Electrode cover plate

Abstract

The utility model relates to the technical field of semiconductor equipment, in particular to an electrode cover plate which comprises a cover plate body, and the top of the cover plate body is fixedly connected with a heat dissipation assembly. Through the combined design of the heat dissipation fins and the micro fan, heat generated by the electronic circuit board can be quickly dissipated, the working temperature of the circuit board is effectively reduced, the service life of equipment is prolonged, the electromagnetic shielding layer made of copper alloy materials can effectively shield external electromagnetic interference, and the service life of the equipment is prolonged. According to the electrode cover plate, stable operation of an electronic circuit board in a complex electromagnetic environment is ensured, the reliability of equipment is improved, the whole electrode cover plate is small in size due to the design of the cover plate body of a multi-layer structure and the compact heat dissipation module, the electrode cover plate can be conveniently integrated into various semiconductor equipment, and the development requirements of miniaturization and high performance are met.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, specifically to an electrode cover plate. Background Technology

[0002] Electronic circuit boards (PCBs) serve as the mechanical and electrical carriers for electronic components. They connect these components by printing conductive patterns on an insulating substrate, enabling circuit functionality. High-quality electrode covers ensure a tight fit between the internal electrode plates, guaranteeing the integrity of the electrolyte and thus maintaining battery capacity. Poor-quality covers, with insufficient adhesion to the electrode plates, can lead to electrolyte leakage and affect battery capacity. The materials and manufacturing processes of the electrode covers also influence the battery's charge-discharge performance. High-quality covers effectively prevent electrolyte evaporation, maintaining the electrolyte concentration within the battery and improving charge-discharge performance. The structural design and material selection of the electrode covers also affect battery safety. High-quality covers typically possess higher flame-retardant properties and corrosion resistance, effectively preventing safety accidents such as internal short circuits or explosions.

[0003] In semiconductor equipment, the electronic circuit board is one of the core components, used to implement various circuit functions. The electrode cover, as an important part of the electronic circuit board, directly affects the stability and reliability of the entire semiconductor device.

[0004] Existing electrode covers have several problems, such as insufficient heat dissipation and poor electromagnetic interference (EMI) shielding. Insufficient heat dissipation leads to excessively high temperatures in electronic components near the electrode cover. High temperatures degrade the performance of semiconductor devices, thus affecting the overall circuit efficiency. Poor EMI shielding can increase the bit error rate in digital signal transmission. For analog signals, EMI can cause signal distortion and increased noise, thereby reducing signal fidelity. Therefore, an electrode cover is needed to address these issues. Utility Model Content

[0005] To address some problems with existing electrode covers, such as insufficient heat dissipation and poor electromagnetic interference shielding, where insufficient heat dissipation leads to excessively high temperatures of electronic components near the electrode cover, which degrades the performance of semiconductor devices and affects the overall circuit efficiency, and poor electromagnetic interference shielding can increase the bit error rate in digital signal transmission, and for analog signals, electromagnetic interference can cause signal distortion and increased noise, thereby reducing signal fidelity, the present invention aims to provide an electrode cover that solves the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An electrode cover plate includes a cover plate body, and a heat dissipation component is fixedly connected to the top of the cover plate body;

[0008] The heat dissipation component includes a heat-conducting outer layer, a rectangular groove is formed inside the heat-conducting outer layer, a miniature fan is formed inside the rectangular groove, and a heat dissipation fin is fixedly connected to the top of the heat-conducting outer layer. The heat dissipation fin is made of aluminum alloy material, and the heat-conducting outer layer is made of aluminum alloy sheet.

[0009] As a preferred embodiment of this utility model, the heat dissipation fins are provided in a plurality of parts, and the miniature fans are provided in two parts.

[0010] As a preferred embodiment of this utility model, the top of the heat-conducting outer layer is covered with an electromagnetic shielding layer, which is made of copper alloy material and has a thickness of 0.3 mm.

[0011] As a preferred embodiment of this utility model, an insulating intermediate layer is fixedly connected to the bottom of the thermally conductive outer layer, and a conductive base layer is fixedly connected to the bottom of the insulating intermediate layer.

[0012] In a preferred embodiment of this invention, the conductive substrate layer is made of copper foil, and the insulating intermediate layer is made of polyimide film.

[0013] As a preferred embodiment of this utility model, the thickness of the heat dissipation fins is 2 mm and the height is 10 mm, and the air volume of the micro fan is 10 cubic meters per hour.

