sided copper foil tape assembly includes a first single-sided copper foil tape 4, a second single-sided copper foil tape 7, and a third single-sided copper foil tape 8; the single-sided Mylar tape assembly includes a first single-sided Mylar tape 5 and a second single-sided Mylar tape 6; the first single-sided copper foil tape 4, the first single-sided Mylar tape 5, the second single-sided Mylar tape 6, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 are sequentially bonded from top to bottom; foam blocks 10 are attached to the positions of the single-sided copper foil tape assembly where no silicone blocks are provided.

[0037] Specifically, in this embodiment, the silicone protective film 1 extends laterally outward relative to the gasket body assembly. The silicone protective film 1 is made of PET (polyester film) as the substrate and coated with silicone on one side. The adhesive side of the silicone protective film 1 is attached to the silicone block 2. In this embodiment, the silicone protective film is model CYB38500S, blue in color, 50±2μm thick, and has an adhesion of 150-450g / 25mm.

[0038] Silicone block 2 has the model number YH-BK70542U, is black, has a thickness of 0.542±0.05mm, and a hardness of 70±5°.

[0039] The double-sided adhesive layer 3 consists of an acrylic adhesive side and a silicone side, model SH-98510AS, with a thickness of 0.1mm. The silicone side of the double-sided adhesive layer 3 is directly bonded to the silicone block 2 without the need for a pretreatment agent, making the process convenient. The shape of the double-sided adhesive layer 3 is consistent with the shape of the silicone block 2.

[0040] In this embodiment, the size of the first single-sided copper foil tape 4 is larger than the sizes of the second single-sided copper foil tape 7 and the third single-sided copper foil tape 8. The silicone block 2 is directly attached to the middle of the first single-sided copper foil tape 4 via the double-sided adhesive layer 3. A step is provided on the lower side of the first single-sided copper foil tape 4, and the first single-sided Mylar tape 5 and the second single-sided Mylar tape 6 are attached to the middle position of the first single-sided copper foil tape 4 and are adapted to the step position. A portion of the second single-sided copper foil tape 7 and the second single-sided copper foil tape 8 are directly attached to the second single-sided Mylar tape 6, and another portion is directly attached to the first single-sided copper foil tape 4.

[0041] The first single-sided copper foil tape 4, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 are all copper foil tapes with an adhesive layer on one side. The first single-sided copper foil tape 4 is model TESA 60238, with one side black and the other copper-colored. Its adhesion is ≥4.5N / cm, surface resistance is <0.7Ω / sq, and vertical resistance is <0.1Ω / in. 2 The first single-sided copper foil tape 7 is 3M1060TC-45, copper-colored, with a thickness of 45±4μm, adhesion: ≥1000g / in, impedance: <0.03ohms, shielding efficiency: 40-70dB, adhesive side down; the second single-sided copper foil tape 8 is 3M1060TC-45, copper-colored, with a thickness of 45±4μm, adhesion: ≥1000g / in, impedance: <0.03ohms, shielding efficiency: 40-70dB, adhesive side down.

[0042] The first single-sided copper foil tape 4, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 all have conductivity in the XY and Z directions, shielding effect, and heat dissipation function. The three layers of materials—first single-sided copper foil tape 4, second single-sided copper foil tape 7, and third single-sided copper foil tape 8—are stacked together to better enhance the heat dissipation function.

[0043] The first single-sided Mylar tape 5 comprises a PET base film and a bio-based adhesive layer disposed on one side of the PET base film. It is model SH-93005AB, black, with an adhesion of ≥1224g / in and a thickness of 0.05mm, with the adhesive side facing down. The second single-sided Mylar tape 6 is an ultra-thin single-sided acrylic PET tape with a matte black coating. The tape surface has a uniform color, a matte effect, does not fade, has high light-blocking properties, maintains high adhesion, and leaves no residue. The second single-sided Mylar tape 6 is model FTBFAP-20, with a thickness of 0.02-0.025mm, an adhesion of ≥1000g / 25mm, and the adhesive side facing down. Both the first single-sided Mylar tape 5 and the second single-sided Mylar tape 6 provide insulation.

[0044] The foam block 10, model number 4701-40-20062-04, is blue and 1.57mm thick. It is attached to the single-sided copper foil tape assembly using double-sided adhesive. Specifically, the foam block 10 is directly attached to the upper surface of the exposed portion of the first single-sided copper foil tape 4.

[0045] An auxiliary release film 9 is provided on the outermost side of the gasket body assembly, away from the silicone protective film. Specifically, the auxiliary release film 9 is attached to the uncovered adhesive surface of the first single-sided copper foil tape 4. This auxiliary release film 9 is made of PET substrate and silicone oil layer. The auxiliary release film 9 is model 75T055B, blue, 0.075mm thick, and has a release force of 30±8g / in. The auxiliary release film 9 protects the adhesive in the secondary bonding area from contamination, preventing any impact on adhesion.

