Miniaturized SMD (Surface Mount Device) capacitor

Abstract

The utility model discloses a miniaturized surface-mounted capacitor, and particularly relates to the technical field of surface-mounted capacitors, which comprises a shell, a capacitor core bag is arranged in the shell, the capacitor core bag comprises an adhesive tape, a cathode formed foil is mounted on the outer surface of the adhesive tape, an anode formed foil is mounted on the outer surface of the cathode formed foil, and the anode formed foil is mounted on the outer surface of the anode formed foil. The side wall of the capacitor shell is provided with the heat dissipation channel, heat of the capacitor core bag is effectively dissipated, and stable operation is guaranteed. In the capacitor core bag, the cathode and anode formed foils are subjected to electrolyte impregnation and formation treatment to form a high-performance dielectric layer. The isolation paper isolates cathode and anode to prevent short circuit, ensures balanced distribution of electrolyte and improves capacitance performance, the shell cover plate and the shell are sealed to prevent electrolyte leakage, through holes of the shell cover plate are matched with guide pins, stable connection is guaranteed, current is led out, the base design is beneficial to installation and fixation, and the partition plate flexibly adjusts internal layout to increase flexibility. The prefabricated cover plate strengthens the base structure and protects the top of the capacitor.

Description

Technical Field

[0001] This utility model relates to the field of surface mount capacitor technology, and more specifically, to miniaturized surface mount capacitors. Background Technology

[0002] Surface mount capacitors, formally known as multilayer (or stacked) ceramic chip capacitors, are a type of capacitor material and are commonly referred to as surface mount capacitors.

[0003] A search revealed that patent publication number CN216015098U discloses a surface-mount electrolytic capacitor, relating to the field of capacitor technology. It includes a base plate, a core package disposed on the top surface of the base plate, a housing connected to the top surface of the base plate and sealing the core package, and leads electrically connected to the core package and extending to the bottom surface of the base plate. When the air pressure inside the housing increases to a certain level, the adhesive portion of the housing gradually tears until the first and second halves of the housing separate. This allows maintenance personnel to quickly identify and replace damaged surface-mount electrolytic capacitors during circuit inspection, significantly improving maintenance efficiency.

[0004] Currently available surface mount capacitors have performance limitations. Due to the lack of an effective heat dissipation mechanism for capacitor components, capacitors are often damaged. In addition, the capacitor components are not securely positioned during installation, which accelerates capacitor aging and reduces their lifespan.

[0005] Therefore, miniaturized surface mount capacitors are proposed to address the above problems. Summary of the Invention

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a miniaturized surface mount capacitor to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a miniaturized surface-mount capacitor, comprising a housing, a capacitor core package disposed inside the housing, the capacitor core including an adhesive tape, a cathodic foil mounted on the outer surface of the adhesive tape, an anodized foil mounted on the outer surface of the cathodic foil, and a release paper mounted on the outer surface of the anodized foil; a housing cover plate detachably mounted on the bottom of the housing; a guide pin disposed at the bottom of the capacitor core package, the guide pin penetrating the housing cover plate and extending to the bottom of the housing cover plate; a base disposed directly below the housing, a partition plate detachably disposed inside the base, a prefabricated cover plate disposed on the top of the base, and the partition plate being disposed between the base and the prefabricated cover plate.

[0008] Preferably, a heat-absorbing layer is adhered to the outer side of the capacitor core package, and the inner wall of the heat-absorbing layer is in close contact with the outer side of the capacitor core package.

[0009] Preferably, a sealing gasket is provided on the side of the shell cover plate near the shell, and the shell and the shell cover plate are sealed by the sealing gasket.

[0010] Preferably, the upper surface of the prefabricated cover plate has a through hole, which penetrates the prefabricated cover plate and the partition plate and extends into the interior of the base.

[0011] Preferably, the guide pin penetrates through the prefabricated cover plate and partition plate until it is inserted into the through hole opened in the inner wall of the base.

[0012] Preferably, a buffer pad is provided on the top of the inner wall of the housing, the bottom of the buffer pad is in contact with the top of the capacitor core, and a heat dissipation layer is provided on the inner wall of the housing.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] Compared with existing technologies, this miniaturized chip capacitor has heat dissipation channels set on the side wall of the capacitor casing to efficiently dissipate the heat accumulated during the operation of the capacitor core, thereby maintaining the stable working state of the capacitor. In the construction of the capacitor core, the cathode foil and the anodic foil are impregnated with electrolyte and treated with special formation technology to build a dielectric layer with excellent energy storage performance. At the same time, the insulating paper not only plays the role of isolating the cathode and anode and preventing short circuits, but also ensures the even distribution of electrolyte inside the capacitor core.