[0014] As a preferred embodiment of this utility model, the cover plate body includes a base frame, a pressure plate is fixedly connected to the side of the base frame, and a threaded fixing hole is provided inside the pressure plate.

[0015] As a preferred embodiment of this utility model, four pressure plates are provided, and a rubber sealing ring is fixedly connected to the bottom of the base frame.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. In this utility model, the combination design of heat dissipation fins and micro fan can quickly dissipate the heat generated by the electronic circuit board, effectively reduce the operating temperature of the circuit board, and extend the service life of the equipment. The electromagnetic shielding layer made of copper alloy material can effectively shield external electromagnetic interference, ensure the stable operation of the electronic circuit board in complex electromagnetic environment, and improve the reliability of the equipment. The multi-layer structure of the cover plate body and the compact heat dissipation module design make the entire electrode cover plate small in size, which is easy to integrate into various semiconductor devices and meet the development needs of miniaturization and high performance.

[0018] 2. In this utility model, the heat dissipation fins are made of aluminum alloy, which has good thermal conductivity and lightweight characteristics. The micro fan adopts a low power consumption and high air volume design, which can effectively improve the heat dissipation effect without affecting the overall power consumption of the semiconductor device. The electromagnetic shielding layer is made of copper foil or copper alloy with a thickness of 0.3 mm, which can effectively shield electromagnetic interference in the frequency range of 100MHz-10GHz, ensuring the stable operation of the electronic circuit board in complex electromagnetic environment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the heat dissipation component structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the installation and sealing assembly structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the cover plate layered assembly structure of this utility model.

[0023] In the diagram: 1. Cover plate body; 101. Base frame; 102. Pressure plate; 103. Threaded fixing hole; 104. Rubber sealing ring; 2. Heat dissipation assembly; 201. Thermally conductive outer layer; 202. Insulating intermediate layer; 203. Conductive base layer; 204. Rectangular groove; 205. Miniature fan; 206. Heat dissipation fins; 207. Electromagnetic shielding layer. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0025] For examples, please refer to Figures 1-4 This utility model provides a technical solution:

[0026] An electrode cover plate includes a cover plate body 1, and a heat dissipation component 2 is fixedly connected to the top of the cover plate body 1.

[0027] In this embodiment, as Figure 1 , Figure 2 and Figure 4As shown, the heat dissipation component 2 includes a thermally conductive outer layer 201, with a rectangular groove 204 inside the thermally conductive outer layer 201. A miniature fan 205 is installed inside the rectangular groove 204. A heat dissipation fin 206 is fixedly connected to the top of the thermally conductive outer layer 201. The heat dissipation fin 206 is made of aluminum alloy, and the thermally conductive outer layer 201 is made of aluminum alloy sheet. Through the combined design of the heat dissipation fin 206 and the miniature fan 205, the heat generated by the electronic circuit board can be quickly dissipated, effectively reducing the operating temperature of the circuit board and extending the service life of the equipment. The electromagnetic shielding layer 207, made of copper alloy, can effectively shield external electromagnetic interference, ensuring the stable operation of the electronic circuit board in a complex electromagnetic environment and improving the reliability of the equipment. The multi-layered cover body 1 and the compact heat dissipation module design make the entire electrode cover small in size, which is easy to integrate into various semiconductor devices and meet the development needs of miniaturization and high performance.

[0028] The system includes several heat dissipation fins 206, two miniature fans 205, an electromagnetic shielding layer 207 (made of copper alloy and 0.3 mm thick) covering the top of the thermally conductive outer layer 201, an insulating intermediate layer 202 (made of copper alloy and 0.3 mm thick) fixedly connected to the bottom of the thermally conductive outer layer 201, and a conductive base layer 203 (made of copper foil) fixedly connected to the bottom of the insulating intermediate layer 202, and a polyimide film made of the conductive base layer 203. The heat dissipation fins 206 are 2 mm thick and 10 mm high. The fan 205 has an airflow of 10 cubic meters per hour. The heat sink 206 is made of aluminum alloy, which has good thermal conductivity and is lightweight. The micro fan 205 adopts a low power consumption and high airflow design, which can effectively improve the heat dissipation effect without affecting the overall power consumption of semiconductor devices. The electromagnetic shielding layer 207 is made of copper foil or copper alloy with a thickness of 0.3 mm. It can effectively shield electromagnetic interference in the frequency range of 100MHz-10GHz, ensuring the stable operation of electronic circuit boards in complex electromagnetic environments.