[0046] In this embodiment, the gasket product is placed on the full-sheet release film. When using it, take the outward extension of the silicone protective film 1 and remove the gasket product from the full-sheet release film; attach the product to the corresponding position on the computer motherboard, then remove the silicone protective film 1, and then remove the auxiliary release film 9 for a second attachment.

[0047] The single-sided copper foil tape assembly of this invention has good conductivity, shielding effect and heat dissipation function. The use of multiple layers of single-sided copper foil tape can better enhance the heat dissipation effect and strengthen the heat dissipation efficiency. The single-sided Mylar tape assembly can achieve better insulation function.

[0048] This utility model includes a silicone block and a foam block; the silicone block is located in the middle of the single-sided copper foil tape assembly and has a higher hardness than the foam block. It disperses impact through high resilience and provides buffer protection for the main structure of the components on the motherboard; the foam block is softer and absorbs impact energy through its foaming structure to achieve ultra-soft buffering, which can buffer and protect the pins of the components on the motherboard and can better protect the small structure of the components.

[0049] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

[0050] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A conductive heat dissipation buffer pad for a computer motherboard, characterized in that, The device includes a silicone protective film and a gasket body assembly. The silicone protective film is attached to the middle of the gasket body assembly. The gasket body assembly includes a silicone block, a double-sided adhesive layer, a single-sided copper foil tape assembly, and a single-sided Mylar tape assembly. The silicone block is attached to the silicone protective film, and the size of the silicone block is smaller than the size of the single-sided copper foil tape assembly, and the silicone block is located in the middle of the single-sided copper foil tape assembly. The single-sided Mylar tape assembly is disposed between the single-sided copper foil tape assemblies. Foam blocks are attached to the positions of the single-sided copper foil tape assemblies where there are no silicone blocks.

2. The conductive heat dissipation buffer pad for a computer motherboard according to claim 1, characterized in that, The silicone protective film extends laterally outward relative to the gasket body assembly.

3. The conductive heat dissipation buffer pad for a computer motherboard according to claim 1, characterized in that, An auxiliary release film is provided on the outermost side of the gasket body assembly away from the silicone protective film.

4. A conductive heat dissipation buffer pad for a computer motherboard according to claim 1, characterized in that, The thickness of the silicone protective film is 50±2μm, and the viscosity is 150-450g / 25mm.

5. A conductive heat dissipation buffer pad for a computer motherboard according to claim 1, characterized in that, The silicone block has a thickness of 0.542±0.05mm and a hardness of 70±5°.

6. A conductive heat dissipation buffer pad for a computer motherboard according to claim 1, characterized in that, The double-sided adhesive layer includes an acrylic adhesive side and a silicone side, with a thickness of 0.1 mm, and the silicone side of the double-sided adhesive layer is bonded to the silicone block.

7. A conductive heat dissipation buffer pad for a computer motherboard according to claim 1, characterized in that, The single-sided copper foil tape assembly includes a first single-sided copper foil tape, a second single-sided copper foil tape, and a third single-sided copper foil tape; the single-sided Mylar tape assembly includes a first single-sided Mylar tape and a second single-sided Mylar tape; the first single-sided copper foil tape, the first single-sided Mylar tape, the second single-sided Mylar tape, the second single-sided copper foil tape, and the third single-sided copper foil tape are sequentially bonded from top to bottom.

8. A conductive heat dissipation buffer pad for a computer motherboard according to claim 7, characterized in that, The first single-sided copper foil tape has the following properties: tack: ≥4.5 N / cm, surface resistance: <0.7 Ω / sq, vertical resistance: <0.1 Ω / in. 2 The thickness of the first single-sided copper foil tape is 0.045 mm; the thickness of the second single-sided copper foil tape is 45±4 μm, the adhesion is ≥1000 g / in, the impedance is <0.03 ohms, and the shielding efficiency is 40-70 dB; the thickness of the third single-sided copper foil tape is 45±4 μm, the adhesion is ≥1000 g / in, the impedance is <0.03 ohms, and the shielding efficiency is 40-70 dB.

9. A conductive heat dissipation buffer pad for a computer motherboard according to claim 7, characterized in that, The first single-sided Mylar tape has an adhesion of ≥1224g / in and a thickness of 0.05mm; the second single-sided Mylar tape has a thickness of 0.02-0.025mm and an adhesion of ≥1000g / 25mm.

10. A conductive heat dissipation buffer pad for a computer motherboard according to claim 1, characterized in that, The foam block is 1.57 mm thick and is attached to a single-sided copper foil tape assembly using double-sided adhesive.

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