[0015] Compared with existing technologies, this miniaturized surface-mount capacitor uses a sealed structure between the cover plate and the housing to prevent electrolyte leakage. At the same time, the cover plate has through holes that match the guide pins, ensuring that the guide pins can not only securely connect to the capacitor core but also smoothly conduct current. The base design facilitates the installation and fixation of the capacitor, while the flexible arrangement of the partitions can adjust the internal space layout of the capacitor according to actual needs, increasing the flexibility of use. The prefabricated cover plate further enhances the structural strength of the base and provides protection for the top of the capacitor. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model.

[0017] Figure 2 This is a schematic diagram of the structure of this utility model from another perspective.

[0018] Figure 3 This is a schematic diagram of the internal structure of the housing of this utility model.

[0019] Figure 4 This is a schematic diagram of the shell structure of this utility model.

[0020] The attached figures are labeled as follows: 1. Housing; 2. Capacitor core; 201. Adhesive tape; 202. Cathodic foil; 203. Anodized foil; 204. Separating paper; 3. Heat-absorbing layer; 4. Housing cover plate; 5. Sealing gasket; 6. Guide pin; 7. Base; 8. Partition plate; 9. Prefabricated cover plate; 10. Through hole; 11. Buffer pad; 12. Heat dissipation layer. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0022] As attached Figures 1 to 4 The miniaturized surface-mount capacitor shown includes a housing 1, inside which a capacitor core 2 is disposed. The capacitor core 2 includes an adhesive tape 201, on the outer surface of which a cathodic foil 202 is mounted, on the outer surface of which an anodized foil 203 is mounted, and on the outer surface of which a separator paper 204 is mounted. A housing cover 4 is detachably mounted at the bottom of the housing 1. A guide pin 6 is disposed at the bottom of the capacitor core 2, penetrating the housing cover 4 and extending to the bottom of the housing cover 4. A base 7 is disposed directly below the housing 1, inside which a partition 8 is detachably disposed. A prefabricated cover 9 is disposed on the top of the base 7, with the partition 8 positioned between the base 7 and the prefabricated cover 9.

[0023] Wherein: a heat-absorbing layer 3 is designed on the side wall of the housing 1 to effectively dissipate the heat generated by the capacitor core 2 during operation and ensure the stable operation of the capacitor. Between the cathode foil 202 and the anode foil 203 inside the capacitor core 2, a dielectric layer with high energy storage capacity is formed by impregnation with electrolyte and treatment with a specific formation process. In addition, the insulating paper 204 not only plays the role of isolating the cathode and anode and preventing short circuits, but also ensures the uniform distribution of electrolyte in the capacitor core 2.

[0024] The cover plate 4 and the housing 1 are sealed to prevent electrolyte leakage. At the same time, the cover plate 4 is provided with a through hole 10 that matches the guide pin 6, so that the guide pin 6 can not only be firmly connected to the capacitor core 2, but also smoothly conduct current. The design of the base 7 facilitates the installation and fixing of the capacitor, while the flexible setting of the partition plate 8 can adjust the internal space layout of the capacitor according to actual needs, increasing the flexibility of use. The prefabricated cover plate 9 further enhances the structural strength of the base 7 and provides protection for the top of the capacitor. Example 2

[0025] Based on Embodiment 1, the solution in Embodiment 1 will be further described in detail below with reference to the specific working method, such as... Figures 1 to 4 As shown below, see details:

[0026] In a preferred embodiment, a heat-absorbing layer 3 is adhered to the outer side of the capacitor core package 2, and the inner wall of the heat-absorbing layer 3 is tightly attached to the outer side of the capacitor core package 2. Furthermore, a heat-absorbing layer 3 is adhered to the outer side of the capacitor core package 2, and the inner wall of this heat-absorbing layer 3 is tightly attached to the outer side of the capacitor core package 2. This not only enhances the structural strength of the capacitor core package 2, but also plays a role in electromagnetic shielding, which can effectively reduce the impact of external electromagnetic interference on the performance of the capacitor and improve the stability and reliability of the capacitor.

[0027] In a preferred embodiment, a sealing gasket 5 is provided on the side of the cover plate 4 near the housing 1, and the housing 1 and the cover plate 4 are sealed by the sealing gasket 5. Furthermore, the cover plate 4 is specially provided with a sealing gasket 5 on the side near the housing 1, which ensures that the housing 1 and the cover plate 4 can be tightly sealed by the sealing gasket 5, effectively preventing leakage of internal electrolyte, and also blocking the intrusion of external moisture and dust, providing a safe and stable operating environment for the capacitor.

[0028] In a preferred embodiment, the upper surface of the prefabricated cover plate 9 is provided with through holes 10, which penetrate the prefabricated cover plate 9 and the partition plate 8 and extend into the interior of the base 7. Furthermore, the through holes 10 on the upper surface of the prefabricated cover plate 9 not only penetrate the prefabricated cover plate 9 itself, but also pass through the partition plate 8 and extend into the interior of the base 7, providing a convenient channel for ventilation and heat dissipation of the internal structure of the capacitor and possible maintenance and repair, while also enhancing the overall ventilation and permeability of the capacitor.