[0029] In this embodiment, as Figure 1 and Figure 3As shown, the cover plate body 1 includes a base frame 101, and a pressure plate 102 is fixedly connected to the side of the base frame 101. The pressure plate 102 has threaded fixing holes 103 inside, and there are four pressure plates 102. A rubber sealing ring 104 is fixedly connected to the bottom of the base frame 101. The connection method of the threaded fixing holes 103 ensures both quick installation and strong connection. Even under equipment vibration or external force, the electrode cover plate can maintain a tight fit with the circuit board. At the same time, it works with the rubber sealing ring 104 for sealing. The sealing ring made of rubber material has excellent elasticity and can fit tightly to the sealing surface after installation. Even in the case of minor unevenness, it can effectively prevent the leakage of liquid or gas. The rubber sealing ring 104 can undergo elastic deformation when compressed, thereby better filling the sealing gap and ensuring the reliability of the seal.

[0030] The working process of this utility model is as follows: When the electrode cover plate designed in this scheme is in operation, the cover plate body 1 adopts a three-layer structure. The conductive base layer 203 is made of copper foil, the insulating intermediate layer 202 is made of polyimide film, and the thermally conductive outer layer 201 is made of aluminum alloy plate. The heat dissipation module includes aluminum alloy heat dissipation fins 206 and a micro fan 205. The thickness of the heat dissipation fins 206 is 2 mm and the height is 10 mm. The air volume of the micro fan 205 is 10 cubic meters / hour. The electromagnetic shielding layer 207 is made of 0.3 mm thick copper foil and covers the entire surface of the cover plate body 1. In actual use, when the electrode cover plate is installed on the electronic circuit board, the device can be fixed by using screws through the threaded fixing holes 103. During operation, the heat dissipation fins 206 and the micro fan 205 work together to quickly dissipate the heat generated by the electronic circuit board, ensuring that the operating temperature of the circuit board is always below 60 degrees Celsius. The electromagnetic shielding layer 207 effectively shields external electromagnetic interference, making the signal transmission of the electronic circuit board stable and reliable, and reducing the failure rate of the equipment by 80%.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electrode cover plate comprising a cover plate body (1), characterized in that: The top of the cover plate body (1) is fixedly connected with a heat dissipation assembly (2); The heat dissipation assembly (2) comprises a heat-conducting outer layer (201), a rectangular groove (204) is formed in the inner part of the heat-conducting outer layer (201), a micro fan (205) is arranged in the inner part of the rectangular groove (204), a heat dissipation fin (206) is fixedly connected to the top of the heat-conducting outer layer (201), the heat dissipation fin (206) is made of aluminum alloy material, and the heat-conducting outer layer (201) is made of aluminum alloy plate.

2. An electrode cover plate according to claim 1, characterized in that: The heat dissipation fin (206) is provided with a plurality of heat dissipation fins, and the micro fan (205) is provided with two micro fans.

3. An electrode cover plate according to claim 1, wherein: The top of the heat-conducting outer layer (201) is covered with an electromagnetic shielding layer (207), the electromagnetic shielding layer (207) is made of copper alloy material and has a thickness of 0.3mm.

4. An electrode cover plate according to claim 1, characterized in that: The bottom of the heat-conducting outer layer (201) is fixedly connected with an insulating intermediate layer (202), and the bottom of the insulating intermediate layer (202) is fixedly connected with a conductive base layer (203).

5. An electrode cover plate according to claim 4, wherein: The conductive base layer (203) is made of copper foil, and the insulating intermediate layer (202) is made of polyimide film.

6. An electrode cover plate according to claim 1, characterized in that: The thickness of the heat dissipation fin (206) is 2mm, the height is 10mm, and the air volume of the micro fan (205) is 10m3 / h.

7. An electrode cover plate according to claim 1, wherein: The cover plate body (1) comprises a chassis (101), and the side of the chassis (101) is fixedly connected with a pressing plate (102), and the inner part of the pressing plate (102) is provided with a threaded fixing hole (103).

8. An electrode cover plate according to claim 7, characterized in that: The pressing plate (102) is provided with four pressing plates, and the bottom of the chassis (101) is fixedly connected with a rubber sealing ring (104).

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