[0029] In a preferred embodiment, the guide pin 6 penetrates the prefabricated cover plate 9 and the partition plate 8 until it is inserted into the through hole 10 opened in the inner wall of the base 7; furthermore, the guide pin 6 not only penetrates the shell cover plate 4, but also passes through the prefabricated cover plate 9 and the partition plate 8, and is finally firmly inserted into the through hole 10 specially opened in the inner wall of the base 7. This not only ensures a stable connection between the guide pin 6 and the various components of the capacitor, but also effectively conducts current from the capacitor core 2, while maintaining the compactness and efficiency of the internal structure of the capacitor.

[0030] In a preferred embodiment, a buffer pad 11 is provided on the top of the inner wall of the housing 1, and the bottom of the buffer pad 11 is in contact with the top of the capacitor core 2. A heat dissipation layer 12 is provided on the inner wall of the housing 1. Furthermore, the buffer pad 11 is provided on the top of the inner wall of the housing 1, and its bottom is in close contact with the top of the capacitor core 2, which effectively reduces the risk of damage to the capacitor core 2 under vibration or impact. At the same time, the inner wall of the housing 1 is also covered with a heat dissipation layer 12, which improves the working stability of the capacitor in high-temperature environments and ensures the long-term reliable operation of the capacitor.

[0031] The working process of this utility model is as follows: During use, the guide pin 6 can be smoothly inserted into the base 7 along the through hole 10. This design not only ensures the overall stability, but also greatly facilitates the disassembly and installation of the capacitor. It ensures that the guide pin 6 can not only firmly connect to the capacitor core 2, but also smoothly conduct current. The design of the base 7 facilitates the installation and fixing of the capacitor, while the flexible setting of the partition 8 can adjust the internal space layout of the capacitor according to actual needs, increasing the flexibility of use. The prefabricated cover plate 9 further enhances the structural strength of the base 7 and provides protection for the top of the capacitor. In addition, when the capacitor core 2 generates heat due to operation and the temperature rises, its external heat-absorbing layer 3 can quickly absorb this heat, effectively slowing down the temperature rise rate of the capacitor core 2. Then, the absorbed heat will be efficiently dissipated through the heat dissipation layer 12, ensuring that the capacitor core 2 can operate stably at a lower temperature, thereby significantly reducing the negative impact of high temperature environment on the performance of the capacitor core 2 and effectively extending its service life. This design is not only simple in structure, but also highly practical, fully meeting the needs of modern electronic equipment for high-performance and high-reliability capacitor components.

Claims

1. A miniaturized surface mount capacitor, comprising a housing (1), characterized in that: The housing (1) is provided with a capacitor core package (2) inside. The capacitor core package (2) includes an adhesive tape (201). A cathodic foil (202) is installed on the outer surface of the adhesive tape (201). An anodized foil (203) is installed on the outer surface of the cathodic foil (202). A release paper (204) is installed on the outer surface of the anodized foil (203). A shell cover plate (4) is detachably installed at the bottom of the housing (1). A guide pin (6) is provided at the bottom of the capacitor core package (2). The guide pin (6) penetrates the shell cover plate (4) and extends to the bottom of the shell cover plate (4). A base (7) is provided directly below the housing (1). A partition plate (8) is detachably installed inside the base (7). A prefabricated cover plate (9) is provided on the top of the base (7). The partition plate (8) is located between the base (7) and the prefabricated cover plate (9).

2. The miniaturized surface-mount capacitor according to claim 1, characterized in that: A heat-absorbing layer (3) is attached to the outside of the capacitor core (2), and the inner wall of the heat-absorbing layer (3) is in close contact with the outside of the capacitor core (2).

3. The miniaturized surface-mount capacitor according to claim 2, characterized in that: A sealing gasket (5) is provided on the side of the shell cover plate (4) near the shell (1), and the shell (1) and the shell cover plate (4) are sealed by the sealing gasket (5).

4. The miniaturized surface-mount capacitor according to claim 2, characterized in that: The upper surface of the prefabricated cover plate (9) is provided with a through hole (10), which penetrates the prefabricated cover plate (9) and the partition plate (8) and extends into the interior of the base (7).

5. The miniaturized surface-mount capacitor according to claim 4, characterized in that: The guide pin (6) penetrates the prefabricated cover plate (9) and partition plate (8) until it is inserted into the through hole (10) opened in the inner wall of the base (7).

6. The miniaturized surface-mount capacitor according to claim 4, characterized in that: The inner wall of the housing (1) is provided with a buffer pad (11), the bottom of the buffer pad (11) is in contact with the top of the capacitor core (2), and the inner wall of the housing (1) is provided with a heat dissipation layer (12).

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